KR20160128762A - Sealing member - Google Patents

Sealing member Download PDF

Info

Publication number
KR20160128762A
KR20160128762A KR1020150060631A KR20150060631A KR20160128762A KR 20160128762 A KR20160128762 A KR 20160128762A KR 1020150060631 A KR1020150060631 A KR 1020150060631A KR 20150060631 A KR20150060631 A KR 20150060631A KR 20160128762 A KR20160128762 A KR 20160128762A
Authority
KR
South Korea
Prior art keywords
sealing member
refrigerant
pipe
present
cooling
Prior art date
Application number
KR1020150060631A
Other languages
Korean (ko)
Inventor
이병일
강호영
염현진
Original Assignee
주식회사 테라세미콘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 테라세미콘 filed Critical 주식회사 테라세미콘
Priority to KR1020150060631A priority Critical patent/KR20160128762A/en
Priority to JP2016084689A priority patent/JP2016211735A/en
Priority to TW105112829A priority patent/TW201706527A/en
Priority to CN201610278751.9A priority patent/CN106098636A/en
Publication of KR20160128762A publication Critical patent/KR20160128762A/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Chemical Vapour Deposition (AREA)
  • Materials Engineering (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Gasket Seals (AREA)

Abstract

A sealing member is disclosed. The sealing member 100 according to the present invention is characterized in that it includes a body part 110 and a cooling part 111 including a passage through which the refrigerant moves in the body part 110. [ Therefore, there is an effect of improving the use limit temperature.

Description

[0001] SEALING MEMBER [0002]

The present invention relates to a sealing member. More particularly, the present invention relates to a sealing member having a temperature that can be used by circulating a refrigerant in a sealing member.

The substrate processing apparatus is used for manufacturing a flat panel display, and is roughly divided into a vapor deposition apparatus and an annealing apparatus.

The deposition apparatus is a device for forming a transparent conductive layer, an insulating layer, a metal layer, or a silicon layer which is a core constituent of a flat panel display, and is a chemical vapor deposition (LPCVD) or a plasma enhanced chemical vapor deposition (PECVD) Device and a physical vapor deposition apparatus such as sputtering.

And, the annealing apparatus is an apparatus for improving the characteristics of a deposited film after depositing a film on a substrate, and heat-treating the deposited film to crystallize or phase change the film.

1 shows a conventional substrate processing apparatus. Fig. 1 (a) is a schematic side sectional view of a conventional substrate processing apparatus, and Fig. 1 (b) is a perspective view of the sealing member 10 shown in Fig. 1 (a).

For example, a conventional substrate processing apparatus includes a main body 1, and a chamber 3 is formed in the main body 1, which is a space in which a substrate is introduced and processed. A door 7 is formed in the front surface of the main body 1 to communicate with the chamber 3 and has a door 5 for opening and closing the door 5. It is essential to provide a sealing member 10 for sealing between the entrance 5 and the chamber 3 in order to form and maintain the atmosphere inside the chamber 3. [ The sealing member 10 which is pressed by the door 7 and seals the chamber 3 may be provided on the front portion of the main body 1 outside the door 5. Referring to FIG. 1 (b), the sealing member 10 may have a substantially circular cross-sectional shape.

The sealing member 10 applied to the above-described conventional substrate processing apparatus is Viton (FPM) or the like, and is mostly made of a rubber material. Therefore, it is generally used in an environment at a relatively low temperature of 15 to 200 DEG C. In a high temperature environment, a sealing member 10 made of a special material such as KALREZ (FFPM) ™ or PERFLUORO (FFPM) This is expensive, and the sealing member 10 made of a special material also has a problem that the use environment is limited to about 300 캜. In a higher temperature environment, there is a problem that the sealing member 10 is deformed due to twisting, cutting, tearing, or the like to cause a gap. Then, foreign matter flows into the chamber 3, and the heat of the chamber 3 leaks to the outside, so that the reliability of the substrate processing process is lowered.

Prior art relating to the sealing member is disclosed in Korean Patent Laid-Open Publication No. 10-2012-0044227.

Prior art relating to a substrate processing apparatus is disclosed in Korean Patent Laid-Open No. 10-2010-0008722.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a sealing member that can circulate refrigerant in a sealing member, thereby improving the operating temperature.

It is another object of the present invention to provide a sealing member capable of improving the reliability of a substrate processing process by preventing deformation of a sealing member to prevent a gap from being generated in a sealing member portion.

According to an aspect of the present invention, there is provided a sealing member comprising: a body; And a cooling unit including a passage through which the refrigerant moves within the body.

And a first pipe and a second pipe communicated from at least one side of the body part to the cooling part.

The refrigerant may be supplied to the cooling unit through the first pipe, and the refrigerant of the cooling unit may be discharged through the second pipe.

The cross-sectional shape of the body portion of the sealing member may be circular or rectangular.

According to the present invention configured as described above, the refrigerant can be circulated inside the sealing member, thereby improving the operating temperature.

Further, the present invention has the effect of improving the reliability of the substrate processing process by preventing deformation of the sealing member to prevent the occurrence of gaps in the sealing member.

1A is a schematic side cross-sectional view of a conventional substrate processing apparatus.
1B is a perspective view of the sealing member shown in FIG. 1A.
2 is a perspective view and an enlarged horizontal sectional view of a sealing member according to an embodiment of the present invention.
3 is a perspective view and an enlarged horizontal sectional view of a sealing member according to another embodiment of the present invention.

The following detailed description of the invention refers to the accompanying drawings, which illustrate, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It should be understood that the various embodiments of the present invention are different, but need not be mutually exclusive. For example, certain features, structures, and characteristics described herein may be implemented in other embodiments without departing from the spirit and scope of the invention in connection with an embodiment. It is also to be understood that the position or arrangement of the individual components within each disclosed embodiment may be varied without departing from the spirit and scope of the invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is to be limited only by the appended claims, along with the full scope of equivalents to which such claims are entitled, if properly explained. In the drawings, like reference numerals refer to the same or similar functions throughout the several views, and length and area, thickness, and the like may be exaggerated for convenience.

In describing the present embodiment, the term " substrate processing " includes a process of heating and cooling the substrate, a process of depositing a predetermined film on the substrate, a process of annealing a predetermined film deposited on the substrate, Process, and the like.

It should be noted that the sealing member of the present invention is not necessarily limited to the one used in the substrate processing apparatus, and can be applied to any apparatus requiring sealing.

Hereinafter, a sealing member according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

2 is a perspective view (FIG. 2A) and an enlarged plan sectional view (FIG. 2B) of a sealing member 100 according to an embodiment of the present invention.

Referring to FIG. 2, the sealing member 100 according to the first embodiment may include a body 110 and a cooling unit 111.

The body 110 constitutes the body of the sealing member 100. The body 110 is an outer surface of the sealing member 100, and is interposed between an entrance of a substrate processing apparatus and the like, and a door that opens and closes an entrance, and can substantially perform sealing. The body 110 may include rubber such as Viton (FPM) which can be used in an environment of 15 to 200 占 폚 as a material of a conventional sealing member 10, ≪ RTI ID = 0.0 > TEFLON < / RTI >

The cooling part 111 can provide a flow path through which the refrigerant moves in the body part 110. Liquid or gaseous refrigerant can flow into the cooling part 111, so that the cool air of the refrigerant can be transmitted to the body part 110. [ Therefore, the possibility that the body portion 110 of the sealing member 100 is deformed even in a high-temperature environment is greatly reduced.

2 (b) shows the cooling part 111 formed as a hollow inside the body part 110. However, the cooling part 111 has a tube inside the body part 110 Or may be formed in an inserted shape. However, in the present specification, a hollow cooling unit 111 will be described on the assumption. The cross-sectional shape of the body 110 and the cooling part 111 may be circular.

The cooling part 111 may be formed on the entire body part 110 but may be provided with a curtain part 115 in order to facilitate flow with external refrigerant supply means (not shown) and refrigerant discharge means (not shown) . The refrigerant flows in the opposite direction P1 of the curtain film 115 and the refrigerant flows in the opposite direction P2 of the curtain film 115 on the other side with the curtain film 115 interposed therebetween. Can be discharged.

It is preferable that the shielding film 115 is formed integrally with the body portion 111 with the same material as the body portion 111. That is, it is preferable that the cooling part 111 is formed directly in a hollow shape so that the body part 111 includes the shielding film 115 without inserting the shielding film 115 into the body part 111 separately. It goes without saying that the cooling part 111 can be formed with respect to the entire body part 110 without forming the shielding film 115. [

The first tube 120 and the second tube 130 may be connected to the cooling part 111 from at least one side of the body part 110 so that the refrigerant is supplied to and discharged from the cooling part 111 .

One end of the first pipe 120 communicates with the cooling part 111 through the side hole 113 and the other end of the first pipe 120 is connected to an external refrigerant supply unit to receive the refrigerant.

One end of the second pipe 130 communicates with the cooling part 111 through the side hole 113 and the other end of the second pipe 130 is connected to an external refrigerant discharging unit It can be discharged to the outside.

2, the first pipe 120 and the second pipe 130 are formed on the same side of the cooling part 111 so that the refrigerant supplied from the first pipe 120 flows into the body part 110, And the refrigerant supplied from the first pipe 120 is formed on the opposite side of the cooling part 111 so that the refrigerant supplied from the first pipe 120 flows to the left and right sides of the cooling part 111 And may be discharged to the second pipe 130 after circulating the body part 110. [

A method of manufacturing the sealing member 100 shown in Fig. 2 is as follows. First, a material such as rubber, which is hollow inside or contains a pipe, is prepared. Subsequently, the first tube 120 and the second tube 130 are inserted from the side after joining and connecting both sides in a circular shape using a bonding agent. And sealing the first and second tubes 120 and 130 and the body 110 to complete the manufacturing of the sealing member 100.

3 is a perspective view (FIG. 3 (a)) and an enlarged plan sectional view (FIG. 3 (b)) of a sealing member 100 'according to another embodiment of the present invention. 3 will not be described in detail with reference to FIG. 2, but only differences will be described.

3, the sealing member 100 'has a rectangular cross-sectional shape of the body portion 110' and the cooling portion 111 '. A method of manufacturing the sealing member 100 'is as follows. First, a body 110 'including a cooling part 111' is formed of a plastic material. Next, the entire shape is formed into a quadrangle using thermal bonding, and the first tube 120 'and the second tube 130' are inserted from the side. The sealing member 100 'can be completed by sealing between the first and second pipes 120' and 130 'and the body 110'.

When the sealing member 100 of FIG. 2 is made of a rubber material, it is not easy to have a rectangular cross-sectional shape, whereas the sealing member 100 'of FIG. 3 is formed of a plastic material and has a rectangular cross- Accordingly, there is an advantage that a flat sealing member 100 'can be used.

As described above, the sealing member 100 of the present invention can cool the refrigerant in the body 110 by forming the cooling part 111 through which the refrigerant can move inside the body part 110, It is possible to use the material at a temperature higher than the inherent temperature at which the (110) material can be applied. In addition, the temperature of the sealing member 100 can be properly controlled, durability can be improved, deformation of the sealing member 100 can be prevented, and gaps can be prevented from being generated in the sealing member 100, The reliability of the process can be improved.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken in conjunction with the present invention. Variations and changes are possible. Such variations and modifications are to be considered as falling within the scope of the invention and the appended claims.

100, 100: sealing member
110:
113: side hole
115: Shield
120: 1st pipe
130:

Claims (4)

Body part; And
A cooling unit including a flow passage through which the refrigerant moves in the body portion,
Wherein the sealing member comprises a sealing member. The method according to claim 1,
And a first tube and a second tube communicated from at least one side of the body part to the cooling part. 3. The method of claim 2,
The refrigerant is supplied to the cooling unit through the first pipe,
And the refrigerant of the cooling unit is discharged through the second pipe. The method according to claim 1,
Wherein a cross-sectional shape of the body portion of the sealing member is circular or rectangular.
KR1020150060631A 2015-04-29 2015-04-29 Sealing member KR20160128762A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020150060631A KR20160128762A (en) 2015-04-29 2015-04-29 Sealing member
JP2016084689A JP2016211735A (en) 2015-04-29 2016-04-20 Sealing component
TW105112829A TW201706527A (en) 2015-04-29 2016-04-25 Sealing member capable of increasing a limit temperature for preventing a sealing member from deformation
CN201610278751.9A CN106098636A (en) 2015-04-29 2016-04-28 Containment member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150060631A KR20160128762A (en) 2015-04-29 2015-04-29 Sealing member

Publications (1)

Publication Number Publication Date
KR20160128762A true KR20160128762A (en) 2016-11-08

Family

ID=57528319

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150060631A KR20160128762A (en) 2015-04-29 2015-04-29 Sealing member

Country Status (4)

Country Link
JP (1) JP2016211735A (en)
KR (1) KR20160128762A (en)
CN (1) CN106098636A (en)
TW (1) TW201706527A (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5900610B2 (en) * 2012-04-16 2016-04-06 富士電機株式会社 Semiconductor device and cooler for semiconductor device
CN103794538B (en) * 2012-10-31 2016-06-08 北京北方微电子基地设备工艺研究中心有限责任公司 Electrostatic chuck and plasma processing device
CN203285984U (en) * 2013-04-28 2013-11-13 天津市精诚高压泵制造有限责任公司 Sealing ring of internal water cooling
TWI628689B (en) * 2013-05-09 2018-07-01 瑪森科技公司 System and method for protection of vacuum seals in plasma processing systems

Also Published As

Publication number Publication date
TW201706527A (en) 2017-02-16
JP2016211735A (en) 2016-12-15
CN106098636A (en) 2016-11-09

Similar Documents

Publication Publication Date Title
KR20110060838A (en) Method and apparatus for pressure control of glass-making thickness-control zone
KR20160128762A (en) Sealing member
KR20180118938A (en) Apparatus for processing substrate
CN103782367A (en) Substrate processing apparatus
KR101435455B1 (en) Sealing member and apparatus for processing substrate using the same
KR101423521B1 (en) Apparatus for processing substrate
US20230408178A1 (en) Vacuum adiabatic body and fabrication method for the same
US20240019199A1 (en) Vacuum adiabatic body and refrigerator
KR101383668B1 (en) Sealring member and apparatus for processing substrate using the same
US20240003479A1 (en) Vacuum adiabatic body
US20230417479A1 (en) Vacuum adiabatic body
WO2022092926A1 (en) Vacuum adiabatic body
US20240011701A1 (en) Vacuum adiabatic body and refrigerator
US20230417358A1 (en) Vacuum adiabatic body
KR101713628B1 (en) Substrate processing apparatus, and heating assembly used therefor
WO2022092939A1 (en) Vacuum adiabatic body
WO2022092929A1 (en) Vacuum adiabatic body
US20240019196A1 (en) Vacuum adiabatic body and method for manufacturing the refrigerator
US20240019073A1 (en) Vacuum adiabatic body
US20240019194A1 (en) Vacuum adiabatic body
US20230408173A1 (en) Vacuum adiabatic body
US20240003480A1 (en) Vacuum adiabatic body
KR20220059343A (en) Vacuum adiabatic body and fabrication method for the same
KR20220059322A (en) Vacuum adiabatic body
KR20220059319A (en) Vacuum adiabatic body and fabrication method for the same

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application
J201 Request for trial against refusal decision
J301 Trial decision

Free format text: TRIAL NUMBER: 2017101000421; TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20170125

Effective date: 20180823

S901 Examination by remand of revocation
E902 Notification of reason for refusal
N231 Notification of change of applicant
E90F Notification of reason for final refusal
S601 Decision to reject again after remand of revocation