CN106098636A - Containment member - Google Patents
Containment member Download PDFInfo
- Publication number
- CN106098636A CN106098636A CN201610278751.9A CN201610278751A CN106098636A CN 106098636 A CN106098636 A CN 106098636A CN 201610278751 A CN201610278751 A CN 201610278751A CN 106098636 A CN106098636 A CN 106098636A
- Authority
- CN
- China
- Prior art keywords
- containment member
- main part
- cooling end
- pipe
- producing medium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Abstract
The open a kind of containment member of the present invention.The containment member (100) that the present invention relates to is characterised by, including: main part (110)；And cooling end (111), it includes the stream supplying cold-producing medium in the internal movement of main part (110).Therefore, have and can improve the effect of operating limit temperature.
Description
Technical field
The present invention relates to a kind of containment member.For in further detail, relate to one and make refrigerant cycle in close
Seal the inside of component and carry the containment member of operation at high temperature.
Background technology
Substrate board treatment is used for manufacturing flat faced display, be roughly divided into deposition (Vapor Deposition:
Vapour deposition) device and annealing (Annealing) device.
Precipitation equipment be for formed composition the transparent conductive layer of flat faced display core texture, insulating barrier,
Metal level or the device of silicon layer, it has such as LPCVD (Low Pressure Chemical Vapor
Deposition: low-pressure chemical vapor deposition) or PECVD (Plasma-Enhanced Chemical Vapor
Deposition: plasma enhanced chemical vapor deposition) etc. chemical vapor deposition unit and such as sputter
Etc. (Sputtering) physical vapor deposition device.
And, annealing device be film is deposited on substrate after improve the device of characteristic of deposited film, its
Carry out heat treatment so that deposited membrane crystallization or phase transformation.
Fig. 1 illustrates existing substrate board treatment.(a) of Fig. 1 is the side of existing substrate board treatment
Cross-sectional schematic figure, (b) of Fig. 1 is the axonometric chart of the containment member 10 that Fig. 1 (a) illustrates.
As an example, existing substrate board treatment includes body 1, body 1 be internally formed chamber 3,
This chamber 3 is to put into substrate and carry out the space processed.Being previously formed of body 1 connects with chamber 3
And the gateway 5 of substrate turnover, and it is provided with the door 7 for opening and closing gateway 5.In order to be formed also
Maintain the atmosphere of the inside of chamber 3, in substrate board treatment, it is necessary to arrange gateway 5 and chamber
The containment member 10 sealed is carried out between room 3.So, position before the body 1 outside gateway 5
Can arrange containment member 10, it is compressed by door 7 and seals chamber 3.With reference to (b) of Fig. 1, seal
The cross sectional shape of component 10 can be shaped generally as circle.
It is applied to the containment member 10 of above-mentioned existing substrate board treatment mostly by Viton (FPM)TMDeng rubber
Glue material is constituted.Therefore, generally use in the relatively low temperature environment of 15～200 DEG C, and in hot environment
Need to use by the 2KALREZ (FFPM) of not elastomeric materialTM, the special material such as perfluor (FFPM) constitutes
Containment member 10, but it is expensive, and the use of the containment member 10 being made up of special material
Environment also has the problem being limited to about 300 DEG C.Even, in hot environment, containment member 10 can be because of
Distortion, corruption, tear etc. deform and crack occur.At this moment, foreign body flows in chamber 3, chamber 3
To external leakage, therefore there is the shortcoming that the reliability of substrate processing step reduces in heat.
Relevant with containment member is disclosed in Korean Patent Laid 10-2012-0044227 in first technology
Number etc..
Relevant with substrate board treatment it is disclosed in Korean Patent Laid the in first technology
No. 10-2010-0008722 etc..
Summary of the invention
Invent technical problem to be solved
The present invention is in order to solve the various problems of above-mentioned prior art and to propose, and its object is to provide
A kind of containment member, it makes refrigerant cycle carry operation at high temperature in the inside of containment member.
It addition, it is an object of the invention to provide a kind of containment member, it is by preventing the change of containment member
Shape prevents from occurring on the position of containment member crack such that it is able to improve the reliability of substrate processing step.
The technical scheme of solution problem
To achieve these goals, the containment member that one embodiment of the invention relates to is characterised by including:
Main part；And cooling end, including for cold-producing medium stream of movement inside described main part.
Can include that at least side from described main part is communicated to first pipe and second of described cooling end
Pipe.
Described cold-producing medium can be by described first pipe supply to described cooling end, and described cooling end
Described cold-producing medium can be gone out by described second bank of tubes.
The cross sectional shape of the described main part of described containment member can be circular or tetragon.
Invention effect
According to the above-mentioned present invention, have the effect that, even if refrigerant cycle is in the inside of containment member,
It is thus possible to carry operation at high temperature.
The present invention also has the effect that, i.e. by preventing the deformation of containment member from preventing containment member
Crack is there is such that it is able to improve the reliability of substrate processing step on position.
Accompanying drawing explanation
(a) of Fig. 1 is the side cross-sectional schematic figure of existing substrate board treatment.
(b) of Fig. 1 is the axonometric chart of what Fig. 1 (a) illustrated containment member.
Fig. 2 is the axonometric chart of the containment member that one embodiment of the invention relates to and overlooks cutaway view Amplified image.
Fig. 3 is the axonometric chart of the containment member that another embodiment of the present invention relates to and overlooks section view amplification
Figure.
Reference
100,100: containment member
110: main part
113: side opening
115: Obstruct membrane
120: the first pipes
130: the second pipes
Detailed description of the invention
For detailed description of the invention described later, have references to exemplify the specific reality that can implement the present invention
Execute the accompanying drawing of example.These embodiments fully describe in detail, to enable those skilled in the art to implement this
Invention.It should be appreciated that though various embodiments of the present invention are different from each other, but without mutually exclusive.
Such as, given shape, structure and characteristic recited herein are relevant to an embodiment, without departing from this
In the case of the spirit and scope of invention, can be realized by other embodiments.Additionally, it should be appreciated that be,
The position of the discrete structure key element in each disclosed embodiment or be arranged in without departing from the present invention spirit and
Can change in the case of scope.Therefore, detailed description described later is not intended to limit the present invention, this
Bright scope only limits with all scopes of claims and its equivalent.Similar accompanying drawing mark in accompanying drawing
Note represents same or analogous function, for convenience's sake, length and area, thickness etc. in many-side
Likely it is exaggerated with its shape and illustrates.
In the explanation of the present embodiment, the process of so-called substrate is it should be appreciated that be to include adding substrate
Heat and the step of cooling, for the film of regulation being deposited on the Overall Steps of substrate, being used for being deposited on base
The film of the regulation on plate carries out annealing, make it crystallize or the concept of whole heat treatment steps etc. of phase transformation.
In addition, it is desirable to it is noted that the containment member of the present invention is not limited to be necessarily used for processing substrate
Device, needs the device sealed all can be suitable for.
Below, referring to the drawings, the containment member related to one embodiment of the invention is described in detail.
Fig. 2 is the axonometric chart ((a) of Fig. 2) of the containment member 100 that one embodiment of the invention relates to
And overlook cutaway view Amplified image ((b) of Fig. 2).
With reference to Fig. 2, the containment member 100 that first embodiment relates to can include main part 110 and cooling
Portion 111.
Main part 110 constitutes the main body of containment member 100.Main part 110 is as containment member 100
Shell, between the door of the gateway of substrate board treatment etc. and opening and closing gateway, can be carried out fully
Sealing.In main part 110, as the rubber of the material of conventional containment member 10, may be configured to
The Viton (FPM) used in the environment of 15～200 DEG CTMDeng, as special material, may be configured to
The TEFLON used in the environment less than or equal to 260 DEG CTMDeng.
Cooling end 111 can provide the stream making cold-producing medium move in the inside of main part 110.Due to liquid
Or the cold-producing medium of gaseous state can flow in cooling end 111 so that the cold air of cold-producing medium can transmit
To main part 110.Therefore, even if in the environment of high temperature, the main part of containment member 100 110
The probability of the shape that changes also is greatly reduced.
Although (b) of Fig. 2 shows that cooling end 111 is formed at the inside of main part 110 with hollow state,
But cooling end 111 can also be formed as inserting the state of pipe in the inside of main part 110.Simply, at this
Description assumes that the cooling end 111 of hollow state illustrates.Main part 110 and the cross section of cooling end 111
Shape can be circular.
Although cooling end 111 can be formed at whole main part 110, but can be partially formed Obstruct membrane
115 so that with outside cold-producing medium feed unit (not shown) and cold-producing medium deliverying unit (not shown)
Between flowing smooth and easy.Across Obstruct membrane 115, in side, flow into after cold-producing medium so that it is towards in contrast to
The direction flowing in direction opposed with Obstruct membrane 115, and at opposite side, cold-producing medium can from Obstruct membrane 115
After opposed direction flows into, discharge to outside.
Preferably, the material of Obstruct membrane 115 is identical with main part 110, and is formed as one with main part 110
Body.I.e., not individually Obstruct membrane 115 is inserted main part 111, but preferably, straight with hollow state
Connect formation cooling end 111 so that main part 110 includes Obstruct membrane 115.It is of course also possible to be formed without resistance
Barrier film 115, but form cooling end 111 at whole main part 110.
In order to enable the refrigerant to supply to cooling end 111 and discharge from it, can include from main part 110
At least side be communicated to the first pipe 120 and the second pipe 130 of cooling end 111.
The one end of the first pipe 120 is connected with cooling end 111 by side opening 113, the other end and outside
Cold-producing medium feed unit (not shown) connects such that it is able to receive cold-producing medium.
The one end of the second pipe 130 is connected with cooling end 111 by side opening 113, the other end and outside
Cold-producing medium deliverying unit (not shown) connects such that it is able to discharge to outside in cooling end 111 circulation
Cold-producing medium.
As in figure 2 it is shown, the first pipe 120 and the second pipe 130 are configured to, it is formed at cooling end 111
Same side, the first pipe 120 cold-producing medium supplied, after whole main part 110 circulates, is expelled to
Two pipes 130, it is also possible to be configured to, are formed at the side opposite each other of cooling end 111, the first pipe 120 supply
The cold-producing medium given is divided into the tributary, two, left and right of cooling end 111, after main part 110 circulates, is expelled to the
Two pipes 130.
The manufacture method of the containment member 100 shown in Fig. 2 is as follows.First, inner hollow or inside are prepared
The materials such as the rubber including pipe.It follows that utilize binding agent, after both sides bonding is connected as circle,
It is laterally inserted into the first pipe 120 and the second pipe 130.Then, the first pipe 120 and the second pipe 130 is encapsulated
And between main part 110, such that it is able to complete the manufacture of containment member 100.
Fig. 3 is the axonometric chart ((a) of Fig. 3) of the containment member 100' that another embodiment of the present invention relates to
And overlook cutaway view Amplified image ((b) of Fig. 3).Fig. 3 eliminates explanation isostructural with Fig. 2 phase,
Only difference is illustrated.
In containment member 100' in Fig. 3, the cross sectional shape of main part 110' and cooling end 111' is tetragon.
The manufacture method of containment member 100' is as follows.First, the main body of cooling end 111' is included with plastic material formation
Portion 110'.It follows that utilize the bonding realized by heat, after global shape is configured to tetragon, from
The first pipe 120' and the second pipe 130' is inserted in side.Then, the first pipe 120' and the second pipe 130' and master are encapsulated
Between body 110', such that it is able to complete containment member 100'.
When with the containment member 100 of elastomeric material pie graph 2, it is difficult to cross sectional shape is formed as Fang Fang
The most positive tetragon, on the contrary, the containment member 100' of Fig. 3 is molded of plastic material, due to cross sectional shape
Be formed as tetragon, therefore can use smooth containment member 100'.
As it has been described above, the containment member 100 of the present invention can make refrigeration being internally formed of main part 110
The cooling end 111 that agent is moved, such that it is able to main part 110 transmits the cold air of cold-producing medium, is therefore being higher than
Can apply and could be used that at a temperature of the intrinsic temperature of main part 110 material.Being additionally, since can be proper
The temperature of local management containment member 100, it is possible to increase durability, by preventing containment member 100
Deformation prevents occurring crack on the position of containment member 100 such that it is able to improve substrate processing step
Reliability.
As it has been described above, described the present invention by preferred embodiment, but it is not limited to described
Embodiment, without departing from the spirit of the invention, the ordinary skill of this technical field that the present invention belongs to
Personnel can carry out various deformation and change.Should be regarded as such variation and modification belongs to the present invention
Claims scope in.
Claims (4)
1. a containment member, it is characterised in that including:
Main part；And
Cooling end, including for cold-producing medium stream of movement inside described main part.
Containment member the most according to claim 1, it is characterised in that
Including the first pipe and the second pipe that are communicated to described cooling end from least side of described main part.
Containment member the most according to claim 2, it is characterised in that
Described cold-producing medium is supplied to described cooling end by described first pipe,
Described cold-producing medium in described cooling end is gone out by described second bank of tubes.
Containment member the most according to claim 1, it is characterised in that
The cross sectional shape of the described main part of described containment member is circular or tetragon.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2015-0060631 | 2015-04-29 | ||
| KR1020150060631A KR20160128762A (en) | 2015-04-29 | 2015-04-29 | Sealing member |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106098636A true CN106098636A (en) | 2016-11-09 |
Family
ID=57528319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610278751.9A Pending CN106098636A (en) | 2015-04-29 | 2016-04-28 | Containment member |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2016211735A (en) |
| KR (1) | KR20160128762A (en) |
| CN (1) | CN106098636A (en) |
| TW (1) | TW201706527A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203285984U (en) * | 2013-04-28 | 2013-11-13 | 天津市精诚高压泵制造有限责任公司 | Sealing ring of internal water cooling |
| CN103794538A (en) * | 2012-10-31 | 2014-05-14 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Static chuck and plasma processing equipment |
| CN104145333A (en) * | 2012-04-16 | 2014-11-12 | 富士电机株式会社 | Semiconductor device and cooler for semiconductor device |
| WO2014182981A1 (en) * | 2013-05-09 | 2014-11-13 | Mattson Technology, Inc. | System and method for protection of vacuum seals in plasma processing systems |
-
2015
- 2015-04-29 KR KR1020150060631A patent/KR20160128762A/en not_active IP Right Cessation
-
2016
- 2016-04-20 JP JP2016084689A patent/JP2016211735A/en active Pending
- 2016-04-25 TW TW105112829A patent/TW201706527A/en unknown
- 2016-04-28 CN CN201610278751.9A patent/CN106098636A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104145333A (en) * | 2012-04-16 | 2014-11-12 | 富士电机株式会社 | Semiconductor device and cooler for semiconductor device |
| CN103794538A (en) * | 2012-10-31 | 2014-05-14 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Static chuck and plasma processing equipment |
| CN203285984U (en) * | 2013-04-28 | 2013-11-13 | 天津市精诚高压泵制造有限责任公司 | Sealing ring of internal water cooling |
| WO2014182981A1 (en) * | 2013-05-09 | 2014-11-13 | Mattson Technology, Inc. | System and method for protection of vacuum seals in plasma processing systems |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160128762A (en) | 2016-11-08 |
| JP2016211735A (en) | 2016-12-15 |
| TW201706527A (en) | 2017-02-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| BRPI0921713B1 (en) | REFRIGERATION, PIPING AND PROCESS CIRCUIT | |
| CN104344653A (en) | Refrigerator | |
| EP2336611A1 (en) | Water cooled valve | |
| US20230184367A1 (en) | Vacuum adiabatic body and refrigerator | |
| CN106098636A (en) | Containment member | |
| US20230204150A1 (en) | Vacuum adiabatic body and refrigerator | |
| US8549875B2 (en) | Modular valve | |
| US11913706B2 (en) | Vacuum adiabatic body and refrigerator | |
| CN114008395B (en) | Vacuum insulator, refrigerator and method for manufacturing refrigerator | |
| TW201330050A (en) | Apparatus for processing substrate | |
| EP3220074A1 (en) | Heat exchanger and heat pump type hot water generating device using same | |
| KR20230162029A (en) | Methods for cooling refrigeration systems, rotary unions for refrigeration systems, vacuum chambers, substrate processing systems and vacuum chambers | |
| RU2776222C1 (en) | Vacuum adiabatic body and refrigerator | |
| CN108518893A (en) | A kind of heat pump system based on micropore injecting type evaporator | |
| CN115289746B (en) | Vacuum heat insulation body and refrigerator | |
| CN102853511A (en) | Air header assembly, assembly method thereof and air-conditioning system with same | |
| CN102853512A (en) | Gas collecting tube assembly, combination method thereof and air conditioning system | |
| US20240011701A1 (en) | Vacuum adiabatic body and refrigerator | |
| US20230392743A1 (en) | Vacuum adiabatic body and refrigerator | |
| US20240019199A1 (en) | Vacuum adiabatic body and refrigerator | |
| CN104344654A (en) | Assembling method for refrigerator | |
| JP2010060216A (en) | Refrigeration apparatus and manufacturing method of water heat exchanger | |
| KR20050080387A (en) | Fabricating method of evaporator for kim-chi storage | |
| CN103375588A (en) | Sealring member and apparatus for processing substrate using the same | |
| CN103911589A (en) | Vacuum cooling device for coating machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20190329 Address after: South Korea Gyeonggi Do Ping Ze Zhenwei Zhenwei group produced 75 road surface Applicant after: Yuanyi IPS Corp. Address before: Jing Jidao Applicant before: Terra Semiconductor Inc. |
|
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20161109 |