KR20160071473A - 터치 패널 제조 방법을 위한 투명 바디 및 터치 스크린 패널을 위한 투명 바디를 제조하기 위한 시스템 - Google Patents
터치 패널 제조 방법을 위한 투명 바디 및 터치 스크린 패널을 위한 투명 바디를 제조하기 위한 시스템 Download PDFInfo
- Publication number
- KR20160071473A KR20160071473A KR1020167013169A KR20167013169A KR20160071473A KR 20160071473 A KR20160071473 A KR 20160071473A KR 1020167013169 A KR1020167013169 A KR 1020167013169A KR 20167013169 A KR20167013169 A KR 20167013169A KR 20160071473 A KR20160071473 A KR 20160071473A
- Authority
- KR
- South Korea
- Prior art keywords
- transparent
- refractive index
- film
- dielectric film
- layer stack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3464—Sputtering using more than one target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5873—Removal of material
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/244—Electrodes made of transparent conductive layers, e.g. transparent conductive oxide [TCO] layers
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Position Input By Displaying (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP13189385.1 | 2013-10-18 | ||
| EP20130189385 EP2863291A1 (en) | 2013-10-18 | 2013-10-18 | Transparent body for a touch panel manufacturing method and system for manufacturing a transparent body for a touch screen panel |
| PCT/EP2014/072348 WO2015055830A1 (en) | 2013-10-18 | 2014-10-17 | Transparent body for a touch panel manufacturing method and system for manufacturing a transparent body for a touch screen panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20160071473A true KR20160071473A (ko) | 2016-06-21 |
Family
ID=49474243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020167013169A Withdrawn KR20160071473A (ko) | 2013-10-18 | 2014-10-17 | 터치 패널 제조 방법을 위한 투명 바디 및 터치 스크린 패널을 위한 투명 바디를 제조하기 위한 시스템 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9920421B2 (enExample) |
| EP (1) | EP2863291A1 (enExample) |
| JP (1) | JP6377735B2 (enExample) |
| KR (1) | KR20160071473A (enExample) |
| CN (1) | CN105637452A (enExample) |
| WO (1) | WO2015055830A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9856554B2 (en) * | 2011-09-07 | 2018-01-02 | Applied Materials, Inc. | Method and system for manufacturing a transparent body for use in a touch panel |
| CN104246667B (zh) * | 2012-03-30 | 2018-04-10 | 应用材料公司 | 用于触控面板的透明体及制造透明体的方法 |
| KR102283921B1 (ko) * | 2015-01-09 | 2021-07-30 | 삼성디스플레이 주식회사 | 플렉서블 터치 패널 |
| TWI564762B (zh) * | 2015-04-22 | 2017-01-01 | 恆顥科技股份有限公司 | 觸控薄膜疊層卷的製作方法與所製得之觸控薄膜疊層片 |
| CN105204691B (zh) * | 2015-10-19 | 2018-08-10 | 洛阳康耀电子有限公司 | 一种触摸屏单面消影导电玻璃的加工方法 |
| CN105204704B (zh) * | 2015-10-19 | 2018-08-10 | 洛阳康耀电子有限公司 | 一种单面触摸屏消影导电玻璃的加工方法 |
| KR102054190B1 (ko) * | 2017-01-23 | 2019-12-10 | 동우 화인켐 주식회사 | 고성능 필름형 터치 센서 및 그 제조방법 |
| WO2018209680A1 (zh) * | 2017-05-19 | 2018-11-22 | 大连大学 | 一种柔性透明电路的制备方法 |
| FI20175595A1 (en) * | 2017-06-22 | 2018-12-23 | Canatu Oy | A transparent conductive film |
| CN111316478A (zh) | 2017-11-09 | 2020-06-19 | 应用材料公司 | 使用硫族化物对锂金属阳极的异位固体电解质界面改性 |
| US10705268B2 (en) * | 2018-06-29 | 2020-07-07 | Applied Materials, Inc. | Gap fill of imprinted structure with spin coated high refractive index material for optical components |
| KR102680576B1 (ko) | 2018-08-14 | 2024-07-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 가요성 커버 렌즈용 다층 습식-건식 하드코트들 |
| US11631840B2 (en) | 2019-04-26 | 2023-04-18 | Applied Materials, Inc. | Surface protection of lithium metal anode |
| CN118711458A (zh) | 2019-06-26 | 2024-09-27 | 应用材料公司 | 可折叠显示器的柔性多层覆盖透镜堆叠 |
| CN111733384A (zh) * | 2020-06-19 | 2020-10-02 | 豪威星科薄膜视窗(深圳)有限公司 | 一种电容触摸屏镀膜工艺 |
| FI131751B1 (en) * | 2020-10-21 | 2025-11-07 | Teknologian Tutkimuskeskus Vtt Oy | Roll-to-roll imprinting |
| CN115188770B (zh) * | 2022-06-28 | 2025-09-05 | 湖北长江新型显示产业创新中心有限公司 | 一种显示面板和显示装置 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4838656A (en) * | 1980-10-06 | 1989-06-13 | Andus Corporation | Transparent electrode fabrication |
| FR2775280B1 (fr) * | 1998-02-23 | 2000-04-14 | Saint Gobain Vitrage | Procede de gravure d'une couche conductrice |
| AU2003243118A1 (en) * | 2002-07-08 | 2004-01-23 | Obducat Ab | A method and a stamp for transferring a pattern to a substrate |
| US7256435B1 (en) * | 2003-06-02 | 2007-08-14 | Hewlett-Packard Development Company, L.P. | Multilevel imprint lithography |
| US7122482B2 (en) * | 2003-10-27 | 2006-10-17 | Molecular Imprints, Inc. | Methods for fabricating patterned features utilizing imprint lithography |
| US20060144814A1 (en) * | 2004-12-30 | 2006-07-06 | Asml Netherlands B.V. | Imprint lithography |
| US8040444B2 (en) * | 2005-06-03 | 2011-10-18 | Samsung Electronics Co., Ltd. | Display device, method of manufacturing the same and mask for manufacturing the same |
| KR101822350B1 (ko) * | 2008-02-28 | 2018-01-25 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 터치 스크린 센서 |
| KR100908101B1 (ko) * | 2008-10-01 | 2009-07-16 | 신와전공 주식회사 | 터치패널의 제조방법 및 이에 의해 제조되는 터치패널 |
| US20110027561A1 (en) * | 2009-07-29 | 2011-02-03 | Cheng-Chieh Chang | Optical film structure and display device |
| EP2402481A1 (en) * | 2010-06-29 | 2012-01-04 | Applied Materials, Inc. | Method and system for manufacturing a transparent body for use in a touch panel |
| JP5531031B2 (ja) * | 2011-01-18 | 2014-06-25 | 富士フイルム株式会社 | 透明電極シート、透明電極シートの製造方法、及びこれらの透明電極シートを用いた静電容量方式のタッチパネル |
| JP5190854B2 (ja) * | 2011-05-10 | 2013-04-24 | 株式会社麗光 | 透明導電フィルム及び透明導電積層体並びにタッチパネル |
| US9856554B2 (en) * | 2011-09-07 | 2018-01-02 | Applied Materials, Inc. | Method and system for manufacturing a transparent body for use in a touch panel |
| WO2013143614A1 (en) * | 2012-03-30 | 2013-10-03 | Applied Materials, Inc. | Transparent body for use in a touch screen panel manufacturing method and system |
| CN104246667B (zh) * | 2012-03-30 | 2018-04-10 | 应用材料公司 | 用于触控面板的透明体及制造透明体的方法 |
| CN103207702B (zh) * | 2013-03-30 | 2016-08-24 | 深圳欧菲光科技股份有限公司 | 触摸屏及其制造方法 |
| JP6202370B2 (ja) * | 2013-05-31 | 2017-09-27 | 大日本印刷株式会社 | タッチパネルセンサ、タッチパネルセンサを備える入出力装置およびタッチパネルセンサの製造方法 |
-
2013
- 2013-10-18 EP EP20130189385 patent/EP2863291A1/en not_active Withdrawn
- 2013-12-09 US US14/101,032 patent/US9920421B2/en not_active Expired - Fee Related
-
2014
- 2014-10-17 JP JP2016523270A patent/JP6377735B2/ja not_active Expired - Fee Related
- 2014-10-17 CN CN201480056789.0A patent/CN105637452A/zh active Pending
- 2014-10-17 WO PCT/EP2014/072348 patent/WO2015055830A1/en not_active Ceased
- 2014-10-17 KR KR1020167013169A patent/KR20160071473A/ko not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| US20150109234A1 (en) | 2015-04-23 |
| EP2863291A1 (en) | 2015-04-22 |
| JP6377735B2 (ja) | 2018-08-22 |
| WO2015055830A1 (en) | 2015-04-23 |
| CN105637452A (zh) | 2016-06-01 |
| JP2016541044A (ja) | 2016-12-28 |
| US9920421B2 (en) | 2018-03-20 |
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