KR20160071473A - 터치 패널 제조 방법을 위한 투명 바디 및 터치 스크린 패널을 위한 투명 바디를 제조하기 위한 시스템 - Google Patents

터치 패널 제조 방법을 위한 투명 바디 및 터치 스크린 패널을 위한 투명 바디를 제조하기 위한 시스템 Download PDF

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Publication number
KR20160071473A
KR20160071473A KR1020167013169A KR20167013169A KR20160071473A KR 20160071473 A KR20160071473 A KR 20160071473A KR 1020167013169 A KR1020167013169 A KR 1020167013169A KR 20167013169 A KR20167013169 A KR 20167013169A KR 20160071473 A KR20160071473 A KR 20160071473A
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South Korea
Prior art keywords
transparent
refractive index
film
dielectric film
layer stack
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KR1020167013169A
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English (en)
Korean (ko)
Inventor
한스-게오르그 로츠
네일 모리슨
토마스 데피쉬
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
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Publication of KR20160071473A publication Critical patent/KR20160071473A/ko
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    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • C23C14/086Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3464Sputtering using more than one target
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/35Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58After-treatment
    • C23C14/5873Removal of material
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/028Bending or folding regions of flexible printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/20Electrodes
    • H10F77/244Electrodes made of transparent conductive layers, e.g. transparent conductive oxide [TCO] layers
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405Magnetron sputtering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0108Transparent
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0145Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/032Materials
    • H05K2201/0326Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10128Display

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Position Input By Displaying (AREA)
KR1020167013169A 2013-10-18 2014-10-17 터치 패널 제조 방법을 위한 투명 바디 및 터치 스크린 패널을 위한 투명 바디를 제조하기 위한 시스템 Withdrawn KR20160071473A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP13189385.1 2013-10-18
EP20130189385 EP2863291A1 (en) 2013-10-18 2013-10-18 Transparent body for a touch panel manufacturing method and system for manufacturing a transparent body for a touch screen panel
PCT/EP2014/072348 WO2015055830A1 (en) 2013-10-18 2014-10-17 Transparent body for a touch panel manufacturing method and system for manufacturing a transparent body for a touch screen panel

Publications (1)

Publication Number Publication Date
KR20160071473A true KR20160071473A (ko) 2016-06-21

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Application Number Title Priority Date Filing Date
KR1020167013169A Withdrawn KR20160071473A (ko) 2013-10-18 2014-10-17 터치 패널 제조 방법을 위한 투명 바디 및 터치 스크린 패널을 위한 투명 바디를 제조하기 위한 시스템

Country Status (6)

Country Link
US (1) US9920421B2 (enExample)
EP (1) EP2863291A1 (enExample)
JP (1) JP6377735B2 (enExample)
KR (1) KR20160071473A (enExample)
CN (1) CN105637452A (enExample)
WO (1) WO2015055830A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9856554B2 (en) * 2011-09-07 2018-01-02 Applied Materials, Inc. Method and system for manufacturing a transparent body for use in a touch panel
CN104246667B (zh) * 2012-03-30 2018-04-10 应用材料公司 用于触控面板的透明体及制造透明体的方法
KR102283921B1 (ko) * 2015-01-09 2021-07-30 삼성디스플레이 주식회사 플렉서블 터치 패널
TWI564762B (zh) * 2015-04-22 2017-01-01 恆顥科技股份有限公司 觸控薄膜疊層卷的製作方法與所製得之觸控薄膜疊層片
CN105204691B (zh) * 2015-10-19 2018-08-10 洛阳康耀电子有限公司 一种触摸屏单面消影导电玻璃的加工方法
CN105204704B (zh) * 2015-10-19 2018-08-10 洛阳康耀电子有限公司 一种单面触摸屏消影导电玻璃的加工方法
KR102054190B1 (ko) * 2017-01-23 2019-12-10 동우 화인켐 주식회사 고성능 필름형 터치 센서 및 그 제조방법
WO2018209680A1 (zh) * 2017-05-19 2018-11-22 大连大学 一种柔性透明电路的制备方法
FI20175595A1 (en) * 2017-06-22 2018-12-23 Canatu Oy A transparent conductive film
CN111316478A (zh) 2017-11-09 2020-06-19 应用材料公司 使用硫族化物对锂金属阳极的异位固体电解质界面改性
US10705268B2 (en) * 2018-06-29 2020-07-07 Applied Materials, Inc. Gap fill of imprinted structure with spin coated high refractive index material for optical components
KR102680576B1 (ko) 2018-08-14 2024-07-01 어플라이드 머티어리얼스, 인코포레이티드 가요성 커버 렌즈용 다층 습식-건식 하드코트들
US11631840B2 (en) 2019-04-26 2023-04-18 Applied Materials, Inc. Surface protection of lithium metal anode
CN118711458A (zh) 2019-06-26 2024-09-27 应用材料公司 可折叠显示器的柔性多层覆盖透镜堆叠
CN111733384A (zh) * 2020-06-19 2020-10-02 豪威星科薄膜视窗(深圳)有限公司 一种电容触摸屏镀膜工艺
FI131751B1 (en) * 2020-10-21 2025-11-07 Teknologian Tutkimuskeskus Vtt Oy Roll-to-roll imprinting
CN115188770B (zh) * 2022-06-28 2025-09-05 湖北长江新型显示产业创新中心有限公司 一种显示面板和显示装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4838656A (en) * 1980-10-06 1989-06-13 Andus Corporation Transparent electrode fabrication
FR2775280B1 (fr) * 1998-02-23 2000-04-14 Saint Gobain Vitrage Procede de gravure d'une couche conductrice
AU2003243118A1 (en) * 2002-07-08 2004-01-23 Obducat Ab A method and a stamp for transferring a pattern to a substrate
US7256435B1 (en) * 2003-06-02 2007-08-14 Hewlett-Packard Development Company, L.P. Multilevel imprint lithography
US7122482B2 (en) * 2003-10-27 2006-10-17 Molecular Imprints, Inc. Methods for fabricating patterned features utilizing imprint lithography
US20060144814A1 (en) * 2004-12-30 2006-07-06 Asml Netherlands B.V. Imprint lithography
US8040444B2 (en) * 2005-06-03 2011-10-18 Samsung Electronics Co., Ltd. Display device, method of manufacturing the same and mask for manufacturing the same
KR101822350B1 (ko) * 2008-02-28 2018-01-25 쓰리엠 이노베이티브 프로퍼티즈 컴파니 터치 스크린 센서
KR100908101B1 (ko) * 2008-10-01 2009-07-16 신와전공 주식회사 터치패널의 제조방법 및 이에 의해 제조되는 터치패널
US20110027561A1 (en) * 2009-07-29 2011-02-03 Cheng-Chieh Chang Optical film structure and display device
EP2402481A1 (en) * 2010-06-29 2012-01-04 Applied Materials, Inc. Method and system for manufacturing a transparent body for use in a touch panel
JP5531031B2 (ja) * 2011-01-18 2014-06-25 富士フイルム株式会社 透明電極シート、透明電極シートの製造方法、及びこれらの透明電極シートを用いた静電容量方式のタッチパネル
JP5190854B2 (ja) * 2011-05-10 2013-04-24 株式会社麗光 透明導電フィルム及び透明導電積層体並びにタッチパネル
US9856554B2 (en) * 2011-09-07 2018-01-02 Applied Materials, Inc. Method and system for manufacturing a transparent body for use in a touch panel
WO2013143614A1 (en) * 2012-03-30 2013-10-03 Applied Materials, Inc. Transparent body for use in a touch screen panel manufacturing method and system
CN104246667B (zh) * 2012-03-30 2018-04-10 应用材料公司 用于触控面板的透明体及制造透明体的方法
CN103207702B (zh) * 2013-03-30 2016-08-24 深圳欧菲光科技股份有限公司 触摸屏及其制造方法
JP6202370B2 (ja) * 2013-05-31 2017-09-27 大日本印刷株式会社 タッチパネルセンサ、タッチパネルセンサを備える入出力装置およびタッチパネルセンサの製造方法

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Publication number Publication date
US20150109234A1 (en) 2015-04-23
EP2863291A1 (en) 2015-04-22
JP6377735B2 (ja) 2018-08-22
WO2015055830A1 (en) 2015-04-23
CN105637452A (zh) 2016-06-01
JP2016541044A (ja) 2016-12-28
US9920421B2 (en) 2018-03-20

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