KR20160052446A - Apparatus of printing electronic device pattern and method of printing the same - Google Patents

Apparatus of printing electronic device pattern and method of printing the same Download PDF

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KR20160052446A
KR20160052446A KR1020150154326A KR20150154326A KR20160052446A KR 20160052446 A KR20160052446 A KR 20160052446A KR 1020150154326 A KR1020150154326 A KR 1020150154326A KR 20150154326 A KR20150154326 A KR 20150154326A KR 20160052446 A KR20160052446 A KR 20160052446A
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South Korea
Prior art keywords
plate
porous
printing apparatus
pattern
work
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KR1020150154326A
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Korean (ko)
Inventor
가즈요시 스기하라
신타로 오구라
히로부미 우시지마
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도쿄엘렉트론가부시키가이샤
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Publication of KR20160052446A publication Critical patent/KR20160052446A/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • H01L21/02288—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating printing, e.g. ink-jet printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/951—Supplying the plurality of semiconductor or solid-state bodies
    • H01L2224/95115—Supplying the plurality of semiconductor or solid-state bodies using a roll-to-roll transfer technique

Abstract

A printing apparatus or a printing method of an electronic device pattern capable of improving the printing property of a pattern of an electronic device by fixing a work plate using at least two porous plates.
A printing apparatus for an electronic device pattern, comprising: a table on which a holding member for holding the work plate is mounted; and a moving mechanism for applying ink to the work plate by relatively moving the table, Wherein at least two porous plates are provided to attract and fix the work plate through the porous plates of the two layers, and in the porous plate of the two layers, the porous plate of one porous plate on the side in contact with the work plate This makes it possible to provide a printing apparatus of an electronic device pattern smaller than the hole diameter of another porous plate.

Figure P1020150154326

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an electronic device pattern printing apparatus,

The present invention relates to a printing apparatus of an electronic device pattern and a printing method thereof.

As a method for forming a pattern of an electronic device, a printing method has been proposed. [0002] In recent years, with the miniaturization of pixels of a liquid crystal display, patterns of electronic devices are required to have high dimensional accuracy. In addition, as a method of printing a pattern with a high dimensional accuracy, an inversion printing method has been proposed.

Patent Document 1 discloses, as an inverted printing method, an ink is first applied to the surface of a roller transfer cylinder (roller), and then a portion of the ink is removed by rotating the roller transfer cylinder on a convexoil (master plate) And transferring the ink remaining on the surface of the substrate to a printing medium (work plate).

Japanese Patent Application Laid-Open No. 11-58921

However, Patent Document 1 does not disclose a method of fixing the substrate. In the technique disclosed in Patent Document 1, when the outside edge of a substrate such as a film or a sheet is fixed with the outside edge interposed therebetween, in the central portion of the substrate to which the pattern is printed, May be locally deviated. Further, in the technique disclosed in Patent Document 1, when the entire surface of a substrate such as a film or a sheet is attracted (fixed) to the porous body, due to the surface irregularities of the porous body, The concavity and the convexity may be scattered in the central portion of the substrate. That is, in the technique disclosed in Patent Document 1, high dimensional accuracy required for printing a pattern of an electronic device can not be realized.

SUMMARY OF THE INVENTION In view of the above circumstances, it is an object of the present invention to provide a printing apparatus or printing method capable of improving the printing property of a pattern of an electronic device by fixing a work plate using at least two porous plates .

According to one aspect of the present invention, there is provided a printing apparatus for an electronic device pattern, comprising: a table on which a holding member for holding the work plate is mounted; a moving mechanism for applying ink to the work plate by relatively moving the table; Wherein the holding member has at least two porous plates, and the two porous plates sandwich the work plate, and the two porous plates sandwich the porous plate on the side contacting the work plate Wherein a hole diameter of one of the porous plates is smaller than a hole diameter of another porous plate. And the thickness of the one porous plate is smaller than the thickness of the other porous plate. An electronic device pattern printing apparatus may be used in which two holding members and two tables are provided, and the two tables are provided with two holding members, respectively. Wherein the holding member further comprises a frame-like porous body on the outer periphery of the two-layered porous plate, the hole diameter of the frame-shaped porous body being larger than the hole diameter of the one porous plate, And the outer edge of the work plate is fixed. And the table is detachable to the guide mechanism with the holding member mounted thereon.

The liquid film on the surface of the roller may be partially removed from the relief plate to form an inverted pattern, and then the inverted pattern may be transferred to the work plate.

According to another aspect of the present invention, there is provided a holding member for a work plate used in a printing apparatus for an electronic device pattern, the holding member comprising at least two porous plates, And the porous plate of the two-layer porous plate has a hole diameter of one porous plate on the side in contact with the work plate is smaller than a hole diameter of the other porous plates.

According to another aspect of the present invention, there is provided a printing method of an electronic device pattern, comprising: a convex holding step of holding the convexoil having a concavo-convex surface shape in a first table; An inverted pattern forming step of moving the first table holding the convex plate to below the roller to partially remove the liquid film from convex portions of the surface shape of the concavities and convexities, And a pattern printing step of transferring the inverted pattern onto the surface of the work plate by moving the second table holding the second table below the roller, wherein the work plate holding step comprises at least two porous plates The porous plate of the two layers was used to fix the work plate by suction, Wherein a hole diameter of one porous plate on the side in contact with the work plate is smaller than a hole diameter of another porous plate.

Wherein the holding member further comprises a frame-like porous body on an outer periphery of the two-layered porous plate, the hole diameter of the frame-shaped porous body being larger than the hole diameter of the one porous plate, And the step may be a method of printing an electronic device pattern, wherein the outside edge of the work plate is further fixed using the frame-shaped porous body.

According to the printing apparatus of the electronic device pattern or the printing method thereof according to the present invention, the printing property of the pattern of the electronic device can be improved by fixing the work plate using at least two porous plates.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic external view for explaining an example of a printing apparatus for an electronic device pattern according to an embodiment of the present invention. Fig.
2 is an explanatory view for explaining a printing method of a printing apparatus of an electronic device pattern according to an embodiment of the present invention;
3 is a schematic external view for explaining an example of a holding member of a printing apparatus of an electronic device pattern according to an embodiment of the present invention.
4 is an exploded view for explaining an example of a holding member (two-layered porous plate) of a printing apparatus of an electronic device pattern according to an embodiment of the present invention;
5 is an explanatory view for explaining another example of a holding member of a printing apparatus of an electronic device pattern according to an embodiment of the present invention (a porous plate of two layers and a frame-shaped porous body);
6 is an explanatory view for explaining the surface shape of the porous plate, which is a holding member of the printing apparatus of the electronic device pattern according to the embodiment of the present invention.
7 is a flowchart for explaining an example of the operation of the printing apparatus of the electronic device pattern according to the embodiment of the present invention.
8 is an explanatory view for explaining an example of a printing result of a printing apparatus of an electronic device pattern according to an embodiment of the present invention.

An embodiment of the present invention will be described using an electronic device pattern printing apparatus (hereinafter referred to as " printing apparatus 100 ") according to an exemplary non-limiting embodiment with reference to the accompanying drawings. The present embodiment can be applied to transferring a pattern formed on the surface of a roller (for example, a roller transfer cylinder) to a predetermined surface (for example, a work plate) Device, unit, system, etc.).

In the following description, the same or corresponding components, components or members of the accompanying drawings are denoted by the same or corresponding reference numerals, and duplicate descriptions are omitted. Further, the drawings are not intended to show a definite relationship between a device, a component or a member unless specifically described. Accordingly, specific correlations may be determined by those skilled in the art in light of the following non-limiting embodiments.

The present embodiment will be described in the following order using the printing apparatus 100 according to one embodiment of the present invention.

1. Configuration of printing device

2. Configuration of table (holding member)

 2-1 Example of holding member (porous plate of two layers)

 2-2 Other examples of holding members (porous plate of two layers and porous body of frame shape)

3. Example of operation of printing device

[One. Configuration of Printing Apparatus]

The printing apparatus 100 according to the present embodiment will be described with reference to Figs. 1 and 2. Fig. Here, Fig. 1 is a schematic external view for explaining an example of the printing apparatus 100. Fig. Fig. 2 is an explanatory view for explaining a printing method of the printing apparatus 100. Fig. Note that the printing apparatus 100 shown in Fig. 1 is an example, and the printing apparatus according to the present embodiment is not limited to that shown in Fig.

In Fig. 1, the X direction is a direction for moving the table (master table Tm, work table Tw, which will be described later). The Y direction is a direction orthogonal to the X direction, and is the width direction of the master table Tm and the like. The Z direction is a vertical direction (direction orthogonal to the X direction and the Y direction). The θ direction is the rotation direction about the Z axis.

The printing apparatus 100 is a device that uses a method (inversion printing method) of partially removing a liquid film on the surface of a roller to form an inversion pattern, and then transferring the inversion pattern to a work plate. That is, the printing apparatus 100 forms an inverted pattern on the surface of the roller by synchronizing the rotation operation of the roller and the linear movement of the convex plate (master plate), and synchronizes the rotation operation of the roller and the linear movement of the work plate And the reverse pattern of the surface of the roller is printed (transferred) on the printing medium.

The printing apparatus 100 can be used, for example, as a printing apparatus when manufacturing a pattern (electronic printed device, etc.) of an electronic device. In addition, the printing apparatus 100 can be used as a semiconductor manufacturing apparatus used when a pattern such as a line and space is formed on a substrate (semiconductor substrate), for example, in a semiconductor manufacturing process.

1, the printing apparatus 100 includes a roller (roller transfer cylinder, transfer roller, etc.) Bk rotatably supported on a roller support portion Bkp, a liquid film (not shown) on the surface of the roller Bk, For example, an ink film). The printing apparatus 100 further includes a master table (first table) Tm for holding a convex plate Pr forming an inverted pattern and a work table Pm for holding a work plate Pw to which the reverse pattern is transferred (Second table) Tw. The printing apparatus 100 further includes a guide mechanism Gd for moving the master table Tm and the work table Tw downward (X direction in the drawing) of the rollers Bk, And a rotation drive section 31R. The master table Tm and the work table Tw may be detachable to the guide mechanism Gd.

2 (a), the printing apparatus 100 rotates the roller Bk using the rotation driving unit 31R in this embodiment, and uses the ink coater Ict to rotate the ink tank Itk) is supplied to the surface of the roller Bk. Specifically, the printing apparatus 100 sets the front end of the ink coater Ict and the surface of the roller Bk at a predetermined interval, rotates the roller Bk in the Ra direction in the drawing, A liquid (ink) is supplied to a desired area of the surface to a desired film thickness. At this time, the printing apparatus 100 forms a liquid film PTa on the surface of the roller Bk.

Next, the printing apparatus 100 moves the convex plate Pr in the X direction (Mb in the figure) using the guide mechanism Gd as shown in Fig. 2 (b) The convex portion Pra of the convex plate Pr is successively brought into contact with the surface of the rotating roller Bk. At this time, the liquid film (PTa) on the surface of the roller (Bk) is partially removed. That is, the printing apparatus 100 forms the reversal pattern PTb on the surface of the roller Bk.

Subsequently, the printing apparatus 100 moves the workpiece Pw in the X direction (Mc in the figure) using the guide mechanism Gd as shown in Fig. 2 (c) And the surface of the work plate Pw is brought into contact with the reversal pattern PTb of the surface of the roller Bk which is rotated by the rotation of the roller Bk. At this time, the reversal pattern PTb is transferred to the surface of the workpiece Pw. That is, the printing apparatus 100 forms the pattern PTc on the surface of the work plate Pw (the print body).

Thereby, the printing apparatus 100 can print (transfer) the desired pattern PTc on the surface of the workpiece (workpiece Pw).

The roller Bk is a rotating body for transferring the reversal pattern PTb to the work plate Pw. The roller Bk is formed by a convex plate Pr and an inverted pattern PTb is formed on the surface of the roller Bk.

In the present embodiment, the roller Bk uses a cylinder in which a water-repellent blanket Bks (FIG. 2) made of silicone is wound around the outer periphery of the roller Bk. The roller Bk is rotatably supported on the rotation center shaft 31r (Fig. 2). The roller Bk is rotated around the rotation center axis 31r by the rotation of the rotation drive section 31R. The roller Bk may be configured to rotate the water-repellent blanket Bks non-interlockingly using a pinion, a clutch or a speed reducer (not shown).

The convexo-Pr is a plate (master plate or the like) having a concavo-convex surface shape. The convex plate Pr uses a flat plate in the present embodiment. Further, the convex plate Pr is mounted on the master table Tm. Further, the convex plate Pr is moved in the X direction (Fig. 2) by the guide mechanism Gd.

The convex portion Pr forms a convex portion Pra on the surface thereof corresponding to the reversed pattern of the pattern printed on the workpiece Pw. The convex portion Pr partially removes the liquid (ink) from the liquid film (PTa in Fig. 2) on the surface of the roller Bk by bringing the convex portion Pra into contact with the surface of the roller Bk, (PTb in Fig. 2).

The work plate Pw is a printed body on which a pattern is formed. In the present embodiment, the work plate Pw uses a print such as a film or a sheet. The workpiece Pw is mounted on the workpiece table Tw. Further, the work plate Pw is moved in the X direction (Fig. 2) by the guide mechanism Gd.

The reversal pattern (PTb in Fig. 2) formed on the surface of the roller Bk is transferred to the work plate Pw. That is, the desired pattern (PTc in Fig. 2) is printed on the work plate Pw.

The guide mechanism Gd is a mechanism for moving the master table Tm and the work table Tw in the downward direction (X direction in Fig. 1) of the roller Bk. The guide mechanism Gd uses a linear guide in this embodiment. A known mechanism capable of moving the master table Tm or the like may be used as the guide mechanism Gd.

The master table Tm is to fix a convex plate Pr by loading a convex plate Pr. The master table Tm is formed by using a holding member (10A of FIG. 3A or 10B of FIG. 3B, which will be described later) having at least two porous plates, The convex portion Pr is attracted and fixed. Further, the master table Tm is moved by the guide mechanism Gd in the conveying direction (X direction in Fig. 1) while the convex plate Pr is fixed. The master table Tm may be a so-called porous chuck or vacuum chuck.

Further, the master table Tm may have a structure in which a mechanism (not shown) capable of finely moving the loaded relief plate Pr in the X direction, the Y direction, the Z direction, and the? Direction is incorporated. Thereby, the master table Tm can adjust the positional deviation of the convex plate Pr.

The work table Tw is to fix the work plate Pw by loading the work plate Pw. The work table Tw is formed by using a holding member (10A in FIG. 3A or 10B in FIG. 3B) having at least two porous plates, The workpiece Pw is sucked and fixed. The work table Tw is moved by the guide mechanism Gd in the transport direction (X direction in Fig. 1) while the work plate Pw is fixed. The work table Tw may be a so-called porous chuck or vacuum chuck.

The work table Tw may have a structure in which a mechanism (not shown) capable of finely moving the loaded workpiece Pw in the X direction, the Y direction, the Z direction, and the θ direction is incorporated. Thus, the work table Tw can adjust the positional deviation of the workpiece Pw.

The configuration of the holding member for fixing the convex plate Pr and the work plate Pw is the same as that of the above-described [2. Configuration of the table (holding member)].

[2. Configuration of table (holding member)

3 to 6, the configuration of the holding member of the master table Tm and the configuration of the holding member of the work table Tw according to the present embodiment will be mainly described. Since the holding member of the master table Tm and the holding member of the work table Tw use the same configuration, the holding member of the work table Tw will be described below, and the master table Tm The description of the holding member of the second embodiment will be omitted.

3 (a) is a schematic external view for explaining an example of the holding member 10A of the printing apparatus 100 according to the present embodiment. 3B is a schematic external view for explaining another example 10B of the holding member of the printing apparatus 100 according to the present embodiment. 4 is an exploded view illustrating an example of the holding member 10A. 5 is an exploded view explaining another example 10B of the holding member.

6A is a schematic contour diagram showing the surface shape (surface roughness) of one porous plate (for example, reference numeral 11 in FIG. 3A) of the holding member. 6B is a schematic contour diagram showing the surface shape (surface roughness) of another porous plate (for example, reference numeral 12 in FIG. 3A) of the holding member.

Further, the holding member (and the porous plate) according to the present embodiment is not limited to those shown in Figs. 3 to 6. That is, the porous plate of the holding member according to the present embodiment can be appropriately changed in accordance with the dimensional accuracy at the time of printing and the specification (shape, size, weight, etc.) of the work plate to be printed. 3 (a) and Fig. 4 show examples of two porous plates, the holding member according to the present embodiment is not limited to two sheets of porous plates. That is, the holding member according to the present embodiment may be constructed by stacking three or more porous plates and holding (or fixing) the work plate Pw or the convex plate Pc.

[2-1 Example of holding member (porous plate of two layers)]

3 (a), the work table Twa and the master table Tma are provided with a holding member 10A and a frame member 20A.

As shown in Fig. 3 (a) and Fig. 4, the holding member 10A is a two-layered porous plate, which comprises a first porous plate 11 and a second porous plate (Porous plate) 12. 4, the holding member 10A is stacked and disposed on a frame member 20A that holds (holds) the first porous plate 11 and the second porous plate 12 . Further, the first porous plate 11 is disposed on the side (outer side) in contact with the work plate Pw. The second porous plate (12) is disposed inside the first porous plate (11). The first porous plate 11 and the frame member 20A are arranged so as to be flush with each other. Further, the upper surface may be polished after the first porous plate 11 and the second porous plate 12 are disposed on the frame member 20A.

As shown in Fig. 4, the frame member 20A includes an opening forming the buffer portion 21a and an acute-power distributing portion 22a supplying and discharging gas inside the opening portion. The acute-dispensing portion 22a is a piping system for sucking the gas inside the buffer portion 21a or supplying the gas into the buffer portion 21a.

The hole diameters and plate thicknesses of the first porous plate 11 and the second porous plate 12 can be appropriately changed depending on the accuracy of the pattern at the time of printing and the specification (shape, size, weight, etc.) have. The pore diameters and the thicknesses of the first porous plate 11 and the second porous plate 12 may be those determined in advance in experiments or calculations. The pore diameters of the first porous plate 11 and the second porous plate 12 may be within a range of, for example, 0.01 탆 to 10 탆. The thicknesses of the first porous plate 11 and the second porous plate 12 may be within a range of, for example, 1 mm to 0.01 mm.

The first porous plate 11 may be an alumina porous body produced by, for example, plasma spraying or the like and having a thickness of 100 to 200 μm. The first porous plate 11 may be made of a conductive porous body to prevent adhesion of fine particles (for example, dust, dust) by static electricity. The second porous plate 12 may be a porous plate having a pore size of, for example, about # 100, and may have a plate thickness that is resistant to the load of the convex plate Pc and the work plate Pw do.

The work table Twa has a structure in which the interior of the buffer portion 21a is decompressed by sucking (for example, evacuating) the gas inside the buffer portion 21a by using the acute portion distributor 22a, The entire surface of the work plate Pw loaded on the work table Twa is sucked and fixed through the plates 11 and 12. The work table Twa releases the suction (fixation) of the work plate Pw loaded on the work table Twa by supplying the gas into the buffer portion 21a by using the acute portion distributor 22a . Thus, in the case of fixing the workpiece Pw such as a film or a sheet, for example, the workpiece table Twa is configured such that, at the time of printing, at the central portion of the workpiece Pw on which the pattern is printed, It is possible to prevent locally deviations of the position of the light guide plate Pw.

The holding member 10A according to the present embodiment has a structure in which the hole diameter of the first porous plate 11 on the side contacting the work plate Pw in the two porous plates is smaller than the hole diameter of the second porous plate 12 Diameter. When the pore diameter of the first porous plate 11 is made smaller than the pore diameter of the second porous plate 12, the surface roughness of the first porous plate 11 is, for example, as shown in Fig. 6 (a) , And the surface roughness of the second porous plate 12 is, for example, as shown in Fig. 6 (b). The work table Twa (printing apparatus 100) is configured such that when the work plate Pw such as a film or sheet is drawn (fixed), the first porous plate It is possible to prevent the unevenness of the surface of the porous body from being scattered by the workpiece Pw by reducing the hole diameter of the workpiece 11.

The holding member 10A according to the present embodiment has a structure in which the thickness of the first porous plate 11 on the side contacting the work plate Pw in the two porous plates is set to be larger than that of the second porous plate 12 It should be smaller than the plate thickness. The work table Twa (printing apparatus 100) thus reduces the hole diameter of the first porous plate 11 when the work plate Pw such as a film or a sheet is drawn (fixed) Since the thickness of the thickness plate is relatively small, the resistance of the fluid of the passing gas can be reduced. Further, the plan view of the work plate Pw can be secured by the plan view of the second porous plate 12 having a relatively large plate thickness. That is, the work table Twa (printing apparatus 100) sucks the work plate Pw using the first porous plate 11 and the second porous plate 12, and obtains a plan view of the work plate Pw It is possible to prevent the occurrence of defects in the pattern and to form a pattern of the electronic device with high precision.

In the holding member 10A according to the present embodiment, in the two-layered porous plate, the hole diameter of the first porous plate 11 on the side in contact with the work plate Pw is made small, (Such as dust) sucked (and attached) to the surface of the substrate 10A can be prevented. The holding member 10A according to the present embodiment can prevent the fine particles (such as dust) from being discharged from the inside to the surface of the holding member 10A by reducing the hole diameter of the first porous plate 11 . As a result, the work table Twa (printing apparatus 100) can prevent fine particles (such as dust) from being sandwiched between the first porous plate 11 and the work plate Pw, It is possible to form a pattern of a high-precision electronic device.

The master table Tma sucks the convex plate Pr using the first porous plate 11 and the second porous plate 12 in the same manner as the work table Twa described above, Lt; / RTI > Thereby, the master table Tma (printing apparatus 100) can form an inverted pattern used for forming a pattern of a high-precision electronic device.

[2-2 Other examples of holding member (porous plate of two layers and porous body of frame shape)] [

As shown in Fig. 3 (b), the work table Twb and the master table Tmb are provided with a holding member 10B and a frame member 20B.

As shown in Fig. 3 (b) and Fig. 5, the holding member 10B includes, in addition to the two porous plates (the first porous plate 11 and the second porous plate 12) And a frame-like porous body 13 as a porous plate. 5, the holding member 10B is made of the same material as that of the first porous plate 11 and the second porous plate 11, The first porous plate 11 is disposed on the side (outer side) of the frame plate 20B contacting (contacting) the work plate Pw. Further, the first porous plate 11, the frame-shaped porous body 13, and the frame member 20A are arranged so as to be coplanar. The top surface may be polished after the first porous plate 11, the second porous plate 12, and the frame-shaped porous body 13 are disposed on the frame member 20B.

The frame-shaped porous body 13 is disposed on the outer periphery of the two porous plates (the first porous plate 11 and the second porous plate 12). The pore diameter of the frame-shaped porous body 13 is larger than the pore diameter of the first porous plate (one porous plate) 11. Here, the hole diameter of the frame-shaped porous body 13 can be appropriately changed depending on the specification (shape, size, weight, etc.) of the work plate to be printed. In addition, the hole diameter of the frame-shaped porous body 13 may be a dimension previously determined in the experiment or calculation.

As shown in Fig. 5, the frame member 20B has an opening portion for forming the buffer portion 21b at a position corresponding to the frame-shaped porous body 13 and an opening portion for supplying and discharging the gas inside the opening portion 22b. The acute-power distributing unit 22b is a piping system for sucking the gas inside the buffer unit 21b or supplying the gas into the buffer unit 21b. As shown in Fig. 5, the frame member 20B is made of a laminate of the gas inside the buffer portion 21a (as in the above example [2-1 holding member (porous plate of two layers)]] And an acute power distributing portion 22a for supplying and exhausting air.

The work table Twb is a workpiece table Tw which is loaded on the work table Tw through the frame-like porous body 13 by sucking the gas inside the buffer portion 21b by using the acute- Pw are suctioned and fixed. Here, since the hole diameter of the frame-shaped porous body 13 is larger than the hole diameter of the first porous plate 11, the work table Twb has the same structure as the above- The workpiece Pw can be attracted (fixed) with a suction force larger than that of the holding member 10A of the workpiece Pw. Since the workpiece table Twb can attract (fix) the outer edge of the workpiece Pw with a large attractive force by using the frame-shaped porous body 13, It is possible to further prevent the workpiece Pw from being rolled up at the time of printing more than the holding member 10A of the holding plate 10A (porous plate of two layers). The work table Twb is constructed by supplying the frame-shaped porous body 13 with the gas by supplying the gas to the buffer portion 21b of the frame-like porous body 13 after the printing is finished by using the acute- The outer edge of the workpiece Pw can be lifted by the gas blown out via the workpiece Pw and the workpiece Pw can be easily removed.

Further, the master table Tmb sucks the convex plate Pr using the frame-shaped porous body 13, like the above-mentioned work table Twb.

As described above, according to the printing apparatus 100 (holding members 10A and 10B) of the present embodiment, the substrate (workpiece Pw) is fixed to the table 10A or 10B using the holding member 10A or 10B. (Tma or Twa, or Tmb or Twb). The printing apparatus 100 (holding members 10A, 10B) according to the present embodiment can suck and fix a substrate such as a film or a sheet which can not be fixed by, for example, a mechanical fixing method . Further, according to the printing apparatus 100 (the holding members 10A and 10B) of the present embodiment, the entire surface of the substrate can be sucked (fixed) by using the holding member 10A or 10B It is possible to prevent the position of the printed body from being locally deviated from the central portion of the printed body on which the pattern is printed, as compared with the case where the outer edge of the printed body such as a film or a sheet is fixed.

According to the printing apparatus 100 (the holding members 10A, 10B) of the present embodiment, by reducing the hole diameters of the first porous plates 11 on the side in contact with the substrate, It is possible to prevent the substrate from being sprinkled on the substrate. According to the printing apparatus 100 (the holding members 10A, 10B) of the present embodiment, by reducing the hole diameters of the first porous plates 11 on the side in contact with the substrate, the holding members 10A , 10B) and fine particles (such as dust) sandwiched between the objects to be printed can be reduced.

That is, according to the printing apparatus 100 of the electronic device pattern of the present embodiment, at least two porous plates are used to fix the substrate (workpiece Pw), and the porous plate It is possible to prevent the occurrence of defects in the printed pattern due to the unevenness of the porous surface being projected on the substrate. Thus, the printing apparatus 100 of the electronic device pattern according to the present embodiment can improve the printing property of the pattern of the electronic device.

[3. Example of Operation of Printing Apparatus]

An example of the operation of the printing apparatus (a method of printing an electronic device pattern) according to the embodiment of the present invention will be described with reference to Fig. Here, Fig. 7 is a flowchart for explaining an example of the operation of the printing apparatus 100 according to the present embodiment. Fig. 8 is an explanatory view for explaining an example of the printing result (experimental result) of the printing apparatus 100. Fig.

The printing apparatus 100 according to the present embodiment forms the reversal pattern PTb by partially removing the liquid film on the surface of the roller Bk from the convex plate Pc as described above with reference to Fig. An inversion printing method for transferring the reversal pattern PTb to the work plate Pw is used. This will be described in detail below.

As shown in Fig. 7, the printing apparatus 100 (Fig. 1) starts the printing operation based on the information input to the printing apparatus 100 in step S701. After the start, the printing apparatus 100 proceeds to step S702.

In step S702, the printing apparatus 100 holds (fixes) the convex plate Pc (Fig. 1) with the master table Tm as the convex plate holding step. Subsequently, in step S703, the printing apparatus 100 holds (fixes) the work plate Pw (Fig. 1) by the work table Tw as a work plate holding step. Thereafter, the printing apparatus 100 proceeds to step S704. Further, the method of fixing the convex plate Pc and the work plate Pw is the same as the method of [2. The configuration of the table (holding member)], the description is omitted.

In step S704, the printing apparatus 100 uses the ink coater Ict to form a liquid film (ink film) PTa on the surface of the roller Bk (Fig. 2 (a)). Thereafter, the printing apparatus 100 proceeds to step S705.

In step S705, the printing apparatus 100 moves the master table Tm holding (fixing) the convex plate Pc to the lower side of the roller Bk as an inversion pattern forming step. At this time, the printing apparatus 100 synchronizes the rotation of the roller Bk and the movement of the master table Tm to partially remove the liquid film from the convex portion Pca of the convex plate Pc, Thereby forming an inversion pattern PTb (Fig. 2 (b)). Thereafter, the printing apparatus 100 proceeds to step S706.

In step S706, the printing apparatus 100 moves the work table Tw holding the workpiece Pw under the roller Bk as a pattern printing step. At this time, the printing apparatus 100 synchronizes the rotation of the roller Bk with the movement of the work table Tw to transfer the reversal pattern PTb of the surface of the roller Bk to the surface of the workpiece Pw 2 (c) of Fig. 2]. That is, the printing apparatus 100 prints (forms) a desired pattern PTc on the surface of the workpiece Pw. Thereafter, the printing apparatus 100 proceeds to step S707.

In step S707, the printing apparatus 100 determines whether to end the printing operation. The printing apparatus 100 can determine whether to end the printing operation based on the information input to the printing apparatus 100, for example. If it is determined that the printing operation is to be ended, the printing apparatus 100 advances to END in the figure and ends the printing operation. When the printing operation is ended, the printing apparatus 100 moves the workpiece table Pw in the following process by moving the workpiece table Tw in a state where the workpiece Pw is sucked and fixed, do. If it is determined that the printing operation is not to end, the printing apparatus 100 returns to step S702 to repeat the printing operation.

(Experiment result)

In order to confirm the effect of the printing apparatus 100, an experiment for performing test printing on the surfaces of the substrates (Tst1, Tst2, and Tst3) was performed. For comparison, the surface roughness of the substrate Tst1 was reduced, the surface roughness of the substrate Tst2 was moderate, and the surface roughness of the substrate Tst3 was increased. The substrate Tst1 has an arithmetic mean roughness Ra (JIS B 0601-2001) of 0.1 占 퐉 and the substrate Tst2 has an arithmetic mean roughness Ra of 0.5 占 퐉, for example, For example, the arithmetic average roughness Ra is 5 mu m.

Fig. 8 shows an example of the printing result of the printing apparatus 100. As shown in Fig. The row Ph1 in Fig. 8 is a surface photograph (before printing) of the objects to be printed (Tst1, Tst2, Tst3). A row Ph2 in FIG. 8 is a result of printing a line-shaped print pattern on the objects to be printed (Tst1, Tst2, Tst3). A row Ph3 in FIG. 8 is a result of printing a dot-shaped print pattern on the objects to be printed (Tst1, Tst2, Tst3).

As shown in Fig. 8, the printing apparatus 100 can print a line-shaped print pattern and a dot-shaped print pattern with high precision in the subject Tst1 having a relatively small surface roughness in this experiment. On the other hand, in the printing apparatus 100, the accuracy of the line-shaped print pattern and the dot-shaped print pattern is lowered in the substrate Tst2 having a relatively rough surface roughness. In addition, the printing apparatus 100 can not print a line-shaped print pattern and a dot-shaped print pattern in the substrate Tst3 having a relatively large surface roughness.

That is, this experiment confirmed that the printability (dimensional accuracy of the printed pattern) depends on the surface roughness of the substrate when the reversal printing method is used. Further, in the case of using the reversal printing method, in the case where the surface shape of the member for holding (holding) the printed substrate (for example, a film-shaped substrate) has irregularities, It was confirmed that the printability was deteriorated when it became dark.

The printing apparatus 100 according to the present embodiment is characterized in that at least two porous plates are used to fix the substrate (workpiece Pw) and the porous plate on the side in contact with the substrate 11, it is possible to prevent the occurrence of defects in the print pattern due to the unevenness of the porous surface being projected onto the substrate. In the printing apparatus 100 according to the present embodiment, at least two porous plates are used to fix the substrate, and the hole diameter of the porous plate on the side in contact with the substrate corresponds to the printing precision (dimensional accuracy) The printing pattern can be printed with a desired dimensional accuracy (printing precision). Thus, the printing apparatus 100 of the electronic device pattern according to the present embodiment can improve the printing property and the productivity of the pattern of the electronic device.

The printing apparatus 100 according to the present embodiment has been described as using the reversed printing method, but the invention is not limited to this. For example, it can be used for fixation of the object to be printed when using a relief printing method, a gravure printing method, or a silk screen printing method. As the substrate to be printed, it is suitably used for a flexible plastic substrate such as PC or PET, but it may be used for a substrate other than a flexible substrate such as a glass substrate or a semiconductor substrate.

Although the present invention has been described with reference to the embodiments of the present invention, the present invention is not limited to the above-described embodiments, but can be variously modified or modified in accordance with the scope of the appended claims.

100: printing device of electronic device pattern
10A, 10B: holding member
11: First porous plate (one porous plate)
12: Second porous plate (other porous plate)
13: Third porous plate (frame-shaped porous body)
20A, 20B: frame member
21a and 21b:
22a and 22b:
31R:
31r:
Bk: Roller (roller transfer cylinder, etc.)
Bkp: roller support
Bks: Water repellent blanket
Gd: Linear guide (guide mechanism)
Ict: Ink Coater
Itk: Ink tank
PTa: liquid film (ink film, etc.)
PTb: Inversion pattern
PTc: pattern (print pattern, etc.)
Pc: relief plate (master plate, etc.)
Pca: convex part of the relief plate
Pw: work plate (printed body, etc.)
Tm, Tma, Tmb: master table (first table)
Tw, Twa, Twb: Work table (second table)

Claims (9)

A printing apparatus for an electronic device pattern,
A table on which a holding member for holding a work plate is mounted,
And a moving mechanism for applying ink to the work plate by relatively moving the table,
Wherein the holding member includes at least two porous plates, and the work plate is sucked and fixed through the two porous plates,
Wherein the porous plate of the two layers has a hole diameter of one porous plate on the side in contact with the work plate is smaller than a hole diameter of the other porous plates. The printing apparatus according to claim 1, wherein the thickness of the one porous plate is smaller than the thickness of the other porous plate. 3. The apparatus according to claim 1 or 2, further comprising: two holding members and two tables,
And the two tables mount two of the holding members, respectively. The porous member according to claim 1 or 2, wherein the holding member further comprises a frame-shaped porous body on an outer periphery of the two-layered porous plate,
The hole diameter of the frame-shaped porous body is larger than the hole diameter of the one porous plate,
Wherein the frame-shaped porous body fixes the outer edge of the work plate. The printing apparatus according to claim 1 or 2, wherein the table is detachable to the guide mechanism with the holding member mounted thereon. The electronic device according to claim 1 or 2, characterized in that an inverted pattern is formed by partially removing the liquid film on the surface of the roller from the relief plate, and then the inverted pattern is transferred to the work plate Device. A holding member of a work plate used in a printing apparatus of an electronic device pattern,
Wherein at least two porous plates are provided, the work plate is sucked and fixed through the two porous plates,
Wherein the porous plate of the two-layer porous plate has a hole diameter of one porous plate on the side in contact with the work plate, which is smaller than a hole diameter of the other porous plates. A method of printing an electronic device pattern,
A convex-concave holding step of holding a convexoil having a concavo-convex surface shape in a first table;
A work plate holding step of holding the work plate in the second table,
An inverted pattern forming step of moving the first table holding the relief plate to the lower side of the roller so as to partially remove the liquid film from the convex portion of the surface shape of the concave and convex,
And a pattern printing step of transferring the reversal pattern onto the surface of the work plate by moving the second table holding the work plate below the roller,
Wherein the workpiece holding step uses a holding member having at least two porous plates to suck and fix the work plate through the two porous plates,
Wherein the porous plate of the two layers is characterized in that the pore diameter of one porous plate on the side in contact with the work plate is smaller than the pore diameter of the other porous plates. 9. The method according to claim 8, wherein the holding member further comprises a frame-like porous body on an outer periphery of the two-layered porous plate,
The hole diameter of the frame-shaped porous body is larger than the hole diameter of the one porous plate,
Wherein the workpiece holding step uses the frame-shaped porous body to further fix the outer edge of the work plate.
KR1020150154326A 2014-11-04 2015-11-04 Apparatus of printing electronic device pattern and method of printing the same KR20160052446A (en)

Applications Claiming Priority (2)

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JPJP-P-2014-224423 2014-11-04
JP2014224423A JP6112620B2 (en) 2014-11-04 2014-11-04 Electronic device pattern printing apparatus and printing method therefor

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US6700535B2 (en) * 2001-06-01 2004-03-02 Texas Instruments Incorporated Location estimation in narrow bandwidth wireless communication systems
JP2003057426A (en) * 2001-08-08 2003-02-26 Koji Onuma Method for manufacturing color filter
JP2006205470A (en) * 2005-01-26 2006-08-10 Mitsubishi Heavy Ind Ltd Monochromatic printing machine and its operating method
JP4740656B2 (en) * 2005-06-21 2011-08-03 シーケーディ株式会社 Porous plate and method for producing the same
JP2011088298A (en) * 2009-10-20 2011-05-06 Hitachi Metals Ltd Screen printing accessory plate and screen printer using the same
JP5869250B2 (en) * 2011-07-26 2016-02-24 東京エレクトロン株式会社 Printing apparatus, printing method, and computer-readable recording medium recording a program for executing the printing method

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