JP6112620B2 - Electronic device pattern printing apparatus and printing method therefor - Google Patents

Description

  The present invention relates to an electronic device pattern printing apparatus and a printing method thereof.

  As a method for forming a pattern of an electronic device, a printing method has been proposed. In recent years, the pattern of an electronic device is required to have high dimensional accuracy, for example, with the miniaturization of a pixel of a liquid crystal display. Further, a reverse printing method has been proposed as a method for printing a pattern with high dimensional accuracy.

  In Patent Document 1, as a reversal printing method, first, ink is applied to the surface of a roller transfer cylinder (roller), then the roller transfer cylinder is rotated on a letterpress (master plate) to remove a part of the ink, and then A technique for transferring ink remaining on the surface of a roller transfer cylinder to a printing medium (work board) is disclosed.

JP-A-11-58921

  However, Patent Document 1 does not describe a method for fixing the printing medium. Further, in the technique disclosed in Patent Document 1, when the outer edge of a printed material such as a film or sheet is sandwiched and fixed, the printing is performed at the center of the printed material on which a pattern is printed. The body position may shift locally. Furthermore, in the technique disclosed in Patent Document 1, when the entire surface of a printed material such as a film or sheet is sucked (fixed) with a porous material, the pattern is affected by the unevenness of the surface of the porous material. In some cases, unevenness may appear at the center of the substrate to be printed. That is, with the technique disclosed in Patent Document 1, there is a case where the high dimensional accuracy required for printing the pattern of the electronic device cannot be realized.

  In view of the above circumstances, the present invention provides a printing apparatus or printing method capable of improving the printability of a pattern of an electronic device by fixing a work board using at least two layers of porous boards. For the purpose.

According to one aspect of the present invention, there is provided an electronic device pattern printing apparatus, wherein a table on which a holding member that holds a work board is mounted, and ink is applied to the work board by relatively moving the table. The holding member includes at least two layers of porous plates, and the work plate is sucked and fixed through the two layers of porous plates, and the two layers of porous plates in quality plate, the pore size of the one porous plate on the side in contact with the workpiece plate is rather smaller than the pore size of the other porous plate, said holding member, a porous frame shape on the outer periphery of the porous plate of the two layers The frame-shaped porous body has a pore diameter larger than that of the one porous plate, and the frame-shaped porous body fixes an outer edge of the work plate. the printing apparatus of the electronic device pattern is provided The electronic device pattern printing apparatus may include two holding members and two tables, and the two tables each include two holding members. The holding member further includes a frame-shaped porous body on an outer periphery of the two-layer porous plate, and the pore diameter of the frame-shaped porous body is larger than the hole diameter of the one porous plate, and the frame shape The porous body may be an electronic device pattern printing apparatus that fixes an outer edge of the work plate. The table may be an electronic device pattern printing apparatus that is detachable from the guide mechanism with the holding member mounted thereon.

  The liquid film on the surface of the roller may be partially removed with a relief plate to form a reverse pattern, and then the reverse pattern may be transferred to a work plate.

According to another aspect of the present invention, there is provided a workpiece plate holding member used in an electronic device pattern printing apparatus, comprising at least two layers of porous plates, and the workpieces interposed through the two layers of porous plates. plates to fix the suction, the porous plate of the two layers, the pore size of the one porous plate on the side in contact with the workpiece plate is rather smaller than the pore size of the other porous plate, the holding member, the 2 A frame-shaped porous body is further provided on the outer periphery of the porous plate of the layer, and the pore diameter of the frame-shaped porous body is larger than the hole diameter of the one porous plate; A work plate holding member for fixing the outer edge of the work plate is provided.

According to another aspect of the present invention, there is provided a printing method for an electronic device pattern, in which a relief plate having an uneven surface shape is held by a first table, and a work plate is held by a second table. A work plate holding step, a reversal pattern forming step in which the first table holding the relief plate is moved below a roller, and a liquid film is partially removed by the convex portions of the uneven surface shape, and the work plate And a pattern printing step of transferring a reverse pattern onto the surface of the work plate, the work plate holding step comprising at least two layers of porous plates. Using the holding member provided, the work plate is sucked and fixed through the two-layer porous plate, and the one porous layer on the side in contact with the work plate in the two-layer porous plate Pore diameter of the plate is rather smaller than the pore size of the other porous plate, wherein the holding member further comprises a porous body frame shape on the outer periphery of the porous plate of the two layers, the pore size of the porous body of the frame shape And printing the electronic device pattern , wherein the work plate holding step further fixes the outer edge of the work plate using the frame-shaped porous body. A method is provided.

  The holding member further includes a frame-shaped porous body on an outer periphery of the two-layer porous plate, and the work plate has a pore diameter larger than that of the one porous plate. The holding step may be an electronic device pattern printing method, wherein the outer edge of the work plate is further fixed using the frame-shaped porous body.

  According to the electronic device pattern printing apparatus or the printing method therefor according to the present invention, it is possible to improve the printability of the electronic device pattern by fixing the work plate using at least two porous plates.

1 is a schematic external view illustrating an example of an electronic device pattern printing apparatus according to an embodiment of the present invention. It is explanatory drawing explaining the printing method of the printing apparatus of the electronic device pattern which concerns on embodiment of this invention. 1 is a schematic external view illustrating an example of a holding member of an electronic device pattern printing apparatus according to an embodiment of the present invention. It is an exploded view explaining the example (2 layer porous board) of the holding member of the printing apparatus of the electronic device pattern which concerns on embodiment of this invention. It is an exploded view explaining the other example (2 layer porous board and frame-shaped porous body) of the holding member of the printing apparatus of the electronic device pattern which concerns on embodiment of this invention. It is a holding member of the electronic device pattern printing apparatus which concerns on embodiment of this invention, Comprising: It is explanatory drawing explaining the surface shape of a porous board. It is a flowchart explaining an example of operation | movement of the printing apparatus of the electronic device pattern which concerns on embodiment of this invention. It is explanatory drawing explaining an example of the printing result of the printing apparatus of the electronic device pattern which concerns on embodiment of this invention.

  An embodiment of the present invention will be described using an electronic device pattern printing apparatus (hereinafter referred to as “printing apparatus 100”) according to a non-limiting exemplary embodiment with reference to the accompanying drawings. In the present embodiment, other than the printing apparatus 100 described below, a pattern (apparatus, apparatus, unit, system) that transfers a pattern formed on the surface of a roller (for example, a roller transfer cylinder) to a predetermined surface (for example, a work plate) Etc.) can be used.

  In the following description, the same or corresponding devices, parts, or members described in all the attached drawings are denoted by the same or corresponding reference numerals, and redundant description is omitted. Also, the drawings are not intended to show a limited relationship between devices, parts or members unless specifically described. Accordingly, specific correlations can be determined by one skilled in the art in light of the following non-limiting embodiments.

  The present embodiment will be described in the following order using the printing apparatus 100 according to an embodiment of the present invention.

1. 1. Configuration of printing apparatus Structure of table (holding member) 2-1 Example of holding member (two-layer porous plate)
2-2 Other examples of holding member (two-layer porous plate and frame-shaped porous body)
3. Example of operation of printing apparatus [1. Configuration of printing device]
A printing apparatus 100 according to the present embodiment will be described with reference to FIGS. 1 and 2. Here, FIG. 1 is a schematic external view for explaining an example of the printing apparatus 100. FIG. 2 is an explanatory diagram for explaining a printing method of the printing apparatus 100. The printing apparatus 100 illustrated in FIG. 1 is an example, and the printing apparatus according to the present embodiment is not limited to the one illustrated in FIG.

  In FIG. 1, the X direction is a direction in which a table (a master table Tm and a work table Tw described later) is moved. The Y direction is a direction orthogonal to the X direction, and is a width direction of the master table Tm or the like. The Z direction is a vertical direction (a direction orthogonal to the X direction and the Y direction). The θ direction is a rotation direction around the Z axis.

  The printing apparatus 100 is an apparatus that uses a method (reverse printing method) in which a liquid film on the surface of a roller is partially removed with a relief plate to form a reversal pattern, and then the reversal pattern is transferred to a work board. That is, the printing apparatus 100 forms a reverse pattern on the surface of the roller by synchronizing the rotation operation of the roller and the rectilinear operation of the relief printing plate (master plate), and the rotation operation of the roller and the rectilinear operation of the work plate (printed body). Are printed (transferred) on the substrate to be reversed.

  The printing apparatus 100 can be used as a printing machine, for example, when manufacturing a pattern of an electronic device (printed electronics device or the like). Further, the printing apparatus 100 can be used as a semiconductor manufacturing apparatus that is used, for example, when a pattern such as a line and space is formed on a substrate (semiconductor substrate) in a semiconductor manufacturing process.

  As shown in FIG. 1, the printing apparatus 100 forms a roller (roller transfer cylinder, transfer roller, etc.) Bk that is rotatably supported by a roller support Bkp, and a liquid film (for example, an ink film) on the surface of the roller Bk. An ink coater Ict. Further, the printing apparatus 100 includes a master table (first table) Tm that holds a relief plate Pr that forms a reverse pattern, and a work table (second table) Tw that holds a work plate Pw onto which the reverse pattern is transferred. . Furthermore, the printing apparatus 100 includes a guide mechanism Gd that moves the master table Tm and the work table Tw below the roller Bk (X direction in the drawing), and a rotation drive unit 31R that rotates the roller Bk. The master table Tm and the work table Tw may be configured to be detachable from the guide mechanism Gd.

  As shown in FIG. 2A, in the present embodiment, the printing apparatus 100 rotates the roller Bk using the rotation driving unit 31R, and uses the ink coater Ict to apply the liquid (ink) in the ink tank Itk to the roller Bk. Supply to the surface. Specifically, the printing apparatus 100 sets a predetermined distance between the tip of the ink coater Ict and the surface of the roller Bk, rotates the roller Bk in the direction Ra in the drawing, and forms a desired region on the surface of the roller Bk. A liquid (ink) is supplied at a desired film thickness. At this time, the printing apparatus 100 forms the liquid film PTa on the surface of the roller Bk.

  Next, as shown in FIG. 2B, the printing apparatus 100 moves the relief printing plate Pr in the X direction (Mb in the drawing) using the guide mechanism Gd, and the roller Bk that rotates in the Rb direction in the drawing. The convex portions Pra of the relief plate Pr are sequentially brought into contact with the surface. At this time, the liquid film PTa on the surface of the roller Bk is partially removed. That is, the printing apparatus 100 forms the reverse pattern PTb on the surface of the roller Bk.

  Next, as shown in FIG. 2C, the printing apparatus 100 moves the work plate Pw in the X direction (Mc in the drawing) using the guide mechanism Gd, and the roller Bk that rotates in the Rc direction in the drawing. The reverse pattern PTb on the surface is brought into contact with the surface of the work plate Pw. At this time, the reverse pattern PTb is transferred to the surface of the work plate Pw. That is, the printing apparatus 100 forms the pattern PTc on the surface of the work board Pw (printed body).

  As a result, the printing apparatus 100 can print (transfer) a desired pattern (PTc) on the substrate to be printed (the surface of the work board Pw).

  The roller Bk is a rotating body that transfers the reverse pattern PTb to the work plate Pw. The reverse pattern PTb is formed on the surface of the roller Bk by the relief printing plate Pr.

  In this embodiment, the roller Bk uses a cylinder in which a silicone water-repellent blanket Bks (FIG. 2) is wound around the outer periphery of the roller Bk. The roller Bk is rotatably supported on the rotation center shaft 31r (FIG. 2). The roller Bk is rotated about the rotation center shaft 31r by the rotation of the rotation drive unit 31R. The roller Bk may be configured to rotate the water-repellent blanket Bks in a non-interlocking manner using a pinion, a clutch, a speed reducer (not shown), or the like.

  The relief plate Pr is a plate (such as a master plate) having an uneven surface shape. As the relief Pr, a flat plate is used in this embodiment. Further, the relief plate Pr is placed on the master table Tm. Furthermore, the relief plate Pr is moved in the X direction (FIG. 2) by the guide mechanism Gd.

  The relief plate Pr is formed with a projection portion Pra corresponding to the reverse pattern of the pattern printed on the work plate Pw on the surface thereof. In addition, the letterpressor Pr partially removes the liquid (ink) from the liquid film (PTa in FIG. 2) on the surface of the roller Bk by bringing the convex part Pra into contact with the surface of the roller Bk. PTb).

  The work board Pw is a substrate to be printed. In the present embodiment, the work plate Pw uses a printed material such as a film or a sheet. The work plate Pw is placed on the work table Tw. Further, the work plate Pw is moved in the X direction (FIG. 2) by the guide mechanism Gd.

  A reverse pattern (PTb in FIG. 2) formed on the surface of the roller Bk is transferred to the work plate Pw. That is, a desired pattern (PTc in FIG. 2) is printed on the work plate Pw.

  The guide mechanism Gd is a mechanism for moving the master table Tm and the work table Tw below the roller Bk (X direction in FIG. 1). In this embodiment, the guide mechanism Gd uses a linear guide. As the guide mechanism Gd, a known mechanism that can move the master table Tm or the like may be used.

  The master table Tm is for placing the relief plate Pr and fixing the relief plate Pr. The master table Tm uses a holding member (10A in FIG. 3 (a) or 10B in FIG. 3 (b) described later) provided with at least two layers of porous plates via two layers of porous plates. The relief printing Pr is sucked and fixed. Further, the master table Tm is moved in the transport direction (X direction in FIG. 1) by the guide mechanism Gd with the relief Pr being fixed. As the master table Tm, a so-called porous chuck or vacuum chuck may be used.

  Note that the master table Tm may have a configuration in which a mechanism (not shown) capable of finely moving the mounted relief plate Pr in the X direction, the Y direction, the Z direction, and the θ direction is incorporated. Thereby, the master table Tm can adjust the positional deviation of the relief Pr.

  The work table Tw is for mounting the work plate Pw and fixing the work plate Pw. The work table Tw uses a holding member (10A in FIG. 3 (a) or 10B in FIG. 3 (b) described later) provided with at least two layers of porous plates via the two layers of porous plates. The work plate Pw is sucked and fixed. Further, the work table Tw is moved in the transport direction (X direction in FIG. 1) by the guide mechanism Gd with the work plate Pw fixed. As the work table Tw, a so-called porous chuck or vacuum chuck may be used.

  The work table Tw may have a configuration in which a mechanism (not shown) that can finely move the placed work plate Pw in the X direction, the Y direction, the Z direction, and the θ direction may be incorporated. Thereby, the work table Tw can adjust the position shift of the work board Pw.

  The structure of the holding member that fixes the relief Pr and the work plate Pw will be described later [2. The structure of the table (holding member)] will be described.

[2. Configuration of table (holding member)]
The configuration of the holding member of the master table Tm and the configuration of the holding member of the work table Tw according to the present embodiment will be mainly described with reference to FIGS. Since the holding member of the master table Tm and the holding member of the work table Tw are of the same configuration, in the following description, the holding member of the work table Tw will be described, and the description of the holding member of the master table Tm will be omitted. .

  Here, FIG. 3A is a schematic external view illustrating an example (10A) of the holding member of the printing apparatus 100 according to the present embodiment. FIG. 3B is a schematic external view illustrating another example (10B) of the holding member of the printing apparatus 100 according to the present embodiment. FIG. 4 is an exploded view illustrating an example (10A) of the holding member. FIG. 5 is an exploded view for explaining another example (10B) of the holding member.

  FIG. 6A is a schematic contour diagram showing the surface shape (surface roughness) of one porous plate (for example, 11 in FIG. 3A) of the holding member. FIG. 6B is a schematic contour diagram showing the surface shape (surface roughness) of another porous plate (for example, 12 in FIG. 3A) of the holding member.

  Note that the holding member (and the porous plate) according to the present embodiment is not limited to those shown in FIGS. 3 to 6. That is, the porous plate of the holding member according to the present embodiment can be appropriately changed according to the dimensional accuracy at the time of printing and the specifications (shape, size, weight, etc.) of the work plate to be printed. 3A and 4 show an example of two porous plates, the holding member according to the present embodiment is not limited to two porous plates. . That is, the holding member according to the present embodiment may be a member in which three or more porous plates are stacked to hold (or fix) the work plate Pw or the relief plate Pc.

[2-1 Example of holding member (two-layer porous plate)]
As shown in FIG. 3A, the work table Twa and the master table Tma include a holding member 10A and a frame member 20A.

  As shown in FIGS. 3A and 4, the holding member 10 </ b> A includes a first porous plate (one porous plate) 11 and a second porous plate (others) as two layers of porous plates. The porous plate) 12 is provided. Further, as shown in FIG. 4, the holding member 10 </ b> A is stacked on the frame member 20 </ b> A that fixes (holds) the first porous plate 11 and the second porous plate 12. The first porous plate 11 is disposed on the side (outside) in contact with the work plate Pw. The second porous plate 12 is disposed inside the first porous plate 11. The first porous plate 11 and the frame member 20A are arranged so as to be on the same plane. Further, the upper surface may be polished after the first porous plate 11 and the second porous plate 12 are arranged on the frame member 20A.

  As shown in FIG. 4, the frame member 20 </ b> A includes an opening that forms the buffer portion 21 a and an air supply / exhaust portion 22 a that supplies and exhausts gas inside the opening. The air supply / exhaust unit 22a is a piping system that sucks gas inside the buffer unit 21a or supplies gas into the buffer unit 21a.

  The hole diameter and plate thickness of the first porous plate 11 and the second porous plate 12 depend on the accuracy of the pattern at the time of printing and the specifications (shape, size, weight, etc.) of the work plate to be printed, It can be changed as appropriate. Moreover, the hole diameter and board thickness of the 1st porous board 11 and the 2nd porous board 12 may use the dimension predetermined by experiment or calculation. Furthermore, the pore diameters of the first porous plate 11 and the second porous plate 12 may be, for example, in the range of 0.01 μm to 10 μm. The plate thicknesses of the first porous plate 11 and the second porous plate 12 may be in the range of 1 mm to 0.01 mm, for example.

  The first porous plate 11 is an alumina porous body manufactured by, for example, plasma spraying or the like, and a plate having a thickness of 100 to 200 μm may be used. The first porous plate 11 may use a conductive porous body to prevent adhesion of fine particles (for example, dust, dust, dust, dust) due to electrostatic charging. The second porous plate 12 may be a porous plate having pores of about # 100, for example, and may have a plate thickness that is resistant to deformation with respect to the loads of the relief plate Pc and the work plate Pw.

  The work table Twa uses the air supply / exhaust part 22a to suck in (for example, vacuum) the gas inside the buffer part 21a, thereby depressurizing the inside of the buffer part 21a, and the two-layer porous plate (11, 12). Then, the entire surface of the work plate Pw placed on the work table Twa is sucked and fixed. Further, the work table Twa releases the suction (fixation) of the work plate Pw placed on the work table Twa by supplying gas into the buffer unit 21a using the air supply / exhaust unit 22a. As a result, when the work table Twa is fixed to a work plate Pw such as a film or sheet, for example, the position of the work plate Pw is locally at the center of the work plate Pw on which a pattern is printed during printing. It is possible to prevent deviation.

  In the two-layer porous plate, the holding member 10 </ b> A according to the present embodiment makes the hole diameter of the first porous plate 11 on the side in contact with the work plate Pw smaller than the hole diameter of the second porous plate 12. When the pore diameter of the first porous plate 11 is smaller than the pore diameter of the second porous plate 12, the surface roughness of the first porous plate 11 is, for example, FIG. The surface roughness of the plate 12 is, for example, FIG. Thereby, when the work table Twa (printing apparatus 100) sucks (fixes) the work plate Pw such as a film or a sheet, the hole diameter of the first porous plate 11 on the side in contact with the work plate Pw is reduced. By doing so, it is possible to prevent the irregularities on the surface of the porous body from being raised on the work plate Pw.

  Further, in the holding member 10A according to the present embodiment, in the two-layer porous plate, the thickness of the first porous plate 11 on the side in contact with the work plate Pw is smaller than the thickness of the second porous plate 12. To do. Accordingly, when the work table Twa (printing apparatus 100) sucks (fixes) a work plate Pw such as a film or a sheet, the plate thickness is compared even if the hole diameter of the first porous plate 11 is reduced. Therefore, the resistance of the gas fluid passing therethrough can be reduced. Furthermore, the flatness of the work plate Pw can be ensured by the flatness of the second porous plate 12 having a relatively large plate thickness. That is, the work table Twa (printing apparatus 100) can suck the work plate Pw using the first porous plate 11 and the second porous plate 12, and maintain the flatness of the work plate Pw. The occurrence of pattern defects can be prevented, and a highly accurate electronic device pattern can be formed.

  Furthermore, in the holding member 10A according to the present embodiment, in the two-layer porous plate, by reducing the hole diameter of the first porous plate 11 on the side in contact with the work plate Pw, the holding member 10A is externally applied to the surface of the holding member 10A. Fine particles (such as dust) that are sucked (and attached) can be prevented. In addition, the holding member 10A according to the present embodiment can prevent fine particles (such as dust) from being discharged from the inside to the surface of the holding member 10A by reducing the hole diameter of the first porous plate 11. it can. Accordingly, the work table Twa (printing apparatus 100) can prevent fine particles (such as dust) from being sandwiched between the first porous plate 11 and the work plate Pw. Generation | occurrence | production can be prevented and the pattern of a highly accurate electronic device can be formed.

  The master table Tma can suck the relief plate Pr using the first porous plate 11 and the second porous plate 12 and maintain the flatness of the relief plate Pr in the same manner as the work table Twa. it can. Thereby, the master table Tma (printing apparatus 100) can form a reverse pattern used for forming a pattern of a highly accurate electronic device.

[2-2 Other examples of holding member (two-layer porous plate and frame-shaped porous body)]
As shown in FIG. 3B, the work table Twb and the master table Tmb include a holding member 10B and a frame member 20B.

  As shown in FIGS. 3B and 5, the holding member 10 </ b> B includes a third porous plate in addition to the two-layered porous plate (first porous plate 11 and second porous plate 12). And a frame-shaped porous body 13. In addition, as shown in FIG. 5, the holding member 10B includes a first porous plate 11 and a second porous plate (similar to the above [2-1 Example of holding member (two-layer porous plate)]). It arrange | positions at the frame member 20B which fixes (hold | maintains) the mass board 12, and the 1st porous board 11 is arrange | positioned at the side (outside) which touches the workpiece | work board Pw. The first porous plate 11, the frame-shaped porous body 13, and the frame member 20A are arranged to be on the same plane. Alternatively, the upper surface may be polished after the first porous plate 11, the second porous plate 12, and the frame-shaped porous body 13 are arranged on the frame member 20B.

  The frame-shaped porous body 13 is disposed on the outer periphery of a two-layered porous plate (first porous plate 11 and second porous plate 12). The pore size of the frame-shaped porous body 13 is larger than the pore size of the first porous plate (one porous plate) 11. Here, the hole diameter of the frame-shaped porous body 13 can be appropriately changed according to the specifications (shape, size, weight, etc.) of the work board to be printed. Further, the pore diameter of the frame-shaped porous body 13 may be a dimension determined in advance by experiment or calculation.

  As shown in FIG. 5, the frame member 20 </ b> B includes an opening for forming the buffer portion 21 b at a position corresponding to the frame-shaped porous body 13, and an air supply / exhaust portion 22 b for supplying and exhausting gas inside the opening. In addition. The air supply / exhaust unit 22b is a piping system that sucks gas inside the buffer unit 21b or supplies gas into the buffer unit 21b. As shown in FIG. 5, the frame member 20 </ b> B is configured to supply / exhaust gas inside the buffer portion 21 a (similar to [2-1 Example of holding member (two-layer porous plate)]). The exhaust part 22a is provided.

  The work table Twb sucks the outer edge of the work plate Pw placed on the work table Tw through the frame-shaped porous body 13 by sucking the gas inside the buffer part 21b using the air supply / exhaust part 22b. And fix. Here, since the hole diameter of the frame-shaped porous body 13 is larger than the hole diameter of the first porous plate 11, the work table Twb has the above [2-1 Example of holding member (two-layer porous plate)]. The work plate Pw can be sucked (fixed) with a suction force larger than that of the holding member 10A. Further, since the work table Twb can suck (fix) the outer edge of the work plate Pw with a large suction force using the frame-shaped porous body 13, the above [2-1 Example of Holding Member (2 Layers) It is possible to further prevent the workpiece plate Pw from rolling up during printing than the holding member 10A of the porous plate)]. Further, the work table Twb is ejected through the frame-shaped porous body 13 by supplying gas to the buffer section 21b of the frame-shaped porous body 13 after the printing is completed using the air supply / exhaust section 22b. The outer edge of the work plate Pw can be lifted by the gas to be performed, and the work plate Pw can be easily removed.

  The master table Tmb sucks the relief Pr using the frame-shaped porous body 13 in the same manner as the work table Twb.

  As described above, according to the printing apparatus 100 (holding members 10A and 10B) according to the present embodiment, the printing medium (work plate Pw) is placed on the table (Tma or Twa) or the holding member (10A or 10B). , Tmb or Twb). According to the printing apparatus 100 (holding members 10A and 10B) according to the present embodiment, it is possible to suck and fix a printed material such as a film or a sheet that cannot be fixed by a mechanical fixing method, for example. . Further, according to the printing apparatus 100 (holding members 10A and 10B) according to the present embodiment, the entire surface of the printing medium can be sucked (fixed) using the holding member (10A or 10B), so that the film shape Or compared with the case where it fixes by pinching | interposing the outer edge of a to-be-printed body, such as a sheet form, it can prevent that the position of a to-be-printed body shifts locally in the center part of the to-be-printed body on which a pattern is printed .

  Furthermore, according to the printing apparatus 100 (holding members 10A and 10B) according to the present embodiment, by reducing the pore diameter of the first porous plate (11) on the side in contact with the printing body, It is possible to prevent unevenness from being raised on the substrate. In addition, according to the printing apparatus 100 (holding members 10A and 10B) according to the present embodiment, the holding member (10A, 10A, 10B, 10B) and the fine particles (dust etc.) sandwiched between the printing medium and the printing medium can be reduced.

  In other words, according to the electronic device pattern printing apparatus 100 according to the present embodiment, the substrate to be printed (work plate Pw) is fixed using at least two layers of porous plates, and the porous on the side in contact with the substrate to be printed is used. By reducing the pore diameter of the material plate (11), it is possible to prevent the occurrence of defects in the printing pattern due to the unevenness of the porous surface being raised on the substrate. Thereby, according to the electronic device pattern printing apparatus 100 according to the present embodiment, the printability of the electronic device pattern can be improved.

[3. Example of printer operation]
An example of the operation of the printing apparatus according to the embodiment of the present invention (electronic device pattern printing method) will be described with reference to FIG. Here, FIG. 7 is a flowchart for explaining an example of the operation of the printing apparatus 100 according to the present embodiment. FIG. 8 is an explanatory diagram illustrating an example of a printing result (experimental result) of the printing apparatus 100.

  As described with reference to FIG. 2, the printing apparatus 100 according to the present embodiment forms the reverse pattern PTb by partially removing the liquid film on the surface of the roller Bk with the relief plate Pc. A reversal printing method for transferring to the plate Pw is used. This will be specifically described below.

  As illustrated in FIG. 7, the printing apparatus 100 (FIG. 1) starts a printing operation based on information input to the printing apparatus 100 in step S701. After the start, the printing apparatus 100 proceeds to step S702.

  In step S702, as a relief holding step, the printing apparatus 100 holds (fixes) the relief Pc (FIG. 1) with the master table Tm. Next, in step S703, the printing apparatus 100 holds (fixes) the work board Pw (FIG. 1) on the work table Tw as a work board holding step. Thereafter, the printing apparatus 100 proceeds to step S704. The method of fixing the relief plate Pc and the work plate Pw is described in [2. Since the method is the same as that described in [Configuration of table (holding member)], the description thereof is omitted.

  In step S704, the printing apparatus 100 uses the ink coater Ict to form a liquid film (ink film) PTa on the surface of the roller Bk (FIG. 2A). Thereafter, the printing apparatus 100 proceeds to step S705.

  In step S705, the printing apparatus 100 moves the master table Tm holding (fixing) the relief plate Pc below the roller Bk as a reverse pattern forming step. At this time, the printing apparatus 100 synchronizes the rotation of the roller Bk and the movement of the master table Tm, partially removes the liquid film by the convex portion Pca of the relief plate Pc, and forms the reverse pattern PTb on the surface of the roller Bk. (FIG. 2 (b)). Thereafter, the printing apparatus 100 proceeds to step S706.

  In step S706, the printing apparatus 100 moves the work table Tw holding (fixed) the work board Pw below the roller Bk as a pattern printing step. At this time, the printing apparatus 100 synchronizes the rotation of the roller Bk and the movement of the work table Tw, and transfers the reverse pattern PTb on the surface of the roller Bk to the surface of the work plate Pw (FIG. 2C). That is, the printing apparatus 100 prints (forms) a desired pattern PTc on the surface of the work board Pw. Thereafter, the printing apparatus 100 proceeds to step S707.

  In step S707, the printing apparatus 100 determines whether to end the printing operation. The printing apparatus 100 can determine whether or not to end the printing operation based on information input to the printing apparatus 100, for example. If it is determined that the printing operation is to be ended, the printing apparatus 100 proceeds to END in the drawing and ends the printing operation. When the printing apparatus 100 finishes the printing operation, the printing apparatus 100 may transport the work board Pw by moving the work table Tw in a state where the work board Pw is sucked and fixed to a subsequent process. . If it is determined that the printing operation is not terminated, the printing apparatus 100 returns to step S702 and repeats the printing operation.

(Experimental result)
In order to confirm the effect of the printing apparatus 100, an experiment was performed in which test printing was performed on the surfaces of the printing materials Tst1, Tst2, and Tst3. For comparison, the surface roughness of the printing medium Tst1 was reduced, the surface roughness of the printing medium Tst2 was set to be medium, and the surface roughness of the printing medium Tst3 was increased. The printing medium Tst1 is, for example, arithmetic average roughness Ra (JIS B 0601-2001) 0.1 μm, the printing medium Tst2 is, for example, arithmetic average roughness Ra 0.5 μm, and the printing medium Tst3 is, for example, arithmetic average roughness. Ra is 5 μm.

  FIG. 8 shows an example of the printing result of the printing apparatus 100. A row Ph1 in FIG. 8 is a surface photograph (before printing) of the printing object (Tst1, Tst2, Tst3). A line Ph2 in FIG. 8 is a result of printing a line-shaped print pattern on the printing medium (Tst1, Tst2, Tst3). A row Ph3 in FIG. 8 is a result of printing a dod-like print pattern on the printing medium (Tst1, Tst2, Tst3).

  As shown in FIG. 8, in this experiment, the printing apparatus 100 was able to print the line-shaped print pattern and the dot-shaped print pattern with high accuracy on the printing medium Tst1 having a relatively small surface roughness. On the other hand, in the printing apparatus 100, the accuracy of the line-shaped print pattern and the dot-shaped print pattern was lowered in the printing medium Tst2 having a relatively medium surface roughness. Furthermore, the printing apparatus 100 cannot print the line-shaped print pattern and the dod-shaped print pattern on the printing medium Tst3 having a relatively large surface roughness.

  That is, this experiment confirmed that the printability (dimensional accuracy of the printed pattern) depends on the surface roughness of the substrate to be printed when the reverse printing method is used. In the case of using the reverse printing method, when the surface shape of the member for fixing (holding) the placed printing body (for example, a film-like printing body) is uneven, the unevenness is the printing body. It was confirmed that the printability deteriorated when it was raised.

  The printing apparatus 100 according to the present embodiment fixes a substrate to be printed (work plate Pw) using at least two layers of porous plates, and the porous plate on the side in contact with the substrate to be printed (FIGS. 4 and 5). 11), it is possible to prevent the occurrence of defects in the print pattern due to the unevenness of the porous surface being raised on the printing medium. In addition, the printing apparatus 100 according to the present embodiment fixes the printing medium using at least two layers of porous plates, and determines the pore diameter of the porous plate on the side in contact with the printing medium with printing accuracy (dimensional accuracy). By setting corresponding to the above, it is possible to print the print pattern with a desired dimensional accuracy (printing accuracy). Thus, according to the electronic device pattern printing apparatus 100 according to the present embodiment, the printability and productivity of the electronic device pattern can be improved.

  Although the printing apparatus 100 according to the present embodiment has been described with respect to the case where the reverse printing method is used, the present invention is not limited to this. For example, it can be used for fixing a printing medium when using a relief printing method, a gravure printing method, or a silk screen printing method. The printed material is preferably used for a flexible plastic substrate such as PC or PET, but may be used for a non-flexible substrate such as a glass substrate or a semiconductor substrate.

  The present invention has been described above with reference to the embodiments of the present invention. However, the present invention is not limited to the above-described embodiments, and various changes or modifications can be made in light of the appended claims. Is possible.

100: Electronic device pattern printing apparatus 10A, 10B: Holding member 11: First porous plate (one porous plate)
12: 2nd porous board (other porous board)
13: Third porous plate (frame-shaped porous body)
20A, 20B: Frame members 21a, 21b: Buffer units 22a, 22b: Supply / exhaust units 31R: Rotation drive unit 31r: Rotating shaft Bk: Roller (roller transfer cylinder, etc.)
Bkp: Roller support Bks: Water repellent blanket Gd: Linear guide (guide mechanism)
Ict: Ink coater Itk: Ink tank PTa: Liquid film (ink film, etc.)
PTb: Inversion pattern PTc: Pattern (print pattern, etc.)
Pc: letterpress (master version, etc.)
Pca: Convex part of letterpress Pw: Work plate (printed body, etc.)
Tm, Tma, Tmb: Master table (first table)
Tw, Twa, Twb: Work table (second table)

Claims (7)

An electronic device pattern printing apparatus comprising:
A table on which a holding member for holding the work plate is mounted;
A moving mechanism for applying ink to the work plate by relatively moving the table;
The holding member includes at least two layers of porous plates, and sucks and fixes the work plate through the two layers of porous plates;
In the porous plate of the two layers, the pore size of the one porous plate on the side in contact with the workpiece plate is rather smaller than the pore size of the other porous plate,
The holding member further includes a frame-shaped porous body on the outer periphery of the two-layer porous plate,
The pore diameter of the frame-shaped porous body is larger than the pore diameter of the one porous plate,
The frame-shaped porous body fixes an outer edge of the work plate;
An electronic device pattern printing apparatus.   2. The electronic device pattern printing apparatus according to claim 1, wherein a thickness of the one porous plate is smaller than a thickness of the other porous plate. 3. Two holding members and two tables,
The two tables are equipped with two holding members, respectively.
The electronic device pattern printing apparatus according to claim 1, wherein the electronic device pattern printing apparatus is characterized in that: The table is detachable from the guide mechanism in a state of mounting the holding member, and wherein the printing device of the electronic device pattern according to any one of claims 1 to 3. The surface of the liquid film of the roller were partially removed letterpress form a reverse pattern, then transferring the reverse pattern to the work plate, characterized in that, any of claims 1 to 4 one The electronic device pattern printing apparatus according to Item. A work board holding member used in an electronic device pattern printing apparatus,
Comprising at least two layers of porous plates, and sucking and fixing the work plate through the two layers of porous plates;
In the porous plate of the two layers, the pore size of the one porous plate on the side in contact with the workpiece plate is rather smaller than the pore size of the other porous plate,
The holding member further includes a frame-shaped porous body on the outer periphery of the two-layer porous plate,
The pore diameter of the frame-shaped porous body is larger than the pore diameter of the one porous plate,
The frame-shaped porous body fixes an outer edge of the work plate;
Work plate holding member. An electronic device pattern printing method comprising:
A relief holding step of holding a relief plate having an uneven surface shape on the first table;
A work plate holding step for holding the work plate on the second table;
A reversal pattern forming step of moving the first table holding the relief plate below a roller and partially removing the liquid film at the projections of the uneven surface shape;
A pattern printing step of moving the second table holding the work board below the roller and transferring a reverse pattern to the surface of the work board,
The work plate holding step uses a holding member having at least two layers of porous plates, and sucks and fixes the work plates through the two layers of porous plates.
In the porous plate of the two layers, the pore size of the one porous plate on the side in contact with the workpiece plate is rather smaller than the pore size of the other porous plate,
The holding member further includes a frame-shaped porous body on the outer periphery of the two-layer porous plate,
The pore diameter of the frame-shaped porous body is larger than the pore diameter of the one porous plate,
The work plate holding step further fixes an outer edge of the work plate using the frame-shaped porous body.
A method for printing an electronic device pattern.