KR20160041908A - 연마 가공 공구 및 부재의 가공 방법 - Google Patents

연마 가공 공구 및 부재의 가공 방법 Download PDF

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Publication number
KR20160041908A
KR20160041908A KR1020167002949A KR20167002949A KR20160041908A KR 20160041908 A KR20160041908 A KR 20160041908A KR 1020167002949 A KR1020167002949 A KR 1020167002949A KR 20167002949 A KR20167002949 A KR 20167002949A KR 20160041908 A KR20160041908 A KR 20160041908A
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KR
South Korea
Prior art keywords
polishing
polished
workpiece
tool
curved surface
Prior art date
Application number
KR1020167002949A
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English (en)
Korean (ko)
Inventor
신고 오츠키
히토시 모리나가
가즈세이 다마이
히로시 아사노
유우이치 이토
소우마 다구치
Original Assignee
가부시키가이샤 후지미인코퍼레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 가부시키가이샤 후지미인코퍼레이티드 filed Critical 가부시키가이샤 후지미인코퍼레이티드
Publication of KR20160041908A publication Critical patent/KR20160041908A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
KR1020167002949A 2013-08-09 2014-08-06 연마 가공 공구 및 부재의 가공 방법 KR20160041908A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013167116 2013-08-09
JPJP-P-2013-167116 2013-08-09
PCT/JP2014/070712 WO2015020082A1 (ja) 2013-08-09 2014-08-06 研磨加工工具及び部材の加工方法

Publications (1)

Publication Number Publication Date
KR20160041908A true KR20160041908A (ko) 2016-04-18

Family

ID=52461413

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167002949A KR20160041908A (ko) 2013-08-09 2014-08-06 연마 가공 공구 및 부재의 가공 방법

Country Status (7)

Country Link
US (1) US20160167192A1 (ja)
EP (1) EP3031577A4 (ja)
JP (1) JPWO2015020082A1 (ja)
KR (1) KR20160041908A (ja)
CN (1) CN105451938A (ja)
TW (1) TW201527048A (ja)
WO (1) WO2015020082A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180018890A (ko) * 2016-08-09 2018-02-22 삼성디스플레이 주식회사 임프린트 마스터 템플릿 및 이의 제조 방법

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6292397B2 (ja) * 2014-04-23 2018-03-14 富士紡ホールディングス株式会社 研磨パッド
CN107073674B (zh) * 2014-10-31 2020-01-21 株式会社荏原制作所 用于对工件进行研磨的化学机械研磨装置
CN106985059B (zh) * 2017-04-27 2018-12-28 厦门大学 一种空心球体内外球面研抛方法及装置
JP6446590B1 (ja) * 2018-08-09 2018-12-26 国立大学法人 東京大学 局所研磨加工方法、および局所研磨加工装置、並びに該局所研磨加工装置を用いた修正研磨加工装置
JP7093875B2 (ja) * 2021-06-24 2022-06-30 一郎 片山 ワーク加工装置、砥石、およびワーク加工方法

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USRE25620E (en) * 1964-07-21 Polishing synthetic resin lenses
US1570177A (en) * 1923-01-29 1926-01-19 James B Pointer Sanding block
US3144737A (en) * 1962-09-27 1964-08-18 Bausch & Lomb Aluminum foil lens grinding pad
JPS5933587Y2 (ja) * 1980-12-09 1984-09-19 昭和ソキ−株式会社 線材等の研削用砥石
JP2559650B2 (ja) * 1991-11-27 1996-12-04 信越半導体株式会社 ウエーハ面取部研磨装置
US5662515A (en) * 1993-12-15 1997-09-02 Evensen; Kenneth Method and apparatus for abrading with a profiled soft roller
JPH08267347A (ja) * 1995-03-31 1996-10-15 Shin Etsu Handotai Co Ltd オリエンテーション・フラットを有するウエーハ面取り部の鏡面研磨方法とその装置
JPH11188590A (ja) 1997-12-22 1999-07-13 Speedfam Co Ltd エッジポリッシング装置
JPH11320363A (ja) * 1998-05-18 1999-11-24 Tokyo Seimitsu Co Ltd ウェーハ面取り装置
JP2000061792A (ja) * 1998-08-14 2000-02-29 Nikon Corp 総形研削砥石
JP2001205549A (ja) 2000-01-25 2001-07-31 Speedfam Co Ltd 基板エッジ部の片面研磨方法およびその装置
DE10004578C1 (de) * 2000-02-03 2001-07-26 Wacker Siltronic Halbleitermat Verfahren zur Herstellung einer Halbleiterscheibe mit polierter Kante
JP2004058186A (ja) * 2002-07-26 2004-02-26 Hitachi Zosen Corp 薄板状ワーク外周部加工装置
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
JP2007088143A (ja) * 2005-09-21 2007-04-05 Elpida Memory Inc エッジ研磨装置
EP2213415A1 (en) * 2009-01-29 2010-08-04 S.O.I. TEC Silicon Device for polishing the edge of a semiconductor substrate
CN201366642Y (zh) * 2009-03-26 2009-12-23 常州工业技术玻璃有限公司 内圆磨轮
US20120315739A1 (en) * 2010-02-26 2012-12-13 Sumco Corporation Manufacturing method for semiconductor wafer
JP2012009550A (ja) * 2010-06-23 2012-01-12 Disco Abrasive Syst Ltd ウエーハの加工方法
CN102441830A (zh) * 2011-11-24 2012-05-09 上海腾企机械技术配套有限公司 切入式磨削/研磨/抛光加工内/外曲面新工艺及系统
JP5982971B2 (ja) * 2012-04-10 2016-08-31 住友電気工業株式会社 炭化珪素単結晶基板
CN103128627B (zh) * 2013-02-18 2016-06-08 洛阳轴研科技股份有限公司 一种球头销球头磨削加工方法及装置
JP2015196224A (ja) * 2014-04-01 2015-11-09 株式会社フジミインコーポレーテッド 研磨方法、及び保持具

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180018890A (ko) * 2016-08-09 2018-02-22 삼성디스플레이 주식회사 임프린트 마스터 템플릿 및 이의 제조 방법

Also Published As

Publication number Publication date
US20160167192A1 (en) 2016-06-16
EP3031577A1 (en) 2016-06-15
WO2015020082A1 (ja) 2015-02-12
JPWO2015020082A1 (ja) 2017-03-02
EP3031577A4 (en) 2017-03-22
TW201527048A (zh) 2015-07-16
CN105451938A (zh) 2016-03-30

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