EP3031577A4 - Polishing tool and processing method for member - Google Patents

Polishing tool and processing method for member Download PDF

Info

Publication number
EP3031577A4
EP3031577A4 EP14834968.1A EP14834968A EP3031577A4 EP 3031577 A4 EP3031577 A4 EP 3031577A4 EP 14834968 A EP14834968 A EP 14834968A EP 3031577 A4 EP3031577 A4 EP 3031577A4
Authority
EP
European Patent Office
Prior art keywords
processing method
polishing tool
polishing
tool
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14834968.1A
Other languages
German (de)
French (fr)
Other versions
EP3031577A1 (en
Inventor
Shingo OTSUKI
Hitoshi Morinaga
Kazusei Tamai
Hiroshi Asano
Yuuichi Itou
Souma TAGUCHI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimi Inc
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of EP3031577A1 publication Critical patent/EP3031577A1/en
Publication of EP3031577A4 publication Critical patent/EP3031577A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
EP14834968.1A 2013-08-09 2014-08-06 Polishing tool and processing method for member Withdrawn EP3031577A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013167116 2013-08-09
PCT/JP2014/070712 WO2015020082A1 (en) 2013-08-09 2014-08-06 Polishing tool and processing method for member

Publications (2)

Publication Number Publication Date
EP3031577A1 EP3031577A1 (en) 2016-06-15
EP3031577A4 true EP3031577A4 (en) 2017-03-22

Family

ID=52461413

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14834968.1A Withdrawn EP3031577A4 (en) 2013-08-09 2014-08-06 Polishing tool and processing method for member

Country Status (7)

Country Link
US (1) US20160167192A1 (en)
EP (1) EP3031577A4 (en)
JP (1) JPWO2015020082A1 (en)
KR (1) KR20160041908A (en)
CN (1) CN105451938A (en)
TW (1) TW201527048A (en)
WO (1) WO2015020082A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6292397B2 (en) * 2014-04-23 2018-03-14 富士紡ホールディングス株式会社 Polishing pad
WO2016068327A1 (en) * 2014-10-31 2016-05-06 株式会社 荏原製作所 Chemical mechanical polishing device for polishing work piece
KR102648921B1 (en) * 2016-08-09 2024-03-19 삼성디스플레이 주식회사 Imprint master template and method of manufacturing the same
CN106985059B (en) * 2017-04-27 2018-12-28 厦门大学 A kind of hollow ball inside and outside spherical surface polishing method and device
JP6446590B1 (en) * 2018-08-09 2018-12-26 国立大学法人 東京大学 Local polishing method, local polishing apparatus, and corrected polishing apparatus using the local polishing apparatus
JP7093875B2 (en) * 2021-06-24 2022-06-30 一郎 片山 Workpiece processing equipment, grindstone, and work processing method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0734811A2 (en) * 1995-03-31 1996-10-02 Shin-Etsu Handotai Co., Ltd. Method and apparatus for mirror-like polishing a chamfer of a wafer having an orientation flat
EP0958889A2 (en) * 1998-05-18 1999-11-24 Tokyo Seimitsu Co.,Ltd. Apparatus and method for chamfering wafer
US20010014570A1 (en) * 2000-02-03 2001-08-16 Wacker Siltronic Gesellschaft For Halbleitermaterialien Ag Process for producing a semiconductor wafer with polished edge
US20120315739A1 (en) * 2010-02-26 2012-12-13 Sumco Corporation Manufacturing method for semiconductor wafer

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE25620E (en) * 1964-07-21 Polishing synthetic resin lenses
US1570177A (en) * 1923-01-29 1926-01-19 James B Pointer Sanding block
US3144737A (en) * 1962-09-27 1964-08-18 Bausch & Lomb Aluminum foil lens grinding pad
JPS5933587Y2 (en) * 1980-12-09 1984-09-19 昭和ソキ−株式会社 Grinding wheel for wire rods, etc.
JP2559650B2 (en) * 1991-11-27 1996-12-04 信越半導体株式会社 Wafer chamfer polishing device
US5662515A (en) * 1993-12-15 1997-09-02 Evensen; Kenneth Method and apparatus for abrading with a profiled soft roller
JPH11188590A (en) 1997-12-22 1999-07-13 Speedfam Co Ltd Edge polishing device
JP2000061792A (en) * 1998-08-14 2000-02-29 Nikon Corp Form grinding wheel
JP2001205549A (en) 2000-01-25 2001-07-31 Speedfam Co Ltd One side polishing method and device for substrate edge portion
JP2004058186A (en) * 2002-07-26 2004-02-26 Hitachi Zosen Corp Machining apparatus for outer circumferential part of thin sheet work
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
JP2007088143A (en) * 2005-09-21 2007-04-05 Elpida Memory Inc Edge grinding device
EP2213415A1 (en) * 2009-01-29 2010-08-04 S.O.I. TEC Silicon Device for polishing the edge of a semiconductor substrate
CN201366642Y (en) * 2009-03-26 2009-12-23 常州工业技术玻璃有限公司 Internal grinding wheel
JP2012009550A (en) * 2010-06-23 2012-01-12 Disco Abrasive Syst Ltd Wafer processing method
CN102441830A (en) * 2011-11-24 2012-05-09 上海腾企机械技术配套有限公司 Novel plunge type inner/outer curved surface cutting/grinding/polishing process and system
JP5982971B2 (en) * 2012-04-10 2016-08-31 住友電気工業株式会社 Silicon carbide single crystal substrate
CN103128627B (en) * 2013-02-18 2016-06-08 洛阳轴研科技股份有限公司 A kind of ball head pin bulb grinding processing method and device
JP2015196224A (en) * 2014-04-01 2015-11-09 株式会社フジミインコーポレーテッド Polishing method and retainer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0734811A2 (en) * 1995-03-31 1996-10-02 Shin-Etsu Handotai Co., Ltd. Method and apparatus for mirror-like polishing a chamfer of a wafer having an orientation flat
EP0958889A2 (en) * 1998-05-18 1999-11-24 Tokyo Seimitsu Co.,Ltd. Apparatus and method for chamfering wafer
US20010014570A1 (en) * 2000-02-03 2001-08-16 Wacker Siltronic Gesellschaft For Halbleitermaterialien Ag Process for producing a semiconductor wafer with polished edge
US20120315739A1 (en) * 2010-02-26 2012-12-13 Sumco Corporation Manufacturing method for semiconductor wafer

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2015020082A1 *

Also Published As

Publication number Publication date
US20160167192A1 (en) 2016-06-16
TW201527048A (en) 2015-07-16
JPWO2015020082A1 (en) 2017-03-02
WO2015020082A1 (en) 2015-02-12
CN105451938A (en) 2016-03-30
KR20160041908A (en) 2016-04-18
EP3031577A1 (en) 2016-06-15

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Ipc: B24B 37/11 20120101ALI20170214BHEP

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