EP3031577A4 - Polishing tool and processing method for member - Google Patents
Polishing tool and processing method for member Download PDFInfo
- Publication number
- EP3031577A4 EP3031577A4 EP14834968.1A EP14834968A EP3031577A4 EP 3031577 A4 EP3031577 A4 EP 3031577A4 EP 14834968 A EP14834968 A EP 14834968A EP 3031577 A4 EP3031577 A4 EP 3031577A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- processing method
- polishing tool
- polishing
- tool
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013167116 | 2013-08-09 | ||
PCT/JP2014/070712 WO2015020082A1 (ja) | 2013-08-09 | 2014-08-06 | 研磨加工工具及び部材の加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3031577A1 EP3031577A1 (en) | 2016-06-15 |
EP3031577A4 true EP3031577A4 (en) | 2017-03-22 |
Family
ID=52461413
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP14834968.1A Withdrawn EP3031577A4 (en) | 2013-08-09 | 2014-08-06 | Polishing tool and processing method for member |
Country Status (7)
Country | Link |
---|---|
US (1) | US20160167192A1 (ja) |
EP (1) | EP3031577A4 (ja) |
JP (1) | JPWO2015020082A1 (ja) |
KR (1) | KR20160041908A (ja) |
CN (1) | CN105451938A (ja) |
TW (1) | TW201527048A (ja) |
WO (1) | WO2015020082A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6292397B2 (ja) * | 2014-04-23 | 2018-03-14 | 富士紡ホールディングス株式会社 | 研磨パッド |
CN107073674B (zh) * | 2014-10-31 | 2020-01-21 | 株式会社荏原制作所 | 用于对工件进行研磨的化学机械研磨装置 |
KR102648921B1 (ko) * | 2016-08-09 | 2024-03-19 | 삼성디스플레이 주식회사 | 임프린트 마스터 템플릿 및 이의 제조 방법 |
CN106985059B (zh) * | 2017-04-27 | 2018-12-28 | 厦门大学 | 一种空心球体内外球面研抛方法及装置 |
JP6446590B1 (ja) * | 2018-08-09 | 2018-12-26 | 国立大学法人 東京大学 | 局所研磨加工方法、および局所研磨加工装置、並びに該局所研磨加工装置を用いた修正研磨加工装置 |
JP7093875B2 (ja) * | 2021-06-24 | 2022-06-30 | 一郎 片山 | ワーク加工装置、砥石、およびワーク加工方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0734811A2 (en) * | 1995-03-31 | 1996-10-02 | Shin-Etsu Handotai Co., Ltd. | Method and apparatus for mirror-like polishing a chamfer of a wafer having an orientation flat |
EP0958889A2 (en) * | 1998-05-18 | 1999-11-24 | Tokyo Seimitsu Co.,Ltd. | Apparatus and method for chamfering wafer |
US20010014570A1 (en) * | 2000-02-03 | 2001-08-16 | Wacker Siltronic Gesellschaft For Halbleitermaterialien Ag | Process for producing a semiconductor wafer with polished edge |
US20120315739A1 (en) * | 2010-02-26 | 2012-12-13 | Sumco Corporation | Manufacturing method for semiconductor wafer |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE25620E (en) * | 1964-07-21 | Polishing synthetic resin lenses | ||
US1570177A (en) * | 1923-01-29 | 1926-01-19 | James B Pointer | Sanding block |
US3144737A (en) * | 1962-09-27 | 1964-08-18 | Bausch & Lomb | Aluminum foil lens grinding pad |
JPS5933587Y2 (ja) * | 1980-12-09 | 1984-09-19 | 昭和ソキ−株式会社 | 線材等の研削用砥石 |
JP2559650B2 (ja) * | 1991-11-27 | 1996-12-04 | 信越半導体株式会社 | ウエーハ面取部研磨装置 |
US5662515A (en) * | 1993-12-15 | 1997-09-02 | Evensen; Kenneth | Method and apparatus for abrading with a profiled soft roller |
JPH11188590A (ja) | 1997-12-22 | 1999-07-13 | Speedfam Co Ltd | エッジポリッシング装置 |
JP2000061792A (ja) * | 1998-08-14 | 2000-02-29 | Nikon Corp | 総形研削砥石 |
JP2001205549A (ja) | 2000-01-25 | 2001-07-31 | Speedfam Co Ltd | 基板エッジ部の片面研磨方法およびその装置 |
JP2004058186A (ja) * | 2002-07-26 | 2004-02-26 | Hitachi Zosen Corp | 薄板状ワーク外周部加工装置 |
US8075372B2 (en) * | 2004-09-01 | 2011-12-13 | Cabot Microelectronics Corporation | Polishing pad with microporous regions |
JP2007088143A (ja) * | 2005-09-21 | 2007-04-05 | Elpida Memory Inc | エッジ研磨装置 |
EP2213415A1 (en) * | 2009-01-29 | 2010-08-04 | S.O.I. TEC Silicon | Device for polishing the edge of a semiconductor substrate |
CN201366642Y (zh) * | 2009-03-26 | 2009-12-23 | 常州工业技术玻璃有限公司 | 内圆磨轮 |
JP2012009550A (ja) * | 2010-06-23 | 2012-01-12 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
CN102441830A (zh) * | 2011-11-24 | 2012-05-09 | 上海腾企机械技术配套有限公司 | 切入式磨削/研磨/抛光加工内/外曲面新工艺及系统 |
JP5982971B2 (ja) * | 2012-04-10 | 2016-08-31 | 住友電気工業株式会社 | 炭化珪素単結晶基板 |
CN103128627B (zh) * | 2013-02-18 | 2016-06-08 | 洛阳轴研科技股份有限公司 | 一种球头销球头磨削加工方法及装置 |
JP2015196224A (ja) * | 2014-04-01 | 2015-11-09 | 株式会社フジミインコーポレーテッド | 研磨方法、及び保持具 |
-
2014
- 2014-08-06 CN CN201480044902.3A patent/CN105451938A/zh active Pending
- 2014-08-06 KR KR1020167002949A patent/KR20160041908A/ko not_active Application Discontinuation
- 2014-08-06 JP JP2015530920A patent/JPWO2015020082A1/ja active Pending
- 2014-08-06 EP EP14834968.1A patent/EP3031577A4/en not_active Withdrawn
- 2014-08-06 US US14/910,059 patent/US20160167192A1/en not_active Abandoned
- 2014-08-06 WO PCT/JP2014/070712 patent/WO2015020082A1/ja active Application Filing
- 2014-08-07 TW TW103127111A patent/TW201527048A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0734811A2 (en) * | 1995-03-31 | 1996-10-02 | Shin-Etsu Handotai Co., Ltd. | Method and apparatus for mirror-like polishing a chamfer of a wafer having an orientation flat |
EP0958889A2 (en) * | 1998-05-18 | 1999-11-24 | Tokyo Seimitsu Co.,Ltd. | Apparatus and method for chamfering wafer |
US20010014570A1 (en) * | 2000-02-03 | 2001-08-16 | Wacker Siltronic Gesellschaft For Halbleitermaterialien Ag | Process for producing a semiconductor wafer with polished edge |
US20120315739A1 (en) * | 2010-02-26 | 2012-12-13 | Sumco Corporation | Manufacturing method for semiconductor wafer |
Non-Patent Citations (1)
Title |
---|
See also references of WO2015020082A1 * |
Also Published As
Publication number | Publication date |
---|---|
US20160167192A1 (en) | 2016-06-16 |
EP3031577A1 (en) | 2016-06-15 |
KR20160041908A (ko) | 2016-04-18 |
WO2015020082A1 (ja) | 2015-02-12 |
JPWO2015020082A1 (ja) | 2017-03-02 |
TW201527048A (zh) | 2015-07-16 |
CN105451938A (zh) | 2016-03-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20160202 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: BA ME |
|
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20170220 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: B24B 37/11 20120101ALI20170214BHEP Ipc: B24D 13/12 20060101ALI20170214BHEP Ipc: B24B 9/00 20060101AFI20170214BHEP Ipc: H01L 21/304 20060101ALI20170214BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
18W | Application withdrawn |
Effective date: 20180615 |