KR20150145711A - 취성 재료 기판의 스크라이브 방법 및 스크라이브 장치 - Google Patents

취성 재료 기판의 스크라이브 방법 및 스크라이브 장치 Download PDF

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Publication number
KR20150145711A
KR20150145711A KR1020150086271A KR20150086271A KR20150145711A KR 20150145711 A KR20150145711 A KR 20150145711A KR 1020150086271 A KR1020150086271 A KR 1020150086271A KR 20150086271 A KR20150086271 A KR 20150086271A KR 20150145711 A KR20150145711 A KR 20150145711A
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KR
South Korea
Prior art keywords
scribing
scribe
scribe line
brittle material
material substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020150086271A
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English (en)
Korean (ko)
Inventor
아츠시 이무라
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
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Publication date
Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Publication of KR20150145711A publication Critical patent/KR20150145711A/ko
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
KR1020150086271A 2014-06-19 2015-06-18 취성 재료 기판의 스크라이브 방법 및 스크라이브 장치 Withdrawn KR20150145711A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW103121259A TWI527674B (zh) 2014-06-19 2014-06-19 脆性材料基板之刻劃方法及裝置
TW103121259 2014-06-19

Publications (1)

Publication Number Publication Date
KR20150145711A true KR20150145711A (ko) 2015-12-30

Family

ID=54944545

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150086271A Withdrawn KR20150145711A (ko) 2014-06-19 2015-06-18 취성 재료 기판의 스크라이브 방법 및 스크라이브 장치

Country Status (4)

Country Link
JP (1) JP6551661B2 (enrdf_load_stackoverflow)
KR (1) KR20150145711A (enrdf_load_stackoverflow)
CN (1) CN105196423B (enrdf_load_stackoverflow)
TW (1) TWI527674B (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3361839A1 (en) * 2017-02-14 2018-08-15 Infineon Technologies AG Multiple substrate and method for its fabrication
CN107538630A (zh) * 2017-07-14 2018-01-05 合肥文胜新能源科技有限公司 一种用于硅片切割的装置
CN107379292B (zh) * 2017-09-15 2019-07-02 京东方科技集团股份有限公司 显示面板的切割方法、系统和存储介质
TWI774883B (zh) * 2017-12-26 2022-08-21 日商三星鑽石工業股份有限公司 黏合基板的劃線方法以及劃線裝置
JP2021154502A (ja) * 2020-03-25 2021-10-07 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法並びに基板加工装置
KR102457343B1 (ko) * 2020-12-14 2022-10-21 한국미쯔보시다이아몬드공업(주) 단자부를 갖는 접합 취성 기판의 스크라이빙 방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000280234A (ja) * 1999-01-28 2000-10-10 Canon Inc 基板の切断方法
USRE41853E1 (en) * 2001-07-18 2010-10-26 Mitsuboshi Diamond Industrial Co., Ltd. Scribing head, and scribing apparatus and scribing method using the scribing head
JP2003212579A (ja) * 2002-01-24 2003-07-30 Nakamura Tome Precision Ind Co Ltd 硬質脆性板のクロススクライブ方法及び装置
JP5076662B2 (ja) * 2007-06-13 2012-11-21 澁谷工業株式会社 脆性材料の割断方法およびその装置
JP5139852B2 (ja) * 2008-03-17 2013-02-06 三星ダイヤモンド工業株式会社 スクライブ装置及びスクライブ方法
JP2011088382A (ja) * 2009-10-23 2011-05-06 Mitsuboshi Diamond Industrial Co Ltd ブレイク装置およびブレイク方法
JP2011155151A (ja) * 2010-01-27 2011-08-11 Mitsuboshi Diamond Industrial Co Ltd 薄膜太陽電池用スクライブ装置
JP2011178054A (ja) * 2010-03-02 2011-09-15 Ihi Corp 脆性材料の割断装置及び割断方法
JP5156080B2 (ja) * 2010-11-05 2013-03-06 三星ダイヤモンド工業株式会社 貼り合せ基板のスクライブ方法
JP5479424B2 (ja) * 2011-09-30 2014-04-23 三星ダイヤモンド工業株式会社 脆性材料用スクライビングホイール、これを用いた脆性材料基板のスクライブ装置及びスクライブ工具
JP2013159540A (ja) * 2012-02-08 2013-08-19 Mitsuboshi Diamond Industrial Co Ltd スクライブ装置

Also Published As

Publication number Publication date
CN105196423B (zh) 2019-01-08
JP2016003181A (ja) 2016-01-12
TWI527674B (zh) 2016-04-01
TW201600293A (zh) 2016-01-01
JP6551661B2 (ja) 2019-07-31
CN105196423A (zh) 2015-12-30

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Patent event date: 20150618

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