KR20150138602A - method of preparing rubber socket for semiconductor test, and computer-readable recording medium for the same - Google Patents

Abstract

The present invention relates to a technique for manufacturing a semiconductor testing socket capable of blocking interference and noise when a semiconductor is tested by using the testing socket. Bi-directionally conductive poles are manufactured by using a cell unit frame in advance and aligned by using an electromagnet from both ends. A liquid insulator is injected between the aligned poles to form a body. Accordingly, the height of the conductive poles protruding from the testing socket in an upward direction can be freely adjusted. The present invention employs a pattern of coupling the conductive poles manufactured in advance to a silicon body in order to block the interference and noise that frequently occurs when a conventional method, which generates such interference and noise during a test operation by partially arranging conductive balls between adjacent conductive poles when the conductive poles are partitioned with respected to the conductive balls mixed in a silicon dough by a magnetic force, is used.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a rubber socket for semiconductor testing and a computer readable recording medium therefor,

TECHNICAL FIELD The present invention relates to a technique for manufacturing a semiconductor test socket that can be implemented at a narrow pitch without causing interference and noise during semiconductor testing through a test socket.

More particularly, the present invention relates to a method of manufacturing a conductive pole in which a conductive pole is bi-directionally energized in advance in a cell-based frame, and a liquid insulator is injected between the conductive poles in a state of being aligned using electromagnets from both ends of the conductive pole. So as to prevent interference and noise from occurring between the conductive poles during the semiconductor test, thereby enabling a narrow pitch to be realized.

In general, the semiconductor package is tested for good electrical energization after the fabrication process. Specifically, the test socket is connected between the inspection apparatus and the semiconductor package, and an electrical signal is sent from the testing apparatus to the semiconductor package to check whether or not there is a signal response from the semiconductor package to determine whether the semiconductor package is good or not.

The test socket is also used as a burn-in socket for testing the durability of a semiconductor package in a harsh environment at a high temperature during the manufacturing process of the semiconductor package, in addition to checking whether the semiconductor package is turned on.

In addition, since the test socket is electrically connected to the inspection apparatus and performs inspection while making a number of temporary contact with a plurality of semiconductor packages, the conductive pole, which is the contact terminal of the test socket, is in a good contact condition from the innumerable contact of the semiconductor package Durability must be maintained.

That is, it is very important that the test socket should maintain a good contact environment even in a BGA (Ball Grid Array) type IC package or an LGA (Land Grid Array) type IC package having different contact environments.

In addition, even in high-temperature harsh environments, it is important to maintain the durability of the test socket to withstand harsh environments.

On the other hand, various types of test sockets have been developed to provide a good contact environment between the test socket and the semiconductor package. However, in the manufacture of a test socket capable of withstanding such a good contact environment, It is very difficult to combine them.

Therefore, there are disadvantages such as mass production of inefficient products in the manufacturing process of test socket.

On the other hand, since the bidirectional current-carrying portion of the conventional semiconductor test socket is fabricated in an environment in which mutual interference or noise may occur with the adjacent bidirectional current-carrying portion, there is a disadvantage in that the bidirectional current- .

1. Manufacturing method of test socket for package test through surface lamination (patent application No. 10-2012-0050563)

2. Test rubber sockets including spring members (Patent Application No. 10-2012-0027331)

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and an object of the present invention is to provide a semiconductor test socket which can be implemented at a narrow pitch without causing interference and noise during semiconductor testing.

Particularly, it is an object of the present invention to provide a method of manufacturing a conductive pawl in which a bi-directional conductive conductive pole is preliminarily manufactured in a frame unit of a cell, and a liquid insulator is injected between the conductive poles, So as to prevent interference and noise from occurring between the conductive poles during the semiconductor test, thereby realizing a narrow pitch pitch.

According to another aspect of the present invention, there is provided a method of manufacturing a rubber socket for semiconductor testing, the method comprising the steps of: (a) Filling a plurality of conductive balls coated with liquid silicon on a surface of a plate partitioned by a plurality of cells into a predetermined layer; (b) curing the liquid silicone to transform the layer into a conductive elastomer; (c) removing the partition wall from the plate to form a plurality of conductive pores made of a single cell unit from the conductive elastic body; (d) transferring an upper magnet pattern block having one or more magnet rods attached to one end of a plurality of conductive poles to an inside of a container of a size corresponding to the rubber test socket for semiconductor testing; (e) aligning the conductive pawls from the lower outer side of the container with the lower magnet block having the magnet bar corresponding to the magnet bar of the upper magnet pattern block interlocking with the upper magnet pattern block; (f) injecting a liquid insulator into the container to fill the space between the plurality of conductive pawls; (g) curing the liquid insulator to form an elastic insulator for fixing the plurality of conductive pawls; (h) separating the upper magnet pattern block, the lower magnet pattern block, and the container from the elastic insulator.

(D) sandwiching the conductive pores in a predetermined pattern in a pattern pallet in which a plurality of holes are formed between step (c) and step (d) It is preferable that the conductive pawl inserted in the pattern pallet is configured to be transferred to the inside of the container.

In the step (f), the injection of the liquid insulator into the container is preferably performed so that a predetermined portion of the plurality of conductive pawls is exposed to the outside.

(I) laminating an insulating guide film to a predetermined thickness on the upper surface of the elastic insulation body except for the conductive pole, and (iii) Is preferably formed to be relatively thicker than a height at which the conductive pawls are exposed to the upper portion of the elastic insulator.

In addition, the method may further include, before step (a), inserting a conductive film in advance into the partitions at positions corresponding to the upper and lower surfaces of the conductive pads, which are parts electrically connected to the semiconductor package and the inspection apparatus, respectively desirable.

According to the method of manufacturing a rubber socket for semiconductor test according to the present invention, the following advantages can be obtained.

(1) Since the conductive pole is preliminarily manufactured and then bonded to the silicon body, when the conductive pole portion is divided by the magnetic force into the conductive balls mixed in the silicone paste, some conductive balls are positioned between the adjacent conductive poles Interference and noise during the test), interference fringes and noise are frequently blocked, so that the pattern of the conductive pawls is realized at a narrow pitch.

(2) Since the conductive pawl is manufactured in advance and then the liquid insulator is injected to form the body, the height of the conductive pole protruding to the upper portion of the test socket can be freely adjusted.

(3) Since a plurality of cells are formed by using a plate and a barrier rib, the conductive pawl is manufactured, so that it is easy to change the pattern of the conductive pawl (for example, to attach the conductive film to both ends of the conductive pawl).

(4) Since the conductive pawl is manufactured in a state in which the cell corresponding to the conductive pawl is previously provided by the plate and the partition wall, there is an advantage that the manufacturing tack type can be remarkably reduced.

FIG. 1 is an exemplary view showing a state in which liquid silicone is coated on a conductive ball according to the present invention. FIG.
Fig. 2 is an exemplary view of a plate for partitioning the conductive pawls according to the present invention on a cell-by-cell basis and lateral and vertical partition walls. Fig.
Fig. 3 is an exemplary view showing a state in which the conductive film according to the present invention is sandwiched between partition walls of each cell.
4 is an exemplary view showing a state in which a coated conductive ball according to the present invention is filled in a predetermined layer in each cell.
FIG. 5 is an illustration showing an example of the conductive pole according to the present invention. FIG.
FIG. 6 is an exemplary view showing a state in which the conductive pole according to the present invention is sandwiched between pattern holes with a plurality of holes. FIG.
7 is an exemplary view of a state in which a conductive pole according to the present invention is placed in a container and aligned with an electromagnet.
FIG. 8 is an exemplary view showing a state in which a liquid insulator is injected into a container in a state in which the conductive pawls according to the present invention are aligned to fill the spaces between the conductive pawls.
9 is an exemplary view of a semiconductor test socket formed by curing a liquid insulator according to the present invention, and then removing the plate and the lateral and vertical partition walls.
10 is an exemplary view showing a state where an LGA semiconductor package is placed on an upper portion of a semiconductor test socket according to the present invention.
11 is an exemplary view showing a state in which a guide film is attached to the upper surface of a liquid insulator according to the present invention.
12 is an exemplary view showing a state where a BGA semiconductor package is placed on an upper portion of a semiconductor test socket to which a guide film according to the present invention is attached.
13 is a flowchart showing a manufacturing process of a semiconductor test socket according to the present invention.

Hereinafter, the present invention will be described in detail with reference to the drawings.

FIG. 1 is an exemplary view showing a state in which a conductive ball according to the present invention is coated with liquid silicon, FIG. 2 is an illustration of a plate for partitioning a conductive pole according to the present invention into cells, and a horizontal and vertical barrier ribs .

Referring to FIG. 1, the conductive ball 110 is configured as a conductor to interface bidirectional energization between the testing apparatus and the semiconductor package. Preferably, the conductive ball 110 is formed by plating gold (Au) on the spherical surface of a nickel (Ni) component and has a diameter of about 30 to 80 um.

Since the small conductive balls 110 are separated from each other like powder particles and are in an amorphous state, a liquid insulator (e.g., silicon) 120 is coated on the surface of each conductive ball 110, Silicon 120 is mixed.

When the liquid silicone 120 mixed in the conductive balls 110 is cured, energization between the conductive balls 110 located between the liquid silicones 120 becomes possible, and thus it can serve as one conductive elastic body.

As shown in FIG. 2, the plurality of single cells may be provided by crossing the horizontal partition 11 and the vertical partition 12 on the upper surface of the plate 10. In this case, The liquid mixed with the silicon 120 and the conductive ball 110 is filled.

When the liquid silicon 120 mixed with the conductive ball 110 is cured in a single cell made up of the partitions 11 and 12, the conductive pillar 200 of the cell unit formed in a bar shape as shown in FIG. 4 Is formed.

When the partition walls 11 and 12 and the plate 10 are separated from the plurality of conductive pawls 200 in this state, the individual conductive pawls 200 can be completed as shown in FIG. 5 below.

In order to complete the sockets of the individual conductive pads 200 in units of one block, it is necessary to perform a subsequent process, which will be described below with reference to FIG. 7 to FIG. 8.

FIG. 3 is a view illustrating a state in which the conductive film according to the present invention is sandwiched between barrier ribs of respective cells, and FIG. 4 is a cross-sectional view of the conductive ball according to the present invention, Fig. 5 is an illustration showing an example of the conductive pole according to the present invention. Fig.

5, the conductive pillar 200 adheres the conductive film 210 to both end faces, which is a process of inspecting whether the semiconductor package can operate in a high-temperature harsh environment during the manufacturing process of the semiconductor package (For example, a burn-in test), the test socket itself must be able to serve as a burn-in socket for interfacing bi-directional energization in such a harsh environment, so that liquid insulators are not disposed on both ends of the conductive pole 200 It is preferable to adhere the thin conductive film 210 made of a metal.

Here, even when a conductive film 210 of a thin film made of metal is attached to both end faces of the conductive pole 200 so that the test socket is suitable for a harsh environment, it can be used for testing whether or not the semiconductor package other than the burn- Of course.

The process of attaching the conductive film 210 to both ends of the conductive pillar 200 by a separate process after completing the conductive pillar 200 is very inefficient Treatment process. There is also a disadvantage in that the addition of such a post-treatment process increases the contact type or the type of test socket manufacturing.

In order to overcome this problem, as shown in FIG. 3, a conductive film 210 is previously fitted on both side walls of a single cell, and then a liquid mixture of the conductive ball 110 and the liquid silicone 120 The surface tension of the liquid silicone 120 is hardened while closely adhering to the side wall of the conductive film 210 so that if the partition walls 11 and 12 are subsequently separated, It is possible to maintain the state in which the second electrode 210 is attached.

Of course, the process of inserting the conductive film 210 may be omitted as shown in FIG. 3, and the conductive pole 200 may be formed in a state where the conductive film 210 is not attached to both end faces of the conductive pole 200 .

FIG. 6 is a view showing an example of a state in which the conductive pole according to the present invention is sandwiched in a pattern pallet in which a plurality of holes are formed. FIG. 7 shows an example of a state in which the conductive pole according to the present invention is placed in a container and aligned with an electromagnet 8 is a view illustrating a state in which a liquid insulator is injected into a container in a state in which the conductive pawls according to the present invention are aligned to fill the spaces between the conductive pawls, And then removing the plate and the horizontal and vertical barrier ribs.

6, the plurality of conductive pawls 200 are bundled and fixed in a desired pattern after the individual conductive pawls 200 are manufactured. The body that bundles the plurality of conductive pawls 200 is formed of a flexible insulator So as to have a predetermined tension.

In order to bind the conductive pawls 200 to a single body (elastic insulator) in a state in which the conductive pawls 200 are arranged in a predetermined pattern, the conductive pawls 200 must keep the presently arranged pattern in the process of being coupled with the elastic insulator A magnetic force is formed at both ends of the conductive pole 200 as shown in FIG. 7 so that the pattern is sandwiched by a desired pattern in the pattern pallet 20 having a plurality of holes formed therein, Fixed.

7, an upper magnetic pattern block 30 having a magnet bar 31 of a pattern corresponding to the conductive pole 200 is attached close to the upper portion of the pattern pallet 20 of FIG. 6 The attached conductive pawls 200 are then transferred into a container 50 of a predetermined size for subsequent processing.

Subsequently, the lower magnet pattern block 40 having the magnet bar 41 corresponding to the magnet bar 31 formed in the upper magnet block 30 is disposed at the lower portion of the container 50, And the magnet poles 41 of the lower magnet pattern block 40 interlock with each other to fix the conductive poles 200 in the presently arranged state.

The liquid insulator 300 is injected into the interior of the vessel 50 while the conductive pole 200 is fixed by the upper magnet block 30 and the lower magnet block 40, And then the container 50 is removed to complete the semiconductor test socket, which is one block as shown in FIG. At this time, any one of silicone, resin, synthetic resin, and rubber may be used for the liquid insulator 300.

8, the height of the liquid insulator 300 injected into the container 50 may be equal to or higher than the height of the conductive pawl 200, which can be used as a test socket. However, since the height of the liquid insulator 300 is made lower than the height of the conductive pole 200, the predetermined portion of the conductive pole 200 protrudes from the upper surface of the elastic insulator 300 as a body as shown in FIG. 9 .

10 is an exemplary view illustrating a state where an LGA semiconductor package is placed on an upper portion of a semiconductor test socket according to the present invention. Referring to FIG. 10, when the semiconductor package for testing is an LGA IC package, the contact terminals of the semiconductor package may be inferior in contact with the conductive pillar 200 because they are flat without protrusion. The protruding portion can be in good contact with the flat contact terminal of the semiconductor package.

11 is a view illustrating a state in which a guide film is attached to a top surface of a liquid insulator according to the present invention, and FIG. 12 is a cross-sectional view of a BGA semiconductor package mounted on an upper portion of a semiconductor test socket to which a guide film according to the present invention is attached Fig.

Referring to FIG. 11, after the semiconductor test socket is completed as shown in FIG. 9, the guide film 400 may be lined to a predetermined thickness on the upper surface of the elastic insulator 300. At this time, The portion where the pole 200 is located is cut so that the protruding portion of the conductive pole 200 is exposed to the outside.

12, when the semiconductor package for testing is a BGA IC package, when the semiconductor package is close to the conductive pole 200 so that the contact terminals of the semiconductor package are precisely centered and contacted at the top of the conductive pole 200 The guide film 400 guides the contact terminal of the semiconductor package in the center direction of the conductive pole 200 and stably maintains the contact state.

The semiconductor package of the BGA IC package type can be inspected even when the guide film 400 does not adhere to the upper surface of the elastic insulator 300 with respect to the conductive pole 200 protruding from the upper surface of the elastic insulator 300 Of course. However, in the inspection of the semiconductor package of the BGA IC package type, the implementation of the guide film 400 on the upper surface of the elastic insulator 300 as shown in FIG. 11 has an advantage that the contact state can be more stably maintained as described above .

On the other hand, it is preferable that the elastic insulator 300 has a predetermined tension. This is because the contact terminals of the semiconductor package close to the conductive pawls 200 can not maintain a perfectly balanced state. Therefore, at the moment when the contact terminals of the semiconductor package and the upper ends of the conductive pawls 200 come into contact with each other, The elastic insulator 300 of the semiconductor package 200 is pushed downward or sideward so that the contact pads of the semiconductor package can contact the remaining conductive pads 200 as well.

[Fig. 13] is a flowchart showing a manufacturing process of a semiconductor test socket according to the present invention. [0040] The manufacturing process of the semiconductor test socket according to the present invention will be described in detail with reference to FIG.

S100: First, the liquid silicon 120 is coated on the surfaces of the plurality of conductive balls 110. More specifically, the liquid silicone 120 is coated on the surfaces of the conductive balls 110 by mixing the liquid silicone 120 with the conductive balls 110 in the amorphous state like the powder particles.

S110 and S120: The conductive film 210 may be attached to both ends of the conductive pillar 110 formed by curing the liquid silicone 120 coated on the surface of the conductive ball 110. In this case, The conductive films 210 are disposed at positions corresponding to both end faces of the conductive pillar 200 before the liquid silicone 120 is hardened in order to attach the conductive pillar 200 to both ends of the conductive pillar 200. [

Specifically, the conductive film 210 is sandwiched and mounted on the sidewall of a single cell provided with the horizontal partition 11 and the vertical partition 12 orthogonally arranged on the upper surface of the flat plate 10.

Subsequently, a liquid in which the conductive balls 110 and the liquid silicon 120 are mixed is filled in a predetermined layer on one surface of the plate 10 partitioned by the cells 11 and 12 by the partition walls 11 and 12.

S130 and S140: When the liquid silicone 120 filled in a plurality of cells is spontaneously cured or thermally cured, the liquid in which the conductive ball 110 and the liquid silicone 120 are mixed is deformed into a conductive elastic body. When the partition walls 11 and 12 are removed from the plate 10 in the state of being deformed by the conductive elastic body, a plurality of conductive pawls 200 formed in a single cell unit shape from the conductive elastic body are provided.

S150 and S160: After manufacturing the individual conductive pads 200, a plurality of conductive pads 200 should be bundled and fixed in a desired pattern. The body that binds the conductive pads 200 is an elastic insulator and has a predetermined tension .

7, a pattern pallet 20 having a plurality of holes formed therein to hold a predetermined pattern by arranging a plurality of conductive pawls 200, A magnetic force is formed at both ends of the pole 200 and fixed.

The upper magnet pattern block 30 having the magnet bar 31 corresponding to the conductive pole 200 moves downward from the upper portion of the pattern pallet 20 to be electrically conductive The pawls 200 are attached and transferred inside the container 50 of the size corresponding to the semiconductor test socket.

S170: Subsequently, the lower magnet pattern block 40 in which the magnet bar 41 corresponding to the magnet bar 31 formed in the upper magnet block 30 is formed is disposed at the lower portion of the container 50, The conductive pole 200 is fixed in the present position as shown in FIG. 7 by the magnetic force of the magnet rod 31 of the upper magnet block 30 and the magnet rod 41 of the lower magnet pattern block 40 interlocking with each other.

S180: In the state where the conductive pole 200 is fixed by the upper magnet pattern block 30 and the lower magnet pattern block 40 as shown in Fig. 8, a liquid insulator (for example, Silicon, and resin 300 are injected to fill the spaces between the plurality of conductive pawls 200.

8, the height of the liquid insulator 300 injected into the container 50 is set to be lower than the height of the conductive pawl 200, so that the upper surface of the elastic insulator 300, which is the body as shown in Fig. 9, A predetermined portion of the upper portion of the body 200 is protruded.

S190: During the process of curing the liquid insulator 300 so that the liquid insulator 300 can be cured while maintaining the plurality of conductive pads 200 in the current state, the upper magnet pattern block 30 and the lower magnet pattern block 40 It is preferable to maintain the currently disposed position.

Subsequently, after the liquid insulator 300 is cured with an elastic insulator, the upper and lower magnet block 30 and 40 and the container 50 are removed from the elastic insulator, Is completed.

S200: On the other hand, after the semiconductor test socket is completed, the guide film 400 can be lined to a predetermined thickness on the upper surface of the elastic insulator 300. At this time, the portion where the protruded conductive pole 200 is located is cut So that the protruded portion of the conductive pole 200 is exposed to the outside.

At this time, it is preferable that the thickness of the guide film 400 is formed to be relatively thicker than the height at which the conductive pillar 200 is exposed to the upper portion of the elastic insulator. This is because when the semiconductor package for testing is a BGA IC package, when the semiconductor package is close to the conductive pillar 200 so that the contact terminals of the semiconductor package can be precisely centered and contacted at the top of the conductive pillar 200, Because the contact terminal of the semiconductor package can be guided in the center direction of the conductive pole 200 and the contact state can be stably maintained through the same.

The present invention can also be embodied in the form of computer readable code on a computer readable recording medium. At this time, the computer-readable recording medium includes all kinds of recording apparatuses in which data that can be read by a computer system is stored.

Examples of the computer-readable recording medium include a ROM, a RAM, a CD-ROM, a magnetic tape, a floppy disk, an optical data storage, and the like, and may be implemented in the form of a carrier wave . The computer-readable recording medium can also be stored and executed by a computer-readable code in a distributed manner on a networked computer system. And functional programs, codes, and code segments for implementing the present invention can be easily deduced by programmers skilled in the art to which the present invention belongs.

10: Plate
11:
12: Vertical partition
20: Pattern palette
30: Upper magnet pattern block
31: magnetic rod
40: Lower magnet pattern block
41: magnetic rod
50: container
110: conductive ball
120: liquid silicone
200: conductive pole
210: conductive film
300: liquid insulator
400: guide film

Claims (7)

A method of manufacturing a rubber socket for semiconductor testing for electrically connecting a semiconductor package and an inspection device to be inspected devices to each other,
(a) filling a predetermined layer with a plurality of conductive balls coated with liquid silicon on one surface of a plate partitioned by a plurality of cells by barrier ribs;
(b) curing the liquid silicone to transform the layer into a conductive elastomer;
(c) removing the partition wall from the plate to form a plurality of conductive pores made of a single cell unit from the conductive elastic body;
(d) transferring an upper magnet pattern block having one or more magnet rods to the inside of the container with a size corresponding to the rubber test socket for semiconductor test by attaching the one end of the plurality of conductive poles;
(e) aligning the conductive pawls from an outer lower portion of the container in cooperation with the upper magnet pattern block, the lower magnet block having a magnet bar corresponding to the magnet bar of the upper magnet pattern block;
(f) filling a gap between the plurality of conductive poles by injecting a liquid insulator into the vessel;
(g) curing the liquid insulator to form an elastic insulator for fixing the plurality of conductive pawls;
(h) separating the upper magnet pattern block, the lower magnet pattern block, and the container from the elastic insulator;
Wherein the rubber socket for semiconductor testing is made of a thermoplastic resin.
The method according to claim 1,
Between the step (c) and the step (d)
Placing the conductive pores in a predetermined pattern in a pattern pallet on which a plurality of holes are formed;
Further comprising:
Wherein in the step (d), the upper magnet pattern block is configured to transfer the conductive pole sandwiched by the pattern pallet to the inside of the container.
The method of claim 2,
Wherein when the liquid insulator is injected into the container in the step (f), a predetermined portion of the plurality of conductive pockets is exposed to the outside.
The method of claim 3,
After step (h)
(i) laminating an insulative guide film on an upper surface of the elastic insulator except for the conductive pole to a predetermined thickness;
Wherein the step of forming the rubber socket comprises the steps of:
The method of claim 4,
In step (i) above,
Wherein the thickness of the guide film is formed to be relatively thicker than the height of the conductive pawl exposed to the upper portion of the elastic insulator.
The method of claim 5,
Prior to step (a)
Inserting a conductive film in advance into the partitions at positions corresponding to the upper and lower surfaces of the conductive pawl, respectively, which are electrically connected to the semiconductor package and the inspection apparatus;
Wherein the step of forming the rubber socket comprises the steps of:
A computer-readable recording medium storing a program for causing a computer to execute a method of manufacturing a rubber socket for semiconductor testing according to any one of claims 1 to 6.

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