KR20150135619A - Floor material improved sound insulation and thermal conductivity - Google Patents

Abstract

The present invention relates to a floor material having a covering-paper layer and a foaming layer from the top thereof. According to the floor material, a plurality of holes are formed at constant intervals on the foaming layer, and a thermal conductive filler is filled in the holes. The thermal conductive filler is capable of containing one or more organic resin powder selected from a group composed of a polyurethane-based resin, a silicon-based resin, a polyethylene-based resin, a polypropylene-based resin, a polymethylpentene-based resin, a polyacrylic resin, a polystyrene-based resin, and a polyfluoro-based resin.

Description

FLOOR MATERIAL IMPROVED SOUND INSULATION AND THERMAL CONDUCTIVITY FIELD OF THE INVENTION [0001]

The present invention relates to a flooring having improved sound insulation performance and heat conduction performance.

In collective collective multi-storey buildings such as multi-family houses, annexed houses, buildings, apartments, schools, hospitals and dormitories, people are living in the upper and lower floors, so that the shocks and / It causes a great inconvenience to the lower class person. Such impact and noise are also referred to as floor impact sounds, which means sounds and shocks caused by vibration of slabs caused by dropping and moving of objects or walking of people. The solid sound generated in such a case is transmitted to various positions with very little damping to vibrate the surface of the structure, and thus the floor impact sound is perceived as air sound transmitted directly to the lower layer people.

Recently, in Korea, the floor noise due to the floor impact sound as described above is recognized as an important factor that affects the quality of the residential environment. That is, the consumer's desire for a comfortable living environment is continuously increasing, while the material used for the bottom structure of the multi-story building is becoming thinner and lighter, and the internal noise source is increasing. As the problem caused by the floor impact sound becomes a socially important issue, it is possible to absorb, disperse, and / or dissipate impact and / or noise applied to the lower layer or the side surface of the upper layer, And to improve the energy efficiency, it is necessary to study the development of a flooring material having excellent heat conduction performance.

The present invention provides a floor material comprising a cover layer and a foam layer from above, wherein a plurality of holes are formed in the foam layer at regular intervals, and the hole is filled with a thermally conductive filler.

However, the technical problem to be solved by the present invention is not limited to the above-mentioned problems, and other matters not mentioned can be clearly understood by those skilled in the art from the following description.

The present invention provides a floor material comprising a cover layer and a foam layer from above, wherein a plurality of holes are formed in the foam layer at regular intervals, and the hole is filled with a thermally conductive filler.

The hole may have a diameter of 1 mm to 10 mm.

The holes may be formed at regular intervals of 10 mm to 100 mm.

Wherein the thermally conductive filler comprises at least one organic resin powder selected from the group consisting of a polyurethane resin, a silicone resin, a polyethylene resin, a polypropylene resin, a polymethylpentene resin, a polyacrylic resin, a polystyrene resin and a polyfluorine resin .

Wherein the thermally conductive filler is selected from the group consisting of calcium carbonate (tin), barium titanate, alumina, silica, carbon, metal, silicon carbide, silicon nitride, boron nitride, aluminum oxide, barium titanate, tin oxide, titanium oxide, Tin oxide, and tin oxide.

The foam layer may have a thickness of 10 mm to 20 mm.

The label layer may be at least one selected from the group consisting of a transparent layer, an opaque layer, a print layer and a chip-in-lay layer.

The label layer may have a thickness of 0.1 mm to 2 mm.

The bottom material according to the present invention has a foam layer of a predetermined thickness or more formed through a cell foaming process and a plurality of holes are formed at a predetermined interval in the foam layer to form a plurality of holes in the foam layer at regular intervals And filling the plurality of holes with the thermally conductive filler, the heat conduction performance is excellent.

1 is a schematic cross-sectional view of a flooring according to one embodiment of the present invention.

The inventors of the present invention completed the present invention by studying a flooring material having improved sound insulation performance and heat conduction performance by forming a plurality of holes at regular intervals in a foam layer and filling a plurality of holes with a thermally conductive filler.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art to which the present invention pertains. The present invention may be embodied in many different forms and is not limited to the embodiments described herein.

In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same or similar components are denoted by the same reference numerals throughout the specification.

In the drawings, the thickness is enlarged to clearly represent the layers and regions. In the drawings, for the convenience of explanation, the thicknesses of some layers and regions are exaggerated.

Hereinafter, formation of an arbitrary structure in the above-mentioned " upper (or lower) " not only means that arbitrary constitution is formed in contact with (or below) the above-described substrate, It is to be understood that the invention is not to be limited to the specific embodiments thereof.

The present invention provides a floor material comprising a cover layer and a foam layer from above, wherein a plurality of holes are formed in the foam layer at regular intervals, and the hole is filled with a thermally conductive filler.

1 is a schematic cross-sectional view of a flooring according to one embodiment of the present invention.

As shown in FIG. 1, a bottom layer according to an embodiment of the present invention includes a cover layer 10 and a foam layer 20 from above, and a plurality of holes 30 are formed in the foam layer 20, And is formed by filling the hole with the thermally conductive filler (40).

The label layer 10 may be a non-foamed layer, or may be composed of a plurality of layers of two or more layers.

Specifically, the label layer 10 may be at least one selected from the group consisting of a transparent layer, an opaque layer, a print layer, and a chip-in-lay layer, and serves to form an appearance that determines the interior quality of the floor.

When the cover layer 10 is composed of a plurality of layers, a pattern is formed in the cover layer 10 by various methods such as gravure printing, screen printing, offset printing, rotary printing, or flexographic printing to give the aesthetics of the flooring .

The cover layer 10 preferably has a thickness of 0.1 mm to 2 mm, but is not limited thereto. At this time, when the cover layer 10 has a thickness of less than 0.1 mm, molding is difficult and durability is insufficient due to wear, and when the cover layer 10 has a thickness exceeding 2 mm, Can cause the cost of flooring manufacturing to rise.

Conventionally, due to difficulties in construction and manufacturing, the foaming layer applied to the flooring usually has a thickness of less than 7 mm, and this flooring is installed on the wall or floor of the multi-story building, And / or to absorb, disperse, and / or exhaust noise.

In the present invention, the foam layer 20 having a certain thickness or more is formed through the cell foaming process.

The foam layer 20 refers to a chemically foamed layer and can be made of any thermoplastic. After the thermoplastic plastic and the chemical blowing agent are mixed, the foamed sheet sheet can be produced through an extrusion or injection process. The foam layer sheet produced through the extrusion or injection process can be used as the foam layer 20 after being expanded in an oven to a desired thickness.

The foam layer 20 may have an expansion ratio of 15 g / l to 40 g / l. When the expansion ratio exceeds the above range, the raw material is reduced and the production cost is reduced, but the specific gravity is light, so that the load And when the expansion ratio is less than the above range, there is a problem that the function of absorbing the interlayer noise is remarkably deteriorated. Therefore, it is important to have an appropriate expansion ratio for interception within the stipulation of the interlaminar noise and vibration.

Specifically, the foam layer 20 may be formed of a polypropylene resin, a polyethylene resin, a polyamide resin, a polystyrene resin, a polyacrylic resin, an acrylonitrile-butadiene-styrene (ABS) Based resin, a polyvinyl chloride-based resin, a polyurethane-based resin, a polyester-based resin, and a foam made from copolymers thereof, and the like. In view of the degree of foaming, the strength of the foam, The urethane resin is most preferably used, but not limited thereto. Today, polyurethane resins are widely used as a raw material for foams, elastomers, paints and adhesives. Generally, polyurethane resins are prepared from polyols and polyfunctional polyisocyanates.

The foam layer 20 preferably has a thickness of 7 to 20 mm, more preferably 10 to 20 mm, but is not limited thereto. At this time, when the foam layer 20 has a thickness less than the above range, there is a problem that the sound insulating performance is not sufficient. When the foam layer 20 has a thickness exceeding the above range, the heat conduction performance is reduced. There is a problem that it may cause a rise in the production cost of the flooring material.

The holes 30 are formed in the foam layer 20 at a predetermined interval to resonate and reduce the interlayer noise at the holes 30 and improve the thermal conductivity of the bottom material. But it is not limited thereto. At this time, when the hole 30 has a diameter of less than 1 mm, it is difficult to realize the manufacturing process, and when the hole 30 has a diameter exceeding 10 mm, the reduction of the interlayer noise is reduced.

The holes 30 are preferably formed at regular intervals of 10 mm to 100 mm, but the present invention is not limited thereto. In this case, when the holes 30 are formed at regular intervals of less than 10 mm, there is a problem that the interlayer noise reduction amount becomes small. In the case where the holes 30 are formed at regular intervals exceeding 100 mm, .

The thermally conductive filler 40 has an advantage that the thermal conductivity of the bottom material can be sufficiently improved due to the thermally conductive filler 40 even if the foam layer 20 having a predetermined thickness or more is formed by filling the plurality of holes 30 have.

The thermally conductive filler 40 may include an organic resin powder having excellent thermal conductivity or may be made of an inorganic fiber powder or a metal / non-metal carbide, a metal / non-metal nitride, a metal / non- Inorganic particle powder.

The thermally conductive filler 40 may be a thermoplastic resin such as a polyurethane resin, a silicone resin, a polyethylene resin, a polypropylene resin, a polymethylpentene resin, a polyacrylic resin, a polystyrene resin (an expandable polystyrene resin (EPS) Resin (XPS)) and a polyfluoric resin. However, the present invention is not limited thereto.

The thermally conductive filler 40 may be selected from the group consisting of calcium carbonate (talc), barium titanate, alumina, silica, carbon, metal, silicon carbide, silicon nitride, boron nitride, aluminum oxide, barium titanate, tin oxide, And indium-tin oxide, but it is not limited thereto.

Particularly, as the thermally conductive filler 40, a carbon nanotube (CNT) is a new material in which six hexagons of carbon are connected to each other to form a tubular shape. The diameter of the tube is several to several tens nanometers It is called carbon nanotubes. Its electrical conductivity is similar to that of copper, its thermal conductivity is the highest in nature, and its strength is 100 times better than steel. Carbon fibers can be broken even if they are deformed by only 1%, while carbon nanotubes can withstand 15% deformation. In addition, carbon nanotubes have a large heating area due to a large number of contact points connected to each other through a molecular structure, so that the heat transfer efficiency to the heated body is excellent, the temperature rise time to the maximum temperature is fast, Excellent durability for long-term use.

At this time, it is preferable that the thermally conductive filler 40 has a particle diameter of 1 탆 to 50 탆.

The bottom material according to the present invention is characterized in that a foaming layer having a thickness equal to or greater than a certain thickness is formed through a cell foaming process and a plurality of holes are formed at regular intervals in the foaming layer so that the heat insulating performance is excellent, It has excellent performance.

Hereinafter, preferred embodiments of the present invention will be described in order to facilitate understanding of the present invention. However, the following examples are provided only for the purpose of easier understanding of the present invention, and the present invention is not limited by the following examples.

[ Example ]

Example  One

A large number of holes each having a diameter of 5 mm were drilled at intervals of 50 mm on a foam layer made of a polyurethane resin having a size of 10 cm x 10 cm x 10 mm thick and a plurality of pores were coated with an organic resin powder having a particle size of 10 to 100 mu m, To form a foam layer. A cover layer having a thickness of 3 mm was formed on the foamed layer, followed by cutting and processing to prepare a flooring material.

Example  2

The same procedure as in Example 1 was carried out, except that a plurality of holes were filled with a calcium carbonate (tin) powder as an inorganic powder having a particle diameter of 10 to 100 mu m.

Experimental Example

1. Sound insulation performance evaluation

The sound insulation performance of the flooring according to Examples 1 and 2 was measured according to KS F 2863 measurement method. The results are shown in Table 1 below.

division Example 1 Example 2 Interlayer noise reduction
(dB) 5 3

As shown in Table 1, the sound insulation performance of Examples 1 and 2, in which a plurality of holes were drilled, was excellent.

2. Evaluation of heat conduction performance

The thermal conductivity of the flooring according to Examples 1 and 2 was measured using a thermal conductivity meter QTM-500, and the results are shown in Table 2 below.

division Example 1 Example 2 Thermal conductivity
(W / MK) 0.3 0.4

As shown in Table 2, it can be seen that Examples 1 and 2, in which a plurality of holes are perforated, have excellent thermal conductivity.

It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

10: Cover layer
20: foam layer
30: hole
40: thermoconductive filler

Claims (8)

In the bottom layer including the cover layer and the foam layer from above,
Wherein a plurality of holes are formed in the foam layer at regular intervals, and the holes are filled with a thermally conductive filler.
The method according to claim 1,
Wherein the hole has a diameter of 1 mm to 10 mm.
The method according to claim 1,
Wherein the holes are formed at regular intervals of 10 mm to 100 mm.
The method according to claim 1,
Wherein the thermally conductive filler comprises at least one organic resin powder selected from the group consisting of a polyurethane resin, a silicone resin, a polyethylene resin, a polypropylene resin, a polymethylpentene resin, a polyacrylic resin, a polystyrene resin and a polyfluorine resin Containing flooring.
The method according to claim 1,
Wherein the thermally conductive filler is selected from the group consisting of calcium carbonate (tin), barium titanate, alumina, silica, carbon, metal, silicon carbide, silicon nitride, boron nitride, aluminum oxide, barium titanate, tin oxide, titanium oxide, And at least one inorganic powder selected from the group consisting of tin oxide.
The method according to claim 1,
Wherein the foam layer has a thickness of 10 mm to 20 mm.
The method according to claim 1,
Wherein the label layer is at least one selected from the group consisting of a transparent layer, an opaque layer, a print layer and a chip-in-lay layer.
The method according to claim 1,
Wherein the cover layer has a thickness of 0.1 mm to 2 mm.

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