KR20150131956A - Prepreg and copper clad laminate and radiant heat board using the same - Google Patents

Abstract

The present invention relates to prepreg, a copper clad laminate, and a heat radiating board using the same. The prepreg comprises: a resin having a core material; and a coating carbon filler contained in the resin. The prepreg and the copper clad laminate, and the heat radiating board using the same easily control bending and increase a heat radiating performance.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a prepreg, a copper-clad laminate, and a heat-

The present invention relates to a prepreg, a copper-clad laminate using the prepreg, and a heat-dissipating substrate using the copper-clad laminate.

The development of multi-functional and high-performance electronic products and the use of LED light sources have led to the development of base boards and high-voltage boards dedicated to light source mounting, and it has become necessary to develop substrate materials to increase the heat dissipation characteristics and heat resistance of the substrates themselves .

In recent years, electronic products have become thinner, smaller, and have a lower weight, and as a substrate becomes thinner, control of warpage, which occurs during manufacturing of a substrate, becomes an important issue.

In order to minimize the warping of the substrate, the material of the substrate has a low CTE, and a high glass transition temperature (Tg) is required. In order to minimize the warping of the substrate, (High Tg) and a high modulus characteristic is realized.

As described above, in order to satisfy the heat dissipation characteristics and the bending control characteristics, conventionally, a substrate is manufactured using a metal core or a heat dissipation substrate using ceramics is manufactured. However, since two types of substrates are used in different ranges, And the warpage control characteristics can not be satisfied.

The core of the metal core has good thermal conductivity and thermal conductivity because of its good core properties. However, the core itself is a conductor and the structural characteristics of the substrate are in between the metal core and the circuit layer Insulation must be made using insulating material. In addition, since the insulating material interposed between the metal core and the circuit layer is mainly composed of a polymer resin, the insulating layer using the polymer resin has a low thermal conductivity, so that the thermal resistance of the insulating layer is increased, Can be remarkably lowered to about 1 to 2.2 W / mK.

In addition, the metal core has a high coefficient of thermal expansion, which causes the breakdown voltage characteristics of the substrate to become unstable.

On the other hand, when manufacturing a circuit layer made of a metal, the heat dissipation substrate using a ceramic has a low circuit accuracy, and it is difficult to form a fine pitch in the process of forming a circuit. Therefore, it is difficult to fabricate a substrate satisfying the miniaturization and high capacity, which is a current trend of electronic products, and the heat dissipation property of the ceramic and the bonding performance with the metal material are not high.

Korean Patent Laid-Open Publication No. 2013-0119643

Accordingly, the present invention provides a prepreg, a copper-clad laminate, and a heat-dissipating substrate using the same, which are developed to solve the above-mentioned problems and disadvantages of conventional heat dissipation boards, .

The above object of the present invention is achieved by providing a prepreg in which an insulating region is formed around a core material and a carbon filler coated with silica is impregnated in the insulating region to improve the insulating performance and the heat radiation performance.

Another object of the present invention is achieved by providing a copper-clad laminate in which an insulating region is formed around a core, a carbon filler coated with silica is impregnated in the insulating region, and a copper foil layer is formed on the insulating region.

It is still another object of the present invention to provide a heat dissipation device in which an insulation region is formed around a core material, a carbon filler coated with silica is impregnated in the insulation region, a circuit layer is formed on the insulation region, And a heat dissipation substrate having a heat sink coupled to the heat dissipation area.

As described above, the prepreg, the copper-clad laminate, and the heat dissipation substrate according to the present invention have the insulating region constituting the prepreg with the predetermined content of the carbon filler coated on the outer circumferential surface with the ceramic material, Heat radiation performance can be satisfied.

1 is a sectional view of a prepreg according to a first embodiment of the present invention;
2 is a sectional view of a prepreg according to a second embodiment of the present invention.
3 is a sectional view of a first embodiment of a copper-clad laminate according to the present invention.
4 is a sectional view of a second embodiment of a copper-clad laminate according to the present invention.
5 is a graph showing a thermal conductivity comparison of the copper-clad laminate of this embodiment.
6 is a graph showing a comparison of insulation resistance of the copper-clad laminate of this embodiment.
7 is a schematic perspective view of a roll pressing apparatus for manufacturing the copper clad laminate of this embodiment.
8 is a sectional view of a heat radiating board according to a first embodiment of the present invention.
9 is a sectional view of a heat radiating board according to a second embodiment of the present invention.
10 and 11 are graphs showing changes in properties of the filler impregnated in the prepreg of this embodiment depending on the material.

The technical effects of the prepreg, the copper-clad laminate, and the heat radiating board according to the present invention, including the technical structure of the above-described objects, will be apparent from the following description of preferred embodiments of the present invention with reference to the drawings, will be.

1 is a sectional view of a prepreg according to a first embodiment of the present invention.

As shown in the figure, the prepreg (PPG) 100 of the present embodiment can be composed of a core 110, a resin material 120 impregnated in the core 110, and a filler contained in the resin 120 .

The core member 110 may be formed of any one of a fabric cloth and a glass cloth and a fabric or a glass is woven in one to three rows in the resin material 120 to give a module , The occurrence of warping of the prepreg can be minimized when heat and pressure are applied to the resin material 120. [

An insulation region 130 may be formed on the upper and lower portions of the core member 110, respectively. The insulating region 130 is formed by impregnating a resin composition such as resin or epoxy with a filler. The filler is composed of a carbon filler (hereinafter, ceramic coated carbon filler) 121 whose surface is coated with a ceramic material, . At this time, the carbon filler may be composed of at least one material selected from the group consisting of carbon, graphite, carbon nano tube, diamond, and the ceramic material coated on the outer surface of the carbon filler Mainly silica can be used.

The ceramic-coated carbon filler 121 can improve the heat radiation performance while maintaining the insulation performance of the insulation region 130 when the carbon filler itself has high thermal conductivity and is impregnated into the insulation region 130.

At this time, the content of the ceramic-coated carbon filler 121 impregnated into each of the insulating regions 130 may be adjusted to suitably control the insulating property and the heat radiation property. That is, as the content of the ceramic-coated carbon filler 121 increases, the heat-releasing property becomes higher. Therefore, the amount of the ceramic-coated carbon filler 121 can be appropriately controlled depending on the density of the circuit or the type of the heating element. However, if too much ceramic-coated carbon filler 121 is impregnated into the resin material 120, the bonding force inherent in the resin composition may be lowered, and therefore, it is preferably impregnated into the resin composition at a weight ratio of not more than 95%.

The insulation regions 130 formed on the upper and lower portions of the core member 110 may have the same thickness or different thicknesses. The thickness of the insulating region 130 and the amount of the ceramic coating carbon filler 121 impregnated in the insulating region 130 are proportional to each other so that the thickness of the upper and lower insulating regions 130 Can be set.

However, if the thickness of the insulating region where the circuit is stacked is too thin, there is a risk of short circuit with the circuit. Conversely, if the thickness is too thick, heat dissipation may be lowered. The insulating region 130 under the core member 110 which functions as a heat radiating member is formed thicker than the insulating region 130 on the core member 110 on which the circuit is formed, .

As described above, the insulator 130 and the insulator 130 can be controlled by mixing the filler with a carbon filler coated with an inorganic filler and a ceramic material, or with a carbon filler coated with a ceramic material. .

2 is a sectional view of a prepreg according to a second embodiment of the present invention.

In the present embodiment, the prepreg 100 may have an insulation region 130 formed above the core member 110, and a heat dissipation region 140 formed below the core member 110. The insulating region 130 may be impregnated with any one of inorganic fillers or carbon fillers coated with a ceramic material so that the insulating property can be maintained, or a carbon filler coated with an inorganic filler and a ceramic material may be mixed and impregnated.

In addition, the heat radiation region 140 may be impregnated with a carbon filler having thermal conductivity such as graphite or graphite. Accordingly, the prepreg 100 of this embodiment maintains the insulation property at the upper portion of the core member 110, and the lower portion of the core member 110 can improve the heat radiation performance.

The prepreg 100 may be formed such that the heat radiation region 140 is formed thicker than the insulation region 130 on the core member 110 to improve the heat radiation performance. The thickness of the prepreg 100 is adjusted to maintain the resistance of the prepreg 100 against bending, so that the bending of the prepreg 100 can be controlled.

In the prepreg 100 constructed as described above, the filler impregnated in the insulating region 130 may be composed of the ceramic coating carbon filler 121. At this time, the thickness of the ceramic material surrounding the carbon filler, that is, The resistance can be changed according to the change of the insulation performance.

Unlike the carbon filler having thermal conductivity, that is, the ceramic-coated carbon filler 121 impregnated in the insulating region 130, the heat-radiating region 140 includes a surface-untreated carbon filler 122 having no surface treatment, . Here, the surface-untreated carbon filler 122 may be composed of at least one material selected from the group consisting of carbon, graphite, carbon nanotube (CNT), and diamond, 140) by adjusting the content of the carbon filler to control the thermal conductivity, the heat radiation performance can be controlled.

3 is a sectional view of a first embodiment of a copper-clad laminate according to the present invention, and Fig. 4 is a sectional view of a second embodiment of a copper-clad laminate according to the present invention.

As shown in the figure, the copper-clad laminate 200 of the present invention may have the copper foil layer 210 laminated on one side or both sides of the prepreg 100. The copper-clad laminate 200 includes a copper foil layer 210 on a prepreg 100 on which an insulation region 130 or an insulation region 130 is formed on the upper and lower portions of the core member 110 and a heat- May be stacked.

3, when only the insulating region 130 is formed on the core material 110 and the lower portion of the prepreg 100, the copper foil layer 210 formed on the copper- Or both surfaces of the substrate 100. 4, when the insulation region 130 and the heat radiation region 140 are separated on the core member 110 and the lower portion of the prepreg 100, only the upper surface of the prepreg 100, (210) may be formed.

This is because when the prepreg 100 is composed only of the insulating region 130, the copper foil layer 210 made of a metal may be formed on the prepreg 100, 130 and the heat radiation region 140, the copper foil layer 210 may be formed on the insulation region 130 only.

The reason why the copper foil layer 210 is formed on the insulating region 130 without forming the copper foil layer 210 on the heat radiation region 140 is that the carbon filler as a conductor is contained in the heat radiation region 140, A short circuit may occur when the copper foil layer 210 made of a metal is formed.

Example 1

30 wt% filler is added to 70 wt% resin, which is an epoxy-based polymer resin, to produce a varnish. At this time, the filler used as the ceramic coated carbon filler 121, silica as the ceramic, and graphite as the carbon material. The varnish was applied to a copper foil with a thickness of 15 탆, and then an RCC (Resin coated copper) having an insulating region was produced through a drying furnace.

Example 2

A graphite-based varnish is prepared by adding 30 wt% of a surface-untreated carbon filler (122) to 70 wt% of a resin, which is an epoxy-based polymer resin. At this time, the carbon material is composed of graphite. The varnish was coated on a PET film having a thickness of 38 mu m to a thickness of 30 mu m and dried to produce a film having high heat dissipation properties.

The thermal conductivity and the insulation resistance of the RCC and the high heat-radiating film manufactured through the above embodiments are as shown in FIGS. 5 and 6 in comparison with the insulating region and carbon filler containing the conventional inorganic filler .

That is, when silica-coated graphite is used as a filler, thermal conductivity and insulation resistance can be much higher than when inorganic filler (silica) alone is used, and characteristics compared with the case where only carbon filler composed of graphite is used The insulation performance and the heat radiation performance can be satisfied.

5 is a comparative graph of the thermal conductivity of the copper-clad laminate of this embodiment, and Fig. 6 is a graph of comparison of insulation resistance of the copper-clad laminate of this embodiment.

The RCC and the high heat dissipation film manufactured through the first and second embodiments can be manufactured through the rolling apparatus shown in FIG.

FIG. 7 shows a roll pressing apparatus for manufacturing the copper clad laminate according to the present embodiment, in which the RCC 330 manufactured through the first embodiment between a pair of rollers 310 and 320 on the upper and lower sides, The high heat dissipation film 340 may be rolled and pressed to produce the CCL 200.

A copper clad laminate 200 having a copper clad layer 110 laminated on a prepreg containing a resin material and a prepreg with a glass cloth 110 interposed between the RCC 330 and the high heat dissipation film 340 Can be produced.

The RCC 330 and the high heat dissipation film 340 are passed through a pair of rollers under the process conditions of 110 ° C, 20 Kgf / cm, and 0.3 m / s through the roll pressing apparatus of FIG. 7 to produce a copper clad laminate. The copper-clad laminate of this example contained glass cloth, and E-1037 was used as the glass cloth.

In order to examine the characteristic changes depending on the content of the ceramic coating carbon filler 121 or the surface untreated carbon filler 122 in accordance with the thickness of the insulating region 130 or the heat radiation region 140, The thermal conductivity, electrical insulation, modulus, and flexural properties of prepregs having the layer compositions shown in the following Table 2 were measured using a resin material having graphite as a filler in the contents shown in the respective samples of Table 1. Glass fiber was used as the core, and 30 parts by weight of MEK (Methyl Ethyl Ketone) solution, 100 parts by weight of epoxy resin and 60 parts by weight of a curing agent were mixed to prepare an epoxy resin solution using graphite as a filler for each sample. And graphite of a weight corresponding to each sample was added. In addition, in order to observe the characteristic change according to the thickness, the sample symbol GS-30 was made to have thickness of 5 kinds such as 10 탆, 20 탆, 30 탆, 40 탆 and 50 탆.

As can be seen from Table 2, as the content ratio of graphite increases, the thermal conductivity increases. Especially, when the surface-untreated graphite is used as a filler and the ceramic (silica) -coated graphite is used as a filler, . In addition, ceramic-coated graphite exhibits an electrical insulation value of 10 ¹⁴ Ω / cm ² or more regardless of its content. Therefore, the ceramic coated graphite is filled in the insulating region 130 where the copper foil layer 210 or the circuit layer 410 is laminated, The insulating property can be maintained and the thermal conductivity can be greatly increased.

It can be seen that the use of ceramic coated graphite for modulus is slightly higher than that for surface untreated graphite. This means that the ceramic-coated graphite is positive for increasing the physical properties of the epoxy-based resin material.

The flexural properties were measured using a prepreg of approximately 5 cm x 5 cm with eleven to fourteen samples of Table 2, i.e., upper and lower layers of different thicknesses, and how much each edge rises at the bottom. As a result, it can be seen that when the upper layer is thicker than the lower layer, it is transformed into a smile form, and conversely, when the lower layer is thicker than the upper layer, it is transformed into a crying form. This means that the substrate warping by the copper foil layer 210 or the circuit layer 410 having a large coefficient of thermal expansion can be controlled by controlling the thickness of the insulation region 130 or the heat radiation region 140.

8 and 9 are sectional views of the heat radiation substrate according to the first and second embodiments of the present invention, respectively.

As shown in the drawing, the heat radiating board 400 of the present invention may be formed by forming the circuit layer 410 on the prepreg 100. The circuit board 410 may be formed on at least one side of the both sides of the prepreg 100 and the circuit layer 410 may be formed on the insulation region 130 of the prepreg 100 have.

8, the prepreg 100 may be formed as an insulation region 130 both above and below the core 110. The prepreg 100 includes the core 110, The ceramic coated carbon filler 121 may be impregnated.

When the prepreg 100 is formed of only the insulating region 130, the heat dissipation substrate 400 may be formed of any one of the insulating region 130 above the core member 110 and the insulating region 130 below the core member 110, The circuit layer 410 may be formed on both sides or both sides.

9, the heat dissipation substrate 400 according to the present invention may have a heat dissipation region 140 in addition to the insulation region 130. In addition, as shown in FIG. That is, the insulating region 130 and the heat radiation region 140 may be formed on the upper portion and the lower portion of the prepreg 100, respectively. The insulating coating 130 may include a ceramic coating carbon filler 121, And the heat radiation performance can be added by the thermal conductivity of the carbon filler. The heat dissipation region 140 may include a carbon filler having thermal conductivity, that is, a surface untreated carbon filler 122, in a resin material such as resin, so as to have heat dissipation.

Therefore, in the embodiment of FIG. 9, the circuit layer 410 may be formed on the insulating region 130, not the heat radiation region 140 impregnated with the surface-untreated carbon filler 122 having conductivity.

Meanwhile, the heat dissipation board 400 may be mounted on the lower portion of the prepreg 100 to improve heat dissipation. The heat sink 420 can be directly bonded by the resin material 120 such as resin constituting the prepreg 100 without a separate adhesive

That is, in the heat dissipation substrate 400 according to the embodiment of FIG. 8, the heat sink 420 is provided in the insulation region 130 opposite to the insulation region 130 where the circuit layers 410 are stacked, The heat sink 420 is provided on the lower portion of the prepreg 100, that is, the heat radiation region 140 in the heat dissipation substrate 400 according to the first embodiment. As described above, the heat dissipation performance can be further improved by joining the heat sink 420 on the heat dissipation region 140.

The CTE and the modulus of the prepreg may be varied depending on the material of the filler included in the prepreg of the present invention, the copper-clad laminate and the heat-dissipating substrate. At this time, the prepreg of the present invention may be impregnated with a silica-coated carbon pillar to satisfy both the silica-impregnated properties and the carbon-filled silica impregnated properties.

10 and 11 are graphs showing changes in properties depending on the material of the filler impregnated in the prepreg of this embodiment. Compared to prepregs containing inorganic filler (silica) and prepregs containing carbon filler (graphite) The prepreg impregnated with silica-coated carbon filler shows a modulus of 1.6 GPa at room temperature and a CTE of 13 ppm / ° C, which is sufficient for the insulating material of the heat-dissipating substrate.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, and that various changes, substitutions and alterations can be made therein without departing from the spirit and scope of the invention. However, it should be understood that such substitutions, changes, and the like fall within the scope of the following claims.

100. Prepreg
110. Core
120. Resin material
121. Ceramic Coated Carbon Filler
122. Surface-free carbon filler
130. Insulation area
140. Heat-
200. Copper clad laminate
210. Copper foil layer
400. Heat-
410. Circuit layer
420. Heatsink

Claims (15)

A resin material including a core material; And
And a ceramic coated carbon filler contained in the resin material.
The method according to claim 1,
Wherein the resin material is composed of an upper insulating region and a lower insulating region, and the core material is provided between the upper insulating region and the lower insulating region.
3. The method of claim 2,
Wherein the upper insulating region and the lower insulating region have different thicknesses.
3. The method of claim 2,
Wherein a ratio of a thickness of the upper insulating region to a thickness of the lower insulating region is 0.1 to 10.
3. The method of claim 2,
Wherein the ceramic coated carbon filler contained in the upper insulating region and the ceramic coated carbon filler contained in the lower insulating region are different from each other.
The method according to claim 1,
Wherein the ceramic-coated carbon filler is contained in an amount of 95% by weight or less based on the resin material.
The method according to claim 1,
Wherein the core material is a fabric cloth or a glass cloth.
The method according to claim 1,
Wherein the ceramic coated carbon filler is at least one material selected from the group consisting of carbon, graphite, carbon nano tube, and diamond.
A resin material composed of an insulating region and a heat radiation region and including a core material between the insulation region and the heat radiation region;
A ceramic coated carbon filler contained in said insulating region; And
And a surface untreated carbon filler contained in the heat radiation region.
10. The method of claim 9,
Wherein the heat radiation region is thicker than the insulation region.
10. The method of claim 9,
Wherein the content ratio of the ceramic-coated carbon filler is different from the content ratio of the surface-untreated carbon filler.
A prepreg of any one of claims 1 to 8 and a copper foil layer formed on at least one of an upper surface and a lower surface of the prepreg.
A copper-clad laminate comprising a prepreg according to any one of claims 9 to 11 and a copper foil layer formed on an insulating region of the prepreg.
A resin material having an upper insulating region and a lower insulating region sandwiching the core material or an upper insulating region and a lower heat radiating region with a core therebetween;
A ceramic coated carbon filler contained in said insulating region;
A surface untreated carbon filler contained in the heat radiation region; And
And a circuit layer formed on the insulating region.
15. The method of claim 14,
And a heat sink provided on the heat radiation region.

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