KR102172294B1 - Epoxy resin composite and printed circuit board comprising the same - Google Patents

Abstract

The epoxy resin composition according to an embodiment of the present invention includes a dicyclopentadiene (DCPD) type epoxy compound and a curing agent 10 to 70 wt%, and an inorganic filler 30 to 90 wt% including plate-shaped boron nitride, and the plate-shaped Boron nitride may be included in 10 to 65 wt% of the total epoxy resin composition.

Description

Epoxy resin composition and a printed circuit board comprising the same TECHNICAL FIELD [EPOXY RESIN COMPOSITE AND PRINTED CIRCUIT BOARD COMPRISING THE SAME}

The present invention relates to an epoxy resin composition, and more particularly, to an epoxy resin composition and a printed circuit board including the same.

A printed circuit board (PCB) includes a circuit pattern layer formed on an insulating layer, and various electronic components may be mounted on the printed circuit board. The electronic component mounted on the printed circuit board may be, for example, a heating element. The heat emitted by the heating element may degrade the performance of the printed circuit board.

The printed circuit board can be divided into a single-sided PCB in which a circuit pattern layer is wired on one side of the board, a double-sided PCB in which a circuit pattern layer is wired on both sides of the board, and a multilayer PCB in which circuit pattern layers are wired in multiple layers. As the complexity of the circuit increases and the demand for a high-density and miniaturization circuit increases, a double-sided PCB or a multilayer PCB is widely used.

On the other hand, as electronic components become highly integrated and have higher capacity, interest in heat dissipation of printed circuit boards is increasing. In general, the insulating layer of a double-sided PCB or a multilayer PCB is mainly composed of FR-4 containing glass fibers impregnated with an amorphous epoxy compound. Since FR-4 has low thermal conductivity, there is a problem that it cannot effectively respond to heat emitted by the heating element.

The technical problem to be achieved by the present invention is to provide an epoxy resin composition and a printed circuit board including the same.

The epoxy resin composition according to an embodiment of the present invention includes a dicyclopentadiene (DCPD) type epoxy compound and a curing agent 10 to 70 wt%, and an inorganic filler 30 to 90 wt% including plate-shaped boron nitride, and the plate-shaped Boron nitride is contained in 10 to 65 wt% of the total epoxy resin composition.

Thermal conductivity is 4W/mK or more, dielectric constant at 1GHz is 4 or less, and peel strength at 1oz may be 1 Kgf/cm or more.

The curing agent may include dicyandiamide.

The curing agent may be included in an amount of 0.1 to 10 parts by weight based on 10 parts by weight of the epoxy compound.

The inorganic filler may further include a ceramic-based inorganic filler.

The ceramic-based inorganic filler may be included in an amount of 1.53 to 65 parts by weight based on 10 parts by weight of the plate-shaped boron nitride.

A printed circuit board according to an embodiment of the present invention includes N insulating layers in which a circuit pattern is formed on at least one of an upper surface and a lower surface, and is sequentially disposed from the first insulating layer to the Nth insulating layer, and the first The insulating layer and the Nth insulating layer include a dicyclopentadiene (DCPD) type epoxy compound, an epoxy resin composition including an inorganic filler including a curing agent and a plate-shaped boron nitride.

The second insulating layer formed above the first insulating layer and the N-1th insulating layer formed below the Nth insulating layer may include the epoxy resin composition.

Of the N insulating layers, 15 to 80% of the insulating layers may include the epoxy resin composition.

Each of the insulating layers may have a thickness of 30 μm to 65 μm.

The remaining insulating layers among the N insulating layers may include glass fibers impregnated with an epoxy resin.

The glass fiber impregnated with the epoxy resin may be FR (Flame Retardant)-4.

According to an embodiment of the present invention, an epoxy resin composition having a low dielectric constant as well as high heat dissipation performance can be obtained. Accordingly, heat generated during operation of a component mounted on the upper or lower part of the printed circuit board is dissipated in a horizontal or vertical direction, thereby reducing the temperature of the component and increasing the life and reliability of the component.

1 is a cross-sectional view of a four-layer printed circuit board according to an embodiment of the present invention.
2 is a cross-sectional view of a four-layer printed circuit board according to another embodiment of the present invention.
3 is a cross-sectional view of a 10-layer printed circuit board according to an embodiment of the present invention.
4 is a cross-sectional view of a 10-layer printed circuit board according to another embodiment of the present invention.
5 is a cross-sectional view of a 12-layer printed circuit board according to an embodiment of the present invention.
6 is a cross-sectional view of a 12-layer printed circuit board according to another embodiment of the present invention.

The present invention is intended to illustrate and describe specific embodiments in the drawings, as various changes may be made and various embodiments may be provided. However, this is not intended to limit the present invention to a specific embodiment, it is to be understood to include all changes, equivalents, and substitutes included in the spirit and scope of the present invention.

Terms including ordinal numbers, such as second and first, may be used to describe various elements, but the elements are not limited by the terms. These terms are used only for the purpose of distinguishing one component from another component. For example, without departing from the scope of the present invention, a second component may be referred to as a first component, and similarly, a first component may be referred to as a second component. The term and/or includes a combination of a plurality of related listed items or any of a plurality of related listed items.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, terms such as "comprise" or "have" are intended to designate the presence of features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, but one or more other features. It is to be understood that the presence or addition of elements or numbers, steps, actions, components, parts, or combinations thereof, does not preclude in advance.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. Terms as defined in a commonly used dictionary should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and should not be interpreted as an ideal or excessively formal meaning unless explicitly defined in this application. Does not.

When a part of a layer, film, region, plate, etc. is said to be "on" another part, this includes not only the case where the other part is "directly above", but also the case where there is another part in the middle. Conversely, when one part is "right above" another part, it means that there is no other part in the middle.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings, but the same reference numerals are assigned to the same or corresponding components regardless of the reference numerals, and redundant descriptions thereof will be omitted.

In the present specification, wt% may be replaced by parts by weight.

A printed circuit board according to an embodiment of the present invention includes a plurality of circuit pattern layers that are sequentially arranged, and a plurality of insulating layers each formed between the plurality of circuit pattern layers, and at least some of the plurality of insulating layers are insulated. The layer includes an epoxy resin composition according to an embodiment of the present invention. The epoxy resin composition according to an embodiment of the present invention includes a dicyclopentadiene (DCPD) type epoxy compound, a curing agent, and an inorganic filler including plate-shaped boron nitride.

The epoxy resin composition according to an embodiment of the present invention includes an inorganic filler including a dicyclopentadiene (DCPD) type epoxy compound, a curing agent, and plate-shaped boron nitride.

The DCPD-type epoxy compound and curing agent are included in 10 to 70 wt%, preferably 20 to 50 wt% of the total epoxy resin composition, and the inorganic filler is included in 30 to 90 wt%, preferably 50 to 80 wt% of the total epoxy resin composition. I can. When the epoxy compound and the curing agent are contained in an amount of 10 wt% or more and 70 wt% or less of the total epoxy resin composition, adhesion is good and thickness control may be easy. In addition, when the inorganic filler is included in an amount of 30 to 90 wt%, high thermal conductivity, low thermal expansion, and high temperature heat resistance of the epoxy resin composition may be improved. High thermal conductivity, low thermal expansion, and high temperature heat resistance are better as the amount of the inorganic filler added increases, but does not improve according to the volume fraction, and improves drastically from a specific amount. However, when the amount of the inorganic filler added is greater than 90 wt%, the viscosity increases and moldability is weakened.

The DCPD-type epoxy compound included in the epoxy resin composition according to an embodiment of the present invention may be, for example, at least one of Formulas 1 to 3 below. However, the present invention is not limited thereto, and various DCPD-type epoxy compounds may be included in addition to Chemical Formulas 1 to 3.

[Formula 1]

[Formula 2]

[Formula 3]

In addition, the epoxy resin composition according to an embodiment of the present invention may further include at least one of a bisphenol-type epoxy compound, a cyclo-type epoxy compound, a novolac-type epoxy compound, an aliphatic epoxy compound, and a modified epoxy compound thereof. When the epoxy resin composition according to an embodiment of the present invention further includes a bisphenol-type epoxy compound, room temperature stability may be improved.

The curing agent included in the epoxy resin composition according to an embodiment of the present invention may include at least one of an amine-based curing agent, a xylol-based curing agent, an acid anhydride-based curing agent, a phenolic curing agent, a DCPD-based curing agent, and a TCPD-based curing agent. For example, the curing agent included in the epoxy resin composition according to an embodiment of the present invention, dicyandiamide of Formula 4, diaminodiphenylsulfone of Formula 5, and DOPO-ATN of Formula 6 It may be at least one of (6-H-dibenz[c,e][1,2]oxaphosphorin-6-[2,5-bis(oxiranylmethoxy)phenyl]-6-oxide-Aminotriazine Novolac).

[Formula 4]

[Formula 5]

[Formula 6]

The epoxy resin composition according to an exemplary embodiment of the present invention may contain 0.6 to 1.1 equivalents of a curing agent based on 1 equivalent of DCPD-type epoxy compound. For example, 0.1 to 10 parts by weight, preferably 1 to 6 parts by weight, and more preferably 2 to 4 parts by weight, based on 10 parts by weight of the DCPD-type epoxy compound of Chemical Formula 1 may be included. When the epoxy compound and the curing agent are included in these numerical ranges, adhesion is good and thickness control may be easy.

The epoxy resin composition according to an embodiment of the present invention may further include a curing accelerator. The curing accelerator includes, for example, an amine curing accelerator, an imidazole curing accelerator, a urea curing accelerator, an acid curing accelerator, and the like. Specifically, 1,8-diazabicyclo (5,4,0 ) Tertiary amines such as undecene-7, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol, 2-methylimidazole, 2-phenylimidazole, 2- And imidazoles such as phenyl-4-methylimidazole and 2-heptadecylimidazole.

Formula 7 is an example of an imidazole curing accelerator.

[Formula 7]

The epoxy resin composition according to an embodiment of the present invention includes an inorganic filler including plate-shaped boron nitride. The thickness of the insulating layer of the multilayer printed circuit board according to an embodiment of the present invention is 30 μm to 65 μm. At this time, D95 of the inorganic filler of the epoxy resin composition included in the insulating layer should be limited to 90% or less of the thickness of the insulating layer. This is because when D95 of the inorganic filler exceeds 90% of the thickness of the insulating layer, the formability deteriorates and the adhesion performance with the circuit pattern is deteriorated. On the other hand, as the particle size of the spherical inorganic filler decreases, the specific surface area increases, and the contact area with the epoxy compound increases. Accordingly, the hydroxyl groups in the epoxy compound increase, thereby increasing the dielectric constant. According to an embodiment of the present invention, when the epoxy resin composition contains plate-shaped boron nitride, the particle size is low and the specific surface area is small, so that a low dielectric constant can be maintained. At this time, the plate-shaped boron nitride may have a D50 of 8 μm or more in the length direction, preferably 8 μm to 30 μm. When D50 in the longitudinal direction of the plate-shaped boron nitride is within this numerical range, an epoxy resin composition having a low dielectric constant and easy molding can be obtained.

In this case, the plate-shaped boron nitride may be included in an amount of 10 to 65 wt% of the total epoxy resin composition. When the plate-shaped boron nitride is contained in an amount of less than 10 wt% of the total epoxy resin composition, the dielectric constant of the epoxy resin composition is increased. In addition, when the plate-shaped boron nitride is contained in an amount exceeding 65 wt% of the total epoxy resin composition, pores are generated and the peel strength is lowered.

The epoxy resin composition according to an embodiment of the present invention is a ceramic inorganic filler including at least one of aluminum oxide, aluminum nitride, spherical boron nitride, silicon nitride, silicon carbide, beryllium oxide and cerium oxide, diamond, carbon nanotube, and graphite. It may further include at least one of a carbon-based inorganic filler including at least one of the pins and insulating metal particles.

At this time, at least one of the ceramic-based inorganic filler and the carbon-based inorganic filler may be included in an amount of 1.53 to 65 parts by weight, preferably 5 to 50 parts by weight, more preferably 10 to 30 parts by weight, based on 10 parts by weight of plate-shaped boron nitride. . When at least one of the plate-shaped boron nitride, the ceramic-based inorganic filler, and the carbon-based inorganic filler are contained within this numerical range, an epoxy resin composition having high thermal conductivity and low dielectric constant can be obtained.

According to one embodiment of the present invention, the epoxy compound, the hardener and the inorganic filler are ball mill, impeller mixing, bead mill, basket mill, planetary mill, dino mill, It can be mixed using a 3 roll mill or the like. At this time, a solvent and a dispersant may be added for even dispersion. The solvent may be added to adjust the viscosity, and the viscosity of the solvent may be 1 to 100,000 Cps. The solvent is, for example, water, methanol, ethanol, isopropanol, butyl carbitol, MEK, toluene, xylene, diethylene glycol, formamide, α-terpineneol, γ-butyrolactone, methylcellulose, propyl It may contain at least one of methylcellulose, cyclopentanone, BCE (Butyl Cellosolve), and DBE (Dibasic ester). In addition, the dispersant may be selected from the group consisting of nonionic surfactants, cationic surfactants, anionic surfactants, octyl alcohol and acrylic and urethane polymers.

The epoxy resin composition according to an embodiment of the present invention may further include a silane-based additive to increase bonding between particles. The silane-based additives are, for example, 1-trimethylsilylbut-1 (yne)-3-ol, aryltrimethylsilane, trimethylsilyl methanesulfonate, trimethylsilyl tricholoacetate, methyl trimethylsilylacetate, trimethylsilyl propionic acid, etc. to be.

The epoxy resin composition according to an embodiment of the present invention may further contain phosphorus (P) to increase flame retardancy. Phosphorus may be included in 0.5 to 4 wt% of the epoxy compound, the curing agent and the curing accelerator.

By curing the epoxy resin composition according to an embodiment of the present invention and using it as an insulating layer, a printed circuit board having excellent heat dissipation performance and low dielectric constant can be obtained.

1 is a cross-sectional view of a four-layer printed circuit board according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of a four-layer printed circuit board according to another embodiment of the present invention.

Referring to FIG. 1, a four-layer printed circuit board 100 includes a plurality of circuit pattern layers 110 that are sequentially disposed, and a plurality of insulating layers 120 formed between the plurality of circuit pattern layers 110. do. That is, the printed circuit board 100 includes an insulating layer 120-1 with a circuit pattern layer 110-1 formed on the lower surface thereof, and an insulating layer with circuit pattern layers 110-2 and 110-3 formed on the upper and lower surfaces thereof ( 120-2) and an insulating layer 120-3 on which the circuit pattern layer 110-4 is formed on the upper surface.

Here, the insulating layer 120 insulates the circuit pattern layer 110. In addition, the circuit pattern layer 110 may be made of a metal such as copper or nickel. Although not shown, the four-layer printed circuit board 100 may be formed on a metal plate. Here, the metal plate may include copper, aluminum, nickel, gold, platinum, and an alloy selected from these.

Referring to FIG. 2, the four-layer printed circuit board 100 may further include a through hole 130 connecting some of the plurality of circuit pattern layers 110. That is, formed to penetrate the entire printed circuit board 100 like the through hole 130-1, or penetrate a part of the printed circuit board 100 like the through hole 130-2 or the through hole 130-3 It can be formed to be.

The inside of the through hole 130 may be surface-plated with copper (Cu) and then filled with an epoxy resin or filled with copper.

1 to 2, the insulating layer 120-1 formed between the circuit pattern layer 110-1 and the circuit pattern layer 110-2, that is, the lowermost insulating layer 120-1 and the circuit pattern. The insulating layer 120-3 formed between the layer 110-3 and the circuit pattern layer 110-4, that is, the uppermost insulating layer 120-3, contains an epoxy resin composition according to an embodiment of the present invention. Include. In this way, when the insulating layer containing the epoxy resin composition having high thermal conductivity and low dielectric constant is symmetrically disposed on the uppermost and lowermost portions of the printed circuit board, heat generated by the heat generating element is transferred not only in the horizontal direction but also in the vertical direction. Can be dispersed.

Here, the thickness of the insulating layer 120 may be 30 μm to 65 μm, respectively. When the thickness of the insulating layer 120 satisfies this numerical range, an effect of reducing the surface temperature of the printed circuit board can be obtained, and the substrate can be easily processed.

In addition, some of the remaining insulating layers 120-2 of the plurality of insulating layers may include glass fibers impregnated with an epoxy resin. Here, the epoxy resin may include an amorphous epoxy compound. The amorphous epoxy compound may be a general amorphous epoxy compound having two or more epoxy groups in the molecule, for example, a bisphenol A type epoxy compound, a bisphenol F type epoxy compound, a cyclo type epoxy compound, a novolak type epoxy compound, an aliphatic It may be an epoxy compound or the like.

Glass fibers impregnated with an epoxy resin may include, for example, FR (Flame Retardant)-4.

3 is a cross-sectional view of a 10-layer printed circuit board according to an embodiment of the present invention, and FIG. 4 is a cross-sectional view of a 10-layer printed circuit board according to another embodiment of the present invention.

3 to 4, the 10-layer printed circuit board 200 includes a plurality of circuit pattern layers 210 that are sequentially disposed, and a plurality of insulating layers 220 formed between the plurality of circuit pattern layers 210, respectively. ).

For example, a plurality of circuit pattern layers 210-1, ..., 210-10 are sequentially disposed, and a plurality of circuit pattern layers 210-1, ..., 210-10 Insulating layers 220-1, ..., 220-9 may be formed.

Referring to FIG. 3, an insulating layer 220-1 formed between the circuit pattern layer 210-1 and the circuit pattern layer 210-2, that is, the lowermost insulating layer 220-1 and the circuit pattern layer ( The insulating layer 220-9 formed between the 210-9) and the circuit pattern layer 210-10, that is, the uppermost insulating layer 220-9 includes an epoxy resin composition according to an embodiment of the present invention. .

4, the insulating layer 220-2 formed on the lowermost insulating layer 220-1 and the insulating layer 220-8 formed under the uppermost insulating layer 220-9 are also shown. It may include an epoxy resin composition according to an embodiment of the present invention.

Here, the thickness of the insulating layer 220 may be 30 μm to 65 μm, respectively. When the thickness of the insulating layer 220 satisfies this numerical range, an effect of reducing the surface temperature of the printed circuit board can be obtained, and the substrate can be easily processed.

In addition, some of the remaining insulating layers among the plurality of insulating layers may include glass fibers impregnated with an epoxy resin. Glass fibers impregnated with an epoxy resin may include, for example, FR (Flame Retardant)-4.

5 is a cross-sectional view of a 12-layer printed circuit board according to an embodiment of the present invention, and FIG. 6 is a cross-sectional view of a 12-layer printed circuit board according to another embodiment of the present invention.

5 to 6, the 12-layer printed circuit board 300 includes a plurality of circuit pattern layers 310 that are sequentially disposed, and a plurality of insulating layers 320 formed between the plurality of circuit pattern layers 310, respectively. ).

For example, a plurality of circuit pattern layers 310-1, ..., 310-12 are sequentially disposed, and a plurality of circuit pattern layers 310-1, ..., 310-12 Insulating layers 320-1, ..., 320-11 may be formed.

5, the insulating layer 320-1 formed between the circuit pattern layer 310-1 and the circuit pattern layer 310-2, that is, the lowermost insulating layer 320-1 and the circuit pattern layer ( The insulating layer 320-11 formed between the 310-11) and the circuit pattern layer 310-12, that is, the uppermost insulating layer 320-11 includes an epoxy resin composition according to an embodiment of the present invention. .

6, the insulating layer 320-2 formed on the lowermost insulating layer 320-1 and the insulating layer 320-10 formed under the uppermost insulating layer 320-11 are also present in the present invention. It may include an epoxy resin composition according to an embodiment of.

Here, the thickness of the insulating layer 320 may be 30 μm to 65 μm, respectively. When the thickness of the insulating layer 320 satisfies this numerical range, an effect of reducing the surface temperature of the printed circuit board can be obtained, and the substrate can be easily processed.

In addition, some of the remaining insulating layers among the plurality of insulating layers may include glass fibers impregnated with an epoxy resin. Glass fibers impregnated with an epoxy resin may include, for example, FR (Flame Retardant)-4.

1 to 6, the insulating layer including the epoxy resin composition according to an embodiment of the present invention is symmetrically disposed on the upper and lower portions of the printed circuit board, and the middle insulating layer may include FR-4. .

In addition, the plurality of insulating layers, for example, 15 to 80% of the insulating layers of the N insulating layers may include the epoxy resin composition according to an embodiment of the present invention. If the insulating layer including the epoxy resin composition according to an embodiment of the present invention is included in less than 15% of the N insulating layers, the effect of reducing the surface temperature of the printed circuit board cannot be obtained. And, if the insulating layer containing the epoxy resin composition according to an embodiment of the present invention is included in more than 80% of the N insulating layers, processing of the printed circuit board becomes difficult.

Hereinafter, it will be described in more detail using Examples and Comparative Examples.

<Example 1>

19.3wt% of the DCPD-type epoxy compound of Formula 1, 5.5wt% of dicyandiamide of Formula 4, and 0.2wt% of the imidazole-based curing accelerator of Formula 7 were dissolved in MEK (Methyl Ethly Ketone) for 20 minutes, and then aluminum oxide 40wt. % And plate-shaped boron nitride (D50 in the longitudinal direction of 10 to 20 µm) 35 wt% were added and stirred for 2 hours. After the solution having been stirred was coated on a copper plate, it was pressurized at 150° C. for 1 hour and 30 minutes to obtain the epoxy resin composition of Example 1.

<Comparative Example 1>

After dissolving 19.3 wt% of the DCPD type epoxy compound of Formula 1, 5.5 wt% of dicyandiamide of Formula 4, and 0.2 wt% of the imidazole-based curing accelerator of Formula 7 for 20 minutes in MEK (Methyl Ethly Ketone), 75 wt of aluminum oxide % Was added and stirred for 2 hours. After the stirring was completed, the solution was coated on a copper plate and then pressurized at 150° C. for 1 hour and 30 minutes to obtain the epoxy resin composition of Comparative Example 1.

<Comparative Example 2>

After dissolving 19.3 wt% of the DCPD-type epoxy compound of Formula 1, 5.5 wt% of dicyandiamide of Formula 4, and 0.2 wt% of the imidazole-based curing accelerator of Formula 7 for 20 minutes in MEK (Methyl Ethly Ketone), 70 wt of aluminum oxide % And plate-shaped boron nitride (D50 in the longitudinal direction of 10 to 20 μm) 5 wt% were added and stirred for 2 hours. After the stirring was completed, the solution was coated on a copper plate and then pressurized at 150° C. for 1 hour and 30 minutes to obtain the epoxy resin composition of Comparative Example 2.

<Comparative Example 3>

After dissolving 19.3 wt% of the DCPD type epoxy compound of Formula 1, 5.5 wt% of dicyandiamide of Formula 4, and 0.2 wt% of the imidazole-based curing accelerator of Formula 7 for 20 minutes in MEK (Methyl Ethly Ketone), 5 wt of aluminum oxide % And plate-shaped boron nitride (D50 in the longitudinal direction of 10 to 20 µm) 70 wt% were added and stirred for 2 hours. The solution after the completion of stirring was coated on a copper plate and then pressurized at 150° C. for 1 hour and 30 minutes to obtain the epoxy resin composition of Comparative Example 3.

<Comparative Example 4>

After dissolving 19.3 wt% of the novolak type epoxy compound of Formula 8, 5.5 wt% of dicyandiamide of Formula 4, and 0.2 wt% of the imidazole-based curing accelerator of Formula 7 for 20 minutes in MEK (Methyl Ethly Ketone), oxidation 40wt% of aluminum and 35wt% of plate-shaped boron nitride (D50 in the longitudinal direction of 10 to 20㎛) were added and stirred for 2 hours. After the solution having been stirred was coated on a copper plate, it was pressurized at 150° C. for 1 hour and 30 minutes to obtain an epoxy resin composition of Comparative Example 4.

[Formula 8]

<Comparative Example 5>

19.3wt% of the DCPD-type epoxy compound of Formula 1, 5.5wt% of dicyandiamide of Formula 4, and 0.2wt% of the imidazole-based curing accelerator of Formula 7 were dissolved in MEK (Methyl Ethly Ketone) for 20 minutes, and then aluminum oxide 40wt. % And plate-shaped boron nitride (D50 in the longitudinal direction of 5 µm) 35 wt% were added and stirred for 2 hours. After the stirring was completed, the solution was coated on a copper plate and then pressurized at 150° C. for 1 hour and 30 minutes to obtain the epoxy resin composition of Comparative Example 5.

<Comparative Example 6>

After dissolving 19.3 wt% of the DCPD type epoxy compound of Formula 1, 5.5 wt% of dicyandiamide of Formula 4, and 0.2 wt% of the imidazole-based curing accelerator of Formula 7 in MEK (Methyl Ethly Ketone) for 20 minutes, glass fiber ( glass fabric) 75wt% was added and stirred for 2 hours. The solution after the completion of stirring was coated on a copper plate and then pressurized at 150° C. for 1 hour and 30 minutes to obtain the epoxy resin composition of Comparative Example 6.

<Experimental Example>

After curing the epoxy resin compositions obtained from Example 1 and Comparative Examples 1 to 6, thermal conductivity was measured using an ASTM E1461 thermal conductivity meter, and dielectric constant was measured using IPC-TM-650 2.5.5.9, and IPC- Peel strength was measured using TM-650 2.4.8.

Table 1 is a result of comparing the thermal conductivity, dielectric constant, and peel strength of Examples and Comparative Examples.

Experiment number Thermal conductivity (W/mK) Permittivity (@1GHz) Peel strength (Kgf/cm @1oz) Example 1 5.0 3.7 1.5 Comparative Example 1 3.5 5.5 1.5 Comparative Example 2 3.6 5.4 1.5 Comparative Example 3 5.7 3.0 0.3 Comparative Example 4 3.9 4.4 1.5 Comparative Example 5 4.5 4.6 1.5 Comparative Example 6 0.3 3.7 1.5

Referring to Table 1, as in Example 1, the epoxy resin composition according to an embodiment of the present invention has a thermal conductivity of 4W/mK or more, a dielectric constant of 4 or less at 1 GHz, and a peel strength of 1 Kgf/oz. It can be seen that it is more than cm.

On the other hand, in Comparative Examples 1 and 2 in which the plate-shaped boron nitride was not included or contained in less than 10 wt% of the total epoxy resin composition, the dielectric constant was higher than 4, so it was found that it was not suitable for use as an insulating layer have. In addition, in Comparative Example 3 in which the plate-shaped boron nitride was included in excess of 65 wt% of the total epoxy resin composition, it can be seen that the peel strength was 1Kgf/cm or less due to the generation of pores.

And, the inorganic filler containing the plate-shaped boron nitride was included in the same manner as in Example 1, but the composition ratio of Comparative Example 4 and Example 1 in which a novolac-type epoxy resin was used, but the D50 in the longitudinal direction was less than 8㎛. It can be seen that in Comparative Example 5 in which boron is used, the dielectric constant is higher than 4. In addition, in Comparative Example 6 including glass fibers, the dielectric constant is 4 or less, but it can be seen that the thermal conductivity is low.

Hereinafter, a result of comparing the heat dissipation performance of a printed circuit board in which some insulating layers include an epoxy resin composition according to an embodiment of the present invention will be described.

Hereinafter, in Table 2, the epoxy resin composition refers to the epoxy resin composition of Example 1, and FR-4 refers to the epoxy resin composition of Comparative Example 6.

Thermal stress was carried out by 10 cycles of the printed circuit boards of Examples and Comparative Examples on a solder at 288° C. by 10 sec. At this time, the cycle when the circuit pattern layer and the insulating layer were separated or the pores started to swell was recorded.

The increased temperature is a result of attaching a ceramic-based heat source with a thermocouple fixed to the surface on the printed circuit boards of Examples and Comparative Examples and measuring the temperature of the heat source at room temperature (25°C). After applying the same output (Voltage*Ampere) to the printed circuit boards of Examples and Comparative Examples, the temperature was measured. After applying the output, the result of subtracting the measured temperature at room temperature from the measured temperature was calculated as the increased temperature.

Table 2 is a result of comparing the heat dissipation performance of the 10-layer printed circuit board shown in FIGS. 3 to 4.

Sectional structure Example 2 Example 3 Comparative Example 7 Comparative Example 8 Kinds Thickness [mm] Kinds Thickness [mm] Kinds Thickness [mm] Kinds Thickness [mm] Circuit pattern layer 210-10 Cu 0.025 Cu 0.025 Cu 0.025 Cu 0.025 Insulation layer (220-9) Epoxy resin composition 0.060 Epoxy resin composition 0.060 Epoxy resin composition 0.060 FR-4 0.060 Circuit pattern layer 210-9 Cu 0.020 Cu 0.020 Cu 0.020 Cu 0.020 Insulation layer (220-8) FR-4 0.060 Epoxy resin composition 0.060 Epoxy resin composition 0.060 FR-4 0.060 Circuit pattern layer 210-8 Cu 0.020 Cu 0.020 Cu 0.020 Cu 0.020 Insulation layer (220-7) FR-4 0.060 FR-4 0.060 Epoxy resin composition 0.060 FR-4 0.060 Circuit pattern layer 210-7 Cu 0.020 Cu 0.020 Cu 0.020 Cu 0.020 Insulation layer (220-6) FR-4 0.060 FR-4 0.060 Epoxy resin composition 0.060 FR-4 0.060 Circuit pattern layer 210-6 Cu 0.020 Cu 0.020 Cu 0.020 Cu 0.020 Insulation layer (220-5) FR-4 0.060 FR-4 0.060 FR-4 0.060 FR-4 0.060 Circuit pattern layer 210-5 Cu 0.020 Cu 0.020 Cu 0.020 Cu 0.020 Insulation layer (220-4) FR-4 0.060 FR-4 0.060 Epoxy resin composition 0.060 FR-4 0.060 Circuit pattern layer 210-4 Cu 0.020 Cu 0.020 Cu 0.020 Cu 0.020 Insulation layer (220-3) FR-4 0.060 FR-4 0.060 Epoxy resin composition 0.060 FR-4 0.060 Circuit pattern layer 210-3 Cu 0.020 Cu 0.020 Cu 0.020 Cu 0.020 Insulation layer 220-2 FR-4 0.060 Epoxy resin composition 0.060 Epoxy resin composition 0.060 FR-4 0.060 Circuit pattern layer 210-2 Cu 0.020 Cu 0.020 Cu 0.020 Cu 0.020 Insulating layer 220-1 Epoxy resin composition 0.060 Epoxy resin composition 0.060 Epoxy resin composition 0.060 FR-4 0.060 Circuit pattern layer 210-1 Cu 0.025 Cu 0.025 Cu 0.025 Cu 0.025 Thermal stress 10cycle 10cycle 10cycle 10cycle Increase temperature(℃) 65.6 62.9 56.7 70.1

As shown in Table 2, it can be seen that even in a 10-layer printed circuit board, Examples 2 to 3 and Comparative Examples 7 to 8 can withstand the thermal stress of 10 cycles. However, compared to Comparative Example 2 (increased temperature: 70.1°C) in which all the insulating layers contain FR-4, the increased temperature of Examples 2 to 3 and Comparative Example 7 in which all or part of the insulating layer contains an epoxy resin composition Appears low. Accordingly, it can be seen that the printed circuit boards of Examples 2 to 3 and Comparative Example 7 have superior heat dissipation performance compared to the printed circuit board of Comparative Example 8. However, in the printed circuit board of Comparative Example 7 in which 80% or more of the insulating layer contains the epoxy resin composition of the present invention, the increase temperature is low, but there is a problem that the process defect rate increases when processing a hole (Via).

Although the above has been described with reference to preferred embodiments of the present invention, those skilled in the art will variously modify and change the present invention within the scope not departing from the spirit and scope of the present invention described in the following claims. You will understand that you can do it.

Claims (12)

Dicyclopentadiene (DCPD) type epoxy compound and curing agent 10 to 70 wt%, and
Contains 30 to 90wt% of an inorganic filler containing plate-shaped boron nitride,
The curing agent includes dicyandiamide,
Contains 0.1 to 10 parts by weight of dicyandiamide based on 10 parts by weight of the DCPD-type epoxy compound,
The plate-shaped boron nitride is included in 10 to 65 wt% of the total epoxy resin composition,
D50 of the plate-shaped boron nitride is 8㎛ to 30㎛ epoxy resin composition. The method of claim 1,
Thermal conductivity is 4W/mK or more, dielectric constant at 1GHz is 4 or less, and peel strength at 1oz is 1 Kgf/cm or more. delete delete The method of claim 1,
The inorganic filler is an epoxy resin composition further comprising a ceramic-based inorganic filler. The method of claim 5,
The epoxy resin composition containing 1.53 to 65 parts by weight of the ceramic inorganic filler based on 10 parts by weight of the plate-shaped boron nitride. It includes N insulating layers in which a circuit pattern is formed on at least one of the upper and lower surfaces,
Sequentially disposed from the first insulating layer to the Nth insulating layer,
The first insulating layer and the N-th insulating layer include a dicyclopentadiene (DCPD) type epoxy compound, a curing agent, and an inorganic filler including plate-shaped boron nitride, and the curing agent includes dicyandiamide, Contains 0.1 to 10 parts by weight of dicyandiamide based on 10 parts by weight of the DCPD-type epoxy compound, the plate-shaped boron nitride is contained in 10 to 65% by weight of the total epoxy resin composition, and the D50 of the plate-shaped boron nitride is 8 μm A printed circuit board comprising an epoxy resin composition of to 30㎛. The method of claim 7,
The second insulating layer formed on the first insulating layer and the N-1th insulating layer formed under the Nth insulating layer include the epoxy resin composition. The method of claim 7,
15 to 80% of the N insulating layers of the printed circuit board containing the epoxy resin composition. The method of claim 7,
Each of the insulating layers has a thickness of 30 μm to 65 μm. The method of claim 7,
The remaining insulating layers among the N insulating layers are printed circuit boards comprising glass fibers impregnated with an epoxy resin. The method of claim 11,
The glass fiber impregnated with the epoxy resin is FR (Flame Retardant)-4 printed circuit board.

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