KR20150105255A - 발광 소자 - Google Patents

발광 소자 Download PDF

Info

Publication number
KR20150105255A
KR20150105255A KR1020150031745A KR20150031745A KR20150105255A KR 20150105255 A KR20150105255 A KR 20150105255A KR 1020150031745 A KR1020150031745 A KR 1020150031745A KR 20150031745 A KR20150031745 A KR 20150031745A KR 20150105255 A KR20150105255 A KR 20150105255A
Authority
KR
South Korea
Prior art keywords
light emitting
connection
pad
carrier
connection pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020150031745A
Other languages
English (en)
Korean (ko)
Inventor
민 순 시에
Original Assignee
에피스타 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에피스타 코포레이션 filed Critical 에피스타 코포레이션
Publication of KR20150105255A publication Critical patent/KR20150105255A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H01L33/62—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/66—Details of globes or covers forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H01L2924/12041—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07202—Connecting or disconnecting of bump connectors using auxiliary members
    • H10W72/07204—Connecting or disconnecting of bump connectors using auxiliary members using temporary auxiliary members, e.g. sacrificial coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
KR1020150031745A 2014-03-06 2015-03-06 발광 소자 Ceased KR20150105255A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201461948917P 2014-03-06 2014-03-06
US61/948,917 2014-03-06

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020190170956A Division KR102187708B1 (ko) 2014-03-06 2019-12-19 발광 소자

Publications (1)

Publication Number Publication Date
KR20150105255A true KR20150105255A (ko) 2015-09-16

Family

ID=53884147

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020150031745A Ceased KR20150105255A (ko) 2014-03-06 2015-03-06 발광 소자
KR1020190170956A Active KR102187708B1 (ko) 2014-03-06 2019-12-19 발광 소자

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020190170956A Active KR102187708B1 (ko) 2014-03-06 2019-12-19 발광 소자

Country Status (6)

Country Link
US (2) US9583469B2 (https=)
JP (1) JP2015170858A (https=)
KR (2) KR20150105255A (https=)
CN (1) CN105280796A (https=)
DE (1) DE102015103289A1 (https=)
TW (2) TWI656300B (https=)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10228093B2 (en) 2015-08-17 2019-03-12 Jiaxing Super Lighting Electric Appliance Co., Ltd LED light bulb and LED filament thereof
US10544905B2 (en) 2014-09-28 2020-01-28 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
US10677396B2 (en) 2006-07-22 2020-06-09 Jiaxing Super Lighting Electric Appliance Co., Ltd LED light bulb with symmetrical filament
US10655792B2 (en) * 2014-09-28 2020-05-19 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
US10487987B2 (en) 2015-08-17 2019-11-26 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament
US10473271B2 (en) 2015-08-17 2019-11-12 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament module and LED light bulb
US9995474B2 (en) 2015-06-10 2018-06-12 Jiaxing Super Lighting Electric Appliance Co., Ltd. LED filament, LED filament assembly and LED bulb
US10240724B2 (en) 2015-08-17 2019-03-26 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament
WO2013067046A2 (en) * 2011-10-31 2013-05-10 Densen Cao Led light source
KR20150105255A (ko) * 2014-03-06 2015-09-16 에피스타 코포레이션 발광 소자
USD786458S1 (en) * 2014-08-07 2017-05-09 Epistar Corporation Light emitting diode filament
US10976009B2 (en) 2014-09-28 2021-04-13 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament light bulb
US10784428B2 (en) 2014-09-28 2020-09-22 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US10982816B2 (en) 2014-09-28 2021-04-20 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb having uniform light emmision
US11259372B2 (en) 2015-06-10 2022-02-22 Zhejiang Super Lighting Electric Appliance Co., Ltd High-efficiency LED light bulb with LED filament therein
US11525547B2 (en) 2014-09-28 2022-12-13 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11997768B2 (en) 2014-09-28 2024-05-28 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11543083B2 (en) 2014-09-28 2023-01-03 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11028970B2 (en) 2014-09-28 2021-06-08 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament light bulb having organosilicon-modified polyimide resin composition filament base layer
US11686436B2 (en) 2014-09-28 2023-06-27 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and light bulb using LED filament
US12007077B2 (en) 2014-09-28 2024-06-11 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US11085591B2 (en) 2014-09-28 2021-08-10 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11073248B2 (en) * 2014-09-28 2021-07-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
US11015764B2 (en) 2014-09-28 2021-05-25 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with flexible LED filament having perpendicular connecting wires
US10845008B2 (en) 2014-09-28 2020-11-24 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US11421827B2 (en) 2015-06-19 2022-08-23 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US10026882B2 (en) * 2014-10-07 2018-07-17 Epistar Corporation Using MEMS fabrication incorporating into LED device mounting and assembly
US20160238199A1 (en) * 2015-02-16 2016-08-18 Gean Technology Co. Limited Light bulb with led symbols
CN106439531A (zh) * 2015-08-07 2017-02-22 深圳市裕富照明有限公司 充气led灯泡
US11168844B2 (en) 2015-08-17 2021-11-09 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb having filament with segmented light conversion layer
US10359152B2 (en) 2015-08-17 2019-07-23 Zhejiang Super Lighting Electric Appliance Co, Ltd LED filament and LED light bulb
TWI744221B (zh) * 2015-12-04 2021-11-01 晶元光電股份有限公司 發光裝置
TWI587543B (zh) * 2015-12-15 2017-06-11 李乃義 發光二極體封裝結構及其製造方法
KR101718652B1 (ko) * 2016-03-11 2017-03-22 한국과학기술원 무전사 플렉서블 수직형 발광다이오드 및 이의 제작 방법
CN107676637A (zh) * 2016-08-01 2018-02-09 漳州立达信光电子科技有限公司 全向出光led灯
DE102016114571A1 (de) * 2016-08-05 2018-02-08 Osram Opto Semiconductors Gmbh Filament mit einem träger
KR102430500B1 (ko) 2017-05-30 2022-08-08 삼성전자주식회사 반도체 발광소자 및 이를 이용한 led 모듈
TWI635605B (zh) * 2017-11-02 2018-09-11 Pixeled Display Co., Ltd. 微型發光二極體顯示面板
KR102459144B1 (ko) * 2017-11-20 2022-10-27 서울반도체 주식회사 전구형 광원
US10790419B2 (en) 2017-12-26 2020-09-29 Jiaxing Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
CN109973833B (zh) 2017-12-26 2023-03-28 嘉兴山蒲照明电器有限公司 Led灯丝及led球泡灯
KR102769519B1 (ko) * 2018-02-14 2025-02-17 에피스타 코포레이션 발광 장치, 그 제조 방법 및 디스플레이 모듈
US10982048B2 (en) 2018-04-17 2021-04-20 Jiaxing Super Lighting Electric Appliance Co., Ltd Organosilicon-modified polyimide resin composition and use thereof
USD893088S1 (en) * 2018-07-13 2020-08-11 Veeco Instruments Inc. Mid-filament spacer
US11359774B2 (en) * 2018-07-18 2022-06-14 Lumileds Llc Flexible light-emitting diode lighting strip with interposer
US11088308B2 (en) * 2019-02-25 2021-08-10 Tdk Corporation Junction structure
KR102908265B1 (ko) * 2019-05-14 2026-01-06 서울바이오시스 주식회사 Led 패키지 및 그 제조방법
KR102327014B1 (ko) 2020-10-22 2021-11-15 서울대학교산학협력단 음의 푸아송비를 가지는 스트레쳐블 디스플레이

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3835942A1 (de) * 1988-10-21 1990-04-26 Telefunken Electronic Gmbh Flaechenhafter strahler
JP3075689U (ja) * 2000-08-17 2001-02-27 舶用電球株式会社 Ｌｅｄ電球
DE20018435U1 (de) 2000-10-27 2001-02-22 Shining Blick Enterprises Co., Ltd., Taipeh/T'ai-pei Glühbirne mit darin enthaltenen biegbaren Lampenbirnchen
US6743982B2 (en) * 2000-11-29 2004-06-01 Xerox Corporation Stretchable interconnects using stress gradient films
KR20070063976A (ko) * 2005-12-16 2007-06-20 서울옵토디바이스주식회사 플립칩 구조의 발광 소자 및 이의 제조 방법
US7834424B2 (en) 2006-09-12 2010-11-16 The Board Of Trustees Of The Leland Stanford Junior University Extendable connector and network
JP4753904B2 (ja) 2007-03-15 2011-08-24 シャープ株式会社 発光装置
US8484836B2 (en) 2007-09-10 2013-07-16 The Board Of Trustees Of The Leland Stanford Junior University Flexible network
KR100928259B1 (ko) 2007-10-15 2009-11-24 엘지전자 주식회사 발광 장치 및 그 제조방법
US8207473B2 (en) * 2008-06-24 2012-06-26 Imec Method for manufacturing a stretchable electronic device
WO2010018426A2 (en) 2008-08-14 2010-02-18 Yipi Pte Ltd Led lamp
KR100999689B1 (ko) 2008-10-17 2010-12-08 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법, 이를 구비한 발광장치
WO2010086033A1 (en) * 2009-01-30 2010-08-05 Interuniversitair Microelektronica Centrum Vzw Stretchable electronic device
US8629353B2 (en) 2009-03-05 2014-01-14 The Board Of Trustees Of The Leland Stanford Junior University Apparatus and method using patterned array with separated islands
WO2011002208A2 (ko) * 2009-07-03 2011-01-06 서울반도체 주식회사 발광 다이오드 패키지
TWI581398B (zh) * 2009-10-19 2017-05-01 晶元光電股份有限公司 發光元件
TWI414088B (zh) 2009-12-16 2013-11-01 晶元光電股份有限公司 發光元件及其製造方法
EP2570006A4 (en) 2010-05-12 2018-02-28 Monolithe Semiconductor Inc. Extendable network structure
JP2011249476A (ja) * 2010-05-25 2011-12-08 Kyocera Corp 半導体発光装置
JP2012023184A (ja) * 2010-07-14 2012-02-02 Sharp Corp 発光装置
TWI455378B (zh) 2010-08-04 2014-10-01 Epistar Corp 一具穿隧栓塞之發光元件及其製造方法
JP2012044043A (ja) * 2010-08-20 2012-03-01 Stanley Electric Co Ltd 半導体発光装置および半導体発光装置の製造方法
US8198109B2 (en) * 2010-08-27 2012-06-12 Quarkstar Llc Manufacturing methods for solid state light sheet or strip with LEDs connected in series for general illumination
CN101982883A (zh) * 2010-09-01 2011-03-02 晶科电子（广州）有限公司 一种由倒装发光单元阵列组成的发光器件及其制造方法
JP2012059736A (ja) * 2010-09-03 2012-03-22 Panasonic Corp 発光装置、バックライトユニット、液晶表示装置及び照明装置
CN102446948B (zh) * 2010-10-12 2014-07-30 晶元光电股份有限公司 发光元件
JP6029262B2 (ja) * 2011-04-26 2016-11-24 日本メクトロン株式会社 フレキシブル回路体
CN102214649B (zh) * 2011-05-25 2013-03-13 映瑞光电科技(上海)有限公司 一种led封装结构及其制备方法
KR20120131751A (ko) * 2011-05-26 2012-12-05 이태세 엘이디칩 어레이 조명
WO2013048865A1 (en) * 2011-09-30 2013-04-04 General Electric Company Phosphor materials and related devices
TW201336114A (zh) 2012-02-22 2013-09-01 矽品精密工業股份有限公司 半導體封裝件及其製法
US20140048824A1 (en) 2012-08-15 2014-02-20 Epistar Corporation Light-emitting device
TWI626395B (zh) * 2013-06-11 2018-06-11 晶元光電股份有限公司 發光裝置
KR20150105255A (ko) * 2014-03-06 2015-09-16 에피스타 코포레이션 발광 소자

Also Published As

Publication number Publication date
JP2015170858A (ja) 2015-09-28
KR20200018365A (ko) 2020-02-19
TWI638962B (zh) 2018-10-21
US9583469B2 (en) 2017-02-28
US10396058B2 (en) 2019-08-27
US20170179086A1 (en) 2017-06-22
US20150255440A1 (en) 2015-09-10
DE102015103289A1 (de) 2015-09-10
TW201534833A (zh) 2015-09-16
TWI656300B (zh) 2019-04-11
KR102187708B1 (ko) 2020-12-08
TW201843412A (zh) 2018-12-16
CN105280796A (zh) 2016-01-27

Similar Documents

Publication Publication Date Title
KR102187708B1 (ko) 발광 소자
US10886262B2 (en) Light bulb
JP4675906B2 (ja) 発光素子搭載用基板、発光素子収納用パッケージ、発光装置および照明装置
KR101504331B1 (ko) 발광소자 패키지
US20100012967A1 (en) Semiconductor light emitting device package
US10693049B2 (en) Light emitting device package and lighting system comprising same
KR101179579B1 (ko) 엘이디 조명 모듈 및 그의 제조 방법
CN105870311A (zh) 发光模块
KR20140041243A (ko) 발광소자 패키지 및 패키지 기판
JP2014130942A (ja) 発光装置
CN112563385B (zh) 发光装置及其制造方法
KR102224098B1 (ko) 발광소자 패키지 및 조명시스템
JP4936169B2 (ja) 発光装置

Legal Events

Date Code Title Description
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

X091 Application refused [patent]
AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PX0901 Re-examination

St.27 status event code: A-2-3-E10-E12-rex-PX0901

PX0601 Decision of rejection after re-examination

St.27 status event code: N-2-6-B10-B17-rex-PX0601

X601 Decision of rejection after re-examination
A107 Divisional application of patent
PA0107 Divisional application

St.27 status event code: A-0-1-A10-A18-div-PA0107

St.27 status event code: A-0-1-A10-A16-div-PA0107

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

R11 Change to the name of applicant or owner or transfer of ownership requested

Free format text: ST27 STATUS EVENT CODE: A-3-3-R10-R11-ASN-PN2301 (AS PROVIDED BY THE NATIONAL OFFICE)

R13 Change to the name of applicant or owner recorded

Free format text: ST27 STATUS EVENT CODE: A-3-3-R10-R13-ASN-PN2301 (AS PROVIDED BY THE NATIONAL OFFICE)