KR20150098908A - Printed circuit board - Google Patents

Abstract

A printed circuit board according to an embodiment of the present invention includes: a plurality of circuit pattern layers disposed in series; a plurality of insulating layers formed between the circuit pattern layers. At least a part of the insulating layers includes a crystalline epoxy compound including a mesogen structure and an epoxy resin compound including hardener and inorganic filler.

Description

{PRINTED CIRCUIT BOARD}

BACKGROUND OF THE INVENTION 1. Field of the Invention [0002] The present invention relates to a printed circuit board, and more particularly, to a printed circuit board wired in multiple layers.

A printed circuit board (PCB) includes a circuit pattern layer formed on an insulating layer, and various electronic components can be mounted on a printed circuit board. The electronic component mounted on the printed circuit board may be, for example, a heating element. The heat emitted by the heating element can degrade the performance of the printed circuit board.

A printed circuit board can be classified into a single-sided PCB on which a circuit pattern layer is wired on one side of a substrate, a double-sided PCB on which circuit pattern layers are wired on both sides of the substrate, and a multi-layer PCB in which circuit pattern layers are wired in multiple layers. As circuit complexity increases and the demand for high density and miniaturization circuits increases, double-sided PCBs or multi-layer PCBs are widely used.

On the other hand, with the increase in the integration and the higher capacity of electronic components, there is a growing interest in heat dissipation of printed circuit boards. However, the insulating layer of the double-sided PCB or multi-layer PCB is mainly composed of FR-4 containing glass fibers impregnated with an amorphous epoxy compound. Since FR-4 has low thermal conductivity, there is a problem that the FR-4 can not effectively cope with heat emitted from the heat generating element.

SUMMARY OF THE INVENTION The present invention provides a printed circuit board that is wired in multiple layers.

A printed circuit board according to an embodiment of the present invention includes a plurality of circuit pattern layers sequentially disposed and a plurality of insulating layers formed between the plurality of circuit pattern layers, The insulating layer includes an epoxy resin composition including a crystalline epoxy compound including a mesogen structure, a curing agent, and an inorganic filler.

At least one of the first insulating layer formed at the lowermost portion of the plurality of insulating layers and the second insulating layer formed at the uppermost portion of the plurality of insulating layers may include the epoxy resin composition.

The thicknesses of the first insulating layer and the second insulating layer may be 30 占 퐉 to 1 mm, respectively.

The plurality of circuit pattern layers may be one of four circuit pattern layers, ten circuit pattern layers, and twelve circuit pattern layers.

And a through hole connecting at least a part of the plurality of circuit pattern layers.

The inside of the through hole is plated with copper and can be filled with an epoxy resin.

The inside of the through hole may be filled with copper.

The remaining insulating layers of the plurality of insulating layers may include glass fibers impregnated with an epoxy resin.

The glass fiber impregnated with the epoxy resin may be FR (Flame Retardant) -4.

A printed circuit board according to an embodiment of the present invention includes a first insulating layer on which a circuit pattern is formed on at least one surface of an upper surface and a lower surface of the printed circuit board, And a third insulating layer stacked on the second insulating layer and having a circuit pattern formed on at least one of an upper surface and a lower surface of the substrate, wherein the first insulating layer and the third insulating layer At least one of the layers comprises an epoxy resin composition comprising a crystalline epoxy compound comprising a mesogenic structure, a curing agent and an inorganic filler.

According to the embodiment of the present invention, a multilayer printed circuit board having high heat dissipation performance can be obtained. Particularly, by dispersing the heat generated in the operation of components mounted on the upper or lower part of the printed circuit board in the horizontal or vertical direction, the temperature of the component can be reduced, and the service life and reliability of the component can be increased.

1 is a cross-sectional view of a four-layer printed circuit board in accordance with an embodiment of the present invention.
2 is a cross-sectional view of a four-layer printed circuit board according to another embodiment of the present invention.
3 is a cross-sectional view of a 10-layer printed circuit board in accordance with an embodiment of the present invention.
4 is a cross-sectional view of a 10-layer printed circuit board in accordance with another embodiment of the present invention.
5 is a cross-sectional view of a 10-layer printed circuit board in accordance with another embodiment of the present invention.
6 is a cross-sectional view of a 12-layer printed circuit board in accordance with one embodiment of the present invention.

The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated and described in the drawings. It should be understood, however, that the invention is not intended to be limited to the particular embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

The terms including ordinal, such as second, first, etc., may be used to describe various elements, but the elements are not limited to these terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the second component may be referred to as a first component, and similarly, the first component may also be referred to as a second component. And / or < / RTI > includes any combination of a plurality of related listed items or any of a plurality of related listed items.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

Whenever a portion of a layer, film, region, plate, or the like is referred to as being "on" another portion, it includes not only the case where it is "directly on" another portion, but also the case where there is another portion in between. Conversely, when a part is "directly over" another part, it means that there is no other part in the middle.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings, wherein like or corresponding elements are denoted by the same reference numerals, and redundant description thereof will be omitted.

In the present specification, wt% can be replaced by parts by weight.

A printed circuit board according to an embodiment of the present invention includes a plurality of circuit pattern layers sequentially disposed and a plurality of insulating layers formed between the plurality of circuit pattern layers, Comprises an epoxy resin composition comprising a crystalline epoxy compound comprising a mesogenic structure, a curing agent and an inorganic filler.

FIG. 1 is a cross-sectional view of a four-layer printed circuit board according to one embodiment of the present invention, and FIG. 2 is a cross-sectional view of a four-layer printed circuit board according to another embodiment of the present invention.

1, a four-layer printed circuit board 100 includes a plurality of circuit pattern layers 110 sequentially disposed and a plurality of insulating layers 120 formed between the plurality of circuit pattern layers 110 do. That is, the printed circuit board 100 includes an insulating layer 120-1 having a circuit pattern layer 110-1 formed on a lower surface thereof, an insulating layer 120-1 having upper and lower circuit pattern layers 110-2 and 110-3 formed thereon And an insulating layer 120-3 on which an upper surface of the circuit pattern layer 110-4 is formed.

Here, the insulating layer 120 insulates the circuit pattern layer 110. The circuit pattern layer 110 may be made of a metal such as copper or nickel. Although not shown, the four-layer printed circuit board 100 may be formed on a metal plate. Here, the metal plate may include copper, aluminum, nickel, gold, platinum and alloys thereof.

Referring to FIG. 2, the four-layer printed circuit board 100 may further include a through-hole 130 connecting a part of the plurality of circuit pattern layers 110. That is, the through hole 130-1 may be formed to penetrate the entirety of the printed circuit board 100 or to penetrate a part of the printed circuit board 100 such as the through hole 130-2 or the through hole 130-3 .

The inside of the through hole 130 may be surface-plated with copper (Cu) and then filled with epoxy resin or filled with copper.

1 and 2, the insulating layer 120-1 formed between the circuit pattern layer 110-1 and the circuit pattern layer 110-2, that is, the lowermost insulating layer 120-1, At least one of the insulating layer 120-3 formed between the layer 110-3 and the circuit pattern layer 110-4, that is, the uppermost insulating layer 120-3, is a crystalline epoxy An epoxy resin composition comprising a compound, a curing agent and an inorganic filler. By disposing the insulating layer containing the epoxy resin composition having a high thermal conductivity on at least one of the uppermost portion and the lowermost portion of the printed circuit board as described above, the heat generated by the heat generating element can be dispersed not only in the horizontal direction but also in the vertical direction .

Here, the thicknesses of the insulating layers 120-1 and 120-3 including the epoxy resin composition may be 30 占 퐉 to 1 mm, respectively. When the thickness of the insulating layers 120-1 and 120-3 satisfies the above numerical range, the effect of reducing the surface temperature of the printed circuit board can be obtained.

The insulating layer 120-2 of the remaining part of the plurality of insulating layers may include glass fibers impregnated with an epoxy resin. The epoxy resin may be contained in an amount of 40 to 80 wt% of the insulating layer 120-2. Here, the epoxy resin may contain an amorphous epoxy compound. The amorphous epoxy compound may be a conventional amorphous epoxy compound having two or more epoxy groups in the molecule, and examples thereof include a bisphenol A type epoxy compound, a bisphenol F type epoxy compound, a cyclo type epoxy compound, a novolak type epoxy compound, Epoxy compounds and the like.

The glass fiber impregnated with the epoxy resin may include, for example, FR (Flame Retardant) -4.

FIG. 3 is a cross-sectional view of a 10-layer printed circuit board according to an embodiment of the present invention, FIG. 4 is a cross-sectional view of a 10-layer printed circuit board according to another embodiment of the present invention, Sectional view of a 10-layer printed circuit board according to FIG.

3 to 5, a 10-layer printed circuit board 200 includes a plurality of circuit pattern layers 210 sequentially disposed, and a plurality of insulating layers 220 formed between the plurality of circuit pattern layers 210. [ .

For example, a plurality of circuit pattern layers 210-1, ..., 210-10 are sequentially arranged, and a plurality of circuit pattern layers 210-1, ..., The insulating layers 220-1, ..., and 220-9 may be formed.

3, the insulating layer 220-1 formed between the circuit pattern layer 210-1 and the circuit pattern layer 210-2, that is, the lowermost insulating layer 220-1 and the circuit pattern layer 210-2, At least one of the insulating layer 220-9, i.e., the uppermost insulating layer 220-9, formed between the insulating layer 210-9 and the circuit pattern layer 210-10 is a crystalline epoxy compound containing a mesogen structure, An epoxy resin composition comprising a curing agent and an inorganic filler.

Here, the thicknesses of the insulating layers 220-1 and 220-9 including the epoxy resin composition may be 30 mu m to 1 mm, respectively. When the thickness of the insulating layers 220-1 and 220-9 satisfies the above numerical range, the effect of reducing the surface temperature of the printed circuit board can be obtained.

The insulating layers 220-2, ..., and 220-8 of the remaining portions of the plurality of insulating layers may include glass fibers impregnated with an epoxy resin. Here, the epoxy resin may contain an amorphous epoxy compound. The amorphous epoxy compound may be a conventional amorphous epoxy compound having two or more epoxy groups in the molecule, and examples thereof include a bisphenol A type epoxy compound, a bisphenol F type epoxy compound, a cyclo type epoxy compound, a novolak type epoxy compound, Epoxy compounds and the like.

The glass fiber impregnated with the epoxy resin may include, for example, FR (Flame Retardant) -4.

4 to 5, at least a part of the insulating layers 220-2, ..., 220-8 other than the lowermost insulating layer 220-1 and the uppermost insulating layer 220- An epoxy resin composition including a crystalline epoxy compound including a phenol structure, a curing structure, a curing agent, and an inorganic filler.

6 is a cross-sectional view of a 12-layer printed circuit board in accordance with one embodiment of the present invention.

6, the 12-layer printed circuit board 300 includes a plurality of circuit pattern layers 310 sequentially disposed and a plurality of insulating layers 320 formed between the plurality of circuit pattern layers 310 do.

For example, a plurality of circuit pattern layers 310-1, ..., 310-12 are sequentially arranged, and a plurality of circuit pattern layers 310-1, ..., Insulating layers 320-1, ..., and 320-11 may be formed.

6, the insulating layer 320-1 formed between the circuit pattern layer 310-1 and the circuit pattern layer 310-2, that is, the lowermost insulating layer 320-1 and the circuit pattern layer At least one of the insulating layer 320-11 formed between the first conductive layer 310-11 and the circuit pattern layer 310-12 or the uppermost insulating layer 320-11 is a crystalline epoxy compound containing a mesogenic structure, An epoxy resin composition comprising a curing agent and an inorganic filler.

Here, the thicknesses of the insulating layers 320-1 and 320-11 including the epoxy resin composition may be 30 占 퐉 to 1 mm, respectively. When the thickness of the insulating layers 320-1 and 320-11 satisfies the above numerical range, the effect of reducing the surface temperature of the printed circuit board can be obtained.

The insulating layers 320-2, ..., and 320-10 of the remaining portions of the plurality of insulating layers may include glass fibers impregnated with an epoxy resin. Here, the epoxy resin may contain an amorphous epoxy compound. The amorphous epoxy compound may be a conventional amorphous epoxy compound having two or more epoxy groups in the molecule, and examples thereof include a bisphenol A type epoxy compound, a bisphenol F type epoxy compound, a cyclo type epoxy compound, a novolak type epoxy compound, Epoxy compounds and the like.

The glass fiber impregnated with the epoxy resin may include, for example, FR (Flame Retardant) -4.

Although not shown, at least some of the insulating layers 320-2, ..., 320-10 excluding the lowermost insulating layer 320-1 and the uppermost insulating layer 320-11 include a mesogen structure An epoxy resin composition comprising a crystalline epoxy compound, a curing agent, and an inorganic filler.

The epoxy resin composition contained in the insulating layer of the printed circuit board according to an embodiment of the present invention is composed of 7 wt% to 66 wt%, preferably 7.5 wt% to 35 wt%, more preferably 8 wt% 30 wt% of an epoxy compound. When the epoxy compound is contained in an amount of not less than 7 wt% and not more than 66 wt% of the entire epoxy resin composition, the adhesion is good and the thickness can be easily controlled.

At this time, the epoxy compound may include a crystalline epoxy compound containing a mesogen structure. Here, a mesogen is a basic unit of a liquid crystal and includes a rigid structure. The mesogens may include a rigid structure such as, for example, (a) to (e) below.

(a)

(b)

(c)

(d)

(e)

A crystalline epoxy compound containing a mesogenic structure such as 4,4'-biphenolether diglycidyl ether, i.e. SE-4280.

Further, the epoxy compound may further include an amorphous epoxy compound.

The crystalline epoxy compound containing a mesogen structure is contained in an amount of 25 wt% to 100 wt%, preferably 45 wt% to 90 wt%, and more preferably 65 wt% to 80 wt% with respect to the total epoxy compound, and the amorphous epoxy compound contains 0 wt % To 75 wt%, preferably 10 wt% to 55 wt%, and more preferably 20 wt% to 35 wt%.

When the crystalline epoxy compound and the amorphous epoxy compound are contained within the above-mentioned numerical values, the crystallization is easy, the heat conduction effect can be enhanced, and the room temperature can be stabilized. In this case, the epoxy compound may include a crystalline epoxy compound containing at least one kind of mesogen structure.

The amorphous epoxy compound may be a conventional amorphous epoxy compound having two or more epoxy groups in the molecule.

Examples of amorphous epoxy compounds include bisphenol A, bisphenol F, 3,3 ', 5,5'-tetramethyl-4,4'-dihydroxydiphenylmethane, 4,4'-dihydroxydiphenyl Sulfone, 4,4'-dihydroxydiphenyl sulfide, 4,4'-dihydroxydiphenyl ketone, fluorene bisphenol, 4,4'-biphenol, 3,3 ', 5,5'-tetra Methyl 4,4'-dihydroxybiphenyl, 2,2'-biphenol, resorcin, catechol, t-butylcatechol, hydroquinone, t- butylhydroquinone, 1,2-dihydroxynaphthalene, 1 Dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1,8-dihydro Dihydroxynaphthalene, 2,4-dihydroxynaphthalene, 2,5-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 2, 8-dihydroxynaphthalene, allyl or polyallylate of the dihydroxynaphthalene, allylated bisphenol A, allylated Bisphenol F, and allylated phenol novolac; and divalent phenols such as phenol novolak, bisphenol A novolak, o-cresol novolac, m-cresol novolak, p- -Hydroxystyrene, tris- (4-hydroxyphenyl) methane, 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane, fluoroglycinol, pyrogallol, Allylated pyrogallol, polyallylated pyrogallol, 1,2,4-benzenetriol, 2,3,4-trihydroxybenzophenone, phenol aralkyl resin, naphthol aralkyl resin, dicyclopentadiene resin, etc. A trivalent or higher phenol, a halogenated bisphenol such as tetrabromobisphenol A, and a mixture selected from the foregoing.

An example of the bisphenol A type epoxy compound is represented by the general formula (1).

[Chemical Formula 1]

Here, n is an integer of 1 or more.

The epoxy resin composition according to an embodiment of the present invention may include a curing agent. 2 to 22 wt% of a curing agent may be included in the whole epoxy resin composition. When the curing agent is contained in an amount of 2 wt% to 22 wt% of the entire epoxy resin composition, the adhesiveness is good and the thickness can be easily controlled. The epoxy resin composition may include at least one of an amine type curing agent, a phenol type curing agent, an acid anhydride type curing agent, a polymercaptan type curing agent, a polyaminoamide type curing agent, an isocyanate type curing agent and a block isocyanate type curing agent.

The amine-based curing agent may be, for example, 4,4'-diaminodiphenyl sulfone. The following formula (2) is an example of diamino diphenyl sulfone.

(2)

Other examples of the amine-based curing agent may be aliphatic amines, polyether polyamines, alicyclic amines, aromatic amines and the like. Examples of the aliphatic amines include ethylenediamine, 1,3-diaminopropane, (Hexamethylene) triamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, tetraethylenepentamine, pentaerythritol tetramine, tetraethylenepentamine, pentaerythritol hexamine, N-hydroxyethylethylenediamine, tetra (hydroxyethyl) ethylenediamine, and the like. Examples of the polyether polyamines include triethylene glycol diamine, tetraethylene glycol diamine, diethylene glycol bis (propylamine), polyoxypropylene diamine, polyoxypropylene triamine, and mixtures thereof. Examples of the alicyclic amines include isophoronediamine, methadecenediamine, N-aminoethylpiperazine, bis (4-amino-3-methyldicyclohexyl) methane, bis (aminomethyl) cyclohexane, 3,9- -Aminopropyl) 2,4,8,10-tetraoxaspiro (5,5) undecane, norbornenediamine, and the like. Examples of the aromatic amines include tetrachloro-p-xylenediamine, m-xylenediamine, p-xylenediamine, m-phenylenediamine, o-phenylenediamine, p-phenylenediamine, 2,4- , 4-toluenediamine, 2,4-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, 4,4'-diamino-1,2-diphenylethane, 2,4- (M-aminophenyl) ethylamine, [alpha] - (p-amino) benzylamine, benzyldimethylamine, benzyldimethylamine, 2-dimethylaminomethyl) phenol, triethanolamine, methylbenzylamine, Phenyl) ethylamine, diaminodiethyldimethyldiphenylmethane,?,? '- bis (4-aminophenyl) -p-diisopropylbenzene and mixtures thereof.

Examples of the phenolic curing agent include bisphenol A, bisphenol F, 4,4'-dihydroxydiphenylmethane, 4,4'-dihydroxydiphenyl ether, 1,4-bis (4-hydroxyphenoxy ) Benzene, 1,3-bis (4-hydroxyphenoxy) benzene, 4,4'-dihydroxydiphenyl sulfide, 4,4'-dihydroxydiphenyl ketone, 4,4'- 4,4'-dihydroxydiphenyl ester, 4,4'-dihydroxybiphenyl, 2,2'-dihydroxybiphenyl, 10- (2,5-dihydroxyphenyl ) -10H-9-oxa-10-phosphaphenanthrene-10-oxide, phenol novolak, bisphenol A novolac, o- cresol novolak, m- cresol novolac, p- cresol novolac, , Poly-p-hydroxystyrene, hydroquinone, resorcin, catechol, t-butyl catechol, t-butyl hydroquinone, fluoroglycinol, pyrogallol, t- butyl pyrogallol, allyl pyrogallol, polyallyl 1,2,4-benzenetriol, 2,3,4-trihydroxybenzophenone, 1,2-dihydroxynaphthalene, 1,3-di 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1,8-dihydroxynaphthalene, 2 , 3-dihydroxynaphthalene, 2,4-dihydroxynaphthalene, 2,5-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 2,8- Allylated bisphenol A, allylated bisphenol F, allylated phenol novolacs, allylated pyrogallol, and mixtures thereof. [0031] The present invention also provides a process for producing the above-mentioned dihydroxynaphthalene.

Examples of the acid anhydride-based curing agent include dodecenylsuccinic anhydride, polyadipic acid anhydride, polyazelaic anhydride, poly sebacic anhydride, poly (ethyloctadecanedioic) anhydride, poly (phenylhexadecanedioic) anhydride, methyltetrahydro There may be mentioned phthalic anhydride, phthalic anhydride, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, methylhydromic anhydride, tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, methylcyclohexene dicarboxylic anhydride, methylcyclohexene tetracarboxylic anhydride, Anhydrides, trimellitic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride, ethylene glycol bistrimellitate, anhydrous hic acid, anhydrous nadic acid, methylnadic anhydride, 5- (2,5-dioxotetrahydro- Methyl-3-cyclohexane-1,2-dicarboxylic anhydride, 3,4-dicarboxy-1,2,3,4-tetrahydro-1-naphthalenesuccinic acid anhydride, 1- Methyl-dicarboxy-1 , 2,3,4-tetrahydro-1-naphthalenesuccinic acid anhydride, and mixtures thereof.

Two or more kinds of curing agents may be mixed and used.

The epoxy resin composition according to an embodiment of the present invention may further include a curing accelerator. The curing accelerator includes, for example, an amine curing accelerator, an imidazole curing accelerator, an organic phosphine curing accelerator, a Lewis acid curing accelerator, and specifically, 1,8-diazabicyclo (5,4,0) 2-phenylimidazole, 2-phenyl-imidazole, 2-methylimidazole, 2-methylimidazole, 2-phenylimidazole, 2-methylimidazole, benzyldimethylamine, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol and tris Imidazoles such as 4-methylimidazole and 2-heptadecylimidazole, organic phosphines such as tributylphosphine, methyldiphenylphosphine, triphenylphosphine, diphenylphosphine and phenylphosphine, Tetra-substituted phosphonium tetra-substituted borates such as tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium ethyltriphenylborate, tetrabutylphosphonium tetrabutylborate and the like, 2-ethyl-4-methylimidazole tetra Phenyl borate, N-methylmorpholine te La and the like tetraphenyl boron salts such as borate.

The epoxy resin composition according to an embodiment of the present invention may contain 17 wt% to 90 wt% of inorganic filler based on the total epoxy resin composition. When the inorganic filler is contained in an amount of from 17 wt% to 90 wt%, high thermal conductivity, low thermal expansion, and high temperature heat resistance of the epoxy resin composition can be improved. The high thermal conductivity, low thermal expansion, and high temperature heat resistance are better as the amount of the inorganic filler added is larger, but it is not improved according to the volume fraction thereof, and is remarkably improved from a certain amount. However, if the addition amount of the inorganic filler is more than 90 wt%, the viscosity becomes high and the formability is weakened.

According to an embodiment of the present invention, the inorganic filler may comprise one of alumina, boron nitride, aluminum nitride, silicon carbide, crystalline silica, barium sulfate, carbon black, polymethylsilsesquioxane (PMSSQ) have.

Hereinafter, results of a comparison of the heat radiation performance between a printed circuit board including a part of an epoxy resin composition and a printed circuit board including all FR-4 insulating layers according to an embodiment of the present invention will be described.

Hereinafter, the epoxy resin composition contained in the insulating layers of Examples 1 to 5 was composed of 6.6 wt% of a crystalline epoxy compound having a mesogen structure, 2.2 wt% of bisphenol A type amorphous epoxy compound, 3.2 wt% of diaminodiphenylsulfone, And 88 wt% alumina, and the thermal conductivity is 10.03 W / mK.

The thermal stress of the printed circuit boards of the examples and comparative examples was spread over 10 seconds on a solder of 288 캜 for 10 seconds. At this time, a cycle when the circuit pattern layer and the insulating layer were separated or the pores started to swell was recorded.

The increasing temperature is a result of measuring the temperature of a heat source at room temperature (25 캜) by attaching a ceramic-based heat source having a thermocouple fixed on its surface to the printed circuit boards of Examples and Comparative Examples. The same output (Voltage * Ampere) was applied to the printed circuit boards of Examples and Comparative Examples, and the temperature was measured. The result obtained by subtracting the measured temperature at room temperature from the measured temperature after the output power was calculated as the increasing temperature.

Table 1 shows the results of comparing the heat radiation performance of the four-layer printed circuit board illustrated in Figs.

Sectional structure Example 1 Comparative Example 1 Kinds Thickness [mm] Kinds Thickness [mm] The circuit pattern layer 110-4 Cu 0.033 Cu 0.033 The insulating layer 120-3 Epoxy resin composition 0.11 FR-4 0.085 The circuit pattern layer (110-3) Cu 0.033 Cu 0.033 The insulating layer 120-1 FR-4 0.2 FR-4 0.2 The circuit pattern layer 110-2 Cu 0.033 Cu 0.033 The insulating layer 120-1 Epoxy resin composition 0.11 FR-4 0.085 The circuit pattern layer (110-1) Cu 0.033 Cu 0.033 Thermal stress 10cycle 10cycle Increasing temperature (℃) 53.0 60.7

As shown in Table 1, it can be seen that Example 1 and Comparative Example 1 can withstand 10 cycles of thermal stress on a four-layer printed circuit board. The lower insulating layer 120-1 and the upper insulating layer 120-3 each contain an epoxy resin composition in comparison with Comparative Example 1 (increase temperature: 60.7 占 폚) in which all the insulating layers include FR-4. Increase temperature of Example 1 (increase temperature: 53.0 ° C) is low. Thus, it can be seen that the printed circuit board of Example 1 has an excellent heat radiation performance as compared with the printed circuit board of Comparative Example 1. [

Table 2 below shows the results of comparing the heat radiation performance of the 10-layer printed circuit board illustrated in Figs. 3 to 5. Fig.

Sectional structure Example 2 Example 3 Example 4 Comparative Example 2 Kinds Thickness [mm] Kinds Thickness [mm] Kinds Thickness [mm] Kinds Thickness [mm] The circuit pattern layer 210 - Cu 0.025 Cu 0.025 Cu 0.025 Cu 0.025 The insulating layer 220-9 Epoxy resin composition 0.075 Epoxy resin composition 0.075 Epoxy resin composition 0.075 FR-4 0.060 The circuit pattern layer 210-9 Cu 0.020 Cu 0.020 Cu 0.025 Cu 0.020 The insulating layer 220-8 FR-4 0.060 Epoxy resin composition 0.075 Epoxy resin composition 0.075 FR-4 0.060 The circuit pattern layer 210-8 Cu 0.020 Cu 0.020 Cu 0.025 Cu 0.020 The insulating layer 220-7 FR-4 0.060 FR-4 0.060 Epoxy resin composition 0.075 FR-4 0.060 The circuit pattern layer 210-7 Cu 0.020 Cu 0.020 Cu 0.025 Cu 0.020 The insulating layer 220-6 FR-4 0.060 FR-4 0.060 Epoxy resin composition 0.075 FR-4 0.060 The circuit pattern layer 210-6 Cu 0.020 Cu 0.020 Cu 0.025 Cu 0.020 The insulating layer 220-5 FR-4 0.060 FR-4 0.060 Epoxy resin composition 0.075 FR-4 0.060 The circuit pattern layer 210-5 Cu 0.020 Cu 0.020 Cu 0.025 Cu 0.020 The insulating layer 220-4 FR-4 0.060 FR-4 0.060 Epoxy resin composition 0.075 FR-4 0.060 The circuit pattern layer 210-4 Cu 0.020 Cu 0.020 Cu 0.025 Cu 0.020 The insulating layer 220-3 FR-4 0.060 FR-4 0.060 Epoxy resin composition 0.075 FR-4 0.060 The circuit pattern layer 210-3 Cu 0.020 Cu 0.020 Cu 0.025 Cu 0.020 The insulating layer 220-2 FR-4 0.060 FR-4 0.060 Epoxy resin composition 0.075 FR-4 0.060 The circuit pattern layer 210-2 Cu 0.020 Cu 0.020 Cu 0.025 Cu 0.020 The insulating layer 220-1 Epoxy resin composition 0.075 Epoxy resin composition 0.075 Epoxy resin composition 0.075 FR-4 0.060 The circuit pattern layer 210-1 Cu 0.025 Cu 0.025 Cu 0.025 Cu 0.025 Thermal stress 10cycle 10cycle 10cycle 10cycle Increasing temperature (℃) 62.6 60.7 51.7 70.1

As shown in Table 2, it can be seen that Examples 2 to 4 and Comparative Example 2 can withstand 10 cycles of thermal stress even in the 10-layer printed circuit board. In comparison with Comparative Example 2 (increase temperature: 70.1 DEG C) in which all the insulating layers include FR-4, the increase temperature of Examples 2, 3, and 4 in which all or a part of the insulating layer includes an epoxy resin composition is low . Thus, it can be seen that the printed circuit boards of Examples 2 to 4 have superior heat radiation performance as compared with the printed circuit boards of Comparative Example 2. [

Table 3 below shows the results of comparing the heat radiation performance of the 12-layer printed circuit board illustrated in Fig.

Sectional structure Example 5 Comparative Example 3 Kinds Thickness [mm] Kinds Thickness [mm] The circuit pattern layer (310-12) Cu 0.025 Cu 0.025 The insulating layer (320-11) Epoxy resin composition 0.075 FR-4 0.035 The circuit pattern layer (310-11) Cu 0.015 Cu 0.015 The insulating layer 320 - FR-4 0.035 FR-4 0.035 The circuit pattern layer (310-10) Cu 0.015 Cu 0.015 The insulating layer 320-9 FR-4 0.035 FR-4 0.035 The circuit pattern layer 310-9 Cu 0.015 Cu 0.015 The insulating layer 320-8 FR-4 0.035 FR-4 0.035 The circuit pattern layer 310-8 Cu 0.015 Cu 0.015 The insulating layer 320-7 FR-4 0.045 FR-4 0.045 The circuit pattern layer 310-7 Cu 0.020 Cu 0.020 The insulating layer 320-6 FR-4 0.060 FR-4 0.060 The circuit pattern layer 310-6 Cu 0.020 Cu 0.020 The insulating layer 320-5 FR-4 0.045 FR-4 0.045 The circuit pattern layer 310-5 Cu 0.015 Cu 0.015 The insulating layer 320-4 FR-4 0.035 FR-4 0.035 The circuit pattern layer 310-4 Cu 0.015 Cu 0.015 The insulating layer 320-3 FR-4 0.035 FR-4 0.035 The circuit pattern layer (310-3) Cu 0.015 Cu 0.015 The insulating layer 320-2 FR-4 0.035 FR-4 0.035 The circuit pattern layer (310-2) Cu 0.015 Cu 0.015 The insulating layer 320-1 Epoxy resin composition 0.035 FR-4 0.035 The circuit pattern layer (310-1) Cu 0.025 Cu 0.025 Thermal stress 10cycle 10cycle Increasing temperature (℃) 66.8 74.0

As shown in Table 3, it can be seen that Example 5 and Comparative Example 3 can withstand 10 cycles of thermal stress even in the 12-layer printed circuit board. In comparison with Comparative Example 3 (increase temperature: 74.0 占 폚) in which all the insulating layers include FR-4, all or part of the insulating layer was increased in Example 5 (increase temperature: 66.8 占 폚) containing the epoxy resin composition The temperature is low. Thus, it can be seen that the printed circuit board of Example 5 has an excellent heat radiation performance as compared with the printed circuit board of Comparative Example 3. [

As described above, it can be seen that at least a part of the insulating layer in the multilayer printed circuit board has excellent heat radiation performance when it includes an epoxy resin composition including a crystalline epoxy compound, a curing agent and an inorganic filler including a mesogen structure.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

Claims (11)

A plurality of circuit pattern layers sequentially disposed, and
And a plurality of insulating layers formed between the plurality of circuit pattern layers,
Wherein the insulating layer of at least some of the plurality of insulating layers comprises an epoxy resin composition comprising a crystalline epoxy compound comprising a mesogenic structure, a curing agent, and an inorganic filler. The method according to claim 1,
Wherein at least one of the first insulating layer formed at the lowermost portion of the plurality of insulating layers and the second insulating layer formed at the uppermost portion of the plurality of insulating layers comprises the epoxy resin composition. 3. The method of claim 2,
Wherein the first insulating layer and the second insulating layer have a thickness of 30 mu m to 1 mm, respectively. The method according to claim 1,
Wherein the plurality of circuit pattern layers are one of four circuit pattern layers, ten circuit pattern layers, and twelve circuit pattern layers. The method according to claim 1,
And a through hole for connecting at least a part of the plurality of circuit pattern layers. 6. The method of claim 5,
Wherein the inside of the through hole is plated with copper and filled with an epoxy resin. 6. The method of claim 5,
And the inside of the through hole is filled with copper. The method according to claim 1,
Wherein the remaining insulating layers of the plurality of insulating layers include glass fibers impregnated with an epoxy resin. 9. The method of claim 8,
The glass fiber impregnated with the epoxy resin is a FR (Flame Retardant) -4 printed circuit board. A first insulating layer in which a circuit pattern is formed on at least one of an upper surface and a lower surface,
A second insulating layer stacked on the first insulating layer and having circuit patterns formed on at least one of upper and lower surfaces thereof,
And a third insulating layer stacked on the second insulating layer, wherein a circuit pattern is formed on at least one of the upper surface and the lower surface,
Wherein at least one of the first insulating layer and the third insulating layer comprises an epoxy resin composition comprising a crystalline epoxy compound having a mesogen structure, a curing agent, and an inorganic filler. 11. The method of claim 10,
Wherein the second insulating layer comprises glass fiber impregnated with an epoxy resin.

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