KR20140139798A - Epoxy resin composite and printed circuit board comprising isolation using the same - Google Patents

Abstract

An epoxy resin composition according to an embodiment of the present invention includes an epoxy compound including a mesogen structure and having the following structure, a curing agent, an inorganic filler and an additive for increasing adhesiveness with a metal. The curing agent includes diaminodiphenyl sulfone, and R^1 to R^14 may be independently selected from the group consisting of H, Cl, Br, F, C_1-C_3 alkyl, C_2-C_3 alkene, C_2-C_3 alkyne, and m and n are independently 1, 2 or 3.

Description

EPOXY RESIN COMPOUND AND PRINTED CIRCUIT BOARD COMPRISING ISOLATION USING THE SAME Technical Field [1] The present invention relates to an epoxy resin composition,

The present invention relates to an epoxy resin composition, and more particularly, to an epoxy resin composition used as an insulating layer of a printed circuit board.

The printed circuit board includes a circuit pattern formed on the insulating layer, and various electronic components can be mounted on the printed circuit board.

The electronic component mounted on the printed circuit board may be, for example, a heating element. The heat emitted by the heating element can degrade the performance of the printed circuit board.

As electronic components become more highly integrated and have higher capacity, heat dissipation problems of printed circuit boards are becoming more and more important. In general, an epoxy resin composition comprising a bisphenol A type epoxy compound or a bisphenol F type epoxy compound is used for an insulating layer of a printed circuit board. However, the bisphenol A type epoxy compound or the bisphenol F type epoxy compound has a low viscosity and thus has a problem of poor curability, mechanical strength, toughness and the like.

Accordingly, an epoxy resin composition containing a crystalline epoxy compound containing a mesogen structure has been used. Such an epoxy resin composition is excellent in storage stability and curability before curing, but has limitations in obtaining a desired level of heat resistance and thermal conductivity.

On the other hand, if the adhesive force between the insulating layer and the metal is low, a problem may occur in processing the printed circuit board. In order to increase the adhesive strength between these materials, a method of bonding a metal and an insulating layer and then heating them for a predetermined time is used. However, even with this method, there is a limitation in obtaining a required level of adhesive force, and there is a problem that additional time and process are required.

Disclosure of Invention Technical Problem [8] The present invention provides a printed circuit board comprising an epoxy resin composition and an insulating layer using the epoxy resin composition.

An epoxy resin composition according to an embodiment of the present invention includes an epoxy compound including a mesogen structure, a curing agent, an inorganic filler, and an additive for enhancing adhesion to a metal, wherein the epoxy compound has a structure represented by the following formula, Include diaminodiphenylsulfone.

Wherein R ¹ to R ¹⁴ may each be selected from the group consisting of H, Cl, Br, F, C ₁ -C ₃ alkyl, C ₂ -C ₃ alkene, C ₂ -C ₃ alkyne, 1, 2, or 3, respectively.

The epoxy compound may include an epoxy compound of the following formula.

The additive may include at least one of an imidazole-based additive and a fluorine-based additive.

The fluorine-based additive may be R-NH ₂ BF ₃ and R may be a C ₁ -C ₃ alkyl group.

The epoxy compound is contained in an amount of 3 to 40 parts by weight, the curing agent is contained in an amount of 0.5 to 30 parts by weight, the inorganic filler is contained in an amount of 30 to 97 parts by weight, the additive is contained in an amount of 0.1 to 5 parts by weight .

A printed circuit board according to an embodiment of the present invention includes a metal plate, an insulating layer formed on the metal plate, and a circuit pattern formed on the insulating layer, wherein the insulating layer includes an epoxy A compound, a curing agent, an inorganic filler, and an additive for enhancing adhesion to a metal, wherein the epoxy compound has a structure represented by the above formula, and the curing agent includes diaminodiphenylsulfone.

The thermal conductivity of the insulating layer may be 9 W / Km or more.

The peel strength of the insulating layer may be 1.2 Kgf / cm or more.

The glass transition temperature of the insulating layer may be 100 ° C or higher.

According to the embodiment of the present invention, an epoxy resin composition excellent in glass transition temperature, thermal conductivity and adhesion to metal can be obtained. By using this, an insulating layer having high heat resistance and high thermal conductivity can be obtained, and heat radiation performance of the printed circuit board can be enhanced. Further, the processing of the printed circuit board can be facilitated. In particular, the adhesive force between the insulating layer and the metal can be increased without further processing.

1 is a cross-sectional view of a printed circuit board according to an embodiment of the present invention.

The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated and described in the drawings. It should be understood, however, that the invention is not intended to be limited to the particular embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

The terms including ordinal, such as second, first, etc., may be used to describe various elements, but the elements are not limited to these terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the second component may be referred to as a first component, and similarly, the first component may also be referred to as a second component. And / or < / RTI > includes any combination of a plurality of related listed items or any of a plurality of related listed items.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

Whenever a portion of a layer, film, region, plate, or the like is referred to as being "on" another portion, it includes not only the case where it is "directly on" another portion, but also the case where there is another portion in between. Conversely, when a part is "directly over" another part, it means that there is no other part in the middle.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings, wherein like or corresponding elements are denoted by the same reference numerals, and redundant description thereof will be omitted.

In the present specification, wt% can be mixed with parts by weight.

According to one embodiment of the present invention, there is provided an epoxy resin composition comprising an epoxy compound containing a mesogen structure, a curing agent, an inorganic filler, and an additive for enhancing adhesion to a metal. Here, a mesogen is a basic unit of a liquid crystal and includes a rigid structure. The mesogens may include a rigid structure such as, for example, biphenyl.

The epoxy resin composition according to an embodiment of the present invention may contain an epoxy compound in an amount of 3 wt% to 40 wt%, preferably 5 wt% to 35 wt%, and more preferably 10 wt% to 30 wt%, based on the entire epoxy resin composition . When the epoxy compound is contained in an amount of not less than 3 wt% and not more than 40 wt% of the entire epoxy resin composition, the adhesion is good and the thickness can be easily controlled. At this time, the epoxy resin composition may contain a crystalline epoxy compound of 3 wt% or more, preferably 3 wt% to 20 wt%, based on the entire epoxy resin composition. When the crystalline epoxy compound is contained in an amount of 3 wt% or more of the entire epoxy resin composition, crystallization is easy and the heat conduction effect is high.

Here, the crystalline epoxy compound may be an epoxy compound having a mesogen structure as shown in the following formula (1).

[Chemical Formula 1]

Here, R ¹ to R ¹⁴ may be selected from the group consisting of H, Cl, Br, F, C ₁ -C ₃ alkyl, C ₂ -C ₃ alkene, C ₂ -C ₃ alkyne. Here, m and n may be 1, 2 or 3, respectively.

The compound of formula (1) includes the compound of formula (2).

(2)

The formula (2) can be named as 4,4'-biphenolether diglycidyl ether. The physical properties of the epoxy compound according to Formula 2 were 158 캜 and ¹ H NMR (CDCl ₃ -d ₆ , ppm). The results were δ = 8.58 (s, 2H), δ = 8.17-8.19 4H),? = 7.99-8.01 (d, 4H),? = 7.33 (s, 4H),? = 4.69-4.72 (d, 1H),? = 4.18-4.22 (m, 1H),? = 2.92-2.94 (m, 1H) and? = 2.74-2.77 (m, 1H). The melting point was measured using a differential scanning calorimeter (DSC Q100, manufactured by TA) at a heating rate of 10 ° C / min. NMR was measured H-NMR was dissolved in CDCL ₃ -d6.

The epoxy resin composition may further comprise a conventional amorphous epoxy compound having two or more epoxy groups in the molecule, in addition to the crystalline epoxy compound according to Formula (1) or (2). When an amorphous epoxy compound is further contained in addition to the crystalline epoxy compound, stability at room temperature can be enhanced.

Examples of amorphous epoxy compounds include bisphenol A, bisphenol F, 3,3 ', 5,5'-tetramethyl-4,4'-dihydroxydiphenylmethane, 4,4'-dihydroxydiphenyl Sulfone, 4,4'-dihydroxydiphenyl sulfide, 4,4'-dihydroxydiphenyl ketone, fluorene bisphenol, 4,4'-biphenol, 3,3 ', 5,5'-tetra Methyl 4,4'-dihydroxybiphenyl, 2,2'-biphenol, resorcin, catechol, t-butylcatechol, hydroquinone, t- butylhydroquinone, 1,2-dihydroxynaphthalene, 1 Dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1,8-dihydro Dihydroxynaphthalene, 2,4-dihydroxynaphthalene, 2,5-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 2, 8-dihydroxynaphthalene, allyl or polyallylate of the dihydroxynaphthalene, allylated bisphenol A, allylated Bisphenol F, and allylated phenol novolac; and divalent phenols such as phenol novolak, bisphenol A novolak, o-cresol novolac, m-cresol novolak, p- -Hydroxystyrene, tris- (4-hydroxyphenyl) methane, 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane, fluoroglycinol, pyrogallol, Allylated pyrogallol, polyallylated pyrogallol, 1,2,4-benzenetriol, 2,3,4-trihydroxybenzophenone, phenol aralkyl resin, naphthol aralkyl resin, dicyclopentadiene resin, etc. A trivalent or higher phenol, a halogenated bisphenol such as tetrabromobisphenol A, and a mixture selected from the foregoing.

The epoxy resin composition according to an embodiment of the present invention may include a curing agent. The curing agent may be contained in an amount of 0.5 wt% to 30 wt%, preferably 1 wt% to 20 wt%, more preferably 3 wt% to 10 wt%, based on the entire epoxy resin composition. When the curing agent is contained in an amount of 0.5 wt% to 30 wt% of the entire epoxy resin composition, the adhesiveness is good and the thickness can be easily controlled. The epoxy resin composition may include at least one of an amine type curing agent, a phenol type curing agent, an acid anhydride type curing agent, a polymercaptan type curing agent, a polyaminoamide type curing agent, an isocyanate type curing agent and a block isocyanate type curing agent.

The amine-based curing agent may be, for example, 4,4'-diaminodiphenyl sulfone. The following formula (3) is an example of diamino diphenyl sulfone. The epoxy resin composition according to an embodiment of the present invention may contain diaminodiphenylsulfone in an amount of 3 wt% to 10 wt%, preferably 6 wt% to 10 wt%, based on the entire epoxy resin composition.

(3)

Other examples of the amine-based curing agent may be aliphatic amines, polyether polyamines, alicyclic amines, aromatic amines and the like. Examples of the aliphatic amines include ethylenediamine, 1,3-diaminopropane, (Hexamethylene) triamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, tetraethylenepentamine, pentaerythritol tetramine, tetraethylenepentamine, pentaerythritol hexamine, N-hydroxyethylethylenediamine, tetra (hydroxyethyl) ethylenediamine, and the like. Examples of the polyether polyamines include triethylene glycol diamine, tetraethylene glycol diamine, diethylene glycol bis (propylamine), polyoxypropylene diamine, polyoxypropylene triamine, and mixtures thereof. Examples of the alicyclic amines include isophoronediamine, methadecenediamine, N-aminoethylpiperazine, bis (4-amino-3-methyldicyclohexyl) methane, bis (aminomethyl) cyclohexane, 3,9- -Aminopropyl) 2,4,8,10-tetraoxaspiro (5,5) undecane, norbornenediamine, and the like. Examples of the aromatic amines include tetrachloro-p-xylenediamine, m-xylenediamine, p-xylenediamine, m-phenylenediamine, o-phenylenediamine, p-phenylenediamine, 2,4- , 4-toluenediamine, 2,4-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, 4,4'-diamino-1,2-diphenylethane, 2,4- (M-aminophenyl) ethylamine, [alpha] - (p-amino) benzylamine, benzyldimethylamine, benzyldimethylamine, 2-dimethylaminomethyl) phenol, triethanolamine, methylbenzylamine, Phenyl) ethylamine, diaminodiethyldimethyldiphenylmethane,?,? '- bis (4-aminophenyl) -p-diisopropylbenzene and mixtures thereof.

Examples of the phenolic curing agent include bisphenol A, bisphenol F, 4,4'-dihydroxydiphenylmethane, 4,4'-dihydroxydiphenyl ether, 1,4-bis (4-hydroxyphenoxy ) Benzene, 1,3-bis (4-hydroxyphenoxy) benzene, 4,4'-dihydroxydiphenyl sulfide, 4,4'-dihydroxydiphenyl ketone, 4,4'- 4,4'-dihydroxydiphenyl ester, 4,4'-dihydroxybiphenyl, 2,2'-dihydroxybiphenyl, 10- (2,5-dihydroxyphenyl ) -10H-9-oxa-10-phosphaphenanthrene-10-oxide, phenol novolak, bisphenol A novolac, o- cresol novolak, m- cresol novolac, p- cresol novolac, , Poly-p-hydroxystyrene, hydroquinone, resorcin, catechol, t-butyl catechol, t-butyl hydroquinone, fluoroglycinol, pyrogallol, t- butyl pyrogallol, allyl pyrogallol, polyallyl 1,2,4-benzenetriol, 2,3,4-trihydroxybenzophenone, 1,2-dihydroxynaphthalene, 1,3-di 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1,8-dihydroxynaphthalene, 2 , 3-dihydroxynaphthalene, 2,4-dihydroxynaphthalene, 2,5-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 2,8- Allylated bisphenol A, allylated bisphenol F, allylated phenol novolacs, allylated pyrogallol, and mixtures thereof. [0031] The present invention also provides a process for producing the above-mentioned dihydroxynaphthalene.

Examples of the acid anhydride-based curing agent include dodecenylsuccinic anhydride, polyadipic acid anhydride, polyazelaic anhydride, poly sebacic anhydride, poly (ethyloctadecanedioic) anhydride, poly (phenylhexadecanedioic) anhydride, methyltetrahydro There may be mentioned phthalic anhydride, phthalic anhydride, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, methylhydromic anhydride, tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, methylcyclohexene dicarboxylic anhydride, methylcyclohexene tetracarboxylic anhydride, Anhydrides, trimellitic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride, ethylene glycol bistrimellitate, anhydrous hic acid, anhydrous nadic acid, methylnadic anhydride, 5- (2,5-dioxotetrahydro- Methyl-3-cyclohexane-1,2-dicarboxylic anhydride, 3,4-dicarboxy-1,2,3,4-tetrahydro-1-naphthalenesuccinic acid anhydride, 1- Methyl-dicarboxy-1 , 2,3,4-tetrahydro-1-naphthalenesuccinic acid anhydride, and mixtures thereof.

Two or more kinds of curing agents may be mixed and used.

The epoxy resin composition according to an embodiment of the present invention may further include a curing accelerator. The curing accelerator includes, for example, an amine curing accelerator, an imidazole curing accelerator, an organic phosphine curing accelerator, a Lewis acid curing accelerator, and specifically, 1,8-diazabicyclo (5,4,0) 2-phenylimidazole, 2-phenyl-imidazole, 2-methylimidazole, 2-methylimidazole, 2-phenylimidazole, 2-methylimidazole, benzyldimethylamine, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol and tris Imidazoles such as 4-methylimidazole and 2-heptadecylimidazole, organic phosphines such as tributylphosphine, methyldiphenylphosphine, triphenylphosphine, diphenylphosphine and phenylphosphine, Tetra-substituted phosphonium tetra-substituted borates such as tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium ethyltriphenylborate, tetrabutylphosphonium tetrabutylborate and the like, 2-ethyl-4-methylimidazole tetra Phenyl borate, N-methylmorpholine te La and the like tetraphenyl boron salts such as borate.

The epoxy resin composition according to an embodiment of the present invention may contain 30 wt% to 97 wt% of inorganic filler based on the total epoxy resin composition. When the inorganic filler is contained in an amount of 30 wt% to 97 wt%, high thermal conductivity, low thermal expansion, and high temperature heat resistance of the epoxy resin composition can be improved. The high thermal conductivity, low thermal expansion, and high temperature heat resistance are better as the amount of the inorganic filler added is larger, but it is not improved according to the volume fraction thereof, and is remarkably improved from a certain amount. However, if the addition amount of the inorganic filler is more than 97 wt%, the viscosity becomes high and the formability is weakened.

The inorganic filler can be, for example, one of alumina, aluminum nitride, silicon nitride, boron nitride, crystalline silica, silicon carbide and mixtures thereof. The average particle diameter of the inorganic filler may be, for example, 30 占 퐉 or less. If the average particle diameter of the inorganic filler is larger than 30 mu m, the flowability of the epoxy resin composition may be impaired and the strength may be lowered.

The epoxy resin composition according to an embodiment of the present invention may include a release agent. As the release agent, waxes such as stearic acid, montanic acid, montanic acid ester, phosphoric acid ester and the like can be used.

The epoxy resin composition according to one embodiment of the present invention may include an additive for enhancing adhesion with a metal (hereinafter may be mixed with an adhesion promoting additive). The adhesion promoting additive may be contained in an amount of 0.1 wt% to 5 wt%, preferably 0.2 wt% to 3 wt%, more preferably 0.3 wt% to 2 wt% with respect to the total epoxy resin composition. When the adhesion promoting additive is contained in an amount of 0.1 wt% to 5 wt%, adhesion between the epoxy resin composition and the metal increases.

As a result, the adhesive force between the epoxy resin composition according to the embodiment of the present invention and the circuit pattern made of copper or the like is increased, and the likelihood of disconnection of the circuit pattern and the possibility of disconnection are reduced. Therefore, processing of the printed circuit board is facilitated, The reliability of the apparatus is improved.

The adhesion promoting additive may include at least one of, for example, an imidazole-based additive and a fluorine-based additive. The imidazole-based additive may be represented by the following general formula (4).

[Chemical Formula 4]

Wherein R ¹⁵ to R ¹⁷ may each be selected from the group consisting of H, Cl, Br, F, C ₁ -C ₂₀ alkyl, C ₂ -C ₂₀ alkene and C ₂ -C ₂₀ alkyne.

The imidazole-based additive of the formula (4) may include the following formula (5).

[Chemical Formula 5]

The fluorine-based additive can be represented by, for example, the following formula (6).

[Chemical Formula 6]

R ¹⁸ -NH ₂ BF ₃

Wherein R ¹⁸ may be selected from the group consisting of H, Cl, Br, F, C ₁ -C ₃ alkyl, C ₂ -C ₃ alkene, C ₂ -C ₃ alkyne. Preferably, R < ¹⁸ > may be a methyl group.

The epoxy resin composition according to an embodiment of the present invention can be applied to a printed circuit board. 1 is a cross-sectional view of a printed circuit board according to an embodiment of the present invention.

Referring to FIG. 1, a printed circuit board 100 includes a metal plate 110, an insulating layer 120, and a circuit pattern 130.

The metal plate 110 may be made of copper, aluminum, nickel, gold, platinum, and alloys thereof.

On the metal plate 110, an insulating layer 120 made of an epoxy resin composition according to an embodiment of the present invention is formed.

On the insulating layer 120, a circuit pattern 130 is formed. The circuit pattern 130 may be formed of a metal such as copper or nickel.

The insulating layer 120 insulates the metal plate 110 from the circuit pattern 130.

By using the epoxy resin composition according to one embodiment of the present invention as an insulating layer by curing, a printed circuit board excellent in heat radiation performance can be obtained.

Particularly, according to one embodiment of the present invention, an insulating layer containing an epoxy resin composition having a thermal conductivity of 9 W / Km or more, a peel strength of 1.2 Kgf / cm and a glass transition temperature of 100 ° C or more is obtained . Preferably, an insulating layer containing an epoxy resin composition having a thermal conductivity of 10 W / Km or more, a peel strength of 1.4 Kgf / cm and a glass transition temperature of 140 ° C or more can be obtained.

Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples.

≪ Example 1 >

10wt% crystalline epoxy compound of formula 2, 10wt% bisphenol F type epoxy compound, 4, sulfone 6wt% 4'- diaminodiphenyl, imidazole 0.6wt% additive of formula (5), fluorine-based additive of the formula 6 (R ¹⁸ , A mixture of 0.4wt% of alumina, 65.7wt% of alumina and 7.3wt% of boron nitride was dried and then heat-treated at 80 ° C for 30 min and cured at 210 ° C for 2 hours to obtain an epoxy resin composition of Example 1 .

≪ Example 2 >

10 wt% of a crystalline epoxy compound of Formula 2, 10 wt% of a bisphenol F type epoxy compound, 3 wt% of hexamethylenediamine, 3 wt% of 4,4'-diaminodiphenylsulfone, 0.3 wt% of an imidazole- , 0.2 wt% of a fluorine-based additive (R ¹⁸ is a methyl group), 66 wt% of alumina and 7.5 wt% of boron nitride was dried and then heat-treated at 80 캜 for 30 minutes and cured at 210 캜 for 2 hours, Of an epoxy resin composition.

≪ Example 3 >

2 wt% of a crystalline epoxy compound of formula (2), 14 wt% of a bisphenol A type epoxy compound, 4 wt% of a bisphenol F type epoxy compound, 6 wt% of hexamethylenediamine, 0.6 wt% of an imidazole type additive of formula ¹⁸ was a mixture of 0.4 wt% of methyl group), 65.7 wt% of alumina and 7.3 wt% of boron nitride, followed by heat treatment at 80 DEG C for 30 minutes and curing at 210 DEG C for 2 hours to obtain an epoxy resin composition ≪ / RTI >

<Example 4>

10wt% crystalline epoxy compound of formula 2, 10wt% of bisphenol A type epoxy compound, hexamethylenediamine 6wt%, imidazole 0.48wt% additive of formula (5), (the group R ¹⁸⁾ 0.32wt% fluorine-based additive of the formula (6), A mixed solution of 66 wt% alumina and 7.2 wt% boron nitride was dried, heat-treated at 80 ° C for 30 min, and cured at 210 ° C for 2 hours to obtain an epoxy resin composition of Example 4.

&Lt; Example 5 >

10 wt% of a crystalline epoxy compound of Formula 2, 10 wt% of a bisphenol F type epoxy compound, 6 wt% of p-xylene diamine, 0.6 wt% of an imidazole type additive of Formula 5, 0.4 wt% of a fluorinated additive of Formula 6 (R ¹⁸ is a methyl group) , 65.7 wt% of alumina and 7.3 wt% of boron nitride was dried, heat-treated at 80 ° C for 30 minutes, and cured at 210 ° C for 2 hours to obtain an epoxy resin composition of Example 5.

&Lt; Comparative Example 1 &

A mixed solution of 18 wt% of a bisphenol A type epoxy compound, 2 wt% of a bisphenol F type epoxy compound, 8 wt% of p-xylene diamine, 64.8 wt% of alumina and 7.2 wt% of boron nitride was dried and then subjected to heat treatment at 80 DEG C for 30 minutes, And then cured at 210 DEG C for 2 hours to obtain an epoxy resin composition of Comparative Example 1. [

&Lt; Comparative Example 2 &

A mixed solution of 14 wt% of a bisphenol A type epoxy compound, 6 wt% of a bisphenol F type epoxy compound, 9 wt% of p-xylene diamine, 64 wt% of alumina and 7 wt% of boron nitride was dried and then subjected to heat treatment at 80 DEG C for 30 minutes, For 2 hours to obtain an epoxy resin composition of Comparative Example 2.

&Lt; Comparative Example 3 &

A mixed solution of 13 wt% of bisphenol A type epoxy compound, 7 wt% of bisphenol F type epoxy compound, 6 wt% of p-xylene diamine, 66.6 wt% of alumina and 7.4 wt% of boron nitride was dried and then heat-treated at 80 DEG C for 30 minutes, And then cured at 210 DEG C for 2 hours to obtain an epoxy resin composition of Comparative Example 3. [

<Experimental Example>

The thermal conductivity of the epoxy resin compositions of Examples 1 to 5 and Comparative Examples 1 to 3 was measured by an unsteady hot wire method using a LFA447 thermal conductivity meter manufactured by NETZSCH. The glass transition temperature of the epoxy resin compositions of Examples 1 to 5 and Comparative Examples 1 to 3 was measured at a temperature raising rate of 10 ° C / minute using a DSC Q100 thermomechanical measuring device manufactured by TA. After the epoxy resin compositions of Examples 1 to 5 and Comparative Examples 1 to 3 were cured, a copper foil having a width of 1 cm was adhered thereto, and peel strength was measured by a peel strength meter. Table 1 shows the results.

Experiment number Thermal conductivity (W / mK) Glass transition temperature (캜) Peel strength (Kgf / cm) Example 1 10.2 148 1.4 Example 2 9.1 102 1.2 Example 3 6.10 77 1.4 Example 4 7.85 125 1.3 Example 5 10.01 80 1.4 Comparative Example 1 2.61 120 1.0 Comparative Example 2 3.72 108 1.0 Comparative Example 3 5.01 91 1.0

Referring to Table 1, as in Examples 1 and 2, the epoxy resin composition comprising the crystalline epoxy compound of Formula 2, 4,4'-diaminodiphenylsulfone, the adhesion promoting additive and the inorganic filler had a thermal conductivity of 9 W / mK or higher, a glass transition temperature of 100 ° C or higher, and a peel strength of 1.2 Kgf / cm or higher.

In particular, as in Example 1, the crystalline epoxy compound of Formula 2 is contained in an amount of 3 wt% or more of the entire epoxy resin composition, 4,4'-diaminodiphenylsulfone is contained in an amount of 6 wt% or more of the entire epoxy resin composition, It can be seen that when an additive is included, an epoxy resin composition having a thermal conductivity of 10 W / mK or more, a glass transition temperature of 140 ° C or more, and a peel strength of 1.4 Kgf / cm or more can be obtained.

On the other hand, the epoxy resin compositions of Examples 1 to 5 have higher peel strength than the epoxy resin compositions of Comparative Examples 1 to 3. That is, the epoxy resin composition containing the adhesion promoting additive has excellent adhesion to metals.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

Claims (10)

An epoxy compound containing a mesogen structure,
Hardener,
Inorganic filler, and
And an additive for enhancing adhesion to metal,
Wherein the epoxy compound has a structure represented by the following Formula 1, and the curing agent comprises diaminophenylsulfone:
[Chemical Formula 1]

Wherein R ¹ to R ¹⁴ may each be selected from the group consisting of H, Cl, Br, F, C ₁ -C ₃ alkyl, C ₂ -C ₃ alkene, C ₂ -C ₃ alkyne, 1, 2, or 3, respectively. The method according to claim 1,
Wherein the epoxy compound comprises an epoxy compound of the following formula (2): &lt; EMI ID =
(2)

3. The method of claim 2,
Wherein the additive comprises at least one of an imidazole-based additive and a fluorine-based additive. The method of claim 3,
Wherein the fluorine-based additive is R-NH ₂ BF ₃ and R is a C ₁ to C ₃ alkyl group. The method according to claim 1,
The epoxy compound is contained in an amount of 3 to 40 parts by weight, the curing agent is contained in an amount of 0.5 to 30 parts by weight, the inorganic filler is contained in an amount of 30 to 97 parts by weight, the additive is contained in an amount of 0.1 to 5 parts by weight &Lt; / RTI &gt; Metal plate,
An insulating layer formed on the metal plate, and
And a circuit pattern formed on the insulating layer,
Wherein the insulating layer comprises an epoxy compound including a mesogen structure, a curing agent, an inorganic filler, and an additive for enhancing adhesion to a metal,
Wherein the epoxy compound has the structure of Formula 1, and the curing agent comprises diaminodiphenylsulfone:
[Chemical Formula 1]

Wherein R ¹ to R ¹⁴ may each be selected from the group consisting of H, Cl, Br, F, C ₁ -C ₃ alkyl, C ₂ -C ₃ alkene, C ₂ -C ₃ alkyne, 1, 2, or 3, respectively. The method according to claim 6,
Wherein the additive comprises at least one of an imidazole-based additive and a fluorine-based additive. The method according to claim 6,
Wherein the insulating layer has a thermal conductivity of 9 W / Km or more. 9. The method of claim 8,
Wherein the insulation layer has a peel strength of 1.2 Kgf / cm or more. 10. The method of claim 9,
Wherein the insulating layer has a glass transition temperature of 100 DEG C or higher.

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