KR20150096766A - 재료 처리 저관성 레이저 주사 엔드 이펙터 조작 - Google Patents

재료 처리 저관성 레이저 주사 엔드 이펙터 조작 Download PDF

Info

Publication number
KR20150096766A
KR20150096766A KR1020157019370A KR20157019370A KR20150096766A KR 20150096766 A KR20150096766 A KR 20150096766A KR 1020157019370 A KR1020157019370 A KR 1020157019370A KR 20157019370 A KR20157019370 A KR 20157019370A KR 20150096766 A KR20150096766 A KR 20150096766A
Authority
KR
South Korea
Prior art keywords
robot
end effector
laser
cable
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020157019370A
Other languages
English (en)
Korean (ko)
Inventor
브레트 알 헤메스
쇼엔 에이 슈크네쳇
앤드류 케이 하젤
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 캄파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 캄파니
Publication of KR20150096766A publication Critical patent/KR20150096766A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • B23K26/0807
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/032Observing, e.g. monitoring, the workpiece using optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/1405
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/144Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing particles, e.g. powder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00Program-controlled manipulators
    • B25J9/16Program controls
    • B25J9/1679Program controls characterised by the tasks executed
    • B25J9/1684Tracking a line or surface by means of sensors
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/39Robotics, robotics to robotics hand
    • G05B2219/39033Laser tracking of end effector, measure orientation of rotatable mirror
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/40Robotics, robotics mapping to robotics vision
    • G05B2219/40623Track position of end effector by laser beam
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00Robots
    • Y10S901/02Arm motion controller

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Robotics (AREA)
  • Laser Beam Processing (AREA)
  • Manipulator (AREA)
KR1020157019370A 2012-12-20 2013-12-11 재료 처리 저관성 레이저 주사 엔드 이펙터 조작 Ceased KR20150096766A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261740340P 2012-12-20 2012-12-20
US61/740,340 2012-12-20
PCT/US2013/074233 WO2014107274A1 (en) 2012-12-20 2013-12-11 Material processing low-inertia laser scanning end-effector manipulation

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020207031772A Division KR102249405B1 (ko) 2012-12-20 2013-12-11 재료 처리 저관성 레이저 주사 엔드 이펙터 조작

Publications (1)

Publication Number Publication Date
KR20150096766A true KR20150096766A (ko) 2015-08-25

Family

ID=51062417

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020157019370A Ceased KR20150096766A (ko) 2012-12-20 2013-12-11 재료 처리 저관성 레이저 주사 엔드 이펙터 조작
KR1020207031772A Active KR102249405B1 (ko) 2012-12-20 2013-12-11 재료 처리 저관성 레이저 주사 엔드 이펙터 조작

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020207031772A Active KR102249405B1 (ko) 2012-12-20 2013-12-11 재료 처리 저관성 레이저 주사 엔드 이펙터 조작

Country Status (7)

Country Link
US (1) US10399178B2 (https=)
EP (1) EP2934812B1 (https=)
JP (1) JP6382220B2 (https=)
KR (2) KR20150096766A (https=)
CN (1) CN104870140B (https=)
BR (1) BR112015014893A2 (https=)
WO (1) WO2014107274A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020520836A (ja) * 2017-05-23 2020-07-16 コンサルトエンジニアイーペー アクチェンゲゼルシャフト 準同時レーザ溶接方法

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9914985B2 (en) * 2014-09-09 2018-03-13 G.C. Laser Systems, Inc. Laser ablation and processing methods and systems
US10788836B2 (en) * 2016-02-29 2020-09-29 AI Incorporated Obstacle recognition method for autonomous robots
JP6035461B1 (ja) * 2016-04-28 2016-11-30 武井電機工業株式会社 レーザー加工方法及びレーザー加工装置
JP6829053B2 (ja) * 2016-11-09 2021-02-10 コマツ産機株式会社 マシンルーム
JP6496340B2 (ja) * 2017-03-17 2019-04-03 ファナック株式会社 スキャナ制御装置、ロボット制御装置及びリモートレーザ溶接ロボットシステム
US20220274208A1 (en) * 2018-08-01 2022-09-01 Cohpros International Co., Ltd. Cutting device for cutting composite material
JP6852031B2 (ja) * 2018-09-26 2021-03-31 株式会社東芝 溶接装置及びノズル装置
CN113056345B (zh) * 2018-09-28 2024-01-02 康宁股份有限公司 用于对透明基板改性的系统和方法
EP4043148B1 (en) * 2018-10-25 2024-09-25 3M Innovative Properties Co. Multiple degree of freedom compliant actuator force control systems and methods used in robotic paint repair
IT201900000995A1 (it) * 2019-01-23 2020-07-23 Nuovo Pignone Tecnologie Srl Apparecchiatura robotica industriale con generazione di percorso di lavorazione migliorata e metodo per azionare un' apparecchiatura robotica industriale secondo un percorso di lavorazione migliorato
DE102019103659B4 (de) * 2019-02-13 2023-11-30 Bystronic Laser Ag Gasführung, Laserschneidkopf und Laserschneidmaschine
CN109807475A (zh) * 2019-03-26 2019-05-28 广西加一米科技有限公司 铝带激光连续切割机组
WO2020261537A1 (ja) * 2019-06-28 2020-12-30 三菱重工業株式会社 レーザー加工装置
US11299950B2 (en) * 2020-02-26 2022-04-12 Saudi Arabian Oil Company Expended laser tool
EP3984688A1 (de) * 2020-10-16 2022-04-20 Bystronic Laser AG Verfahren, computerprogramm und laserschneidsystem für intelligentes eckenschneiden
DE102021202644A1 (de) * 2021-03-18 2022-09-22 Volkswagen Aktiengesellschaft Verfahren zur Herstellung einer Ableiterfolie für Batterien
CN115555852B (zh) * 2021-06-30 2023-06-30 宁德时代新能源科技股份有限公司 极片成型方法及设备
US12330239B2 (en) * 2022-02-09 2025-06-17 Ford Global Technologies, Llc Laser notching apparatus for cutting of electrode sheets
CN115958290A (zh) * 2023-01-20 2023-04-14 通快(中国)有限公司 用于激光焊接的气体辅助装置和激光焊接系统

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2915646B2 (ja) * 1991-08-29 1999-07-05 オークマ株式会社 板金加工方法及びその機械
US5204517A (en) * 1991-12-24 1993-04-20 Maxwell Laboratories, Inc. Method and system for control of a material removal process using spectral emission discrimination
JP2917763B2 (ja) * 1993-08-11 1999-07-12 日産自動車株式会社 肉盛溶接における溶接金属粉末供給方法及びその装置
US6427096B1 (en) * 1999-02-12 2002-07-30 Honeywell International Inc. Processing tool interface apparatus for use in manufacturing environment
US20020104833A1 (en) * 2001-02-08 2002-08-08 Automated Welding Systems Inc. Welding head mount for robotic welding apparatus with micro adjustment capability
US20040034599A1 (en) * 2001-06-01 2004-02-19 Pietro Ferrero Method and device for the robot-controlled cutting of workpieces to be assembled by means of laser radiation
JP2003181663A (ja) 2001-12-11 2003-07-02 Mitsubishi Heavy Ind Ltd 複合溶接方法および複合溶接ヘッド
DE10204993B4 (de) * 2002-02-05 2005-06-09 Jenoptik Automatisierungstechnik Gmbh Vorrichtung zum Bearbeiten von dreidimensional ausgedehnten Werkstückoberflächen mittels Laser
GB2390319B (en) * 2002-07-03 2005-07-27 Rolls Royce Plc Method and apparatus for laser welding
JP2005177786A (ja) * 2003-12-17 2005-07-07 Denso Corp 高密度エネルギビーム加工方法及びその装置、孔付き管の製造方法及びその装置
JP4922584B2 (ja) 2004-12-10 2012-04-25 株式会社安川電機 ロボットシステム
JP2007044726A (ja) * 2005-08-09 2007-02-22 Nissan Motor Co Ltd レーザ溶接装置および溶接方法
CN100409994C (zh) * 2005-10-14 2008-08-13 江苏大学 基于激光冲击技术的水约束层增压的方法和装置
JP2009045625A (ja) * 2007-08-13 2009-03-05 Fuji Electric Systems Co Ltd レーザ加工装置
JP4258567B1 (ja) * 2007-10-26 2009-04-30 パナソニック電工株式会社 三次元形状造形物の製造方法
DE102007062212A1 (de) * 2007-12-21 2009-06-25 Linde Ag Verfahren und Vorrichtung zum Laser-Remote-Schneiden
JP5262810B2 (ja) * 2009-02-18 2013-08-14 村田機械株式会社 パラレルメカニズム
CN102656679B (zh) * 2009-10-19 2016-10-26 万佳雷射有限公司 用于加工连续的多段柔性箔片的装置
JP2011125877A (ja) * 2009-12-16 2011-06-30 Mitsubishi Heavy Ind Ltd レーザ加工方法及び装置
JP5609500B2 (ja) * 2010-10-01 2014-10-22 スズキ株式会社 レーザ溶接装置
DE102011016519B4 (de) * 2011-04-08 2019-03-28 Lessmüller Lasertechnik GmbH Vorrichtung zur Bearbeitung eines Werkstücks mittels eines hochenergetischen Bearbeitungsstrahls
CN202278307U (zh) * 2011-08-19 2012-06-20 广州有色金属研究院 一种可调式双线结构光焊缝跟踪视觉传感系统
CN102825383B (zh) * 2012-07-19 2014-10-29 宁海县盛源激光科技有限公司 一种数控半导体激光加工机床

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020520836A (ja) * 2017-05-23 2020-07-16 コンサルトエンジニアイーペー アクチェンゲゼルシャフト 準同時レーザ溶接方法

Also Published As

Publication number Publication date
CN104870140A (zh) 2015-08-26
EP2934812B1 (en) 2019-12-11
JP2016505389A (ja) 2016-02-25
KR102249405B1 (ko) 2021-05-07
CN104870140B (zh) 2018-05-22
KR20200129167A (ko) 2020-11-17
EP2934812A1 (en) 2015-10-28
EP2934812A4 (en) 2016-08-24
WO2014107274A1 (en) 2014-07-10
US20150352667A1 (en) 2015-12-10
US10399178B2 (en) 2019-09-03
JP6382220B2 (ja) 2018-08-29
BR112015014893A2 (pt) 2017-07-11

Similar Documents

Publication Publication Date Title
KR102249405B1 (ko) 재료 처리 저관성 레이저 주사 엔드 이펙터 조작
JP5316124B2 (ja) レーザー溶接装置
US4626999A (en) Apparatus for controlled manipulation of laser focus point
JP2017524827A (ja) レーザ焼結による積層造形用レーザ加工機およびそれに対応する方法
CN101722365B (zh) 特别用于激光加工机的操作头
KR20110114526A (ko) 사전 결정된 경로를 매니퓰레이터가 주행하게 하기 위한 방법, 및 이러한 방법을 실행하기 위한 제어 장치
JP2016505389A5 (https=)
KR102600375B1 (ko) 툴링 경로 생성이 개선된 산업용 로봇 장치, 및 개선된 툴링 경로에 따라 산업용 로봇 장치를 작동시키기 위한 방법
WO2009119457A1 (ja) ビーム加工装置、ビーム加工方法およびビーム加工基板
JP2025071193A (ja) ロボットの動作方法およびプログラム
US6727463B2 (en) Arrangement for the working of three-dimensional, expandable upper surfaces of work pieces by means of a laser
JP2024502156A (ja) 超短パルスレーザー回転方向誤差を補償する方法及びその装置並びに工作機械
JP2023020007A (ja) ロボットシステムの制御方法およびロボットシステム
CN211275752U (zh) 一种在线激光清洗装置
CN113020125A (zh) 在线激光清洗装置及清洗方法
JP2023020000A (ja) ロボットシステムの制御方法およびロボットシステム
EP4438311A1 (en) Three-dimensional object printing apparatus
KR20140005196A (ko) 직교 통합형 클리빙 장치
CN217493611U (zh) 补偿超快激光光路回转误差的装置和机床
CN101628273A (zh) 涂布装置
CN115254804B (zh) 一种大幅面激光清洗系统和方法
EP4364901A1 (en) Micromanipulator
CN116568466A (zh) 使多个移动机械移动并进行规定的作业的控制装置、机械系统、方法以及计算机程序
Zhou et al. 6 DOF dexterous microgripper for inspection of microparts
JP2001170575A (ja) 剥離・洗浄装置

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20150717

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
AMND Amendment
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20181016

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20200305

Patent event code: PE09021S01D

AMND Amendment
E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20200806

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20200305

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

X091 Application refused [patent]
AMND Amendment
PX0901 Re-examination

Patent event code: PX09011S01I

Patent event date: 20200806

Comment text: Decision to Refuse Application

Patent event code: PX09012R01I

Patent event date: 20200428

Comment text: Amendment to Specification, etc.

Patent event code: PX09012R01I

Patent event date: 20181016

Comment text: Amendment to Specification, etc.

PX0601 Decision of rejection after re-examination

Comment text: Decision to Refuse Application

Patent event code: PX06014S01D

Patent event date: 20201005

Comment text: Amendment to Specification, etc.

Patent event code: PX06012R01I

Patent event date: 20200902

Comment text: Decision to Refuse Application

Patent event code: PX06011S01I

Patent event date: 20200806

Comment text: Amendment to Specification, etc.

Patent event code: PX06012R01I

Patent event date: 20200428

Comment text: Notification of reason for refusal

Patent event code: PX06013S01I

Patent event date: 20200305

Comment text: Amendment to Specification, etc.

Patent event code: PX06012R01I

Patent event date: 20181016

X601 Decision of rejection after re-examination
A107 Divisional application of patent
PA0104 Divisional application for international application

Comment text: Divisional Application for International Patent

Patent event code: PA01041R01D

Patent event date: 20201103