KR20150067019A - 기판의 기판 장소를 누르기 위한 다운홀더 - Google Patents

기판의 기판 장소를 누르기 위한 다운홀더 Download PDF

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Publication number
KR20150067019A
KR20150067019A KR1020140160125A KR20140160125A KR20150067019A KR 20150067019 A KR20150067019 A KR 20150067019A KR 1020140160125 A KR1020140160125 A KR 1020140160125A KR 20140160125 A KR20140160125 A KR 20140160125A KR 20150067019 A KR20150067019 A KR 20150067019A
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KR
South Korea
Prior art keywords
plate
pneumatic
downholder
opening
holder
Prior art date
Application number
KR1020140160125A
Other languages
English (en)
Korean (ko)
Inventor
구이도 주터
Original Assignee
베시 스위처랜드 아게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 베시 스위처랜드 아게 filed Critical 베시 스위처랜드 아게
Publication of KR20150067019A publication Critical patent/KR20150067019A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/75981—Apparatus chuck

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Actuator (AREA)
  • Die Bonding (AREA)
  • Road Paving Machines (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
KR1020140160125A 2013-12-09 2014-11-17 기판의 기판 장소를 누르기 위한 다운홀더 KR20150067019A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH02035/13 2013-12-09
CH02035/13A CH708932B1 (en) 2013-12-09 2013-12-09 Downholder for holding down the substrate locations of a substrate for the purpose of mounting semiconductor components.

Publications (1)

Publication Number Publication Date
KR20150067019A true KR20150067019A (ko) 2015-06-17

Family

ID=53185405

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140160125A KR20150067019A (ko) 2013-12-09 2014-11-17 기판의 기판 장소를 누르기 위한 다운홀더

Country Status (7)

Country Link
JP (1) JP6627143B2 (zh)
KR (1) KR20150067019A (zh)
CN (1) CN104701220B (zh)
CH (1) CH708932B1 (zh)
DE (1) DE102014116939A1 (zh)
HK (1) HK1206867A1 (zh)
SG (1) SG10201407399PA (zh)

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01120834A (ja) * 1987-11-04 1989-05-12 Nec Corp 半導体素子のダイボンディング装置
JPH0538884U (ja) * 1991-10-28 1993-05-25 関西日本電気株式会社 リードボンダ
JPH06252210A (ja) * 1993-02-25 1994-09-09 Nec Kansai Ltd インナーリードボンダ
US5556808A (en) * 1994-06-30 1996-09-17 Motorola Inc. Method for aligning a semiconductor device
JP2000021930A (ja) * 1998-07-01 2000-01-21 Nippon Avionics Co Ltd 熱圧着装置
KR100399387B1 (ko) * 1999-11-26 2003-09-26 에스엠씨 가부시키 가이샤 실린더장치
JP3850351B2 (ja) * 2002-04-25 2006-11-29 京セラ株式会社 電子部品素子の実装方法
US7048174B2 (en) * 2003-08-25 2006-05-23 The Boeing Company Adaptable spring force clamping apparatus and methods
JP4241683B2 (ja) * 2005-07-06 2009-03-18 パナソニック株式会社 部品押圧装置
FR2905883B1 (fr) * 2006-09-14 2008-12-05 Valeo Electronique Sys Liaison Procede de soudage d'un organe sur un support par apport de matiere et dispositif d'agencement de deux elements l'un sur l'autre
KR101195085B1 (ko) * 2007-11-08 2012-10-29 가부시키가이샤 아루박 접합 기판 제조 장치 및 접합 기판 제조 방법
JP5359009B2 (ja) * 2008-04-18 2013-12-04 株式会社ニコン 半導体基板の貼り合わせ装置
CN201262949Y (zh) * 2008-09-04 2009-06-24 浙江华越芯装电子股份有限公司 集成电路热压超声球焊机改进型压焊夹具
EP2485244A4 (en) * 2009-09-28 2014-07-30 Nikon Corp PRESSURE APPLICATION MODULE, PRINT APPLICATION DEVICE AND SUBSTRATE BINDING DEVICE
JP5580163B2 (ja) * 2010-10-13 2014-08-27 東レエンジニアリング株式会社 実装装置の平行度調整方法および平行度調整装置
TWI564106B (zh) * 2011-03-28 2017-01-01 山田尖端科技股份有限公司 接合裝置以及接合方法
JP2013143542A (ja) * 2012-01-12 2013-07-22 Tokyo Electron Ltd 半導体デバイス製造システム及び半導体デバイス製造方法
WO2013133015A1 (ja) * 2012-03-07 2013-09-12 東レ株式会社 半導体装置の製造方法および半導体装置の製造装置

Also Published As

Publication number Publication date
JP6627143B2 (ja) 2020-01-08
DE102014116939A1 (de) 2015-06-11
HK1206867A1 (zh) 2016-01-15
SG10201407399PA (en) 2015-07-30
JP2015115606A (ja) 2015-06-22
CN104701220A (zh) 2015-06-10
CN104701220B (zh) 2019-07-23
CH708932A1 (de) 2015-06-15
CH708932B1 (en) 2017-04-13

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