KR20150045310A - Composition of resin and condunctive pattern forming mold with the same - Google Patents

Abstract

The present invention is to provide a resin composition having improved adhesive strength, and a mold for forming a conductive pattern comprising the same. According to an embodiment, the resin composition comprises an epoxy derivative oligomer having 1 to 10 functional groups; a monomer; and a photopolymerization initiator.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a resin composition and a mold for forming a conductive pattern,

The present invention relates to a resin composition and a mold for forming a conductive pattern comprising the resin composition.

Indium tin oxide (ITO), which is most widely used as a transparent electrode of a display device, is expensive and is physically easily struck by bending and warping of the substrate, thereby deteriorating the characteristics of the electrode. Thus, ) Device. ≪ / RTI > Also, when applied to large size devices, problems arise due to high resistance.

In order to solve such problems, active researches on alternative electrodes are under way. In particular, although the electrode material is formed in a conductive pattern, for example, a mesh shape to replace ITO, there is a problem in that the process is complicated when the conductive pattern shape is formed by imprinting.

That is, during the imprinting process, two or more expensive molds such as a mother mold and a sun mold are required, which increases the cost and complexity of the process. Further, in manufacturing the second pattern for the main pattern of the target, different processes have to be applied depending on the material of the base material. That is, when the base material is made of silicon, a second pattern having a recessed shape should be formed by dry etching. When the base material is glass, quartz or glazcicol, a master mold corresponding to the second pattern should be prepared separately, and then the second pattern should be prepared by thermal nanoimprinting. When the base material is glass or quartz, it can be produced by exposure, development and etching, but it is difficult to control the shape of the second pattern because it has only a certain shape such as isotropic etching. In addition, when the base material is a film, ultrasound nanoimprinting is rarely performed. However, there is a problem that it is difficult to control the shape of the nanoimprint because the nanoimprinting has only a certain shape relative to the output energy of the ultrasonic wave. As a result, the conventional manufacturing process requires a mold to be manufactured at least twice, which complicates the process and is costly.

The embodiment is intended to provide a resin composition having improved adhesion and a mold for forming a conductive pattern comprising the resin composition.

Examples of the resin composition according to the embodiment include an epoxy derivative oligomer having 1 to 10 reactors; Monomers; And a photopolymerization initiator.

A pattern can be formed on various substrates through the resin composition according to the embodiments. That is, it is possible to secure the adhesion of the pattern. Conventionally, there has been a problem that a pattern should be formed by varying the resin composition depending on the kind of the base material, but in the embodiment, the pattern can be formed while securing the adhesive force regardless of the type of the base material. In addition, the chemical resistance is excellent, and it is possible to prevent the pattern from being corroded or deformed by the next step. That is, even if another process proceeds, the pattern can withstand sufficiently and the pattern shape can be maintained.

In addition, in the embodiment, a desired target can be formed with only one mold. Thus, the cost can be reduced and the process can be simplified.

1 to 6 are sectional views for explaining a method of manufacturing a conductive pattern forming mold according to an embodiment.
7 to 11 are sectional views and plan views of a touch window manufactured using a mold for forming a conductive pattern according to an embodiment.
12 to 16 show experimental results comparing the examples and the comparative examples.

In the description of the embodiments, it is to be understood that each layer (film), area, pattern or structure may be referred to as being "on" or "under / under" Quot; includes all that is formed directly or through another layer. The criteria for top / bottom or bottom / bottom of each layer are described with reference to the drawings.

The thickness or the size of each layer (film), region, pattern or structure in the drawings may be modified for clarity and convenience of explanation, and thus does not entirely reflect the actual size.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

First, with reference to Figs. 1 to 6, a resin composition, a mold for forming a conductive pattern, and a method for manufacturing the same will be described.

Referring to Fig. 1, a substrate 10 for preparing a mold for forming a conductive pattern can be prepared. The substrate 10 may include any one selected from the group consisting of silicon, glass, polymer films such as PC, PMMA, and PET, glassy carbon, and quartz.

Referring to FIG. 2, a first pattern 20 may be formed on the substrate 10. The first pattern 20 may have a shape corresponding to a sub pattern of the target conductive pattern (reference numeral 320 in FIG. 8). The first pattern 20 has a relief shape. Accordingly, the first pattern 20 may protrude from the upper surface of the substrate 10. The first pattern 20 may be formed through a nanoimprinting process, a photoresist process, or an etching process.

At this time, the first pattern 20 may include the resin composition according to the embodiment.

The resin composition according to an embodiment may include an epoxy derivative oligomer, a monomer, and a photopolymerization initiator.

The oligomer may have from 1 to 10 reactors. The reactor may include an epoxy group or a hydroxy group. Thus, the oligomer may be an epoxy derivative oligomer. In one example, the oligomer may be an epoxy acrylate oligomer. At this time, the oligomer may be an oligomer obtained by reacting epichlorohydrin-bi320henol A epoxy with 1/2-methacrylate. Alternatively, the oligomer may be an oligomer diluted with acryloyl morpholine by reacting both epichlorohydrin-bi320henol A epoxy with (meth) acrylate.

At this time, the oligomer may have the following structure.

The monomer may have a double bond. Specifically, the monomer may comprise a cyclic structure. That is, the monomer may have a structure of benzene or hexane. For example, the monomer may be isobornyl (meth) acrylate, 2-methylcyclohexyl (meth) acrylate, tetrahydrofurfuran-3-yl (meth) acrylate, furfuryl (meth) acrylate or dicyclopentanyl (meth) acrylate.

Since the monomer contains an annular structure, volume shrinkage may hardly occur when the resin composition is cured. Therefore, the shape of the first pattern 20 formed of the resin composition according to the embodiment can be maintained without modification. Further, when the monomer contains an annular structure, chemical resistance can be secured. Accordingly, after the formation of the first pattern 20 formed of the resin composition according to the embodiment, the first pattern 20 can be prevented from being affected by other processes.

Then, the photopolymerization initiator was added to a solution of (2-hydroxy-2-methyl-1-phenylpropan-1-one), Darocur 1173 651, Ciba), (1-hydroxy-cyclohexylphenylketone, Irgacure 184, Ciba), (2-methyl-1- [4- (methylthio) phenyl] -2- (4-morpholinylpropan- (2,4,6-trimethylbenzoyl) -phenylpho320hine oxide, Irgacure 819, Ciba) or (2,4,6-trimethylbenzoyldiphenylpho320hine oxide, Darocur TPO, Ciba) The initiator may be any one or more of the above materials.

As a result, the first pattern 20 can be adhered onto the various substrates 10, thereby securing an adhesive force. In other words, conventionally, there has been a problem that the first pattern 20 must be formed by varying the resin composition depending on the type of the base material 10. However, in the embodiment, The pattern 20 can be formed. In addition, it is excellent in chemical resistance and can prevent the first pattern 20 from being corroded or deformed by the next step. That is, even if another process is performed, the first pattern 20 can withstand sufficiently and the pattern shape can be maintained.

Next, referring to FIG. 3, a second pattern 30 may be formed on the substrate 10. The second pattern 30 is disposed between the first patterns 20. The second pattern 30 may have a shape corresponding to the main pattern of the target conductive pattern (reference numeral 310 in FIG. 8). The second pattern 30 is in the form of a conductive pattern. The second pattern 30 has a relief shape. Therefore, the second pattern 30 may protrude from the upper surface of the substrate 10. Thereby, the conductive pattern forming mold 100 can be manufactured.

The second pattern 30 may be formed by a photoresist process. That is, the second pattern 30 may be formed through exposure, development, and etching of a photosensitive material. Accordingly, the second pattern 30 may include a photosensitive film or a photoresist. At this time, the second pattern 30 may include a material that can sufficiently withstand the plating process used in forming the mold by forming a mold material (reference numeral 200 'in FIG. 5). Accordingly, the second pattern 30 may include a plating-only photosensitive film or a plating-only photoresist.

Referring to FIG. 4, a seed layer 40 may be formed on the conductive pattern forming mold 100. Therefore, the seed layer 40 may be formed on the upper surface and the side surfaces of the first pattern 20 and the second pattern 30. The seed layer 40 may include a metal. The seed layer 40 may include a metal having high corrosion resistance. The seed layer 40 may include any one selected from the group consisting of copper, aluminum, nickel, tin, zinc, gold, silver, and alloys thereof. However, the present invention is not limited thereto, and the seed layer 40 may include a material corresponding to the mold material (200 'in FIG. 5, hereinafter the same) formed on the conductive pattern forming mold 100 . That is, the seed layer 40 may include the same material as the mold material 200 '. Thus, the patterns formed on the mold 200 can be uniformly plated.

On the other hand, a surface treatment layer such as a fluorine coating layer may be formed on the conductive pattern forming mold 100 instead of the seed layer 40. The mold 200 to be formed later can be easily released through the fluorine coating layer.

Referring to FIG. 5, a mold material 200 'may be formed on the conductive pattern forming mold 100. The mold material 200 'may be formed by electroplating from the seed layer 40. Accordingly, the mold 200 having a high strength can be manufactured from the mold material 200 '.

Referring now to FIGS. 5 and 6, the mold 200 produced from the mold material 200 'may be separated. Accordingly, the mold 200 includes a third pattern 32 corresponding to the subpattern 320 of the target conductive pattern (see FIG. 8) and a fourth pattern 31 corresponding to the main pattern 310 . The third pattern 32 and the fourth pattern 31 may have a negative shape. Although the mold 200 is illustrated as having a flat plane shape, the embodiment is not limited thereto. Accordingly, the mold 200 may include a roll shape. A roll-to-roll process can be performed through the roll-shaped mold 200.

Referring to FIG. 7, a target material 300 'may be formed on the mold 200, and the imprinted target conductive pattern 300 may be separated from the mold 200 . Accordingly, the target conductive pattern 300 includes a main pattern 310 and a sub pattern 320 which are intended.

Conventionally, two or more expensive molds, such as a mother mold and a sun mold, are required, which increases the cost and complexity of the process. Further, in manufacturing the second pattern 30 for the main pattern 310 of the target, other processes have to be applied depending on the material of the substrate 10. That is, when the substrate 10 is made of silicon, it is necessary to form the second pattern 30 having a depressed shape by dry etching. When the substrate 10 is made of glass, quartz or glazcicol, the master mold 200 corresponding to the second pattern 30 is separately manufactured, and then the second pattern 30 is manufactured by thermal nanoimprinting. shall. When the substrate 10 is made of glass or quartz, it can be produced by exposure, development and etching, but it is difficult to control the shape of the second pattern 30 because it has only a certain shape such as isotropic etching. When the substrate 10 is a film, ultrasound nanoimprinting is rarely performed. However, there is a problem that it is difficult to control the shape of the nanoimprint because the nanoimprinting has a certain shape relative to the output energy of the ultrasonic wave. As a result, the conventional manufacturing process requires a mold to be manufactured at least twice, which complicates the process and is costly.

However, in the embodiment, a desired target can be formed with only one mold 200. Thus, the cost can be reduced and the process can be simplified. In particular, the second pattern 30 for the main pattern 310 of the target can be formed by a simple photoresist process. In addition, since the seed layer 40 is formed on the substrate 10, the target conductive pattern can be produced regardless of the kind of the substrate 10.

Referring to FIG. 9, an electrode material 400 'may be formed on the main pattern 310 and the subpattern 320. The electrode material 400 'may be formed by vapor deposition or plating.

Referring to FIG. 10, the electrode material 400 'may be etched. At this time, a difference in etch area occurs due to the difference in the bonding area between the structure of the main pattern 310 and the sub pattern 320 and the electrode material 400 '. That is, since the bonding area of the main pattern 310 and the electrode material 400 'is larger than the bonding area of the main pattern 310 and the electrode material 400' The etching of the electrode material 400 'formed on the substrate 400' occurs less. That is, according to the same etching rate, the electrode material 400 'formed on the main pattern 310 remains, and the electrode material 400' formed on the subpattern 320 is etched and removed. Therefore, the electrode layer 400 may be formed only on the main pattern 310, and the electrode layer 400 may be disposed in a conductive pattern.

11, the touch window includes a valid area AA for sensing the position of an input device (e.g., a finger or the like) and a non-valid area UA disposed around the valid area AA And a substrate 300. Here, the electrode unit 350 may be formed in the effective area AA to sense the input device. In the non-effective area UA, a wiring 370 for electrically connecting the electrode unit 350 may be formed. The electrode portion 350 includes a conductive pattern shape. Specifically, the electrode portion 350 includes a conductive pattern opening portion OA and a conductive pattern line portion LA.

On the other hand, as shown in FIG. 11, the conductive pattern opening OA may have a rectangular shape. However, the embodiment is not limited thereto, and the conductive pattern opening OA may have various shapes such as a diamond shape, a pentagon, a hexagonal polygonal shape, or a circular shape.

11, a sub-pattern 320 may be formed in the entire effective area AA or in the non-effective area UA. However, the sub- have.

Since the electrode portion 350 has a conductive pattern shape, it is possible to prevent the pattern of the electrode portion 350 from being seen on the effective region AA. That is, even if the electrode unit 350 is formed of metal, the pattern can be made invisible. In addition, the resistance of the touch window can be lowered even if the electrode unit 350 is applied to a touch window of a large size. In addition, when the electrode unit 350 is formed by the imprinting process, a high quality touch window can be secured by improving the print quality.

Although it has been described that the conductive pattern pattern is applied to the touch window, the embodiment is not limited to this, and can be applied to various display devices including electrodes.

Hereinafter, the present invention will be described in more detail by way of examples. However, the present invention is not limited thereto.

Example

2-methylcyclohexyl (meth) acrylate, and 2-hydroxy-2-methyl-1-phenylpropane (meth) acrylate were reacted with acryloyl morpholine, epichlorohydrin-bi- -1-one, Darocur 1173, Ciba), and then a second pattern was formed by a photoresist process.

Comparative Example

Except that an epoxy-free oligomer was used.

For the Examples and the Comparative Examples, a cross-cut experiment was conducted on how much the first pattern was left on the substrate when the first pattern was cut with the razor, and when the first pattern was peeled off with the adhesive tape, A rubbing experiment was conducted to determine how much the first pattern remained on the substrate.

As a result of the cross-cut test, it can be seen that the first pattern of the embodiment (FIG. 12) is more remained than the comparative example (FIG. 13). As a result of the rubbing test, it can be seen that the first pattern of the embodiment (Fig. 14) is more remained than the comparative example (Fig. 15). That is, it can be confirmed that the first pattern of the embodiment is excellent in adhesion.

Referring to FIGS. 16 and 17, it can be seen that the first pattern and the second pattern maintain a good pattern shape in comparison with the comparative example (FIG. 17) in the embodiment (FIG. 16).

The features, structures, effects and the like described in the foregoing embodiments are included in at least one embodiment of the present invention and are not necessarily limited to one embodiment. Further, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified in other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be construed as limiting the scope of the present invention. It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments may be modified and implemented. It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof.

Claims (6)

Epoxy derivative oligomers having from 1 to 10 reactors;
Monomers; And
A resin composition comprising a photo polymerization initiator. The method according to claim 1,
Wherein the monomer comprises a cyclic structure. The method according to claim 1,
Wherein the monomer is selected from the group consisting of isobornyl (meth) acrylate, 2-methylcyclohexyl (meth) acrylate, tetrahydrofurfuran-3-yl (meth) acrylate, furfuryl (meth) acrylate and dicyclopentanyl Composition. The method according to claim 1,
The photopolymerization initiator may be at least one selected from the group consisting of (2-hydroxy-2-methyl-1-phenylpropan-1-one), (2,2-dimethoxy-1,2-diphenylethan- 2-methyl-1- [4- (methylthio) phenyl] -2- (4-morpholinylpropan-1-one), bis (2,4,6- trimethylbenzoyl) -phenylphosphine, trimethylbenzoyldiphenylpho320hine oxide). < / RTI > And a second pattern having a larger line width than the first pattern,
Wherein the first pattern comprises:
Epoxy derivative oligomers having 1 to 10 reactors;
Monomers; And
A mold for forming a conductive pattern comprising a photopolymerization initiator. 6. The method of claim 5,
Wherein the monomer comprises an annular structure.

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