JP2013188876A - Transparent thin film laminate and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a low retardation and low thermal shrinkage transparent thin film laminate capable of reducing a thermal shrinkage coefficient even if using a TAC (triacetylcellulose) base material in the transparent thin film laminate and a method of manufacturing the same.SOLUTION: In a transparent thin film laminate that a transparent thin film is formed on a transparent resin base material, when d1 is a distance between optional two points of the transparent thin film laminate and d2 is a distance between the two points after heating the transparent thin film laminate at 130 °C for one hour, the following formula (d2-d1)/d1≤0.0015 is established.

Description

  The present invention relates to a transparent touch panel attached as an input device on a display of an electronic device, a transparent thin film laminate used for an electrode of a flexible display, and the like, and a manufacturing method thereof.

  In recent years, transparent touch panels that allow input by simply touching a display screen with a finger or pressing with a pen have become widespread. The transparent conductive film used as an electrode of this touch panel basically has a configuration in which a conductive film is laminated on glass or a polymer film. Particularly in recent years, transparent conductive films using polymer films such as polyethylene terephthalate have been used because they are excellent in flexibility and workability and are lightweight.

  In addition, in order to suppress internal reflection, touch panels having a structure in which a transparent conductive film is sandwiched between a polarizing plate and a circularly polarizing plate are increasing. At this time, if the retardation of the transparent conductive film is high, the effect of suppressing internal reflection cannot be sufficiently obtained, and therefore, it is required to use a low retardation substrate for the transparent conductive film.

JP 2009-93395 A

  Conventionally, glass has often been used as the low retardation substrate, but an alternative to a polymer film has been demanded from the viewpoint of weight reduction, flexibility, and workability of the entire touch panel. Various films have been marketed as low retardation polymer films. Among them, triacetyl cellulose (hereinafter referred to as TAC) has excellent cost performance.

  However, when manufacturing a touch panel, it is common to include a process in which a transparent conductive film is placed in a high-temperature environment. However, TAC has a large thermal shrinkage when heated compared to glass or polyethylene terephthalate, This will adversely affect the positional accuracy when assembling the touch panel. Therefore, although there exists a technique which uses TAC for the member in a touch panel like patent document 1, this does not hit the thing for reducing the thermal contraction of the transparent conductive film using TAC.

  The present invention has been made in view of the problems of the prior art, and its purpose is to achieve low retardation and low heat shrinkage, which can reduce the heat shrinkage rate even when a TAC substrate is used for the transparent thin film laminate. It is in providing a transparent thin film laminated body and its manufacturing method.

The present invention is for solving the above problems, and the invention according to claim 1 of the present invention is the transparent thin film laminate in which a transparent thin film is formed on a transparent resin substrate. When the distance between any two points on the body is d1, and the distance between the two points after heating the transparent thin film laminate at 130 ° C. for 1 hour is d2, the equation (1) is satisfied. It is a transparent thin film laminate.
(D2-d1) /d1≦0.0015 (1)

In the invention according to claim 2, R (0) represents an in-plane retardation at an incident angle of 0 ° after heating the transparent thin film laminate at 130 ° C. for 1 hour, and R (50) represents an in-plane retardation at an incident angle of 50 °. The transparent thin-film laminate according to claim 1, wherein formula (2) and formula (3) are satisfied.
R (0) ≦ 10 nm (2)
R (50) ≦ 20 nm (3)

  The invention according to claim 3 is the transparent thin film laminate according to claim 1 or 2, wherein the transparent resin base material is triacetyl cellulose.

  The invention according to claim 4 is the transparent thin film laminate according to any one of claims 1 to 3, wherein the transparent thin film laminate includes at least a transparent conductive film.

  The invention according to claim 5 is the transparent thin film laminate according to any one of claims 1 to 4, wherein the transparent thin film laminate has at least a metal layer or an inorganic compound layer.

  The invention according to claim 6 is characterized in that a metal layer or an inorganic compound layer is provided between the transparent resin substrate and the transparent conductive film of the transparent thin film laminate. The transparent thin film laminate.

  The invention according to claim 7 is the transparent thin film laminate according to claim 4, further comprising a metal layer or an inorganic compound layer outside the transparent conductive film of the transparent thin film laminate. .

  The invention according to claim 8 is the transparent thin film laminate according to any one of claims 1 to 7, characterized in that the transparent thin film laminate has at least an organic compound layer.

  The invention according to claim 9 has an organic compound layer between the transparent resin substrate and the transparent conductive film of the transparent thin film laminate, according to claim 4. Is the body.

  The invention according to claim 10 is characterized in that an organic compound layer is provided on a surface opposite to the transparent conductive film side of the transparent resin base material of the transparent thin film laminate. It is a transparent thin film laminate.

  The invention which concerns on Claim 11 is a manufacturing method of the transparent thin film laminated body which manufactures the transparent thin film laminated body of any one of Claims 1-10, Comprising: The said transparent thin film to the said transparent thin film laminated body is a manufacturing method. In the forming process, the transparent thin film laminate before the formation of the transparent thin film is heated at 110 ° C. or higher and 160 ° C. or lower for 5 minutes or longer.

  The invention which concerns on Claim 12 is a manufacturing method of the transparent thin film laminated body which manufactures the transparent thin film laminated body of any one of Claims 1-10, Comprising: The said transparent thin film to the said transparent thin film laminated body is In the forming process, the transparent thin film laminate is heated at 110 ° C. or higher and 160 ° C. or lower for 5 minutes or more in the course of forming the transparent thin film.

  The invention according to claim 13 is a method for producing a transparent thin film laminate for producing the transparent thin film laminate according to any one of claims 1 to 10, wherein the transparent thin film is applied to the transparent thin film laminate. In the forming process, the transparent thin film laminate is heated at 110 ° C. or higher and 160 ° C. or lower for 5 minutes or more after the transparent thin film is formed.

  The invention according to claim 14 is the method for producing a transparent thin film laminate according to any one of claims 11 to 13, wherein a tension applied when the transparent thin film laminate is heated is 30 N or less. It is.

  According to the present invention, even when a TAC substrate is used for the transparent thin film laminate, the heat shrinkage rate of the transparent thin film laminate is reduced by carrying out the heat treatment, and the transparent thin film laminate having a low retardation and low heat shrinkage. And a manufacturing method thereof.

Sectional drawing which shows one Embodiment of this invention and shows the structure of a 1st transparent thin film laminated body Sectional drawing which shows one Embodiment of this invention and shows the structure of a 2nd transparent thin film laminated body The graph which shows one Embodiment of this invention and shows the relationship between heat processing temperature when heat-processing with the tension | tensile_strength of 0 N, and a thermal contraction rate. The graph which shows one Embodiment of this invention and shows the relationship between heat processing temperature when heat-processing with the tension | tensile_strength of 30 N, and a thermal contraction rate. The graph which shows one Embodiment of this invention and shows the relationship between heat processing temperature when heat-processing with the tension | tensile_strength of 50 N, and a thermal contraction rate. The graph which shows one Embodiment of this invention and shows the relationship between the heat processing temperature when heat-processing with the tension | tensile_strength of 0 N, and the in-plane retardation of 0 degrees of incident angles. The graph which shows one Embodiment of this invention and shows the relationship between the heat processing temperature when heat-processing with the tension | tensile_strength of 30 N, and the in-plane retardation of 0 degrees of incident angles. The graph which shows one Embodiment of this invention and shows the relationship between the heat processing temperature when heat-processing with the tension | tensile_strength of 50 N, and the in-plane retardation of 0 degrees of incident angles. The graph which shows one Embodiment of this invention and shows the relationship between the heat processing temperature when heat-processing with the tension | tensile_strength of 0 N, and the in-plane retardation of 50 degrees of incident angles. The graph which shows one Embodiment of this invention and shows the relationship between the heat processing temperature when heat-processing with the tension | tensile_strength of 30 N, and the in-plane retardation of 50 degrees of incident angles. The graph which shows one Embodiment of this invention and shows the relationship between the heat processing temperature when heat-processing with the tension | tensile_strength of 50 N, and the in-plane retardation of 50 degrees of incident angles.

  Hereinafter, the form for implementing this invention is demonstrated using the basic composition explanatory drawing of one Embodiment of a transparent thin film laminated body. The present invention is not limited to the embodiments described below, and modifications such as design changes can be made based on the knowledge of those skilled in the art, and such modifications have been added. Embodiments are also included in the scope of the present invention.

  As shown in FIG. 1, the transparent thin film laminated body 1 which is the 1st transparent thin film laminated body which concerns on this embodiment has the transparent conductive film 3 as a transparent thin film laminated | stacked on one surface of the transparent resin base material 2. As shown in FIG. It is the composition which becomes.

  TAC can be used for the transparent resin base material of this embodiment. The TAC used at this time is selected so that the in-plane retardation at an incident angle of 0 ° is 10 nm or less and the in-plane retardation at an incident angle of 50 ° is 20 nm or less. Further, considering the thickness of the member and the flexibility of the base material, it is preferable to use a thickness of about 10 μm or more and 200 μm or less.

  The first transparent thin-film laminate of the present embodiment includes at least a transparent conductive film made of a metal oxide on a transparent resin base material. HYPERLINK "http://homtp-hoj00.edc.toppan.co. jp / patweb / patweb.exe? Command = imgform & DocDir = tma029761 & ImageNo = 2 "\ t" imageframe "As shown in FIG. 1, it is preferable that a transparent conductive film 3 is laminated on a transparent resin substrate 2.

  The transparent conductive film 3 is made of a metal oxide, and as the metal oxide, any one of indium oxide, zinc oxide and tin oxide, or two or three of these mixed oxides, and other additions Examples include various materials added, but various materials can be used depending on the purpose and application, and are not particularly limited. At present, the most reliable and proven material is indium tin oxide (ITO).

  When the indium tin oxide (ITO) is used as the material of the transparent conductive film 3, the content ratio of tin oxide doped in indium oxide may be arbitrarily selected according to the specifications required for the device. In the case of the transparent resin base material 2, the material used for crystallizing the thin film for the purpose of increasing the mechanical strength preferably has a tin oxide content of less than 10% by weight, and imparts flexibility by amorphizing the thin film. In order to do so, it is preferable that the content ratio of tin oxide is 10% by weight or more. Moreover, when low resistance is calculated | required by a thin film, it is preferable that the content rate of a tin oxide is the range of 2-20 weight%.

  The manufacturing method of the transparent conductive film 3 may be any film forming method as long as the film thickness can be controlled, and the thin film dry coating method is particularly excellent. For this, a vacuum vapor deposition method, a physical vapor deposition method such as sputtering, or a chemical vapor deposition method such as a CVD method can be used. In particular, in order to form a thin film having a uniform film quality over a large area, a sputtering method in which the process is stable and the thin film becomes dense is preferable.

  The thickness of the transparent conductive film 3 is not particularly limited and may be appropriately adjusted according to the target characteristics. For example, the thickness is preferably in the range of 10 nm to 50 nm.

  In the transparent thin film laminated body 1, before the transparent conductive film 3 is laminated on the transparent resin substrate 2, the transparent conductive film 3 is laminated on the transparent resin substrate 2, or the transparent conductive film 3 is a transparent resin. In any step after being laminated on the substrate 2, the transparent thin film laminate 1 is heat-treated at a temperature of 110 ° C. or more and 160 ° C. or less for 5 minutes or more in a state where a tension of 30 N or less is applied. Thereby, the residual stress of the transparent resin base material 2 is removed, and the thermal contraction rate of the transparent thin film laminate 1 is reduced.

  In the embodiment of FIG. 1, by selecting the above-described configuration and process, the thermal shrinkage rate when heated at 130 ° C. for 1 hour is 0.15% or less, the in-plane retardation at an incident angle of 0 ° is 10 nm or less, The transparent thin film laminate 1 having an in-plane retardation at an incident angle of 50 ° of 20 nm or less can be provided.

  Here, when the distance between any two points of the transparent thin film laminate 1 is d1, and the distance between the two points after heating the transparent thin film laminate 1 is d2, the value of (d2-d1) / d1. Is the heat shrinkage rate.

  The 1st transparent thin film laminated body of this embodiment can be used suitably as a structural member of a touch panel.

  Moreover, as shown in FIG. 2, the transparent thin film laminated body 4 which is the 2nd transparent thin film laminated body which concerns on this embodiment is the 1st transparent thin film layer as a transparent thin film on one surface of the transparent resin base material 5. 6 and a transparent conductive film 7 as a transparent thin film are sequentially laminated, and a second transparent thin film layer 8 as a transparent thin film is provided on the other surface of the transparent resin substrate 5.

  The material of the transparent resin substrate 5 is the same as in the case of FIG.

  In the 2nd transparent thin film laminated body of this embodiment, it is preferable that the 1st transparent thin film layer which consists of an inorganic compound is formed in the at least one surface of a transparent resin base material, and as shown in FIG. It is preferable that the first transparent thin film layer 6 is formed on the resin base material 5 and the transparent conductive film 7 is laminated thereon. In addition, the transparent conductive film 7 may be formed on the transparent resin base material 5, and the 1st transparent thin film layer 6 may be laminated | stacked on the outer side. Moreover, the layer which consists of metals may be formed in the layer position of the said 1st transparent thin film layer. The metal is provided as a light-shielding conductive film, for example.

  The 1st transparent thin film layer 6 has a function which adjusts the transmittance | permeability and hue of the transparent thin film laminated body 4, and is a layer for improving visibility. When the 1st transparent thin film layer 6 consists of inorganic compounds, inorganic compounds, such as an oxide, sulfide, fluoride, nitride, can be used, for example. The first transparent thin film layer 6 made of such an inorganic compound has a different refractive index depending on its material (type of compound), and the first transparent thin film layer 6 having a different refractive index is formed with a specific film thickness. The optical characteristics can be adjusted. The first transparent thin film layer is not limited to a single layer, and may be a plurality of layers according to the target optical characteristics.

  Examples of the inorganic compound having a low refractive index include magnesium oxide (1.6), silicon dioxide (1.5), magnesium fluoride (1.4), calcium fluoride (1.3 to 1.4), and fluoride. Examples include cerium (1.6) and aluminum fluoride (1.3). Examples of the inorganic compound having a high refractive index include titanium oxide (2.4), zirconium oxide (2.4), zinc sulfide (2.3), tantalum oxide (2.1), and zinc oxide (2.1 ), Indium oxide (2.0), niobium oxide (2.3), tantalum oxide (2.2), and the like. However, the numerical value in the parenthesis represents a refractive index.

  The manufacturing method of the first transparent thin film layer 6 may be any film forming method as long as the film thickness can be controlled, and the thin film dry coating method is particularly excellent. For this, a vacuum vapor deposition method, a physical vapor deposition method such as sputtering, or a chemical vapor deposition method such as a CVD method can be used. In particular, in order to form a thin film having a uniform film quality over a large area, a sputtering method in which the process is stable and the thin film becomes dense is preferable.

  The thickness of the first transparent thin film layer 6 is not particularly limited, and may be specified together with the type of the inorganic compound to be used according to the target optical characteristics. For example, it may be in the range of 10 nm or more and 100 nm or less. preferable.

  The second transparent thin film laminate of the present embodiment includes at least a transparent conductive film made of a metal oxide on a transparent resin base material. HYPERLINK "http://homtp-hoj00.edc.toppan.co .jp / patweb / patweb.exe? Command = imgform & DocDir = tma029761 & ImageNo = 2 "\ t" imageframe "As shown in FIG. 2, the first transparent thin film layer 6 is formed on the transparent resin base material 5 and is transparent thereon. It is preferable that the conductive film 7 is laminated.

  The material and manufacturing process of the transparent conductive film 7 are the same as those in FIG.

  In order to give mechanical strength to the second transparent thin film laminate of the present embodiment, it is preferable that a second transparent thin film layer is formed on the surface of at least one of the transparent resin substrates, as shown in FIG. Moreover, it is preferable that the second transparent thin film layer 8 is formed on the surface of the transparent resin substrate 5 opposite to the first transparent thin film layer 6 side. Here, the second transparent thin film layer 8 is made of an organic compound. The second transparent thin film layer 8 may be formed between the transparent resin substrate 5 and the transparent conductive film 7.

  Although it does not specifically limit as resin used for the 2nd transparent thin film layer 8, Resin with transparency, moderate hardness, and mechanical strength is preferable. Specifically, a photocurable resin such as a monomer or a crosslinkable oligomer having a tri- or higher functional acrylate that can be expected to be three-dimensionally crosslinked as a main component is preferable.

  Trifunctional or higher acrylate monomers include trimethylolpropane triacrylate, isocyanuric acid EO-modified triacrylate, pentaerythritol triacrylate, dipentaerythritol triacrylate, dipentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate Ditrimethylolpropane tetraacrylate, pentaerythritol tetraacrylate, polyester acrylate and the like are preferable. Particularly preferred are isocyanuric acid EO-modified triacrylate and polyester acrylate. These may be used alone or in combination of two or more. In addition to these tri- or higher functional acrylates, so-called acrylic resins such as epoxy acrylate, urethane acrylate, and polyol acrylate can be used in combination.

  As the crosslinkable oligomer, acrylic oligomers such as polyester (meth) acrylate, polyether (meth) acrylate, polyurethane (meth) acrylate, epoxy (meth) acrylate, and silicone (meth) acrylate are preferable. Specific examples include polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, bisphenol A type epoxy acrylate, polyurethane diacrylate, and cresol novolac type epoxy (meth) acrylate.

  In addition, the second transparent thin film layer 8 may contain additives such as particles and a photopolymerization initiator.

  Examples of the particles to be added include organic or inorganic particles, but it is preferable to use organic particles in consideration of transparency. Examples of the organic particles include particles made of acrylic resin, polystyrene resin, polyester resin, polyolefin resin, polyamide resin, polycarbonate resin, polyurethane resin, silicone resin, and fluorine resin.

  The average particle diameter of the particles varies depending on the thickness of the second transparent thin film layer 8, but for reasons of appearance such as haze, the lower limit is 2 μm or more, more preferably 5 μm or more, and the upper limit is 30 μm or less, preferably 15 μm or less. Use things. Further, for the same reason, the particle content is preferably 0.5% by weight or more and 5% by weight or less based on the resin.

When a photopolymerization initiator is added, radical generating photopolymerization initiators include benzoin and its alkyl ethers such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and benzyl methyl ketal, acetophenone, 2, 2 , -Dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexyl phenyl ketone, and other acetophenones, methylanthraquinone, 2-ethylanthraquinone, 2-amylanthraquinone and other anthraquinones, thioxanthone, 2,4-diethylthioxanthone, 2, 4 -Thioxanthones such as diisopropylthioxanthone, ketals such as acetophenone dimethyl ketal and benzyl dimethyl ketal, benzophenone, 4,4-bismeth Le benzophenones such aminobenzophenone and azo compounds, and the like. These can be used alone or as a mixture of two or more thereof, and further, tertiary amines such as triethanolamine and methyldiethanolamine, benzoic acid derivatives such as 2-dimethylaminoethylbenzoic acid and ethyl 4-dimethylaminobenzoate, etc. It can be used in combination with a photoinitiator aid or the like.

  The addition amount of the photopolymerization initiator is 0.1% by weight or more and 5% by weight or less, preferably 0.5% by weight or more and 3% by weight or less with respect to the main component resin. Less than the lower limit is not preferable because the hard coat layer is insufficiently cured. Moreover, when exceeding an upper limit, since yellowing of a hard-coat layer is produced or a weather resistance falls, it is unpreferable. The light used for curing the photocurable resin is ultraviolet rays, electron beams, or gamma rays, and in the case of electron beams or gamma rays, it is not always necessary to contain a photopolymerization initiator or a photoinitiating aid. As these radiation sources, high pressure mercury lamps, xenon lamps, metal halide lamps, accelerated electrons, and the like can be used.

  The thickness of the second transparent thin film layer 8 is not particularly limited, but is preferably in the range of 0.5 μm to 15 μm. Moreover, it is more preferable that the refractive index is the same as or close to that of the transparent substrate layer 1, and it is preferably about 1.45 or more and 1.75 or less.

  The second transparent thin film layer 8 is formed by dissolving a resin as a main component in a solvent, a die coater, curtain flow coater, roll coater, reverse roll coater, gravure coater, knife coater, bar coater, spin coater, micro It forms by well-known coating methods, such as a gravure coater.

  The solvent is not particularly limited as long as it dissolves the main component resin and the like. Specifically, as a solvent, ethanol, isopropyl alcohol, isobutyl alcohol, benzene, toluene, xylene, acetone, methyl ethyl ketone, methyl isobutyl ketone, ethyl acetate, n-butyl acetate, isoamyl acetate, ethyl lactate, methyl cellosolve, ethyl cellosolve, Examples include butyl cellosolve, methyl cellosolve acetate, and propylene glycol monomethyl ether acetate. These solvents may be used alone or in combination of two or more.

  In the transparent thin film laminate 4 according to the present embodiment, when any layer is not laminated on the transparent resin substrate 5, any of the first transparent thin film layer 6, the transparent conductive film 7, and the second transparent thin film layer 8 is used. In the process in which the first transparent thin film layer 6, the transparent conductive film 7, and the second transparent thin film layer 8 are all laminated on the transparent resin base material 5 The thin film laminate 1 is heat-treated at a temperature of 110 ° C. or higher and 160 ° C. or lower for 5 minutes or more in a state where a tension of 30 N or less is applied. Thereby, the residual stress of the transparent resin base material 5 is removed, and the thermal contraction rate of the transparent thin film laminate 4 is reduced.

In the embodiment of FIG. 2, by selecting the above-described configuration and process, the shrinkage when heated at 130 ° C. for 1 hour is 0.15% or less, the in-plane retardation at an incident angle of 0 ° is 10 nm or less, and the incident The transparent thin film laminate 4 having an in-plane retardation of 50 ° in angle of 20 nm or less can be provided.
The method for obtaining the heat shrinkage rate is the same as in FIG.

  The 2nd transparent thin film laminated body of this embodiment can be used suitably as a structural member of a touch panel.

Next, specific examples of the present invention will be described. Each process is a roll-to-roll format.
<Example>
In the configuration of FIG. 2, TAC (manufactured by Fuji Film Co., Ltd.) having a film thickness of 60 μm was used as the transparent resin base material.

Next, a hard coat coating solution (composition: urethane acrylate (manufactured by Kyoeisha Chemical Co., Ltd., UA-510H) 100 weight) is applied to one surface on the transparent resin substrate by a gravure coating method so that the cured film thickness becomes 8 μm. 4 parts by weight of an alkylphenone photopolymerization initiator (Ciba Specialty Chemicals, IRGACURE907) and 100 parts by weight of ethyl acetate), dried, and irradiated with 400 mJ / cm ² of ultraviolet rays with a metal halide lamp, A second transparent thin film layer was formed.

  Furthermore, the transparent resin base material on which the second transparent thin film layer was formed was heat-treated in an oven.

Subsequently, the first transparent thin film layer and the transparent conductive film were formed on the surface of the transparent resin substrate without the second transparent thin film layer by a DC magnetron sputtering method. At this time, silicon dioxide (SiO ₂ ) was used as the material for the first transparent thin film layer, and ITO containing 10% by weight of tin oxide was used as the material for the transparent conductive film. The thickness of the first transparent thin film layer was 50 nm, and the thickness of the transparent conductive film was 20 nm.

<Comparative example>
In the configuration of FIG. 2, a transparent thin film laminate was manufactured using the same materials and steps as in the above example. However, the process of heat-processing the transparent resin base material after formation of a 2nd transparent thin film layer in oven is not implemented. When the transparent thin film laminate produced here is heated at 130 ° C. for 1 hour, the thermal shrinkage rate is 0.32%, the in-plane retardation R (0) at an incident angle of 0 ° is 0.1 nm, and the incident angle is 50 °. The in-plane retardation R (50) was 5.0 nm.

  When the transparent thin-film laminated body manufactured by the Example was heated at 130 degreeC for 1 hour, the measurement result of the heat contraction rate with respect to the heat processing temperature and the heat processing time in the case of the tension | tensile_strength 0N, 30N, and 50N at the time of heat processing is shown. 3 to 5 show in-plane retardation R (0) at an incident angle of 0 °, and FIGS. 9 to 11 show in-plane retardation R (50) at an incident angle of 50 °. In Example 1, when the heat treatment temperature exceeded 160 ° C., white turbidity occurred in the transparent thin film laminate, and thus the evaluation was performed in the range of 100 ° C. to 160 ° C.

<Evaluation results>
From the results shown in FIGS. 3 to 5, the transparent thin film laminate is subjected to heat treatment at a tension of 30 N or less, a temperature of 110 ° C. or more and 160 ° C. or less, and a treatment time of 5 minutes or more. It was found that the rate was within 0.15%. It was also confirmed that the in-plane retardation R (0) at an incident angle of 0 ° was 10 nm or less and the in-plane retardation R (50) at an incident angle of 50 ° was 20 nm or less.

  The present invention can be suitably used as a constituent member of a touch panel, for example.

DESCRIPTION OF SYMBOLS 1 Transparent thin film laminated body 2 Transparent resin base material 3 Transparent conductive film 4 Transparent thin film laminated body 5 Transparent resin base material 6 1st transparent thin film layer 7 Transparent conductive film

Claims (14)

In a transparent thin film laminate in which a transparent thin film is formed on a transparent resin substrate,
When the distance between any two points of the transparent thin film laminate is d1, and the distance between the two points after heating the transparent thin film laminate at 130 ° C. for 1 hour is d2, the following formula:
(D2-d1) /d1≦0.0015 (1)
A transparent thin film laminate characterized by that: When the in-plane retardation at an incident angle of 0 ° after heating the transparent thin film laminate at 130 ° C. for 1 hour is R (0) and the in-plane retardation at an incident angle of 50 ° is R (50),
R (0) ≦ 10 nm (2)
R (50) ≦ 20 nm (3)
The transparent thin film laminate according to claim 1, wherein   The transparent thin film laminate according to claim 1 or 2, wherein the transparent resin base material is triacetyl cellulose.   The said transparent thin film laminated body contains a transparent conductive film at least, The transparent thin film laminated body in any one of Claims 1-3 characterized by the above-mentioned.   The transparent thin-film laminate according to any one of claims 1 to 4, wherein the transparent thin-film laminate has at least a metal layer or an inorganic compound layer.   The transparent thin film laminate according to claim 4, further comprising a metal layer or an inorganic compound layer between the transparent resin substrate and the transparent conductive film of the transparent thin film laminate.   The transparent thin film laminate according to claim 4, further comprising a metal layer or an inorganic compound layer outside the transparent conductive film of the transparent thin film laminate.   The said transparent thin film laminated body has a layer of an organic compound at least, The transparent thin film laminated body of any one of Claims 1-7 characterized by the above-mentioned.   The transparent thin film laminate according to claim 4, further comprising an organic compound layer between the transparent resin substrate and the transparent conductive film of the transparent thin film laminate.   5. The transparent thin film laminate according to claim 4, further comprising an organic compound layer on a surface opposite to the transparent conductive film side of the transparent resin substrate of the transparent thin film laminate. It is a manufacturing method of the transparent thin film laminated body which manufactures the transparent thin film laminated body of any one of Claims 1-10,
In the process of forming the transparent thin film on the transparent thin film laminate, the transparent thin film laminate before forming the transparent thin film is heated at 110 ° C. or higher and 160 ° C. or lower for 5 minutes or longer. Manufacturing method. It is a manufacturing method of the transparent thin film laminated body which manufactures the transparent thin film laminated body of any one of Claims 1-10,
In the process of forming the transparent thin film on the transparent thin film laminate, the transparent thin film laminate is heated at 110 ° C. or higher and 160 ° C. or lower for 5 minutes or longer during the process of forming the transparent thin film. A manufacturing method of a layered product. It is a manufacturing method of the transparent thin film laminated body which manufactures the transparent thin film laminated body of any one of Claims 1-10,
In the process of forming the transparent thin film on the transparent thin film laminate, the transparent thin film laminate is heated at 110 ° C. or higher and 160 ° C. or lower for 5 minutes or longer after the transparent thin film is formed. Production method.   The method for producing a transparent thin film laminate according to any one of claims 11 to 13, wherein a tension applied during heating of the transparent thin film laminate is 30 N or less.

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