KR20150044371A - 미세-홈 형성된 비-점착성 표면을 갖는 설치 픽스처 - Google Patents

미세-홈 형성된 비-점착성 표면을 갖는 설치 픽스처 Download PDF

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Publication number
KR20150044371A
KR20150044371A KR20140081147A KR20140081147A KR20150044371A KR 20150044371 A KR20150044371 A KR 20150044371A KR 20140081147 A KR20140081147 A KR 20140081147A KR 20140081147 A KR20140081147 A KR 20140081147A KR 20150044371 A KR20150044371 A KR 20150044371A
Authority
KR
South Korea
Prior art keywords
ring
elastomeric band
base ring
clamp ring
band
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR20140081147A
Other languages
English (en)
Korean (ko)
Inventor
닐 뉴튼
Original Assignee
램 리써치 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 램 리써치 코포레이션 filed Critical 램 리써치 코포레이션
Publication of KR20150044371A publication Critical patent/KR20150044371A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49863—Assembling or joining with prestressing of part
    • Y10T29/4987—Elastic joining of parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T403/00—Joints and connections
    • Y10T403/67—Thimble: screw or cam

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
KR20140081147A 2013-06-28 2014-06-30 미세-홈 형성된 비-점착성 표면을 갖는 설치 픽스처 Withdrawn KR20150044371A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/930,659 2013-06-28
US13/930,659 US9502279B2 (en) 2013-06-28 2013-06-28 Installation fixture having a micro-grooved non-stick surface

Publications (1)

Publication Number Publication Date
KR20150044371A true KR20150044371A (ko) 2015-04-24

Family

ID=52115739

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20140081147A Withdrawn KR20150044371A (ko) 2013-06-28 2014-06-30 미세-홈 형성된 비-점착성 표면을 갖는 설치 픽스처

Country Status (5)

Country Link
US (1) US9502279B2 (https=)
JP (1) JP2015029088A (https=)
KR (1) KR20150044371A (https=)
CN (1) CN104253078A (https=)
TW (1) TWI622123B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105405797B (zh) * 2015-12-30 2018-01-12 天津金海通自动化设备制造有限公司 一种给气浮动机构
JP6572788B2 (ja) * 2016-01-29 2019-09-11 住友大阪セメント株式会社 静電チャック装置
JP7340938B2 (ja) * 2019-02-25 2023-09-08 東京エレクトロン株式会社 載置台及び基板処理装置
CN116845004A (zh) * 2020-05-27 2023-10-03 北京北方华创微电子装备有限公司 半导体工艺设备

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5636098A (en) 1994-01-06 1997-06-03 Applied Materials, Inc. Barrier seal for electrostatic chuck
US5740009A (en) 1996-11-29 1998-04-14 Applied Materials, Inc. Apparatus for improving wafer and chuck edge protection
US6090304A (en) 1997-08-28 2000-07-18 Lam Research Corporation Methods for selective plasma etch
US6364957B1 (en) 1997-10-09 2002-04-02 Applied Materials, Inc. Support assembly with thermal expansion compensation
JP4549022B2 (ja) 2001-04-30 2010-09-22 ラム リサーチ コーポレイション ワーク支持体の表面を横切る空間温度分布を制御する方法および装置
US6771482B2 (en) 2001-07-30 2004-08-03 Unaxis Usa Inc. Perimeter seal for backside cooling of substrates
JP4451098B2 (ja) * 2002-08-22 2010-04-14 住友大阪セメント株式会社 サセプタ装置
US7252738B2 (en) 2002-09-20 2007-08-07 Lam Research Corporation Apparatus for reducing polymer deposition on a substrate and substrate support
US7942425B2 (en) 2002-10-25 2011-05-17 Nok Corporation Plasma resistant seal
US6944006B2 (en) 2003-04-03 2005-09-13 Applied Materials, Inc. Guard for electrostatic chuck
US7514506B2 (en) 2004-03-31 2009-04-07 Greene, Tweed Of Delaware, Inc. Fast curing fluoroelastomeric compositions, adhesive fluoroelastomeric compositions and methods for bonding fluoroelastomeric compositions
US8038796B2 (en) 2004-12-30 2011-10-18 Lam Research Corporation Apparatus for spatial and temporal control of temperature on a substrate
US7319316B2 (en) 2005-06-29 2008-01-15 Lam Research Corporation Apparatus for measuring a set of electrical characteristics in a plasma
US7431788B2 (en) 2005-07-19 2008-10-07 Lam Research Corporation Method of protecting a bond layer in a substrate support adapted for use in a plasma processing system
JP2007207728A (ja) * 2006-02-06 2007-08-16 Aisin Seiki Co Ltd 固体高分子型燃料電池用セパレータ及びその製造方法、並びに固体高分子型燃料電池
GB0610479D0 (en) 2006-05-26 2006-07-05 Ge Healthcare Bio Sciences Ab A method for generating metal chelating affinity ligands
US20090179366A1 (en) 2008-01-16 2009-07-16 Sokudo Co., Ltd. Apparatus for supporting a substrate during semiconductor processing operations
KR101577474B1 (ko) * 2008-02-08 2015-12-14 램 리써치 코포레이션 플라즈마 프로세싱 장치용 rf 리턴 스트랩
CN201167837Y (zh) * 2008-03-06 2008-12-24 浙江爱仕达电器股份有限公司 铝合金阳极氧化物理不粘锅
US7884925B2 (en) 2008-05-23 2011-02-08 Lam Research Corporation Electrical and optical system and methods for monitoring erosion of electrostatic chuck edge bead materials
WO2010021890A2 (en) 2008-08-19 2010-02-25 Lam Research Corporation Edge rings for electrostatic chucks
KR101663844B1 (ko) 2008-09-26 2016-10-07 램 리써치 코포레이션 정전 척에 대해 사용하기 위한 클로킹가능 디바이스
KR101624123B1 (ko) 2008-10-31 2016-05-25 램 리써치 코포레이션 플라즈마 프로세싱 챔버의 하부 전극 어셈블리
US20100117309A1 (en) 2008-11-13 2010-05-13 Applied Materials, Inc. Sealing apparatus for a process chamber
US8409995B2 (en) 2009-08-07 2013-04-02 Tokyo Electron Limited Substrate processing apparatus, positioning method and focus ring installation method
JP5291039B2 (ja) * 2010-03-31 2013-09-18 大日本スクリーン製造株式会社 基板保持回転装置および基板処理装置
TWM431430U (en) * 2011-08-24 2012-06-11 Wafer Works Corp Clip board type fastening device for use in annularly etching wafer
US9869392B2 (en) * 2011-10-20 2018-01-16 Lam Research Corporation Edge seal for lower electrode assembly
US8844106B2 (en) * 2011-11-10 2014-09-30 Lam Research Corporation Installation fixture for elastomer bands and methods of using the same
US8677586B2 (en) * 2012-04-04 2014-03-25 Lam Research Corporation Installation fixture for elastomer bands and methods of using the same
US9583377B2 (en) * 2013-12-17 2017-02-28 Lam Research Corporation Installation fixture for elastomer bands

Also Published As

Publication number Publication date
US9502279B2 (en) 2016-11-22
US20150003903A1 (en) 2015-01-01
CN104253078A (zh) 2014-12-31
TWI622123B (zh) 2018-04-21
TW201516278A (zh) 2015-05-01
JP2015029088A (ja) 2015-02-12

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Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000