CN104253078A - 具有微槽不粘表面的安装夹具 - Google Patents

具有微槽不粘表面的安装夹具 Download PDF

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Publication number
CN104253078A
CN104253078A CN201410306477.2A CN201410306477A CN104253078A CN 104253078 A CN104253078 A CN 104253078A CN 201410306477 A CN201410306477 A CN 201410306477A CN 104253078 A CN104253078 A CN 104253078A
Authority
CN
China
Prior art keywords
ring
elastic band
clamping
base ring
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410306477.2A
Other languages
English (en)
Chinese (zh)
Inventor
尼尔·牛顿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of CN104253078A publication Critical patent/CN104253078A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49863—Assembling or joining with prestressing of part
    • Y10T29/4987—Elastic joining of parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T403/00—Joints and connections
    • Y10T403/67—Thimble: screw or cam

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
CN201410306477.2A 2013-06-28 2014-06-30 具有微槽不粘表面的安装夹具 Pending CN104253078A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/930,659 2013-06-28
US13/930,659 US9502279B2 (en) 2013-06-28 2013-06-28 Installation fixture having a micro-grooved non-stick surface

Publications (1)

Publication Number Publication Date
CN104253078A true CN104253078A (zh) 2014-12-31

Family

ID=52115739

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410306477.2A Pending CN104253078A (zh) 2013-06-28 2014-06-30 具有微槽不粘表面的安装夹具

Country Status (5)

Country Link
US (1) US9502279B2 (https=)
JP (1) JP2015029088A (https=)
KR (1) KR20150044371A (https=)
CN (1) CN104253078A (https=)
TW (1) TWI622123B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111725096A (zh) * 2020-05-27 2020-09-29 北京北方华创微电子装备有限公司 半导体工艺设备

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105405797B (zh) * 2015-12-30 2018-01-12 天津金海通自动化设备制造有限公司 一种给气浮动机构
JP6572788B2 (ja) * 2016-01-29 2019-09-11 住友大阪セメント株式会社 静電チャック装置
JP7340938B2 (ja) * 2019-02-25 2023-09-08 東京エレクトロン株式会社 載置台及び基板処理装置

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JP2007207728A (ja) * 2006-02-06 2007-08-16 Aisin Seiki Co Ltd 固体高分子型燃料電池用セパレータ及びその製造方法、並びに固体高分子型燃料電池
CN201167837Y (zh) * 2008-03-06 2008-12-24 浙江爱仕达电器股份有限公司 铝合金阳极氧化物理不粘锅
CN104272445A (zh) * 2012-04-04 2015-01-07 朗姆研究公司 用于弹性体带的安装固定架及其使用方法

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US5636098A (en) 1994-01-06 1997-06-03 Applied Materials, Inc. Barrier seal for electrostatic chuck
US5740009A (en) 1996-11-29 1998-04-14 Applied Materials, Inc. Apparatus for improving wafer and chuck edge protection
US6090304A (en) 1997-08-28 2000-07-18 Lam Research Corporation Methods for selective plasma etch
US6364957B1 (en) 1997-10-09 2002-04-02 Applied Materials, Inc. Support assembly with thermal expansion compensation
JP4549022B2 (ja) 2001-04-30 2010-09-22 ラム リサーチ コーポレイション ワーク支持体の表面を横切る空間温度分布を制御する方法および装置
US6771482B2 (en) 2001-07-30 2004-08-03 Unaxis Usa Inc. Perimeter seal for backside cooling of substrates
JP4451098B2 (ja) * 2002-08-22 2010-04-14 住友大阪セメント株式会社 サセプタ装置
US7252738B2 (en) 2002-09-20 2007-08-07 Lam Research Corporation Apparatus for reducing polymer deposition on a substrate and substrate support
US7942425B2 (en) 2002-10-25 2011-05-17 Nok Corporation Plasma resistant seal
US6944006B2 (en) 2003-04-03 2005-09-13 Applied Materials, Inc. Guard for electrostatic chuck
US7514506B2 (en) 2004-03-31 2009-04-07 Greene, Tweed Of Delaware, Inc. Fast curing fluoroelastomeric compositions, adhesive fluoroelastomeric compositions and methods for bonding fluoroelastomeric compositions
US8038796B2 (en) 2004-12-30 2011-10-18 Lam Research Corporation Apparatus for spatial and temporal control of temperature on a substrate
US7319316B2 (en) 2005-06-29 2008-01-15 Lam Research Corporation Apparatus for measuring a set of electrical characteristics in a plasma
US7431788B2 (en) 2005-07-19 2008-10-07 Lam Research Corporation Method of protecting a bond layer in a substrate support adapted for use in a plasma processing system
GB0610479D0 (en) 2006-05-26 2006-07-05 Ge Healthcare Bio Sciences Ab A method for generating metal chelating affinity ligands
US20090179366A1 (en) 2008-01-16 2009-07-16 Sokudo Co., Ltd. Apparatus for supporting a substrate during semiconductor processing operations
KR101577474B1 (ko) * 2008-02-08 2015-12-14 램 리써치 코포레이션 플라즈마 프로세싱 장치용 rf 리턴 스트랩
US7884925B2 (en) 2008-05-23 2011-02-08 Lam Research Corporation Electrical and optical system and methods for monitoring erosion of electrostatic chuck edge bead materials
WO2010021890A2 (en) 2008-08-19 2010-02-25 Lam Research Corporation Edge rings for electrostatic chucks
KR101663844B1 (ko) 2008-09-26 2016-10-07 램 리써치 코포레이션 정전 척에 대해 사용하기 위한 클로킹가능 디바이스
KR101624123B1 (ko) 2008-10-31 2016-05-25 램 리써치 코포레이션 플라즈마 프로세싱 챔버의 하부 전극 어셈블리
US20100117309A1 (en) 2008-11-13 2010-05-13 Applied Materials, Inc. Sealing apparatus for a process chamber
US8409995B2 (en) 2009-08-07 2013-04-02 Tokyo Electron Limited Substrate processing apparatus, positioning method and focus ring installation method
JP5291039B2 (ja) * 2010-03-31 2013-09-18 大日本スクリーン製造株式会社 基板保持回転装置および基板処理装置
TWM431430U (en) * 2011-08-24 2012-06-11 Wafer Works Corp Clip board type fastening device for use in annularly etching wafer
US9869392B2 (en) * 2011-10-20 2018-01-16 Lam Research Corporation Edge seal for lower electrode assembly
US8844106B2 (en) * 2011-11-10 2014-09-30 Lam Research Corporation Installation fixture for elastomer bands and methods of using the same
US9583377B2 (en) * 2013-12-17 2017-02-28 Lam Research Corporation Installation fixture for elastomer bands

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007207728A (ja) * 2006-02-06 2007-08-16 Aisin Seiki Co Ltd 固体高分子型燃料電池用セパレータ及びその製造方法、並びに固体高分子型燃料電池
CN201167837Y (zh) * 2008-03-06 2008-12-24 浙江爱仕达电器股份有限公司 铝合金阳极氧化物理不粘锅
CN104272445A (zh) * 2012-04-04 2015-01-07 朗姆研究公司 用于弹性体带的安装固定架及其使用方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111725096A (zh) * 2020-05-27 2020-09-29 北京北方华创微电子装备有限公司 半导体工艺设备
CN111725096B (zh) * 2020-05-27 2023-08-18 北京北方华创微电子装备有限公司 半导体工艺设备

Also Published As

Publication number Publication date
US9502279B2 (en) 2016-11-22
KR20150044371A (ko) 2015-04-24
US20150003903A1 (en) 2015-01-01
TWI622123B (zh) 2018-04-21
TW201516278A (zh) 2015-05-01
JP2015029088A (ja) 2015-02-12

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20141231

WD01 Invention patent application deemed withdrawn after publication