JP2015029088A - 微細溝付き非付着面を有する装着装置 - Google Patents

微細溝付き非付着面を有する装着装置 Download PDF

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Publication number
JP2015029088A
JP2015029088A JP2014132168A JP2014132168A JP2015029088A JP 2015029088 A JP2015029088 A JP 2015029088A JP 2014132168 A JP2014132168 A JP 2014132168A JP 2014132168 A JP2014132168 A JP 2014132168A JP 2015029088 A JP2015029088 A JP 2015029088A
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JP
Japan
Prior art keywords
ring
band
base ring
clamp
mounting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014132168A
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English (en)
Japanese (ja)
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JP2015029088A5 (https=
Inventor
ニール・ニュートン
Newton Neal
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
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Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of JP2015029088A publication Critical patent/JP2015029088A/ja
Publication of JP2015029088A5 publication Critical patent/JP2015029088A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49863—Assembling or joining with prestressing of part
    • Y10T29/4987—Elastic joining of parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T403/00—Joints and connections
    • Y10T403/67—Thimble: screw or cam

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
JP2014132168A 2013-06-28 2014-06-27 微細溝付き非付着面を有する装着装置 Pending JP2015029088A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/930,659 2013-06-28
US13/930,659 US9502279B2 (en) 2013-06-28 2013-06-28 Installation fixture having a micro-grooved non-stick surface

Publications (2)

Publication Number Publication Date
JP2015029088A true JP2015029088A (ja) 2015-02-12
JP2015029088A5 JP2015029088A5 (https=) 2017-09-21

Family

ID=52115739

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014132168A Pending JP2015029088A (ja) 2013-06-28 2014-06-27 微細溝付き非付着面を有する装着装置

Country Status (5)

Country Link
US (1) US9502279B2 (https=)
JP (1) JP2015029088A (https=)
KR (1) KR20150044371A (https=)
CN (1) CN104253078A (https=)
TW (1) TWI622123B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017135332A (ja) * 2016-01-29 2017-08-03 住友大阪セメント株式会社 静電チャック装置
JP2020136616A (ja) * 2019-02-25 2020-08-31 東京エレクトロン株式会社 載置台及び基板処理装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105405797B (zh) * 2015-12-30 2018-01-12 天津金海通自动化设备制造有限公司 一种给气浮动机构
CN116845004A (zh) * 2020-05-27 2023-10-03 北京北方华创微电子装备有限公司 半导体工艺设备

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US20070131350A1 (en) * 2005-07-19 2007-06-14 Anthony Ricci Method of protecting a bond layer in a substrate support adapted for use in a plasma processing system
US20090200269A1 (en) * 2008-02-08 2009-08-13 Lam Research Corporation Protective coating for a plasma processing chamber part and a method of use
WO2013059590A1 (en) * 2011-10-20 2013-04-25 Lam Research Corporation Edge seal for lower electrode assembly
US20130117986A1 (en) * 2011-11-10 2013-05-16 Lam Research Corporation Installation fixture for elastomer bands and methods of using the same

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US5636098A (en) 1994-01-06 1997-06-03 Applied Materials, Inc. Barrier seal for electrostatic chuck
US5740009A (en) 1996-11-29 1998-04-14 Applied Materials, Inc. Apparatus for improving wafer and chuck edge protection
US6090304A (en) 1997-08-28 2000-07-18 Lam Research Corporation Methods for selective plasma etch
US6364957B1 (en) 1997-10-09 2002-04-02 Applied Materials, Inc. Support assembly with thermal expansion compensation
JP4549022B2 (ja) 2001-04-30 2010-09-22 ラム リサーチ コーポレイション ワーク支持体の表面を横切る空間温度分布を制御する方法および装置
US6771482B2 (en) 2001-07-30 2004-08-03 Unaxis Usa Inc. Perimeter seal for backside cooling of substrates
JP4451098B2 (ja) * 2002-08-22 2010-04-14 住友大阪セメント株式会社 サセプタ装置
US7252738B2 (en) 2002-09-20 2007-08-07 Lam Research Corporation Apparatus for reducing polymer deposition on a substrate and substrate support
US7942425B2 (en) 2002-10-25 2011-05-17 Nok Corporation Plasma resistant seal
US6944006B2 (en) 2003-04-03 2005-09-13 Applied Materials, Inc. Guard for electrostatic chuck
US7514506B2 (en) 2004-03-31 2009-04-07 Greene, Tweed Of Delaware, Inc. Fast curing fluoroelastomeric compositions, adhesive fluoroelastomeric compositions and methods for bonding fluoroelastomeric compositions
US8038796B2 (en) 2004-12-30 2011-10-18 Lam Research Corporation Apparatus for spatial and temporal control of temperature on a substrate
US7319316B2 (en) 2005-06-29 2008-01-15 Lam Research Corporation Apparatus for measuring a set of electrical characteristics in a plasma
JP2007207728A (ja) * 2006-02-06 2007-08-16 Aisin Seiki Co Ltd 固体高分子型燃料電池用セパレータ及びその製造方法、並びに固体高分子型燃料電池
GB0610479D0 (en) 2006-05-26 2006-07-05 Ge Healthcare Bio Sciences Ab A method for generating metal chelating affinity ligands
US20090179366A1 (en) 2008-01-16 2009-07-16 Sokudo Co., Ltd. Apparatus for supporting a substrate during semiconductor processing operations
CN201167837Y (zh) * 2008-03-06 2008-12-24 浙江爱仕达电器股份有限公司 铝合金阳极氧化物理不粘锅
US7884925B2 (en) 2008-05-23 2011-02-08 Lam Research Corporation Electrical and optical system and methods for monitoring erosion of electrostatic chuck edge bead materials
WO2010021890A2 (en) 2008-08-19 2010-02-25 Lam Research Corporation Edge rings for electrostatic chucks
KR101663844B1 (ko) 2008-09-26 2016-10-07 램 리써치 코포레이션 정전 척에 대해 사용하기 위한 클로킹가능 디바이스
KR101624123B1 (ko) 2008-10-31 2016-05-25 램 리써치 코포레이션 플라즈마 프로세싱 챔버의 하부 전극 어셈블리
US20100117309A1 (en) 2008-11-13 2010-05-13 Applied Materials, Inc. Sealing apparatus for a process chamber
US8409995B2 (en) 2009-08-07 2013-04-02 Tokyo Electron Limited Substrate processing apparatus, positioning method and focus ring installation method
JP5291039B2 (ja) * 2010-03-31 2013-09-18 大日本スクリーン製造株式会社 基板保持回転装置および基板処理装置
TWM431430U (en) * 2011-08-24 2012-06-11 Wafer Works Corp Clip board type fastening device for use in annularly etching wafer
US8677586B2 (en) * 2012-04-04 2014-03-25 Lam Research Corporation Installation fixture for elastomer bands and methods of using the same
US9583377B2 (en) * 2013-12-17 2017-02-28 Lam Research Corporation Installation fixture for elastomer bands

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070131350A1 (en) * 2005-07-19 2007-06-14 Anthony Ricci Method of protecting a bond layer in a substrate support adapted for use in a plasma processing system
JP2009503816A (ja) * 2005-07-19 2009-01-29 ラム リサーチ コーポレーション プラズマ処理システムでの使用に適合された基板支持部の結合層を保護する方法
US20090200269A1 (en) * 2008-02-08 2009-08-13 Lam Research Corporation Protective coating for a plasma processing chamber part and a method of use
JP2013102236A (ja) * 2008-02-08 2013-05-23 Lam Research Corporation プラズマ処理チャンバのパーツのための保護被覆およびその使用方法
WO2013059590A1 (en) * 2011-10-20 2013-04-25 Lam Research Corporation Edge seal for lower electrode assembly
JP2015501538A (ja) * 2011-10-20 2015-01-15 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 下方電極アセンブリのためのエッジシール
US20130117986A1 (en) * 2011-11-10 2013-05-16 Lam Research Corporation Installation fixture for elastomer bands and methods of using the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017135332A (ja) * 2016-01-29 2017-08-03 住友大阪セメント株式会社 静電チャック装置
WO2017130827A1 (ja) * 2016-01-29 2017-08-03 住友大阪セメント株式会社 静電チャック装置
US10957573B2 (en) 2016-01-29 2021-03-23 Sumitomo Osaka Cement Co., Ltd. Electrostatic chuck device including a heating member
JP2020136616A (ja) * 2019-02-25 2020-08-31 東京エレクトロン株式会社 載置台及び基板処理装置
JP7340938B2 (ja) 2019-02-25 2023-09-08 東京エレクトロン株式会社 載置台及び基板処理装置

Also Published As

Publication number Publication date
US9502279B2 (en) 2016-11-22
KR20150044371A (ko) 2015-04-24
US20150003903A1 (en) 2015-01-01
CN104253078A (zh) 2014-12-31
TWI622123B (zh) 2018-04-21
TW201516278A (zh) 2015-05-01

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