KR20150042161A - The light emitting device package and the light emitting system - Google Patents

Abstract

The present invention relates to a light emitting device package, which comprises: a body having a first cavity; at least one lead frame arranged in the first cavity and having a second cavity; and at least one light emitting device arranged in the second cavity of the lead frame. A side surface of the second cavity provides light emitting device packages with different inclination angles. Therefore, when forming a groove on the lead frame, it is possible to enhance the rigidity by forming a different inclination angle of each of the two side surfaces facing each other. Also, when two lead frames are formed, it is possible to reduce wire length by forming a large inclination angle of a side surface of grooves adjacent to each other.

Description

[0001] The present invention relates to a light emitting device package and a light emitting device,

The present invention relates to a light emitting device package.

Light emitting diodes (LEDs) can be made of a compound semiconductor material such as GaAs-based, AlGaAs-based, GaN-based, InGaN-based, and InGaAlP-based.

Such a light emitting diode is used as a light emitting device package that is packaged and emits various colors, and the light emitting device package is used as a light source in various fields such as a lighting indicator, a character indicator, and an image indicator.

The embodiment provides a light emitting device package having a new structure.

The embodiment provides a light emitting device package having a lead frame with improved rigidity.

An embodiment includes a body including a first cavity, at least one lead frame disposed in the first cavity, the at least one lead frame including a second cavity, and at least one light emitting element disposed in a second cavity of the lead frame And the sides of the second cavity have different inclination angles.

According to the present invention, in forming the groove in the lead frame in the light emitting device package, the rigidity can be improved by forming the opposing side surfaces at different inclination angles. Further, when the two lead frames are formed, the length of the wire can be reduced by increasing the inclination angle of the side portions of the adjacent grooves. By reducing the area of the lead frame by controlling the inclination angle, the size of the package can be reduced.

1 is a top view of a light emitting device package according to a first embodiment of the present invention.
FIG. 2 is a cross-sectional view of the light emitting device package of FIG. 1 taken along line I-I '.
3 is a cross-sectional view of the light emitting diode of FIG.
4 is a top view of a light emitting device package according to a second embodiment of the present invention.
5 is a cross-sectional view of the light emitting device package of FIG. 4 taken along line II-II '.
6 is a view showing a display device including the light emitting device package of the present invention.
7 is a view showing an example of a lighting apparatus including the light emitting device package of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Throughout the specification, when an element is referred to as "comprising ", it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise.

In order to clearly illustrate the present invention in the drawings, thicknesses are enlarged in order to clearly illustrate various layers and regions, and parts not related to the description are omitted, and like parts are denoted by similar reference numerals throughout the specification .

Whenever a portion of a layer, film, region, plate, or the like is referred to as being "on" another portion, it includes not only the case where it is "directly on" another portion, but also the case where there is another portion in between. Conversely, when a part is "directly over" another part, it means that there is no other part in the middle.

Hereinafter, a light emitting device package according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 4. FIG.

FIG. 1 is a top view of a light emitting device package according to a first embodiment of the present invention, FIG. 2 is a sectional view of the light emitting device package of FIG. 1 taken along line I-I ' And Fig. 4 is an enlarged view of the inclined portion of Fig.

1 to 4, the light emitting device package 100 includes a body 110, at least one light emitting device 120 disposed on the body 110, and a light emitting diode 120 disposed on the body 110 And a first lead frame 130 and a second lead frame 140 electrically connected to the light emitting device 120.

In addition, the light emitting device package 100 includes a resin material 170 for protecting the light emitting device 120.

The body 110 may be formed of at least one of a resin material such as polyphthalamide (PPA), a silicon (Si), a metal material, a photo sensitive glass (PSG), a sapphire (Al2O3) . Preferably, the body 110 may be made of a resin material such as polyphthalamide (PPA).

The body 110 may be formed of a conductor having conductivity. When the body 110 is made of an electrically conductive material, an insulating film (not shown) is formed on the surface of the body 110 so that the body 110 is electrically shorted with the first lead frame and the second lead frame ≪ / RTI > The peripheral shape of the body 110 viewed from above may have various shapes such as a triangular shape, a rectangular shape, a polygonal shape, and a circular shape depending on the use and design of the light emitting device package 100.

A first cavity 115 may be formed in the body 110 to open the upper portion 112. The first cavity 115 may be formed by, for example, injection molding, or may be formed by etching.

The first cavity 115 may be formed in a cup shape, a concave container shape, or the like, and the inner surface thereof may be a side surface perpendicular to the bottom surface or a side surface inclined. The inclined side surface may be inclined by 50 to 60 when the body 110 is wet etched.

The shape of the first cavity 115 viewed from the top may be circular, square, polygonal, elliptical, or the like.

The first lead frame 130 and the second lead frame 140 may be formed on the body 110. The first lead frame 130 and the second lead frame 140 may be electrically separated from the anode and the cathode to provide power to the light emitting device 120. According to the design of the light emitting device 120, a plurality of lead frames may be formed in addition to the first and second lead frames 130 and 140. However, the present invention is not limited thereto.

The first and second lead frames 130 and 140 may be separated from each other in the first cavity 115 and extend to the backside of the body 110 as shown in FIG. It is not limited.

The first and second lead frames 130 and 140 may have a multi-layer structure. For example, the first and second lead frames 130 and 140 may be a Ti / Cu / Ni / Au layer in which titanium (Ti), copper (Cu), nickel (Ni) , But is not limited thereto.

That is, a material having excellent adhesion to the body such as titanium (Ti), chromium (Cr), and tantalum (Ta) is laminated on the lowermost layer of the first and second lead frames 130 and 140, The uppermost layer of the frames 130 and 140 is easily attached with a wire such as gold and the like and a material having excellent electrical conductivity is stacked. The uppermost layer and the lowermost layer of the first and second lead frames 130 and 140 are platinum A diffusion barrier layer formed of platinum (Pt), nickel (Ni), copper (Cu), or the like may be stacked, but the present invention is not limited thereto.

The first and second lead frames 130 and 140 may be electrically connected to a wire 122 to electrically connect the first and second lead frames 130 and 140 to the light emitting device 120.

The first lead frame 130 occupies most of the area of the first cavity 115, and preferably occupies an area of 70% or more.

The first lead frame 130 includes a second cavity 135 that is recessed toward the bottom surface of the body 110 in the first cavity 115.

The second cavity 135 may be disposed in a central region of the first cavity 115 of the body 110.

The first lead frame 130 includes a bottom 131 forming a bottom surface of the second cavity 135 and a bottom 131 extending from the bottom 131 to form a side surface of the second cavity 135 And includes a side surface portion 133 and an upper surface portion 134 formed parallel to the bottom portion 131 and extending from the side surface portion 133.

The bottom surface of the bottom part 131 is exposed to the bottom surface of the body 110 to form a pad.

The upper surface portion 134 may cross the central region of the body 110 and protrude outside the body 110 to form a terminal.

A wire 122 electrically connecting the light emitting device 120 is connected to the upper surface portion 134.

The side portion 133 has an inclination depending on an area difference between the upper portion and the lower portion of the second cavity 135.

The first inclination angle alpha of the side surface portion 133 connected to the outwardly directed upper surface portion 134 with respect to the two side surface portions 133 passing through the wire 122 passes through the side surface portion 133 of the second inclination angle?.

The angle of inclination means that the angle of inclination of the side part 133 is measured with respect to the bottom surface of the body 110 and the side part 133 facing the second lead frame 140 is formed to be close to vertical .

At this time, the second inclination angle? Is larger than the first inclination angle?, And the angle is smaller than 90 degrees.

Since the inclination angles of the lead grooves are different from each other, the rigidity of the lead frame 130 is improved, and warping can be prevented even if the body is hardened at a high temperature.

In addition, since the second inclination angle beta of the side portion 133 close to the second lead frame 140 is larger, the length of the wire 122 connected to the second lead frame is shortened. The first inclination angle alpha of the opposite side surface portion 133 may be formed to be smaller so that the wire 122 may be formed on the opposite side surface portion 133 as well as the upper surface portion 134.

Unlike the first lead frame 130, the second lead frame 140 does not include the second cavity 135 but is formed in a planar shape. The upper surface portion 134 of the first lead frame 130 And the wire 122 is contacted.

A reflective layer (not shown) may be formed on the first lead frame 130 and the second lead frame 140 of the body 110.

The light emitting device 120 may be mounted on the body 110. When the body 110 includes the first cavity 115, the light emitting device 120 may be mounted in the first cavity 115.

At least one light emitting device 120 may be mounted on the body 110 according to the design of the light emitting device package 100. When a plurality of the light emitting device packages 100 are mounted, a plurality of lead frames and a plurality of reflective layers for supplying power to the plurality of light emitting device packages 100 may be formed, but the present invention is not limited thereto.

The light emitting device 120 may be directly mounted on the body 110 or may be electrically bonded to the first or second lead frames 130 and 140.

The light emitting device 120 can be mounted by selectively using wire bonding, die bonding, and flip bonding. The bonding method can be changed depending on the chip type and the position of the lead frame of the chip.

 The light emitting device 120 may optionally include a semiconductor light emitting device manufactured using a semiconductor of a group III or V compound semiconductor such as AlInGaN, InGaN, GaN, GaAs, InGaP, AllnGaP, InP, or InGaAs have.

As shown in FIG. 2, the light emitting device 120 may be attached to the second lead frame 140 with a conductive adhesive, and may be electrically connected to the first lead frame 130 with a wire 122.

The light emitting device 120 is called a vertical light emitting device and includes a conductive supporting substrate 21, a bonding layer 23, a second conductive semiconductor layer 25, an active layer 27, And a conductive type semiconductor layer (29).

 The conductive support substrate 21 may be formed of a metal or an electrically conductive semiconductor substrate.

 The group III-V nitride semiconductor layer is formed on the substrate 21, and the growth equipment of the semiconductor includes an electron beam evaporator, physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma laser deposition (PLD) For example, a dual-type thermal evaporator, sputtering, metal organic chemical vapor deposition (MOCVD), and the like.

 A bonding layer 23 may be formed on the conductive supporting substrate 21. The bonding layer 23 bonds the conductive support substrate 21 and the nitride semiconductor layer. In addition, the conductive supporting substrate 21 may be formed by a plating method instead of a bonding method. In this case, the bonding layer 23 may not be formed.

 The second conductive type semiconductor layer 25 is formed on the bonding layer 23 and the second conductive type semiconductor layer 25 is electrically connected to the first lead frame 31.

 The second conductivity type semiconductor layer 25 may be formed of at least one of Group III-V compound semiconductor such as GaN, InN, AlN, InGaN, AlGaN, InAlGaN, and AlInN. The second conductivity type semiconductor layer 25 may be doped with a second conductivity type dopant, and the second conductivity type dopant may be a p type dopant including Mg, Zn, Ca, Sr, and Ba.

 The second conductivity type semiconductor layer 25 may be formed of a p-type GaN layer having a predetermined thickness by supplying a gas including a p-type dopant such as NH3, TMGa (or TEGa), and Mg.

 The second conductivity type semiconductor layer 25 includes a current spreading structure in a predetermined region. The current diffusion structure includes semiconductor layers having a higher current diffusion speed in the horizontal direction than the current diffusion speed in the vertical direction.

 The current diffusion structure may include, for example, semiconductor layers having a dopant concentration or a difference in conductivity.

 The second conductivity type semiconductor layer 25 can be supplied with a carrier diffused in a uniform distribution to another layer on the second conductivity type semiconductor layer 25, for example, the active layer 27.

 An active layer 27 is formed on the second conductivity type semiconductor layer 25. The active layer 27 may be formed as a single quantum well or a multiple quantum well (MQW) structure. One period of the active layer 27 may selectively include a period of InGaN / GaN, a period of AlGaN / InGaN, a period of InGaN / InGaN, or a period of AlGaN / GaN.

 A second conductive clad layer (not shown) may be formed between the second conductive semiconductor layer 25 and the active layer 27. The second conductivity type cladding layer may be formed of a p-type GaN-based semiconductor. The second conductivity type cladding layer may be formed of a material having a band gap higher than the energy band gap of the well layer.

 The first conductive semiconductor layer 29 is formed on the active layer 27. The first conductive semiconductor layer 29 may be an n-type semiconductor layer doped with a first conductive dopant. The n-type semiconductor layer may be made of any one of compound semiconductors such as GaN, InN, AlN, InGaN, AlGaN, InAlGaN, and AlInN. The first conductivity type dopant is an n-type dopant, and at least one of Si, Ge, Sn, Se, and Te can be added.

 The first conductivity type semiconductor layer 29 can be formed by supplying a gas containing an n-type dopant such as NH3, TMGa (or TEGa), and Si to an n-type GaN layer of a predetermined thickness.

The second conductivity type semiconductor layer 25 may be a p-type semiconductor layer, and the first conductivity type semiconductor layer 29 may be an n-type semiconductor layer. The light emitting structure may be implemented by any one of an n-p junction structure, a p-n junction structure, an n-p-n junction structure, and a p-n-p junction structure. Hereinafter, the uppermost layer of the semiconductor layer will be described as an example of the first conductivity type semiconductor layer 29 for the description of the embodiments.

A first electrode and / or an electrode layer (not shown) may be formed on the first conductive semiconductor layer 29. The electrode layer may be formed of an oxide or nitride-based light-transmitting layer such as indium tin oxide (ITO), indium tin oxide nitride (ITON), indium zinc oxide (IZO), indium zinc oxide nitride (IZON) (indium aluminum zinc oxide), IGZO (indium gallium zinc oxide), IGTO (indium gallium tin oxide), AZO (aluminum zinc oxide), ATO (antimony tin oxide), GZO (gallium zinc oxide), IrO x, RuO x, NiO. ≪ / RTI > The electrode layer can function as a current diffusion layer capable of diffusing a current.

The electrode layer may be a reflective electrode layer and the reflective electrode layer may be formed of a material consisting of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, . For example, the metal layer may be formed of at least one of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, and Hf or an alloy thereof. .

A plurality of the light emitting devices 120 may be mounted on the body 110.

And a molding material 170 for embedding the first cavity 115 in the first cavity 115.

The molding material 170 is formed of a light transmitting material and is formed up to the upper portion of the body 110.

The molding material 170 may include a phosphor. For example, when the light emitting element 120 is a blue light emitting diode and the phosphor is a yellow phosphor, the yellow phosphor may be excited by blue light to generate white light. When the light emitting device 120 emits ultraviolet rays, phosphors of three colors of red, green, and blue may be added to the phosphor sheet 180 to realize white light.

Hereinafter, another embodiment of the present invention will be described with reference to FIGS. 4 and 5. FIG.

4 and 5, the light emitting device package 200 includes a body 220, a first lead frame 230 having a cavity 240, a second lead frame 240, a plurality of light emitting devices 220, , And wires (222).

The body 210 may be formed of at least one of a resin material such as polyphthalamide (PPA), a silicon (Si), a metal material, a photo sensitive glass (PSG), a sapphire (Al2O3) . Preferably, the body 210 may be made of a resin material such as polyphthalamide (PPA).

The body 210 may be formed of a conductor having conductivity. When the body 210 is made of an electrically conductive material, an insulating film (not shown) is formed on the surface of the body 210 so that the body 210 is connected to the first lead frame 230 and the second lead frame 240 And can be configured to prevent electrical shorting. The perimeter shape of the body 210 viewed from above may have various shapes such as a triangular shape, a rectangular shape, a polygonal shape, and a circular shape depending on the use and design of the light emitting device package 200.

An upper portion of the body 220 includes an open region 215 and is a region where light is emitted.

The first lead frame 230 includes a cavity 235 and the cavity 235 is recessed from the upper surface of the first lead frame 230 such as a cup structure or a recess, Shape. The side surface of the cavity 235 may be inclined or bent perpendicularly from the bottom surface of the cavity 235.

The second lead frame 240 includes a cavity 245, the configuration of which is the same as that of the first lead frame 230.

The cavity 225 of the first lead frame 230 and the cavity 245 of the second lead frame 240 are disposed under the open area 215. [

The first and second lead frames 230 and 240 extend from bottom portions 231 and 241 forming bottom surfaces of the cavities 135 and 145 to the bottom portions 231 and 241, Side surfaces 233 and 243 forming side surfaces of the side surfaces 233 and 245 and upper surfaces 234 and 244 formed in parallel with the bottom surfaces 231 and 241 and extending from the side surfaces 233 and 243 .

The bottoms of the bottoms 231 and 241 are exposed to the bottom of the body 210 to form pads.

The upper surface portions 234 and 244 may cross the central region of the body 110 and protrude outside the body 110 to form a terminal.

A wire 222 electrically connecting the light emitting device 220 is connected to the top surfaces 234 and 244.

The side portions 233 and 243 have an inclination depending on the difference in area between the upper portion and the lower portion of the cavities 235 and 245.

The side surfaces 233 and 243 of the lead frames 230 and 240 connected to the outward facing surface portion 134 with respect to the two side surfaces 233 and 243 facing each other through which the wire 222 passes, 243 are smaller than the second inclination angle beta of the side surface portions 233, 243 facing the middle region of the two lead frames 230, 240. [

At this time, each inclination angle is an outer angle measurement of the side portions 233 and 243 with respect to the bottom surface of the body 210. Side portions 233 and 243 facing the intermediate region of the two lead frames 230 and 240 It means that it is formed close to the vertical.

At this time, the second inclination angle? Is larger than the first inclination angle?, And the angle is smaller than 90 degrees.

Since the inclination angles of the cavities 235 and 245 are different from each other, the rigidity of the lead frames 230 and 240 is improved, and warping can be prevented even when the body is hardened at a high temperature.

The second inclination angle beta of the side portions 233 and 243 facing the intermediate region of the two lead frames 230 and 240 is greater than the width of the wire 222 connected to the adjacent lead frames 230 and 240. [ Is shortened. The first inclination angle alpha of the opposite side surface portions 233 and 243 may be formed smaller so that the wire 222 may be formed on the opposite side surface portions 233 and 243 as well as the upper surface portions 234 and 244. [

At this time, the first inclination angles? Of the first and second lead frames 230 and 240 may be equal to each other, and the second inclination angle? May be equal to each other.

At least one light emitting device 220 is disposed in the cavities 235 and 245 and the light emitting device 220 is attached to the bottoms 231 and 241 of the cavity 240 and is connected And is connected to the first and second lead frames 230 and 240. The light emitting device 220 can selectively emit light in the ultraviolet band to a wavelength range of the visible light band, emit light having the same peak wavelength, or emit light having different peak wavelengths. The light emitting device 220 may include at least one of an LED chip using a Group III-V compound semiconductor such as an ultraviolet (UV) LED chip, a blue LED chip, a green LED chip, a white LED chip, and a red LED chip .

The area between the two lead frames 230 and 240 is reduced by disposing the light emitting device 220 in the cavities 235 and 245 and the adjacent side surfaces 233 and 243 close to the vertical, (200) can be downsized.

A lower surface of the first lead frame 230 and a lower surface of the second lead frame 240 are disposed on the lower surface of the body 220. The lower surface of the body 220 is connected to a pad on the board by a connection member such as solder, .

The resin material 270 is formed so as to cover the open area 215.

The resin material 270 may be dispensed with a light-transmitting material, but is not limited thereto.

The light emitting device package according to the embodiment can be applied to a light unit. The light unit includes a structure in which a plurality of light emitting device packages are arrayed, and includes a display device shown in Fig. 8, a lighting device shown in Fig. 9, and a light unit such as an illumination lamp, a traffic light, a vehicle headlight, Can be applied.

6 is an exploded perspective view of a display device according to an embodiment.

6, a display device 1000 includes a light guide plate 1041, a light emitting module 1031 for providing light to the light guide plate 1041, a reflection member 1022 under the light guide plate 1041, An optical sheet 1051 on the light guide plate 1041, a display panel 1061 on the optical sheet 1051, and a bottom cover 1011 for storing the light guide plate 1041, the light emitting module 1031 and the reflecting member 1022 , But is not limited thereto.

The bottom cover 1011, the reflective sheet 1022, the light guide plate 1041, and the optical sheet 1051 can be defined as a light unit 1050.

The light guide plate 1041 diffuses the light from the light emitting module 1031 to convert the light into a surface light source. The light guide plate 1041 may be made of a transparent material such as acrylic resin such as polymethyl methacrylate (PET), polyethylene terephthalate (PET), polycarbonate (PC), cycloolefin copolymer (COC), and polyethylene naphthalate Resin. ≪ / RTI >

The light emitting module 1031 is disposed on at least one side of the light guide plate 1041 to provide light to at least one side of the light guide plate 1041 and ultimately to serve as a light source of the display device.

The light emitting module 1031 may include at least one light source, and may provide light directly or indirectly from one side of the light guide plate 1041. The light emitting module 1031 includes a substrate 1033 and a light emitting device package 100 according to the embodiment described above. The light emitting device package 100 may be arrayed on the substrate 1033 at predetermined intervals. have. The substrate may be, but is not limited to, a printed circuit board. The substrate 1033 may include a metal core PCB (MCPCB), a flexible PCB (FPCB), or the like, but is not limited thereto. When the light emitting device package 100 is mounted on the side surface of the bottom cover 1011 or on the heat radiation plate, the substrate 1033 can be removed. A part of the heat radiation plate may be in contact with the upper surface of the bottom cover 1011. Accordingly, heat generated in the light emitting device package 100 can be emitted to the bottom cover 1011 via the heat dissipation plate.

The plurality of light emitting device packages 100 may be mounted on the substrate 1033 such that the light emitting surface of the light emitting device package 100 is spaced apart from the light guiding plate 1041 by a predetermined distance. The light emitting device package 100 may directly or indirectly provide light to the light-incident portion, which is one side of the light guide plate 1041, but is not limited thereto.

The reflective member 1022 may be disposed under the light guide plate 1041. The reflective member 1022 reflects the light incident on the lower surface of the light guide plate 1041 and supplies the reflected light to the display panel 1061 to improve the brightness of the display panel 1061. The reflective member 1022 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto. The reflective member 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 may house the light guide plate 1041, the light emitting module 1031, the reflective member 1022, and the like. To this end, the bottom cover 1011 may be provided with a housing portion 1012 having a box-like shape with an opened upper surface, but the present invention is not limited thereto. The bottom cover 1011 may be coupled to a top cover (not shown), but is not limited thereto.

The bottom cover 1011 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding. In addition, the bottom cover 1011 may include a metal or a non-metal material having good thermal conductivity, but the present invention is not limited thereto.

The display panel 1061 is, for example, an LCD panel, including first and second transparent substrates facing each other, and a liquid crystal layer interposed between the first and second substrates. A polarizing plate may be attached to at least one surface of the display panel 1061, but the present invention is not limited thereto. The display panel 1061 transmits or blocks light provided from the light emitting module 1031 to display information. The display device 1000 can be applied to video display devices such as portable terminals, monitors of notebook computers, monitors of laptop computers, and televisions.

The optical sheet 1051 is disposed between the display panel 1061 and the light guide plate 1041 and includes at least one light-transmitting sheet. The optical sheet 1051 may include at least one of a sheet such as a diffusion sheet, a horizontal / vertical prism sheet, a brightness enhanced sheet, and the like. The diffusion sheet diffuses incident light, and the horizontal and / or vertical prism sheet concentrates incident light on the display panel 1061. The brightness enhancing sheet reuses the lost light to improve the brightness I will. A protective sheet may be disposed on the display panel 1061, but the present invention is not limited thereto.

The optical path of the light emitting module 1031 may include the light guide plate 1041 and the optical sheet 1051 as an optical member, but the present invention is not limited thereto.

7 is a perspective view of a lighting apparatus according to an embodiment.

7, the lighting apparatus 1500 includes a case 1510, a light emitting module 1530 installed in the case 1510, a connection terminal 1520 installed in the case 1510 and supplied with power from an external power source 1520).

The case 1510 is preferably formed of a material having a good heat dissipation property, and may be formed of, for example, a metal material or a resin material.

The light emitting module 1530 may include a substrate 1532 and a light emitting device package 100 mounted on the substrate 1532. A plurality of the light emitting device packages 100 may be arrayed in a matrix or at a predetermined interval.

The substrate 1532 may be a circuit pattern printed on an insulator. For example, the substrate 1532 may be a printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, FR-4 substrate, and the like.

In addition, the substrate 1532 may be formed of a material that efficiently reflects light, or may be a coating layer such as a white color, a silver color, or the like whose surface is efficiently reflected by light.

At least one light emitting device package 100 may be mounted on the substrate 1532. Each of the light emitting device packages 100 may include at least one LED (Light Emitting Diode) chip. The LED chip may include a light emitting diode in a visible light band such as red, green, blue or white, or a UV light emitting diode that emits ultraviolet (UV) light.

The light emitting module 1530 may be arranged to have a combination of various light emitting device packages 100 to obtain color and brightness. For example, a white light emitting diode, a red light emitting diode, and a green light emitting diode may be arranged in combination in order to secure a high color rendering index (CRI).

The connection terminal 1520 may be electrically connected to the light emitting module 1530 to supply power. The connection terminal 1520 is connected to the external power source by being inserted in a socket manner, but the present invention is not limited thereto. For example, the connection terminal 1520 may be formed in a pin shape and inserted into an external power source or may be connected to an external power source through wiring.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It belongs to the scope of right.

The light emitting device packages 100 and 200
The light emitting devices 120 and 220
The body 110, 210
The lead frames 130, 140, 230, 240

Claims (12)

A body including a first cavity,
At least one lead frame disposed within the first cavity, the at least one lead frame including a second cavity, and
At least one light emitting element disposed in a second cavity of the lead frame
/ RTI >
And the sides of the second cavity have different inclination angles. The method according to claim 1,
The lead frame
A bottom surface exposed on the back surface of the body, and
A side surface extending from the bottom surface and forming a side surface of the second cavity;
Emitting device package. 3. The method of claim 2,
When the second cavity is formed to have a rectangular shape,
Wherein the side portion has two pairs of slopes facing each other. The method of claim 3,
Wherein the inclined surfaces of the side portions are different from each other. 5. The method of claim 4,
Wherein the inclination angle of the inclined surface facing the outside of the body is smaller than the inclination angle of the inclined surface facing the adjacent lead frame. 6. The method of claim 5,
And a wire electrically connecting the lead frame and the light emitting element. The method according to claim 6,
Wherein the inclination angle of the inclined plane facing each other is different from that of the inclined plane passing through the wire. 8. The method of claim 7,
Wherein an inclination angle of the inclined surface facing the adjacent lead frame is less than 90 degrees
A light emitting device package. 9. The method of claim 8,
The lead frame includes:
A first lead frame having a third cavity, and
And a second lead frame disposed in parallel with the first lead frame and having a fourth cavity. 10. The method of claim 9,
The third cavity and the fourth cavity
A first side facing the neighboring lead frame, and
And a second side facing the first side and facing the outside of the body
A light emitting device package. 11. The method of claim 10,
Wherein the inclination angles of the first side face of the third cavity and the fourth cavity are equal to each other and the inclination angles of the second side face are equal to each other. 11. The method of claim 10,
And the wire is attached to the second side surface.

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