KR20150006098A - Substrate separating apparatus and method for separating substrate using the same - Google Patents

Abstract

Provided are a substrate separating apparatus and a method for separating substrates using the same. Provided are a display plate and a method of manufacturing a liquid crystal display device using the display plate. The substrate separating apparatus according to an embodiment of the present invention comprises: a laser emitting unit which emits a first laser in a first direction; a beam splitter which is arranged to be displaced from the laser emitting unit in the first direction; and an optical reflection mirror which is arranged to be displaced from the beam splitter in the first direction.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate separating apparatus and a substrate separating method using the substrate separating apparatus.

The present invention relates to a substrate separating apparatus and a substrate separating method using the same, and more particularly, to a substrate separating apparatus for separating a first substrate and a second substrate, and a substrate separating method using the same.

Recently, the display device market is rapidly changing, mainly in flat panel displays (FPD), which are large in size and can be made thin and light.

Such flat panel displays include a liquid crystal display (LCD), a plasma display panel (PDP), and an organic light emitting display (OLED). However, conventional liquid crystal display devices, plasma-less play panels, organic light-emitting display devices, and the like use a glass substrate and thus have low flexibility and applications and applications.

Therefore, a flexible display device which can be bent by using a substrate of a flexible material such as plastic, foil or the like instead of a glass substrate has recently been actively developed as a next-generation display device.

Flexible displays require flexible substrates. However, it is known that generally known flexible substrates are difficult to be applied to a glass substrate for a conventional panel manufacturing process due to limitations of heat resistance. Accordingly, methods for imparting flexibility to the panel by removing the glass substrate after forming the panel using the glass substrate as a base are being studied.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a substrate separating apparatus capable of simultaneously performing separation and cleaning of a substrate.

Another object of the present invention is to provide a substrate separation method capable of simultaneously performing separation and cleaning of a substrate.

The present invention has been made in view of the above problems, and it is an object of the present invention to provide a method of manufacturing the same.

According to an aspect of the present invention, there is provided a substrate separation apparatus including a laser irradiation unit for irradiating a first laser in a first direction, And a light reflection mirror disposed apart from the beam splitter in the first direction.

According to an aspect of the present invention, there is provided a substrate separation method for separating a substrate assembly including a first substrate and a second substrate attached to a first substrate, the method comprising: Separating the first laser into a second laser traveling in a first direction and a third laser traveling in a second direction different from the first direction, switching the traveling direction of the second laser or the third laser, And irradiating the substrate combination with the second laser and the third laser.

The details of other embodiments are included in the detailed description and drawings.

The embodiments of the present invention have at least the following effects.

That is, the separation and cleaning of the substrate can be performed simultaneously.

In addition, by performing the separation and cleaning of the substrate at the same time, the process efficiency can be improved.

The effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the specification.

1 is a block diagram of a substrate separation apparatus according to some embodiments of the present invention.
2 is a cross-sectional view illustrating that the laser is irradiated on the other side of the first substrate in some embodiments of the present invention.
3 is a cross-sectional view illustrating that a laser is irradiated on one surface of a first substrate in some embodiments of the present invention.
4 is a cross-sectional view of a substrate separator according to an embodiment of the present invention.
5 is a partial plan view of a substrate separation apparatus according to an embodiment of the present invention.
6 to 8 are sectional views for explaining the operation of the substrate separating apparatus according to an embodiment of the present invention.
FIG. 9 is a cross-sectional view of a substrate combination according to a modification of the substrate combination according to the embodiment of FIG. 4;
10 is a cross-sectional view of a substrate separation apparatus according to another embodiment of the present invention.
11 is a cross-sectional view of a substrate separator according to another embodiment of the present invention.
12 is a cross-sectional view of a substrate separation apparatus according to another embodiment of the present invention.
13 is a block diagram of a substrate separation apparatus according to another embodiment of the present invention.
14 is a cross-sectional view of a substrate separator according to another embodiment of the present invention.
15 is a cross-sectional view of a substrate separator according to another embodiment of the present invention.
16 is a flowchart of a method of separating a substrate according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

It will be understood that when an element or layer is referred to as being "on" of another element or layer, it encompasses the case where it is directly on or intervening another element or intervening layers or other elements. Like reference numerals refer to like elements throughout the specification.

Although the first, second, etc. are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, it goes without saying that the first component mentioned below may be the second component within the technical scope of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

1 is a block diagram of a substrate separation apparatus according to some embodiments of the present invention.

1, a substrate separation apparatus 100 according to some embodiments of the present invention includes a substrate assembly 40 including a first substrate 41 and a second substrate 42 attached to the first substrate 41, A second laser (52) for advancing a first laser in a first direction; a second laser (52) for advancing a second laser in a second direction; and a second laser And a direction switching unit 30 for switching the proceeding direction of the second laser 52 or the third laser 53 do.

The substrate assembly 40 includes a first substrate 41 and a second substrate 42 attached to the first substrate 41.

The first substrate 41 may be made of a material having heat resistance and transparency, for example, transparent glass or plastic. The first substrate 41 may be attached to the second substrate 42 to fix the second substrate 42 so that it does not warp or distort during the process.

The second substrate 42 attached to the first substrate 41 may be a flexible substrate. For example, the second substrate 42 may be formed of one or more materials selected from the group consisting of Kapton, polyethersulphone (PES), polycarbonate (PC), polyimide (PI), polyethylene terephthalate (PET) And at least one material selected from the group consisting of polyethylene naphthalate (PEN), polyacrylate (PAR), and fiber reinforced plastic (FRP).

Although not shown in the drawing, an adhesive layer (not shown) may be interposed between the first substrate 41 and the second substrate 42. The adhesive layer may be made of a light-transmitting material, and may have a heat transmission characteristic with a glass transition temperature of 220 ° C or higher, having a transmittance that allows a laser of a specific wavelength to pass therethrough. For example, the adhesive layer may include a silicone adhesive or a polymer adhesive of the acryl base.

The laser irradiation unit 10 can irradiate the first laser 51 in the first direction. As the laser, for example, an excimer laser may be used, but the present invention is not limited thereto.

The laser irradiation unit 10 may further include a controller (not shown) for controlling the wavelength and intensity of the first laser 51.

The first laser 51 may be irradiated linearly to the object to be irradiated. This will be described later.

The laser separation unit 20 serves to separate the first laser 51 irradiated by the laser irradiation unit 10. The laser separation unit 20 can separate the first laser 51 into a second laser 52 and a third laser 53. [ In this case, the sum of the intensity of the second laser 52 and the intensity of the third laser 53 may be less than or substantially equal to the intensity of the first laser 51.

The traveling directions of the second laser 52 and the third laser 53 may be different from each other. For example, the second laser 52 may proceed in a first direction, such as the first laser 51, and the third laser 53 may proceed in a second direction, which is different from the first direction. In an exemplary embodiment, the first direction and the second direction may be perpendicular to each other. However, the angle formed by the first direction and the second direction is not limited thereto, and the first direction and the second direction may form an acute angle with each other or an obtuse angle.

The manner in which the laser separation unit 20 separates the laser is not limited. In the exemplary embodiment, the laser separation unit 20 can separate the laser in such a manner that it transmits a part of the first laser 51 and reflects a part of the first laser 51. [ That is, the first laser 51 transmitted through the laser separation unit 20 becomes the second laser 52 and proceeds in the first direction, and the first laser 51 reflected by the laser separation unit 20 The third laser 53 can proceed in the second direction. In an exemplary embodiment, the laser separation unit 20 may include a beam splitter.

The direction switching unit 30 can switch the traveling direction of the second laser 52 or the third laser 53. [ In the exemplary embodiment, the redirecting section 30 may include a light reflecting mirror. Also, in some embodiments of the present invention, the redirecting unit 30 may advance the second laser 52 traveling in the first direction in a third direction different from the first direction. In this case, the first direction and the third direction may be perpendicular, but the angle formed by the first direction and the third direction is not limited thereto.

When the direction of the second laser 52 or the third laser 53 is switched by the direction switching unit 30, the second laser 52 and the third laser 53 can be irradiated toward the same plane . That is, the second laser 52 and the third laser 53 can be irradiated to different regions of the substrate combining body 40 simultaneously or sequentially. A detailed description thereof will be described later.

Hereinafter, the operation of the substrate separating apparatus 100 according to some embodiments of the present invention will be described.

A laser separation unit 20 and a laser irradiation unit 10 for irradiating the entire region of the substrate combination body 40 with the second laser 52 and / And the substrate combination 40 can be moved relative to each other. For convenience of explanation, the movement of the substrate combination body 40 will be described below.

The substrate combination can be arranged so as to face the irradiation direction of the second laser 52 or the third laser 53 and perform a linear motion. The substrate separating apparatus 100 according to some embodiments of the present invention may further include a driving unit (not shown) for linearly moving the substrate combining body 40 so that the substrate combining body 40 moves linearly.

As described above, the second laser 52 and the third laser 53 can be irradiated to different regions of the substrate combining body 40. The second laser 52 and the third laser 53 may be linearly irradiated onto the substrate combination 40. That is, the second laser 52 and the third laser 53 may be a line beam, so that the second laser 52 and the third laser 53 are defined on the substrate combination 40 Energy can be applied to the line segment. The line segment defined on the substrate combining body 40 by the second laser 52 and the line segment defined on the substrate combining body 40 by the third laser 53 may be parallel. Further, the substrate combination 40 can move in a direction perpendicular to a line segment defined by the second laser 52 and the third laser 53. [

The second laser 52 and the third laser 53 can be irradiated from one side of the substrate bonding body 40 to the other side as the substrate bonding body 40 moves. The second laser 52 may be irradiated on one side of the first substrate 41 and the third laser 53 may be irradiated on the other side 402 of the first substrate 41 in the exemplary embodiment. In the exemplary embodiment in which the second laser 52 is irradiated on one side 401 of the first substrate 41 and the third laser 53 is irradiated on the other side 402 of the first substrate 41, The second laser 52 sequentially moves the third laser 53 to the entire area of the first surface 41a of the first substrate 41 and then the second laser 52 sequentially moves the first substrate 41 The entire area can be inspected.

The third laser may be a cleaning laser that performs a function of cleaning the other surface of the first substrate. Reference is made to Figure 2 to illustrate the manner in which the third laser cleans the substrate.

2 is a cross-sectional view illustrating that the laser is irradiated on the other side of the first substrate in some embodiments of the present invention. 2, the third laser 53 irradiating the other surface 402 of the first substrate 41 removes the particles 43 disposed on the other surface 402 of the first substrate 41 can do. That is, when the particle 43 located on the other surface 402 of the first substrate 41 and the third laser 53 come into contact with each other as the substrate combination 40 moves, the energy of the third laser 53 causes the particles The particles 43 existing on the other surface 402 of the first substrate 41 can be removed.

That is, the second laser may be a desorption laser for separating the first substrate and the second substrate. Reference is made to Figure 3 to illustrate the manner in which the second laser separates the substrate.

3 is a cross-sectional view illustrating that a laser is irradiated on one surface of a first substrate in some embodiments of the present invention. Referring to FIG. 3, the second laser 52 may be irradiated to one surface 401 of the first substrate 41 through the second surface 402 of the first substrate 41. The second laser 53 irradiated on one surface of the first substrate 41 can separate the first substrate 41 and the second substrate 42 from each other. In the present specification, "separating the first substrate 41 and the second substrate 42" means not only spatially separating the first substrate 41 and the second substrate 42, but also separating the first substrate 41 and the second substrate 42 from each other, And reducing or eliminating the bonding force between the first substrate 42 and the second substrate 42. In an exemplary embodiment, a third laser 53 may be irradiated onto the substrate combination 41 and subsequently the second laser 52 may be irradiated. That is, the other surface 402 of the first substrate 41 is cleaned by the third laser 53, and the second laser 52 can be irradiated to the cleaned area. The third laser 53 cleans the other surface 402 of the first substrate 41 and the second laser 52 irradiates the one surface 401 of the first substrate 41 along the third laser 53 The cleaning and desorption of the substrate combination 40 can be performed substantially simultaneously, whereby the efficiency of the substrate separation process can be improved by omitting a separate cleaning process.

Hereinafter, more specific embodiments of the present invention will be described with reference to the drawings.

4 is a cross-sectional view of a substrate separator according to an embodiment of the present invention. 5 is a partial plan view of a substrate separation apparatus according to an embodiment of the present invention. 6 to 8 are sectional views for explaining the operation of the substrate separating apparatus according to an embodiment of the present invention.

4, a substrate separating apparatus 101 according to an embodiment of the present invention includes a laser irradiating unit 11 for irradiating a first laser 51 in a first direction, a laser irradiating unit 11 for irradiating the laser irradiating unit 11 in a first direction A beam splitter 21 disposed to be spaced apart from the beam splitter 21, and a light reflection mirror 31 disposed apart from the beam splitter 21 in the first direction.

The laser irradiation unit 11 can irradiate the first laser 51 in the first direction. As the laser, for example, an excimer laser may be used, but the present invention is not limited thereto.

The first direction may be a direction parallel to the paper surface. The first laser 51 irradiated in the first direction can reach the beam splitter 21 spaced apart from the laser irradiation unit 11 along the first direction.

The beam splitter 21 can separate the first laser 51 into the second laser 52 and the third laser 53. [ In this case, the sum of the intensity of the second laser 52 and the intensity of the third laser 53 may be less than or substantially equal to the intensity of the first laser 51. The traveling directions of the second laser 52 and the third laser 53 may be different from each other. For example, the second laser 52 may proceed in a first direction, such as the first laser 51, and the third laser 53 may proceed in a second direction, which is different from the first direction.

The beam splitter 21 can separate the laser in such a manner that a part of the first laser 51 is transmitted and a part of the first laser 51 is reflected. That is, the first laser beam 51 transmitted through the beam splitter 21 becomes the second laser beam 52 and proceeds in the first direction. The first laser beam 51 reflected by the beam splitter 21 passes through the third The laser 53 can be made to proceed in the second direction. Illustratively, the first direction and the second direction may be vertical, but the angle formed by the first direction and the second direction is not limited thereto. The second laser 52 transmitted through the beam splitter 21 can reach the beam splitter 21 and the light reflection mirror 31 spaced apart from the beam splitter 21 in the first direction.

The light reflection mirror 31 can switch the traveling direction of the second laser 52 to a third direction that is different from the first direction. The first direction and the third direction may be perpendicular to each other, but the angle formed by the first direction and the third direction is not limited thereto.

The second laser 52 traveling in the first direction is switched to the third direction by the light reflecting mirror 31 so that the second laser 52 and the third laser 53 can proceed toward the same plane.

In the exemplary embodiment, the traveling direction of the second laser 52 and the third laser 53 may be substantially parallel.

The depth of focus of the second laser 52 and the third laser 53 irradiated on the substrate combination body 40 may be different from each other. That is, the second laser 52 may be irradiated to one surface 401 of the first substrate 41, and the third laser 53 may be irradiated to the other surface 402 of the first substrate 41.

The third laser 53 reflected by the beam splitter 21 can be irradiated to the other surface 402 of the first substrate 41. [ The third laser 53 irradiating the other surface 402 of the first substrate 41 can remove the particles 43 existing on the first substrate 41. [ That is, the particles 43 that are in contact with the third laser 53 are decomposed by the energy of the third laser 53, so that the particles 43 existing on the other surface 402 of the first substrate 41 can be removed . That is, the third laser 53 may be a cleaning laser that cleans the other surface 402 of the first substrate 41.

The second laser 52 reflected by the light reflection mirror 31 may be transmitted through the other surface 402 of the first substrate 41 and irradiated to one surface of the first substrate 41. The second laser 52 irradiating the one surface 401 of the first substrate 41 can separate the first substrate 41 and the second substrate 42 from each other. In the present specification, "separating the first substrate 41 and the second substrate 42" means not only spatially separating the first substrate 41 and the second substrate 42, but also separating the first substrate 41 and the second substrate 42 from each other, And reducing or eliminating the bonding force between the first substrate 42 and the second substrate 42. That is, the second laser 52 may be a desorption laser for separating the first substrate 41 and the second substrate 42 from each other.

Referring to FIG. 5, the second laser 52 and the third laser 53 in the substrate separating apparatus according to an embodiment of the present invention may be irradiated linearly on the substrate combining body 40.

The second laser 52 and the third laser 53 can apply energy to the line segment defined on the substrate combination 40. That is, the second laser 52 and the third laser 53 may be a line beam.

The line segment defined on the substrate combination body 40 by the second laser 52 and the line segment defined on the substrate combination body 40 by the third laser 53 may be arranged at a predetermined interval. However, as described above, the focal depths of the second laser 52 and the third laser 53 may also be different in this case as well.

Hereinafter, the operation of the substrate separating apparatus 101 according to the embodiment of the present invention will be described.

As described above, the second laser 52 and the third laser 53 and the substrate combination 40 can move relative to each other. 6 to 8 illustrate the movement of the substrate combination in the x-axis direction.

Although not shown in the drawing, the substrate separating apparatus 101 according to an embodiment of the present invention may further include a driving unit (not shown) for moving the substrate combining body 40 so that the substrate combining body 40 moves . The driving unit may include, for example, a motor or an actuator.

The substrate combination body 40 can linearly move in the x-axis negative direction as shown in Figs. The substrate combination can move at a constant speed.

Referring to FIG. 6, the substrate joining body 40 can move toward the third laser 53 which is irradiated in the second direction by the beam splitter 21.

Referring to FIG. 7, as the substrate bonding body 40 moves continuously, one side of the substrate bonding body 40 can contact the third laser 53. The substrate joining body 40 can continuously move while one side of the substrate joining body 40 is in contact with the third laser 53. [ As the substrate bonding body 40 continuously moves, the third laser 53 having a linear shape can be sequentially irradiated to the other surface of the substrate bonding body 40.

Referring to FIG. 6, the substrate joining body 40 can continuously move toward the second laser 52. As the substrate bonding body 40 continuously moves, one side of the substrate bonding body 40 can touch the second laser 52. The substrate combining body 40 can continuously move while one side of the substrate combining body 40 is in contact with the second laser 52. [ The second laser 52 having a linear shape passes through the second surface 402 of the first substrate 40 and is sequentially transferred onto one surface 401 of the first substrate 41 Can be investigated.

The third laser 53 can clean the other surface 402 of the first substrate 41 by removing the particles 43 on the second surface 402 of the first substrate 41 as described above. The particles 43 existing on the other surface 402 of the first substrate 41 are irradiated with the energy of the second laser 52 by the irradiation of the second laser 52 on the area cleaned by the third laser 53, It is possible to prevent a substrate detachment failure phenomenon that may occur by absorbing a part of the substrate. In addition, since the cleaning by the third laser 53 and the desorption by the second laser 52 proceed substantially at the same time, the substrate separation process can be performed without a separate cleaning process, thereby shortening the process time, Process efficiency can be increased.

Hereinafter, other embodiments of the present invention will be described. In the following embodiments, the same components as those already described are referred to as the same reference numerals, and redundant description will be omitted or simplified.

FIG. 9 is a cross-sectional view of a substrate combination according to a modification of the substrate combination according to the embodiment of FIG. 4;

9 illustrates a case where the substrate combination 45 further includes a thin film transistor array and a top protective film.

The thin film transistor array 48 may be formed on the second substrate 42. The thin film transistor array 48 may include a plurality of thin film transistors arranged in a matrix direction. Signal lines such as gate lines (not shown) and data lines (not shown) are formed on the second substrate 42, and gate signals and data signals can be applied to the thin film transistors through these. On the second substrate 42, a pixel electrode (not shown) is formed for each pixel, and each pixel electrode can receive a pixel voltage or a current through the thin film transistor.

An upper protective film 49 may be formed on the thin film transistor array 48. The upper protective film 49 may completely cover the second substrate 42. [

The upper protective film 49 serves to fix the second substrate 42 so that the second substrate 42 can be easily bent or distorted after the first substrate 41 is separated. Therefore, after the first substrate 41 is separated, the second substrate 42 can be easily handled without the first substrate 41, and the subsequent process of attaching the lower film (not shown) can proceed more precisely and stably have.

The first substrate 41 is larger than the second substrate 42 so that the first substrate 41 is not overlapped with the second substrate 42 (hereinafter referred to as the "non-overlapping region" Quot;). The non-overlapping regions of the first substrate 41 may be disposed along the rim of the first substrate 41. The upper protective film 49 may be disposed so as to completely cover one side and the side surface of the second substrate 42. The end of the upper protective film 49 may be in contact with the non-overlapping area of the first substrate 41. [ Further, the upper protective film 49 may be in contact with the side surface of the second substrate 42.

The upper protective film 49 may be formed of a polymer material such as polyethylenenaphthalate, polyethylene terephthalate, polycarbonate or polyethersulfone as an upper protective film or a polymer material such as stainless steel (SUS: A metal foil including a metal foil or the like may be applied.

10 is a cross-sectional view of a substrate separation apparatus according to another embodiment of the present invention.

10, the substrate separating apparatus according to another embodiment of the present invention differs from the embodiment of FIG. 2 in that the laser irradiation unit 11 is disposed on the substrate coupling body 40 and irradiates the laser beam toward the substrate coupling body 40 .

As described above, the laser irradiation unit 11 can irradiate the first laser 51 toward the first direction. In the substrate separating apparatus 102 according to another embodiment of the present invention, the first direction may be a y-axis negative direction in FIG.

The first laser 51 irradiated in the first direction can reach the beam splitter 21 spaced apart from the laser irradiation unit 11 along the first direction.

The beam splitter 21 can separate the laser in such a manner as to transmit a part of the first laser 51 and reflect a part of the first laser 51. [ That is, the first laser beam 51 transmitted through the beam splitter 21 becomes the second laser beam 52 and proceeds in the first direction. The first laser beam 51 reflected by the beam splitter 21 passes through the third The laser 53 can be made to proceed in the second direction. Illustratively, the first direction and the second direction may be vertical, but the angle formed by the first direction and the second direction is not limited thereto. The third laser 53 reflected by the beam splitter 21 can reach the beam reflecting mirror 31 separated from the beam splitter 21 in the second direction.

The light reflection mirror 31 can switch the traveling direction of the third laser 53 to a third direction different from the second direction. In this case, the first direction and the third direction may be parallel to each other, but the angle formed by the first direction and the third direction is not limited thereto.

The third laser 53 traveling in the second direction is switched to the third direction by the light reflecting mirror 31 so that the second laser 52 and the third laser 53 can proceed toward the same plane.

The depth of focus of the second laser 52 and the third laser 53 irradiated on the substrate combination body 40 may be different from each other. That is, the second laser 52 may be irradiated to one surface 401 of the first substrate 41, and the third laser 53 may be irradiated to the other surface 402 of the first substrate 41.

The third laser 53 reflected by the light reflecting mirror 31 can be irradiated to the other surface 402 of the first substrate 41. [ The third laser 53 irradiating the other surface 402 of the first substrate 41 can remove the particles 43 existing on the first substrate 41. [ That is, the particles 43 that are in contact with the third laser 53 are decomposed by the energy of the third laser 53, so that the particles 43 existing on the other surface 402 of the first substrate 41 can be removed . That is, the third laser 53 may be a cleaning laser that cleans the other surface 402 of the first substrate 41.

The second laser 52 transmitted through the beam splitter 21 may be transmitted through the second surface 402 of the first substrate 41 and irradiated onto one surface 401 of the first substrate 41. The second laser 52 irradiated on one surface of the first substrate 41 can separate the first substrate 41 and the second substrate 42 from each other. In the present specification, "separating the first substrate 41 and the second substrate 42" means not only spatially separating the first substrate 41 and the second substrate 42, but also separating the first substrate 41 and the second substrate 42 from each other, And reducing or eliminating the bonding force between the first substrate 42 and the second substrate 42. That is, the second laser 52 may be a desorption laser for separating the first substrate 41 and the second substrate 42 from each other.

The operation of the substrate separating apparatus 102 according to another embodiment of the present invention may be substantially the same as the operation of the substrate separating apparatus 101 according to the embodiment of the present invention described above with reference to FIGS. Therefore, a detailed description thereof will be omitted.

11 is a cross-sectional view of a substrate separator according to another embodiment of the present invention.

11, the substrate separating apparatus 103 according to another embodiment of the present invention is configured such that the second laser 52 and / or the third laser 53 are moved from a plane perpendicular to the upper surface of the substrate combining body 40 Differs from the embodiment of Fig. 4 in that the light is angled and tilted.

The second laser 52 and / or the third laser 53 reflected by the light reflecting mirror 31 and / or the beam splitter 21 are inclined at a certain angle from the plane perpendicular to the upper surface of the substrate combining body 40 Can be investigated. The angle formed by the second laser 52 with the plane perpendicular to the upper surface of the substrate combining body 40 is defined as a first angle? 1 and the angle formed by the third laser 53 perpendicular to the upper surface of the substrate combining body 40 The angle is referred to as a second angle? 2.

The first angle? 1 and the second angle? 2 may be greater than 0 degrees and less than or equal to 10 degrees. However, the sizes of the first angle? 1 and the second angle? 2 are not limited thereto.

It is obvious that the first angle? 1 and the second angle? 2 may be substantially the same in the exemplary embodiment in which the traveling direction of the second laser 52 and the traveling direction of the third laser 53 are parallel something to do.

When the second laser 52 and / or the third laser 53 are irradiated at a certain angle from the plane perpendicular to the upper surface of the substrate combining body 40, 52 and / or the third laser 53 interfere with the second laser 52 and / or the third laser 53 emanating from the beam splitter 21 and / or the light reflecting mirror 31, Can be prevented.

12 is a cross-sectional view of a substrate separation apparatus according to another embodiment of the present invention.

12, the substrate separating apparatus 104 according to another embodiment of the present invention operates the substrate separating apparatus 104 by inputting a plurality of substrate assemblies 40a and 40b, It is different.

The distance between the beam splitter 21 and the light reflection mirror 31 disposed in the first direction from the beam splitter 21 may be relatively long or short as compared with the embodiment of FIG. When the distance between the beam splitter 21 and the light reflecting mirror 31 is longer than that in the embodiment of Fig. 4, the distance between the second laser 52 and the third laser 53 is also smaller than that in the embodiment of Fig. Can be large.

When the distance between the beam splitter 21 and the light reflecting mirror 31 is relatively large, a plurality of substrate assemblies can be put into the substrate separating apparatus 104 according to another embodiment of the present invention. For convenience of explanation, the substrate combination disposed on the left side in FIG. 12 will be referred to as a first substrate combination body 40a, and the substrate combination disposed on the right side will be referred to as a second substrate combination body 40b.

The first substrate bonding body 40a and the second substrate bonding body 40b may be aligned in a straight line and proceed in the x-axis negative direction in FIG. The first substrate bonding body 40a and the second substrate bonding body 40b can move at a constant speed.

The first substrate combination body 40a and the second substrate combination body 40b can move toward the third laser 53 which is irradiated in the second direction by the beam splitter 21. [ One side of the first substrate coupling body 40a can contact the third laser 53 as the first substrate coupling body 40a and the second substrate coupling body 40b continue to move. The first substrate bonding body 40a and the second substrate bonding body 40b can continuously move while one side of the first substrate bonding body 40a is in contact with the third laser. As the first substrate bonding body 40a and the second substrate bonding body 40b are continuously moved, the third laser 53 having a linear shape is sequentially transferred onto the other surface of the first substrate 41a of the first substrate bonding body 40a Can be investigated.

One side of the second substrate bonding body 40b can contact the third laser 53 as the first substrate bonding body 40a and the second substrate bonding body 40b continue to move. When the first substrate bonding body 40a and the second substrate bonding body 40b are continuously moved, the first substrate bonding body 40a is irradiated with the second laser 52 and the second substrate bonding body 40b is irradiated with the third laser 53 may be examined. That is, the second laser 52 is irradiated to one surface of the first substrate 41a of the first substrate coupling body 40a and the third laser 53 is irradiated to the other surface of the first substrate 41b of the second substrate coupling body 40b. Can be examined.

The second substrate bonding body 40b can continuously move while one side of the second substrate bonding body 40b is in contact with the second laser 52 and the second laser bonding body 40b can move continuously on one surface Lt; / RTI >

As described above, when a plurality of substrate assemblies are simultaneously injected to perform the substrate separating process, the time required for the process can be shortened and the efficiency of the process can be improved.

13 is a block diagram of a substrate separation apparatus according to another embodiment of the present invention.

13, the substrate separating apparatus according to another embodiment of the present invention further includes a focus adjusting unit 60 for adjusting the focus of the second laser 52 and / or the third laser 53 4 is different from the embodiment of FIG.

The substrate separating apparatus 105 according to another embodiment of the present invention may further include a focus adjusting unit 60 that adjusts the focus of the second laser 52 and / or the third laser 53. The focus adjusting section 60 may include at least one optical system.

14 is a cross-sectional view of a substrate separator according to another embodiment of the present invention.

14, a substrate separating apparatus 106 according to another embodiment of the present invention includes a first optical system 61 disposed between a light reflecting mirror 31 and a substrate combining body 40, a beam splitter 21, And the second optical system 62 disposed between the substrate assemblies 40 is different from the embodiment of FIG. The first optical system 61 and the second optical system 62 can adjust the focus of the second laser 52 and the third laser 53. That is, the first optical system 61 can adjust the focus of the second laser 52 so that the second laser 52 passing through the first optical system 61 is irradiated on one surface 401 of the first substrate 41 The second optical system 62 can adjust the focus of the third laser 53 so that the third laser 53 passing through the second optical system 62 is irradiated on the other surface 402 of the first substrate 40.

15 is a cross-sectional view of a substrate separator according to another embodiment of the present invention.

15, the substrate separating apparatus 107 according to another embodiment of the present invention includes the optical system 63 disposed between the laser irradiating unit 11 and the beam splitter 21, It is different.

In the substrate separating apparatus 107 according to another embodiment of the present invention, the optical system 63 may be disposed apart from the laser irradiation unit 11 in the first direction.

When the optical system 63 is disposed between the laser irradiation unit 11 and the beam splitter 21, the optical system 63 is arranged such that the first laser 51 passing through the optical system 63 has energy suitable for cleaning and / The first laser 51 can be adjusted.

Hereinafter, a method of separating a substrate according to an embodiment of the present invention will be described. A method of separating a substrate according to an embodiment of the present invention may be performed by a substrate separating apparatus according to some embodiments of the present invention described above. For the sake of convenience of description, substantially the same constituent elements as those of the constituent elements shown in Figs. 4 to 8 are denoted by the same reference numerals and duplicate explanation will be omitted.

16 is a flowchart of a method of separating a substrate according to an embodiment of the present invention.

Referring to FIG. 16, a method of separating a substrate according to an embodiment of the present invention includes separating a substrate assembly including a first substrate and a second substrate attached to the first substrate, (S20) of separating the first laser into a second laser which advances in a first direction and a third laser which advances in a second direction which is different from the first direction, a step (s20) of irradiating the second laser or the third laser (S30) of turning the traveling direction of the first laser and the third laser (s30) and irradiating the substrate combination with the second laser and the third laser (s40).

The step of separating the first laser 51 into the second laser 52 proceeding in the first direction and the third laser 53 proceeding in the second direction different from the first direction may be performed by a part of the first laser 51 , And reflecting a part of the first laser 51. [0035]

The step of irradiating the second laser 52 and the third laser 53 to the substrate combination body 40 may be performed by irradiating the second laser 52 onto one surface 401 of the first substrate 41 and irradiating the third laser 53 to the other surface 402 of the first substrate 41. [0051] FIG.

The method of separating a substrate according to an embodiment of the present invention may further include adjusting the focus of the first laser 51 or the second laser 52. [

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, You will understand. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

10, 11: laser irradiation unit
20: laser separation unit
30:
51: first laser
52: second laser
53: Third laser
40: substrate combination
41: first substrate
42: second substrate
21: beam splitter
31: light reflecting mirror
60:
61, 62, 63: optical system

Claims (20)

A substrate separating apparatus for separating a substrate combination including a first substrate and a second substrate attached to the first substrate,
A laser irradiation unit for irradiating the first laser in the first direction;
A laser separator for separating the first laser into a second laser traveling in the first direction and a third laser traveling in a second direction different from the first direction;
And a direction changing unit for changing the direction of the second laser or the third laser. The method according to claim 1,
Wherein the laser separator transmits the second laser in a first direction and reflects a part of the first laser in the second direction different from the first direction. The method according to claim 1,
Wherein the second laser is irradiated on one surface of the first substrate and the third laser is irradiated on the other surface of the first substrate. The method of claim 3,
Wherein the second laser and the third laser are irradiated while being inclined at a predetermined angle from a plane perpendicular to the upper surface of the substrate combination body. The method according to claim 1,
And the direction changing unit switches the direction of the second laser in a third direction different from the first direction. 6. The method of claim 5,
And the third direction and the second direction are parallel to each other. The method according to claim 1,
And the direction changing unit switches the direction of the third laser in a third direction different from the second direction. 8. The method of claim 7,
Wherein the first direction and the third direction are parallel to each other. The method according to claim 1,
Further comprising a focus adjusting section for adjusting a focus of the first laser, the second laser, or the third laser. 10. The method of claim 9,
Wherein the focus adjusting section includes a first optical system for adjusting the focus of the second laser and a second optical system for adjusting the focus of the third laser. The method according to claim 1,
Wherein the redirecting unit includes a light reflecting mirror. The method according to claim 1,
Wherein the second laser is a desorption laser for separating the first substrate and the second substrate, and the third laser is a cleaning laser for cleaning the other surface of the first substrate. A laser irradiation unit for irradiating the first laser in the first direction;
A laser which is spaced apart from the laser irradiation part in a first direction by a predetermined distance and which separates the first laser into a second laser which advances in the first direction and a third laser which advances in a second direction different from the first direction, Separator;
And a light reflection mirror disposed at a predetermined distance from the laser separation unit in the first direction or the second direction and switching the direction of the second laser or the third laser. 15. The method of claim 14,
And an optical system disposed at a predetermined distance from the laser irradiation unit in the first direction. 15. The method of claim 14,
Wherein the light reflecting mirror includes a first optical system that is arranged to be spaced apart from the light reflecting mirror in a third direction by switching the traveling direction of the second laser in a third direction different from the first direction, And a second optical system disposed at a predetermined distance in a second direction. 15. The method of claim 14,
Wherein the second laser is a desorption laser and the third laser is a cleaning laser. A method of separating a substrate combination comprising a first substrate and a second substrate attached to the first substrate, the method comprising: irradiating a first laser in a first direction;
Separating the first laser into a second laser traveling in the first direction and a third laser traveling in a second direction different from the first direction;
Switching the traveling direction of the second laser or the third laser; And
And irradiating the second laser and the third laser to the substrate combination. 18. The method of claim 17,
Separating the first laser into a second laser traveling in the first direction and a third laser traveling in a second direction different from the first direction transmits a portion of the first laser, To reflect a portion of the substrate. 18. The method of claim 17,
The step of irradiating the second laser and the third laser to the substrate combination includes irradiating the second laser onto one surface of the first substrate and irradiating the third laser onto the other surface of the first substrate Lt; / RTI > 18. The method of claim 17,
Further comprising adjusting the focus of the first laser, the second laser or the third laser.

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