KR20140148331A - Dicing die-bonding film - Google Patents

Abstract

Provided is a dicing die-bonding film which prevents the generation of whisker and the deterioration of the cutting quality of a dicing blade as well. The present invention relates to a dicing die-bonding film which has the abrasion loss of a dicing blade, 20-200 μm, when a silicon bare wafer is step-cut.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing die-

The present invention relates to a dicing die-bonding film.

In the step of dicing the semiconductor wafer, the semiconductor wafer may be diced while being attached to the dicing film. As the dicing film, it is known that the dicing film has a structure in which a pressure-sensitive adhesive layer is laminated on a substrate (see, for example, Patent Document 1).

However, in the case of dicing a semiconductor wafer using a dicing film, foreign matter (abrasive particles originating from the substrate) on the whisker may remain in the dicing line.

Japanese Patent Application Laid-Open No. 2011-198976

Patent Document 1 discloses a dicing film using a specific resin as a constituent component of a substrate in order to reduce occurrence of whiskers. However, when a conventional dicing film described in Patent Document 1 or the like is diced in a state in which it is bonded to a semiconductor wafer, a phenomenon in which abrasive grains adhere to the dicing blade and clogging occurs, and the cutting quality of the dicing blade is lowered Throw away. The lowering of the cutting quality of the dicing blade makes whiskers easier to generate.

It is an object of the present invention to solve the above problems and to provide a dicing die-bonding film capable of suppressing the deterioration of the cutting quality of the dicing blade and suppressing the occurrence of whiskers.

The present invention relates to a dicing die-bonding film in which a base material, a pressure-sensitive adhesive layer and an adhesive layer are laminated in this order, wherein a silicone bare wafer having a thickness of 100 mu m is bonded to the adhesive layer, The silicon bare wafer and the adhesive layer are cut to a depth of 100 m at a cut-off depth at which the second dicing blade reaches at least the pressure-sensitive adhesive layer, along the notch of the first dicing blade, Wherein the abrasion amount of the second dicing blade at the time of cutting is 20 to 200 占 퐉 and the blade width of the second dicing blade is smaller than the blade width of the first dicing blade, A dicing die having a cutting speed of 50 mm / sec and a rotation speed of 45000 rpm, and a cutting condition by a second dicing blade at a speed of 50 mm / sec and a rotation speed of 40,000 rpm, To a bonding film.

Since the wear amount is 20 占 퐉 or more, deterioration of the cutting quality of the dicing blade can be suppressed and occurrence of whiskers can be suppressed. On the other hand, since the amount of wear is 200 m or less, the durability of the dicing blade can be prevented from becoming excessively short.

On the other hand, in the present invention, the abrasion amount of the second dicing blade when the silicon bare wafer was step-cut using two types of dicing blades is specified, but the dicing and die bonding film of the present invention is not limited to the single- The above-described effects can be obtained even when another dicing method is adopted.

It is preferable that the thickness of the adhesive layer / the total thickness of the base material and the pressure-sensitive adhesive layer is 0.045 to 0.9. 0.045 or more, the polishing (dressing) effect of the dicing blade can be obtained, and the deterioration of the cutting quality of the dicing blade can be suppressed. 0.9 or less, it is possible to prevent the life of the dicing blade from becoming excessively short.

It is preferable that the adhesive layer contains a spherical alumina filler as an abrasive, and the content of the spherical alumina filler in the adhesive layer is 60 to 88 wt%. By containing alumina harder than diamond in the adhesive layer, the dicing blade can be polished well. In addition, by making the shape of the alumina spherical so as to be highly fillable, a good polishing effect can be obtained. Further, by setting the content of the spherical alumina filler within the above range, it is possible to polish the dicing blade well, thereby preventing deterioration of the cutting quality.

According to the present invention, the deterioration of the cutting quality of the dicing blade can be suppressed, and the occurrence of whiskers can be suppressed.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a cross-sectional schematic diagram of a dicing and die-bonding film of Embodiment 1. FIG.
Fig. 2 is a schematic cross-sectional view of a modified example of the dicing and die-bonding film of Embodiment 1. Fig.
3 is a diagram schematically showing a part of the manufacturing process of the semiconductor device.
4A is a diagram schematically showing an aspect of the first dicing blade cutting the silicon bare wafer. (b) is a diagram schematically showing a part of a cross section of a silicon bare wafer in which a notch is formed by the first dicing blade.
FIG. 5A is a diagram schematically showing an aspect of cutting the silicon bare wafer and the adhesive layer by the second dicing blade. FIG. (b) is a diagram schematically showing a part of a cross section of the silicon bare wafer cut by the second dicing blade.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail with reference to embodiments. However, the present invention is not limited to these embodiments.

[Embodiment 1]

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a cross-sectional schematic diagram of a dicing and die-bonding film of Embodiment 1. FIG. Fig. 2 is a schematic cross-sectional view of a modified example of the dicing and die-bonding film of Embodiment 1. Fig.

As shown in Fig. 1, the dicing and die-bonding film 10 has a structure in which the adhesive layer 3 is laminated on the dicing film 11. The dicing film 11 is formed by laminating a pressure-sensitive adhesive layer 2 on a base material 1 and the adhesive layer 3 is provided on the pressure-sensitive adhesive layer 2. [ 2, the dicing / die-bonding film 10 may have a structure in which the adhesive layer 3 is formed only on a portion to which a work (semiconductor wafer 4 or the like) is attached.

After a silicon bare wafer having a thickness of 100 占 퐉 was bonded to the adhesive layer 3 of the dicing and die-bonding film 10, the first dicing blade was cut into 100 m of the silicon wafer wafer at a depth of cut of 50 占 퐉, The amount of wear of the second dicing blade when the silicone bare wafer and the adhesive layer 3 were cut at a depth of notch at which the second dicing blade reaches at least the pressure sensitive adhesive layer 2 along the notch of the first dicing blade 20 mu m or more. It is possible to suppress the deterioration of the cutting quality of the dicing blade and to suppress the occurrence of whiskers. From the viewpoint of suppressing the deterioration of the cutting quality of the dicing blade, the larger the wear amount, the more preferable. Therefore, the wear amount is preferably 30 占 퐉 or more, and more preferably 50 占 퐉 or more.

On the other hand, the wear amount is preferably as small as possible from the viewpoint of the life of the dicing blade. Specifically, the wear amount is 200 탆 or less, preferably 150 탆 or less, and more preferably 120 탆 or less.

The silicon bare wafer is a silicon wafer in a state before a processing such as pattern formation is performed. As the first dicing blade and the second dicing blade, diamond particles embedded in a resin can suitably be used.

On the other hand, the blade width of the second dicing blade is smaller than the blade width of the first dicing blade. The notch formation by the first dicing blade is performed under the conditions of a transfer speed of 50 mm / sec and a rotational speed of 40000 rpm. The cutting by the second dicing blade is performed under the conditions of a transfer speed of 50 mm / sec and a rotational speed of 45000 rpm.

The amount of wear can be measured by the method described in the examples.

(The adhesive layer 3)

The adhesive layer 3 may be formed of, for example, a thermoplastic resin and a thermosetting resin. More specifically, the adhesive layer 3 may be formed of an epoxy resin, a phenol resin, or an acrylic resin.

The epoxy resin is not particularly limited as long as it is generally used as an adhesive composition and examples thereof include epoxy resins such as bisphenol A type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type, bisphenol AF type, biphenyl type, A bifunctional epoxy resin or a polyfunctional epoxy resin such as a fluorene type, a fluorene type, a phenol novolac type, an orthocresol novolac type, a tris hydroxyphenyl methane type and a tetraphenylol ethene type, Epoxy isocyanurate type epoxy resin, or glycidyl amine type epoxy resin. These may be used alone or in combination of two or more. Among these epoxy resins, an epoxy resin having an aromatic ring such as a benzene ring, a biphenyl ring, and a naphthalene ring is particularly preferable in the present invention. Specific examples thereof include novolak type epoxy resins, xylenol skeleton-containing phenol novolak type epoxy resins, biphenyl skeleton-containing novolak type epoxy resins, bisphenol A type epoxy resins, bisphenol F type epoxy resins, tetramethylbiphenol type epoxy Resin, triphenylmethane-type epoxy resin, and the like. These epoxy resins are rich in reactivity with a phenol resin as a curing agent and have excellent heat resistance. On the other hand, the epoxy resin contains less ionic impurities and the like which corrode semiconductor elements.

The weight average molecular weight of the epoxy resin is preferably in the range of 300 to 1500, more preferably in the range of 350 to 1000. If the weight average molecular weight is less than 300, the mechanical strength, heat resistance and moisture resistance of the die-bonding film 3 after heat curing may be lowered. On the other hand, if it is larger than 1500, the die-bonding film after heat curing may become rigid and become vulnerable. Meanwhile, the weight average molecular weight in the present invention means a polystyrene reduced value using a calibration curve by standard polystyrene in Gel Permeation Chromatography (GPC).

Furthermore, the phenol resin acts as a curing agent for the epoxy resin, and examples thereof include phenol novolak resins, phenol biphenyl resins, phenol aralkyl resins, cresol novolak resins, tert-butyl phenol novolak resins, Novolac phenol resins such as novolak type phenolic resins such as novolak type phenolic resins, and phenol novolak type resins such as polypolyoxystyrene. These may be used alone or in combination of two or more. Among these phenol resins, phenol novolac resins and phenol aralkyl resins are preferable. This is because connection reliability of the semiconductor device can be improved.

The phenol resin preferably has a weight average molecular weight in the range of 300 to 1,500, more preferably 350 to 1,000. If the weight-average molecular weight is less than 300, the epoxy resin may not be sufficiently thermally cured and sufficient toughness may not be obtained. On the other hand, if the weight-average molecular weight is larger than 1500, the viscosity becomes high and the workability in the production of the die-bonding film may be lowered.

The mixing ratio of the epoxy resin to the phenol resin is preferably such that the hydroxyl group in the phenol resin is equivalent to 0.5 to 2 equivalents per equivalent of the epoxy group in the epoxy resin component. More suitable is 0.8 equivalents to 1.2 equivalents. That is, if the mixing ratio of the two is out of the above range, sufficient curing reaction does not proceed and the properties of the epoxy resin cured product tend to deteriorate.

The total content of the epoxy resin and the phenol resin in the adhesive layer 3 is preferably 5% by weight or more, and more preferably 9% by weight or more. If it is 5% by weight or more, the flow-through reliability can be obtained by the cross-linking reaction between the epoxy resin and the phenolic resin. The total content of the epoxy resin and the phenol resin in the adhesive layer 3 is preferably 40% by weight or less, more preferably 30% by weight or less. If it is 40% by weight or less, the fragility of the adhesive layer 3 can be suppressed. The epoxy resin and the phenol resin are generally low molecular weight components and have low flexibility at room temperature, so that if the total content is too large, the adhesive layer 3 tends to be easily broken.

The acrylic resin is not particularly limited, but in the present invention, a carboxyl group-containing acrylic copolymer and an epoxy group-containing acrylic copolymer are preferable. The functional monomer used in the carboxyl group-containing acrylic copolymer may be acrylic acid or methacrylic acid. The content of acrylic acid or methacrylic acid is adjusted so that the acid value is in the range of 1 to 4. The balance may be a mixture of an alkyl acrylate having an alkyl group having 1 to 8 carbon atoms such as methyl acrylate and methyl methacrylate, alkyl methacrylate, styrene or acrylonitrile. Of these, ethyl (meth) acrylate and / or butyl (meth) acrylate are particularly preferred. The mixing ratio is preferably adjusted in consideration of the glass transition point (Tg) of the acrylic resin described below. The polymerization method is not particularly limited, and conventionally known methods such as a solution polymerization method, a bulk polymerization method, a suspension polymerization method and an emulsion polymerization method can be employed.

Further, other monomer components copolymerizable with the above-mentioned monomer component are not particularly limited, and examples thereof include acrylonitrile. The amount of these copolymerizable monomer components to be used is preferably in the range of 1 wt% to 20 wt% with respect to the total monomer components. Modification of the cohesive force, adhesiveness, and the like can be achieved by incorporating other monomer components within the above range.

The content of the acrylic resin in the adhesive layer 3 is preferably 2% by weight or more, and more preferably 5% by weight or more. If it is 2% by weight or more, the shape of the film can be easily maintained. The content of the acrylic resin is preferably 15% by weight or less, more preferably 10% by weight or less. If it is 15% by weight or less, good unevenness followability at high temperature is obtained.

The adhesive layer 3 usually contains an abrasive. By containing an abrasive in the adhesive layer 3, the surface of the dicing blade can be polished (dressed), and deterioration of the cutting quality of the dicing blade can be prevented.

As the abrasive, spherical alumina filler is preferable. Since alumina has a hardness comparable to that of diamond, by containing alumina in the adhesive layer 3, the dicing blade can be polished well. When the alumina has a low filling amount, the polishing effect is small. However, by making the shape of the alumina spherical so as to be highly fillable, a good polishing effect can be obtained.

The spherical alumina filler preferably has an average particle diameter of 0.3 mu m or more, more preferably 0.5 mu m or more. Since it is 0.3 m or more, irregularity followability at a high temperature can be obtained and high filling can be achieved. The average particle diameter of the spherical alumina filler is preferably 15 占 퐉 or less, and more preferably 10 占 퐉 or less. The thickness of the adhesive layer 3 can be reduced.

The average particle diameter of the spherical alumina filler is, for example, a value determined by a particle size distribution meter (manufactured by HORIBA, Inc., LA-910).

The maximum particle diameter of the spherical alumina filler is preferably 40 탆 or less. When the thickness is 40 μm or less, it is possible to cope with thinning. The thickness of the adhesive layer 3 is required to be thin each year, and the mainstream of the adhesive layer 3 is 40 탆 or less, and a filler having a larger particle diameter is not suitable.

The spherical alumina filler is preferably treated (pretreated) with a silane coupling agent. As a result, the dispersibility of the spherical alumina filler is improved, and the spherical alumina filler can be highly searched.

The silane coupling agent is a compound having a hydrolyzable group and an organic functional group in the molecule.

Examples of the hydrolyzable group include an alkoxy group having 1 to 6 carbon atoms such as a methoxy group and an ethoxy group, an acetoxy group, and a 2-methoxyethoxy group. Among them, a methoxy group is preferable because of its high hydrolysis rate and good silane coupling treatment.

Examples of the organic functional group include a vinyl group, an epoxy group, a styryl group, a methacrylic group, an acryl group, an amino group, an ureido group, a mercapto group, a sulfide group and an isocyanate group. Among them, an epoxy group and a methacrylic group are preferable because the dispersibility of the spherical alumina filler can be increased and the fluidity of the adhesive layer 3 can be increased.

Examples of the silane coupling agent include vinyl group-containing silane coupling agents such as vinyltrimethoxysilane and vinyltriethoxysilane; 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyl, 3-glycidoxypropylmethyldimethoxysilane, 3- An epoxy group-containing silane coupling agent (epoxysilane-based silane coupling agent) such as diethoxy silane and 3-glycidoxypropyl triethoxy silane; styryl group-containing silane coupling agents such as p-styryltrimethoxysilane; Methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, etc. Methacrylic group-containing silane coupling agent (methacryl silane-based silane coupling agent); Acrylic group-containing silane coupling agents such as 3-acryloxypropyltrimethoxysilane; Aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, N-2- -Aminopropyltriethoxysilane, 3-triethoxysilyl-N- (1,3-dimethyl-butyrylidene) propylamine, N-phenyl- Vinylbenzyl) -2-aminoethyl-3-aminopropyltrimethoxysilane, and other amino group-containing silane coupling agents; Ureido-containing silane coupling agents such as 3-ureidopropyltriethoxysilane; Mercapto group-containing silane coupling agents such as 3-mercaptopropylmethyl dimethoxysilane and 3-mercaptopropyl trimethoxysilane; Sulfide group-containing silane coupling agents such as bis (triethoxysilylpropyl) tetrasulfide; And an isocyanate group-containing silane coupling agent such as 3-isocyanate propyltriethoxysilane.

The method of treating the spherical alumina filler with the silane coupling agent is not particularly limited and the wet method in which the spherical alumina filler and the silane coupling agent are mixed in the solvent, the dry method in which the spherical alumina filler and the silane coupling agent are treated in the gas phase .

The throughput of the silane coupling agent is not particularly limited, but 0.05 to 5 parts by weight of the silane coupling agent is preferably added to 100 parts by weight of the spherical alumina filler.

The content of the spherical alumina filler in the adhesive layer (3) is preferably at least 60 wt%, more preferably at least 70 wt%, and even more preferably at least 75 wt%. If it is 60% by weight or more, the dicing blade can be polished well, and the deterioration of the cutting quality can be prevented. The content of the spherical alumina filler in the adhesive layer (3) is preferably 90% by weight or less, and more preferably 88% by weight or less. If it is 90% by weight or less, the life of the dicing blade can be prevented from becoming excessively short.

In addition to the above components, the adhesive layer 3 may suitably contain a compounding agent generally used in the production of an adhesive layer, such as a crosslinking agent.

The method for producing the adhesive layer 3 is not particularly limited, but may include a step of producing an adhesive composition solution containing the respective components (for example, a thermoplastic resin, a thermosetting resin and a spherical alumina filler), a step of filtering the adhesive composition solution to obtain a filtrate And a step of applying a filtrate onto the substrate separator to form a coating film, followed by drying the coating film.

The solvent used in the adhesive composition solution is not particularly limited, but an organic solvent capable of uniformly dissolving, kneading or dispersing the above components is preferable. Examples thereof include ketone solvents such as dimethylformamide, dimethylacetamide, N-methylpyrrolidone, acetone, methyl ethyl ketone and cyclohexanone, toluene and xylene.

The opening of the filter medium used for filtration is preferably 50 占 퐉 or less. Thereby, the maximum particle diameter of the spherical alumina filler can be made 50 mu m or less, and the aggregation of the alumina filler can be suppressed from being mixed into the adhesive layer 3. [

As the base separator, a plastic film or paper surface-coated with a release agent such as polyethylene terephthalate (PET), polyethylene, polypropylene, a fluorine-based release agent, or a long-chain alkyl acrylate-based release agent can be used. Examples of the application method of the adhesive composition solution include roll coating, screen coating, and gravure coating. The drying condition of the coating film is not particularly limited, and can be carried out, for example, at a drying temperature of 70 to 160 DEG C and a drying time of 1 to 5 minutes.

The thickness of the adhesive layer 3 is not particularly limited, but is preferably 5 占 퐉 or more. If the thickness is 5 占 퐉 or more, deterioration of the cutting quality of the dicing blade can be suppressed. The thickness of the adhesive layer 3 is preferably 100 占 퐉 or less, more preferably 50 占 퐉 or less. If it is 100 탆 or less, the life of the dicing blade can be prevented from becoming excessively short.

(Substrate (1))

The base material (1) serves as a matrix of the dicing / die-bonding film (10). Examples of the substrate 1 include polyolefins such as low density polyethylene, linear polyethylene, medium density polyethylene, high density polyethylene, ultra low density polyethylene, random copolymerized polypropylene, block copolymerized polypropylene, homopolypropylene, polybutene, (Meth) acrylic acid ester (random, alternating) copolymer, an ethylene-butene copolymer, an ethylene-hexene copolymer, a polyurethane, an ethylene-vinyl acetate copolymer, an ionomer resin, Polyimide, polyetherimide, polyamide, wholly aromatic polyamide, polyphenylsulfide, aramid (paper), polyimide, polyether sulfone, Glass, glass cloth, fluororesin, polyvinyl chloride, polyvinylidene chloride, cell Based resin, a silicon resin, a metal (foil), and paper. Of these, polyethylene, polypropylene and the like are preferable as the base material 1 because of a small water absorption rate.

The surface of the substrate 1 is subjected to chemical or physical treatments such as surface treatment for tolerance, such as chromium acid treatment, ozone exposure, flame exposure, high voltage exposure and ionizing radiation treatment, in order to improve the adhesion with the adjacent layer, , And an undercoating agent (for example, an adhesive material described later).

The base material (1) can be selected from homogeneous or heterogeneous materials suitably, and blended with various kinds of materials may be used if necessary.

The thickness of the substrate 1 is not particularly limited and can be appropriately determined, but is generally about 60 to 150 mu m.

(Pressure-sensitive adhesive layer (2))

As the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer (2), an acrylic pressure-sensitive adhesive using an acrylic polymer as a base polymer from the viewpoints of ultrapure water of an electronic part that is not susceptible to contamination such as a semiconductor wafer or glass or an organic solvent such as alcohol desirable.

Examples of the acrylic polymer include (meth) acrylic acid alkyl esters such as methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, But are not limited to, esters, hexyl esters, heptyl esters, octyl esters, 2-ethylhexyl esters, isooctyl esters, nonyl esters, decyl esters, isodecyl esters, undecyl esters, dodecyl esters, tridecyl esters, Linear or branched alkyl esters having 1 to 30 carbon atoms, particularly 4 to 18 carbon atoms, of alkyl groups such as ester, octadecyl ester and eicosyl ester) and (meth) acrylic acid cycloalkyl esters (for example, cyclopentyl ester, cyclo Hexyl ester, etc.) as the monomer component, or the like Can. On the other hand, (meth) acrylic acid ester refers to acrylic acid ester and / or methacrylic acid ester, and (meth)

The acrylic polymer may contain units corresponding to other monomer components copolymerizable with the (meth) acrylic acid alkyl ester or the cycloalkyl ester, if necessary, for the purpose of modifying the cohesive force, heat resistance and the like. Examples of the monomer component include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid and crotonic acid; Acid anhydride monomers such as maleic anhydride and itaconic anhydride; (Meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl Hydroxyl group-containing monomers such as (meth) acrylic acid 10-hydroxydecyl, (meth) acrylic acid 12-hydroxylauryl and (4-hydroxymethylcyclohexyl) methyl (meth) acrylate; (Meth) acrylamidopropane sulfonic acid, sulfopropyl (meth) acrylate, (meth) acryloyloxy (meth) acrylamide, Sulfonic acid group-containing monomers such as naphthalene sulfonic acid; Phosphoric acid group-containing monomers such as 2-hydroxyethyl acryloyl phosphate; Acrylamide, acrylonitrile, and the like. These copolymerizable monomer components may be used alone or in combination of two or more. The amount of these copolymerizable monomers to be used is preferably 40% by weight or less based on the total monomer components.

Further, the acryl-based polymer may include a multi-functional monomer or the like as a monomer component for copolymerization for crosslinking. Examples of such a polyfunctional monomer include hexane diol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (Meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylate, Polyester (meth) acrylate, and urethane (meth) acrylate. These multifunctional monomers may be used alone or in combination of two or more. The amount of the multifunctional monomer to be used is preferably 30% by weight or less based on the total amount of the monomer components from the viewpoint of adhesion properties and the like.

The acrylic polymer may be prepared, for example, by applying a suitable method such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method or a suspension polymerization method to a mixture of one or more kinds of component monomers. The pressure-sensitive adhesive layer (2) is preferably a composition in which the content of a low molecular weight substance is suppressed from the standpoint of prevention of contamination of the wafer, and in this respect, an acrylic polymer having a weight average molecular weight of 300,000 or more, particularly 400,000 to 3,000,000, The pressure-sensitive adhesive may be of a suitable crosslinking type by an internal crosslinking method or an external crosslinking method.

For controlling the crosslinking density of the pressure-sensitive adhesive layer (2), for example, a polyfunctional isocyanate compound, a polyfunctional epoxy compound, a melamine compound, a metal salt compound, a metal chelate compound, an amino resin compound, Or a method in which a low molecular weight compound having two or more carbon-carbon double bonds is mixed and subjected to a crosslinking treatment by irradiation of an energy ray or the like can be adopted. When an external crosslinking agent is used, the amount thereof to be used is appropriately determined according to the balance with the base polymer to be crosslinked, and further, depending on the intended use as a pressure-sensitive adhesive. Generally, about 5 parts by weight or less, more preferably 0.1 part by weight to 5 parts by weight, based on 100 parts by weight of the base polymer is preferably blended. If necessary, various additives such as a tackifier and an anti-aging agent may be used for the pressure-sensitive adhesive in addition to the above components.

As a pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer (2), a radiation-curable pressure-sensitive adhesive is suitable. As the radiation-curable pressure-sensitive adhesive, there can be cited an addition-type radiation-curable pressure-sensitive adhesive in which a radiation-curable monomer component or a radiation-curable oligomer component is blended with the aforementioned pressure-sensitive adhesive.

Examples of the radiation curable monomer component to be blended include urethane (meth) acrylate, trimethylol propane tri (meth) acrylate, tetramethylolmethane tetra (meth) acrylate, pentaerythritol tri (meth) (Meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate and 1,4- have. These monomer components may be used alone or in combination of two or more.

Examples of the radiation-curable oligomer component include various oligomers such as urethane-based, polyether-based, polyester-based, polycarbonate-based, and polybutadiene-based oligomers, and the molecular weight thereof is suitably in the range of about 100 to 30,000. The amount of the radiation-curable monomer component or oligomer component can be appropriately determined depending on the type of the pressure-sensitive adhesive layer so that the adhesive force of the pressure-sensitive adhesive layer can be lowered. Generally, it is, for example, about 5 parts by weight to 500 parts by weight, preferably about 70 parts by weight to 150 parts by weight, based on 100 parts by weight of the base polymer such as acrylic polymer constituting the pressure-sensitive adhesive.

As radiation curable pressure sensitive adhesives, radiation curable pressure sensitive adhesives of the internal type which use, in addition to the addition type radiation curable pressure sensitive adhesives, those having a carbon-carbon double bond as a base polymer at the polymer side chain or at the main chain or at the main chain terminal. The radiation-curable pressure-sensitive adhesive of the internal type does not need or need to contain an oligomer component, which is a low-molecular component, so that the oligomer component or the like does not move in the pressure- Sensitive adhesive layer can be formed.

The base polymer having a carbon-carbon double bond may have a carbon-carbon double bond and may be used without any particular limitation. As such a base polymer, an acrylic polymer is preferably used as a basic skeleton. Examples of the basic skeleton of the acrylic polymer include the acrylic polymer exemplified above.

There are no particular restrictions on the method for introducing the carbon-carbon double bond to the acryl-based polymer, and various methods can be employed. However, it is easy to introduce the carbon-carbon double bond into the side chain of the polymer in terms of molecular design. For example, after a monomer having a functional group is copolymerized in advance with an acrylic polymer, a compound having a functional group capable of reacting with the functional group and a carbon-carbon double bond is condensed or added with maintaining the radiation curability of the carbon- .

Examples of combinations of these functional groups include a carboxylic acid group and an epoxy group, a carboxylic acid group and an aziridyl group, and a hydroxyl group and an isocyanate group. Among the combinations of these functional groups, a combination of a hydroxyl group and an isocyanate group is suitable from the viewpoint of easy tracking of the reaction. In the combination of these functional groups, the functional group may be present either on the acrylic polymer or on the side of the compound, provided that the acrylic polymer having the carbon-carbon double bond is produced. In the preferred combination, , And the compound having an isocyanate group is suitable. In this case, examples of the isocyanate compound having a carbon-carbon double bond include methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, m-isopropenyl-α, Dimethyl benzyl isocyanate, and the like. As the acrylic polymer, a copolymer obtained by copolymerizing a hydroxyl group-containing monomer, the 2-hydroxyethyl vinyl ether, the 4-hydroxybutyl vinyl ether, the diethylene glycol monovinyl ether, and the like can be used.

The above internal-type radiation-curable pressure-sensitive adhesive may use the above-mentioned base polymer having a carbon-carbon double bond (in particular, an acrylic polymer) alone, but may be used as a radiation curable monomer component or oligomer component A compound may also be compounded. The compounding amount of the photopolymerizable compound is usually within a range of 30 parts by weight or less, preferably from 0 to 10 parts by weight, based on 100 parts by weight of the base polymer.

When the radiation-curable pressure-sensitive adhesive is cured by ultraviolet rays or the like, it is preferable to include a photopolymerization initiator.

As the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer (2), an active energy ray-curable pressure-sensitive adhesive described in JP-A-2010-129701 can be used particularly suitably. The active energy ray-curable pressure-sensitive adhesive contains the following acrylic polymer A.

The acrylic polymer A: CH ₂ = CHCOOR carboxyl group, containing an acrylic acid ester at least 50 wt% and a hydroxyl group containing monomer is 10% by weight to 30% by weight represented by (wherein, R is an alkyl group having the carbon number of 6 to 10) Containing monomer having a radical reactive carbon-carbon double bond in an amount of 50 mol% to 95 mol% with respect to the hydroxyl group-containing monomer is added to the polymer by the monomer composition not containing the monomer

Roneun acrylic polymer A, CH ₂ = CHCOOR uses (may be called as "acrylic acid C6-10 alkyl ester") acrylic acid alkyl ester represented by the formula (In the formula, R is an alkyl group having a carbon number of 6 to 10). If the number of carbon atoms in the alkyl group of the alkyl acrylate is less than 6, the peeling force becomes excessively large and the pickup property may be lowered. On the other hand, when the number of carbon atoms in the alkyl group of the alkyl acrylate is more than 10, the adhesiveness or adhesiveness with the adhesive layer 3 is lowered, and as a result, chip scattering may occur during dicing. As the C6-10 alkyl acrylate ester, acrylic acid alkyl ester having 8 to 9 carbon atoms in the alkyl group is particularly preferable. Of these, 2-ethylhexyl acrylate and isooctyl acrylate are most suitable.

The content of the C6-10 alkyl acrylate ester is preferably 50% by weight or more, more preferably 70% by weight to 90% by weight, based on the whole amount of the monomer components. If the content of the C6-10 alkyl acrylate ester is less than 50 wt% with respect to the total amount of the monomer components, the peeling force becomes excessively large and the pickup property may be deteriorated.

The content of the hydroxyl group-containing monomer is preferably in the range of 10 wt% to 30 wt%, more preferably in the range of 15 wt% to 25 wt% with respect to the total amount of the monomer components. If the content of the hydroxyl group-containing monomer is less than 10% by weight based on the total amount of the monomer components, crosslinking after irradiation with an active energy ray is insufficient to reduce the pick-up property and cause a residual residue on the semiconductor chip with the adhesive layer 3 have. On the other hand, if the content of the hydroxyl group-containing monomer exceeds 30 wt% with respect to the total amount of the monomer component, the polarity of the pressure-sensitive adhesive increases, and the interaction with the adhesive layer 3 increases.

The acrylic polymer A may contain units corresponding to other monomer components, if necessary.

As the acrylic polymer A, an isocyanate compound having a radical reactive carbon-carbon double bond (sometimes referred to as a " double bond-containing isocyanate compound ") is used. That is, it is preferable that the acrylic polymer has a structure in which a double bond-containing isocyanate compound is additionally reacted with the polymer formed by the monomer composition such as the acrylic acid ester or the hydroxyl group-containing monomer. Therefore, it is preferable that the acrylic polymer has a radical reactive carbon-carbon double bond in its molecular structure. This makes it possible to form an active energy ray-curable pressure-sensitive adhesive layer (ultraviolet-curable pressure-sensitive adhesive layer or the like) which is cured by irradiation of an active energy ray (ultraviolet ray or the like), and detaches the peeling force between the adhesive layer 3 and the pressure- .

Examples of the double bond-containing isocyanate compound include methacryloyl isocyanate, acryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, 2-acryloyloxyethyl isocyanate And m-isopropenyl-alpha, alpha -dimethylbenzyl isocyanate. The double bond-containing isocyanate compounds may be used alone or in combination of two or more.

The amount of the double bond-containing isocyanate compound used is preferably in the range of 50 mol% to 95 mol%, more preferably in the range of 75 mol% to 90 mol% with respect to the hydroxyl group-containing monomer. If the amount of the double bond-containing isocyanate compound used is less than 50 mol% based on the hydroxyl group-containing monomer, crosslinking after irradiation with an active energy ray is insufficient, resulting in poor pick- May occur.

In addition, an external crosslinking agent may be appropriately used in the active energy ray-curable pressure-sensitive adhesive for adjusting the adhesive strength before irradiation with active energy rays or the adhesion force after irradiation with active energy rays. Specific examples of the external crosslinking method include a method in which a so-called crosslinking agent such as a polyisocyanate compound, an epoxy compound, an aziridine compound, or a melamine crosslinking agent is added and reacted. When an external crosslinking agent is used, the amount thereof to be used is appropriately determined according to the balance with the base polymer to be crosslinked, and further, depending on the intended use as a pressure-sensitive adhesive. The amount of the external crosslinking agent to be used is generally 20 parts by weight or less (preferably 0.1 parts by weight to 10 parts by weight) based on 100 parts by weight of the base polymer. Further, the active energy ray-curable pressure-sensitive adhesive may be blended with additives, such as various tackifiers, antioxidants, and foaming agents, which are conventionally known, in addition to the above components, if necessary.

The thickness of the pressure-sensitive adhesive layer 2 is not particularly limited and can be appropriately determined, but is generally about 5 to 200 占 퐉.

(The thickness of the adhesive layer 3 / the total thickness of the substrate 1 and the pressure-sensitive adhesive layer 2)

The thickness of the adhesive layer 3 / the total thickness of the substrate 1 and the pressure-sensitive adhesive layer 2 is preferably 0.045 or more, and more preferably 0.05 or more. If it is 0.045 or more, the polishing (dressing) effect of the dicing blade is obtained, and deterioration of the cutting quality of the dicing blade can be suppressed. The thickness of the adhesive layer 3 / the total thickness of the substrate 1 and the pressure-sensitive adhesive layer 2 is preferably 0.9 or less, more preferably 0.45 or less, further preferably 0.3 or less. If it is 0.9 or less, the life of the dicing blade can be prevented from becoming excessively short.

(Manufacturing Method of Semiconductor Device)

Hereinafter, a method of manufacturing a semiconductor device using the dicing and die-bonding film 10 will be described with reference to FIG. 3 is a diagram schematically showing a part of the manufacturing process of the semiconductor device.

First, the semiconductor wafer 4 is pressed onto the semiconductor wafer attaching portion 3a of the adhesive layer 3 in the dicing / die bonding film 10, and the semiconductor wafer 4 is adhered and fixed by the attaching step. This step is carried out while being pressed by a pressing means such as a pressing roll.

Next, the semiconductor wafer 4 is cut into pieces by the dicing blade to obtain a semiconductor chip 5. The dicing method is not particularly limited, but the dicing blade A cuts the semiconductor wafer 4 to half the thickness of the semiconductor wafer 4, and then the dicing blade B having a blade width smaller than that of the dicing blade A, (Step cut) in which at least the cutting tool 3 is cut.

As the dicing blade, diamond particles are preferably embedded in the resin.

The thickness of the blade of the dicing blade is preferably as thin as possible, and more preferably 15 to 30 탆 or so. This is because the number of chips that can be formed from one semiconductor wafer 4 increases as the dicing line becomes narrower. This tendency is more conspicuous when a small semiconductor chip 5 is fabricated from a semiconductor wafer 4 having many dicing lines.

Since the dicing blade is worn out by dicing, the exposure amount of the blade determines the durability of the dicing blade.

When the dicing blade is thin, the strength of the dicing blade is weakened. Therefore, unless the blade exposure amount of the dicing blade is reduced, the strength can not be maintained. As a result, the dicing blade life is shortened. On the other hand, if the exposure amount of the blade is excessively increased, the dicing blade may crack during dicing, or the dicing blade may be twisted during dicing, causing cracking or cracking of the chip. For this reason, it is preferable that the exposure amount of such a thin dicing blade is 400 to 1000 mu m.

The semiconductor chip 5 is picked up in order to peel the semiconductor chip 5 adhered and fixed to the dicing / die-bonding film 10. The pick-up method is not particularly limited, and various conventionally known methods can be employed. For example, there is a method in which individual semiconductor chips 5 are pushed up by a needle from the side of the dicing and die-bonding film 10, and the semiconductor chip 5 which is pushed up is picked up by a pickup device have.

Here, the pick-up is carried out after irradiating ultraviolet rays to the pressure-sensitive adhesive layer 2 when the pressure-sensitive adhesive layer 2 is of ultraviolet curing type. As a result, the adhesive force of the pressure-sensitive adhesive layer 2 to the adhesive layer 3 is lowered, and the semiconductor chip 5 is easily peeled off. As a result, the semiconductor chip 5 can be picked up without damaging it. The conditions such as the irradiation intensity at the time of ultraviolet irradiation, the irradiation time, and the like are not particularly limited and may be appropriately set according to necessity.

The picked up semiconductor chip 5 is adhered and fixed to the adherend 6 via the adhesive layer 3 (die attach). The die attach temperature is not particularly limited and is, for example, 80 to 150 캜.

Subsequently, the semiconductor chip 5 and the adherend 6 are adhered to each other by heating the adhesive layer 3. The temperature of the heat treatment is preferably 80 占 폚 or higher, and more preferably 170 占 폚 or higher. The temperature of the heat treatment is preferably 200 占 폚 or lower, and more preferably 180 占 폚 or lower. When the temperature of the heat treatment is within the above range, good adhesion can be achieved. Further, the heat treatment time can be appropriately set.

Next, a wire bonding step for electrically connecting the tip of the terminal portion (inner lead) of the adherend 6 and the electrode pad (not shown) on the semiconductor chip 5 with the bonding wire 7 is performed. As the bonding wire 7, for example, a gold wire, an aluminum wire, a copper wire, or the like is used. The temperature at the time of wire bonding is preferably 80 占 폚 or higher, more preferably 120 占 폚 or higher, and the temperature is preferably 250 占 폚 or lower, more preferably 175 占 폚 or lower. Further, the heating time is performed for several seconds to several minutes (for example, one second to one minute). The connection is carried out by the combination of the vibration energy by the ultrasonic wave and the pressing energy by the applied pressure while being heated to be within the above temperature range.

Subsequently, a sealing step for sealing the semiconductor chip 5 with the sealing resin 8 is performed. This step is performed in order to protect the semiconductor chip 5 and the bonding wire 7 mounted on the adherend 6. This step is carried out by molding the sealing resin into a mold. As the sealing resin 8, for example, an epoxy resin is used. The heating temperature at the time of resin sealing is preferably 165 DEG C or higher, more preferably 170 DEG C or higher, and the heating temperature is preferably 185 DEG C or lower, more preferably 180 DEG C or lower.

If necessary, the sealing material may be further heated (post-curing step). Thus, the sealing resin 8, which is insufficiently cured in the sealing step, can be completely cured. The heating temperature can be appropriately set.

As described above, the step (I) of bonding the adhesive layer 3 of the dicing and die bonding film 10 to the semiconductor wafer 4, the step of dicing the semiconductor wafer 4 to form the semiconductor chip 5 The semiconductor chip 5 picked up by the step (III) of picking up the semiconductor chip 5 formed by the steps (II) and (II) together with the adhesive layer 3 and the step (III) The semiconductor device can be manufactured by a method including the step (IV) of attaching the adherend 6 to the surface of the adherend 6 through the intermediary of the step (3).

Example

Hereinafter, the present invention will be described in detail with reference to Examples, but the present invention is not limited to the following Examples unless it exceeds its gist.

The components used in the examples are described below.

Alumina filler 1: DAW-03 (spherical alumina filler, average particle size: 5.1 占 퐉, specific surface area: 0.5 m ² / g) manufactured by Denki Kagaku Kogyo Co.,

Alumina filler 2: ASFP-20 (spherical alumina filler, average particle diameter: 0.3 탆, specific surface area: 12.5 m ² / g) manufactured by Denki Kagaku Kogyo Co.,

Alumina filler 3: AO802 (spherical alumina filler, average particle diameter: 0.7 m, specific surface area: 7.5 m ² / g) manufactured by Admatech Co.,

Acrylic polymer 1: TAYASA RESIN SG-70L (acrylic copolymer, Mw: 900,000, glass transition temperature: -13 DEG C) manufactured by Nagase Chemtex Co.,

Acrylic polymer 2: TAYASA RESIN SG-P3 (acrylic copolymer, Mw: 85,000, glass transition temperature: 12 占 폚) manufactured by Nagase Chemtex Co.,

Phenol resin: MEH-7851H (phenol resin, Mw: 1580) manufactured by Meiwa Chemical Co.,

Epoxy resin: JER827 (bisphenol A type epoxy resin, Mw: 370) manufactured by Mitsubishi Chemical Corporation,

Silane coupling agent: KBM-403 (3-glycidoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co.,

The surface treatment method of the alumina filler will be described.

Alumina fillers 1 to 3 were surface-treated with a silane coupling agent to obtain surface-treated alumina fillers 1 to 3. The surface treatment was conducted by a dry method and treated with an amount of a silane coupling agent represented by the following formula.

Silane coupling agent throughput = (weight of alumina filler g × specific surface area of alumina filler m ² / g) / minimum coverage of silane coupling agent (m ² / g)

(M ² / g) of the silane coupling agent = 6.02 × 10 ²³ × 13 × 10 ^-20 / molecular weight of the silane coupling agent

[Examples 1 to 6 and Comparative Examples 2 to 6]

(Production of Die Bonding Film (Adhesive Layer)

The surface-treated alumina filler, acrylic polymer, phenol resin and epoxy resin were placed in a 150 mL polyethylene (PE) vessel and stirred at 2000 rpm (ARE-310) using a rotation revolving mixer Lt; / RTI > for 4 minutes. Subsequently, methyl ethyl ketone (MEK) was added and further stirred at 2000 rpm for 5 minutes to obtain an adhesive composition solution having a viscosity suitable for coating. Thereafter, the adhesive composition solution was filtered using a twill SUS mesh having a size of 400 mesh (aperture: 46 mu m), and a release treatment film (release liner) composed of a polyethylene terephthalate film having a thickness of 50 mu m, , And then dried at 130 캜 for 2 minutes to obtain a die bonding film (thickness is shown in Table 1).

(Preparation of dicing film)

80 parts of 2-ethylhexyl acrylate (sometimes referred to as " 2EHA "), 2-hydroxyethyl acrylate (sometimes referred to as " HEA ") was added to a reaction vessel equipped with a stirrer, a thermometer, 20 parts) and toluene (65 parts) were charged, and polymerization was carried out at 61 ° C for 6 hours in a stream of nitrogen to obtain an acrylic polymer X.

24.1 parts (90 mol% based on HEA) of 2-methacryloyloxyethyl isocyanate (sometimes referred to as " MOI ") was added to 100 parts of this acryl-based polymer X, Hour reaction treatment to obtain an acryl-based polymer Y.

Next, 3 parts of a polyisocyanate compound (trade name: "Colonate L", manufactured by Nippon Polyurethane Industry Co., Ltd.), 100 parts of a thermally expandable microspheres (trade name "Microsphere F- 35 parts of a thermosetting pressure-sensitive adhesive of active energy ray-curable type and 50 parts of a photopolymerization initiator (trade name: Irgacure 651, manufactured by Chiba Specialty Chemicals Co., Ltd.) Thereby preparing a pressure sensitive adhesive solution.

Subsequently, a pressure sensitive adhesive solution of an active energy ray-curable type heat-expandable pressure-sensitive adhesive was applied onto a base material (polypropylene) made of polypropylene having a thickness of 100 占 퐉 and dried to form a pressure-sensitive adhesive layer having a thickness of 10 占 퐉 on the base material.

Further, only a portion corresponding to the wafer attaching portion on the pressure-sensitive adhesive layer was irradiated with ultraviolet rays of 500 mJ / cm ² (ultraviolet irradiation cumulative light quantity), and the corresponding portion was ultraviolet cured to produce a dicing film.

(Production of dicing / die-bonding film)

The die bonding film was transferred onto the pressure-sensitive adhesive layer of the dicing film to prepare a dicing / die-bonding film.

[Comparative Example 1]

A dicing / die-bonding film was produced in the same manner as in Example 1 except that the production method of the die-bonding film was changed.

(Production of die bonding film)

Acrylic polymer, phenol resin and methyl ethyl ketone (MEK) were placed in a plastic cup container according to the compounding ratio shown in Table 1, and stirred at 3000 rpm for 4 minutes using a dispenser to obtain an adhesive composition solution. Thereafter, the adhesive composition solution was filtered using a twill SUS mesh having a size of 400 mesh (aperture: 46 mu m), and a release treatment film (release liner) composed of a polyethylene terephthalate film having a thickness of 50 mu m, And then dried at 130 DEG C for 2 minutes to obtain a die bonding film.

[evaluation]

The following evaluations were carried out using the obtained dicing / die-bonding film. The results are shown in Table 1.

(Amount of blade wear)

The back surface of the silicon bare wafer was ground until the thickness of the silicon bare wafer (8 inch diameter, thickness 750 占 퐉) became 100 占 퐉 by using a grinding machine (DGP-8760 manufactured by DISCO Corporation). A silicone bare wafer (thickness 100 占 퐉, 8 inch) was attached to the die bonding film (adhesive layer) of the dicing / die bonding film at 60 占 폚 at a speed of 10 m / min and a pressure of 0.15 mPa using a laminator. Thereafter, it was attached to the dicing ring and step cut was performed with a Dicer (DFD6760) manufactured by DISCO Corporation.

Hereinafter, step cut will be described with reference to Figs.

The height of the blade was set so that the first dicing blade 21 (Z1 blade) cuts the silicon bare wafer 24 to a depth of 50 mu m, and the silicon bare wafer 24 was cut at a speed of 50 mm / sec and at a rotation speed of 40000 rpm 100 m (see Fig. 4). Thereafter, the second dicing blade 23 (Z2 blade) was set so as to cut the substrate 1 to a depth of 10 mu m, cut out for 100 m along the cutout 22 under the condition of a speed of 50 mm / sec and a rotation speed of 45000 rpm, The silicon bare wafer 24 and the adhesive layer 3 were cut (see Fig. 5). On the other hand, the amount of washing water was set at 1 L / min for each of a cooler, a shower and a spray.

As the Z1 blade, 203O-SE 27HCDD manufactured by DISCO Co., Ltd. was used.

The specifications of the Z1 blade will be described below.

203O-SE 27HCDD manufactured by DISCO Co., Ltd.

Concentration (concentration of diamond particles): Standard concentration

Particle diameter (particle diameter of diamond particles): # 3500

Bonding: Standard type

Base shape: Sharp edge expectation

Inside and outside diameter dimensions: outer diameter 55.56mm (diameter), inner diameter 19.05mm (diameter)

Diameter symbol: C

Blade blade exposure: 0.76 to 0.89 mm

Kerf width (blade width): 0.030 to 0.035 mm

As the Z2 blade, 203O-SE 27HCBB was used.

The specifications of the Z2 blade will be described below.

203O-SE 27HCBB manufactured by DISCO Co., Ltd.

Concentration (concentration of diamond particles): Standard concentration

Particle diameter (particle diameter of diamond particles): # 3500

Bonding: Standard type

Expected shape: Sharp edge expectation

Inside and outside diameter dimensions: outer diameter 55.56mm (diameter), inner diameter 19.05mm (diameter)

Diameter symbol: C

Blade blade exposure: 0.51 to 0.64 mm

Cuff width (blade width): 0.020 to 0.025 mm

The abrasion amount of the Z2 blade was measured by a contact type blade alignment function of a dicing machine (DFD6361, manufactured by DISCO).

(Presence / absence of whisker occurrence (1))

Dicing was performed in the same manner as described in the blade wear amount except for the point of 300m dicing. The discrete wafer with adhesive (adhesive-attached chip) was peeled off from the dicing film, and the dicing line was observed with an optical microscope. A case where a whisker foreign matter having a length of 20 mu m or more was generated was judged as X, and a case where the foreign matter was less than 20 mu m or no whisker foreign matter was judged as?.

(Presence / absence of whisker (2))

Dicing was performed in the same manner as described in the blade wear amount except for the point of 300m dicing. The chip with the adhesive was peeled off from the dicing film and the intersection of the dicing lines was observed with an optical microscope. Observation points were observed at one point in a total of five places per one silicon bare wafer and at four locations around the periphery of the wafer (within 5 cm from the outer periphery). Of the total of 5 places, locations where whiskers of 100 占 퐉 or more occurred were counted. In Table 1, " 0/5 " indicates no occurrence of whiskers of 100 mu m or more at all five locations. In Table 1, " 5/5 " indicates occurrence of whiskers of 100 mu m or more at all five locations.

In Comparative Example 1 in which no alumina filler was added to the adhesive layer, the amount of abrasion of the blade was too small, and the cutting quality of the blade was deteriorated, and whiskers were generated. Further, in Comparative Examples 2 and 3 in which the thickness of the adhesive layer was large, the amount of abrasion of the blade was excessively large, and it was impossible to evaluate the occurrence of whiskers. In Comparative Example 4 in which the thickness of the adhesive layer was small, the amount of abrasion of the blade was too small and whisker occurred. Even in Comparative Example 5 in which the alumina filler was small, the amount of abrasion of the blade was too small and whisker occurred. Further, in Comparative Example 6 in which the alumina filler was large, the silicone bare wafer did not adhere to the adhesive layer, and the occurrence of wear amount and whisker could not be evaluated.

On the other hand, in Examples 1 to 6 in which an alumina filler was added to the adhesive layer so that the thickness of the adhesive layer / the total thickness of the base material and the pressure-sensitive adhesive layer were designed to be within a specific range, the amount of blade abrasion could be optimized and the occurrence of whiskers could be suppressed I could.

1: substrate
2: Pressure-sensitive adhesive layer
3: Adhesive layer
4: Semiconductor wafer
5: Semiconductor chip
6: adherend
7: Bonding wire
8: sealing resin
10: Dicing / die bonding film
11: Dicing film
21: first dicing blade
22: The cut
23: second dicing blade
24: Silicon bare wafer

Claims (3)

A dicing / die-bonding film in which a substrate, a pressure-sensitive adhesive layer, and an adhesive layer are laminated in this order,
After the silicon bare wafer having a thickness of 100 탆 was bonded to the adhesive layer, the first dicing blade was cut into 100 m of the silicon bare wafer at a depth of cut of 50 탆,
The abrasion amount of the second dicing blade when the silicone bare wafer and the adhesive layer are cut by 100 m to a notch depth at which the second dicing blade reaches at least the pressure sensitive adhesive layer along the notch of the first dicing blade 20 to 200 mu m,
Wherein the blade width of the second dicing blade is smaller than the blade width of the first dicing blade,
The conditions for forming the cutout by the first dicing blade were 50 mm / sec and the number of revolutions was 40000 rpm.
Wherein the cutting condition by the second dicing blade is a speed of 50 mm / sec and a rotation speed of 45000 rpm. The method according to claim 1,
Wherein the thickness of the adhesive layer / the total thickness of the base material and the pressure-sensitive adhesive layer is 0.045 to 0.9. 3. The method according to claim 1 or 2,
Wherein the adhesive layer comprises a spherical alumina filler as an abrasive,
Wherein the content of the spherical alumina filler in the adhesive layer is 60 to 88 wt%.

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