KR20140130029A - 묘화 장치 및 물품의 제조 방법 - Google Patents

묘화 장치 및 물품의 제조 방법 Download PDF

Info

Publication number
KR20140130029A
KR20140130029A KR20140047894A KR20140047894A KR20140130029A KR 20140130029 A KR20140130029 A KR 20140130029A KR 20140047894 A KR20140047894 A KR 20140047894A KR 20140047894 A KR20140047894 A KR 20140047894A KR 20140130029 A KR20140130029 A KR 20140130029A
Authority
KR
South Korea
Prior art keywords
charged particle
substrate
region
area
optical system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR20140047894A
Other languages
English (en)
Korean (ko)
Inventor
마사토 무라키
요시히로 히라타
Original Assignee
캐논 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 캐논 가부시끼가이샤 filed Critical 캐논 가부시끼가이샤
Publication of KR20140130029A publication Critical patent/KR20140130029A/ko
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/045—Beam blanking or chopping, i.e. arrangements for momentarily interrupting exposure to the discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H01J37/3177—Multi-beam, e.g. fly's eye, comb probe
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31761—Patterning strategy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR20140047894A 2013-04-30 2014-04-22 묘화 장치 및 물품의 제조 방법 Abandoned KR20140130029A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013095961A JP2014216631A (ja) 2013-04-30 2013-04-30 描画装置、及び物品の製造方法
JPJP-P-2013-095961 2013-04-30

Publications (1)

Publication Number Publication Date
KR20140130029A true KR20140130029A (ko) 2014-11-07

Family

ID=51788475

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20140047894A Abandoned KR20140130029A (ko) 2013-04-30 2014-04-22 묘화 장치 및 물품의 제조 방법

Country Status (5)

Country Link
US (1) US9293292B2 (enExample)
JP (1) JP2014216631A (enExample)
KR (1) KR20140130029A (enExample)
CN (1) CN104134603A (enExample)
TW (1) TWI556063B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6195349B2 (ja) * 2013-04-26 2017-09-13 キヤノン株式会社 描画装置、描画方法、および物品の製造方法
JP2016092136A (ja) * 2014-10-31 2016-05-23 キヤノン株式会社 描画装置、および、物品の製造方法
JP6616986B2 (ja) * 2015-09-14 2019-12-04 株式会社ニューフレアテクノロジー マルチ荷電粒子ビーム描画方法及びマルチ荷電粒子ビーム描画装置
JP2019102661A (ja) * 2017-12-04 2019-06-24 株式会社ニューフレアテクノロジー ビーム偏向形状取得方法及びブランキングアパーチャアレイの配置角度取得方法
WO2023017186A1 (en) * 2021-08-13 2023-02-16 Qdevil Aps Circuit for transporting charged particles

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3647128B2 (ja) * 1996-03-04 2005-05-11 キヤノン株式会社 電子ビーム露光装置とその露光方法
JPH1092356A (ja) * 1996-09-19 1998-04-10 Seiko Instr Inc 集束イオンビームの光軸調整方法および集束イオンビーム装置
JP4308504B2 (ja) 2002-11-21 2009-08-05 株式会社荏原製作所 電子線装置及びその装置を用いたデバイス製造方法
CN101681809B (zh) * 2007-12-28 2012-04-25 株式会社尼康 曝光装置、曝光方法以及器件制造方法
EP2556527B1 (en) * 2010-04-09 2017-03-22 Carl Zeiss Microscopy GmbH Charged particle detection system and multi-beamlet inspection system
EP2633544B1 (en) * 2010-10-26 2014-09-03 Mapper Lithography IP B.V. Modulation device and method of manufacturing a fiber fixation substrate for use in a lithography system
JP2013045838A (ja) * 2011-08-23 2013-03-04 Canon Inc 描画装置、および、物品の製造方法
JP2013178961A (ja) * 2012-02-28 2013-09-09 Canon Inc 荷電粒子線装置及び物品製造方法

Also Published As

Publication number Publication date
TWI556063B (zh) 2016-11-01
CN104134603A (zh) 2014-11-05
US20140319367A1 (en) 2014-10-30
JP2014216631A (ja) 2014-11-17
TW201441771A (zh) 2014-11-01
US9293292B2 (en) 2016-03-22

Similar Documents

Publication Publication Date Title
US9236224B2 (en) Drawing apparatus and method of manufacturing article
JP5835892B2 (ja) 荷電粒子線描画装置及びデバイス製造方法
JP2008521221A (ja) 粒子ビーム露光装置のためのパターンロック装置
JP6128744B2 (ja) 描画装置、描画方法、および、物品の製造方法
KR20140130029A (ko) 묘화 장치 및 물품의 제조 방법
KR101721070B1 (ko) 묘화 장치 및 물품의 제조 방법
KR101790829B1 (ko) 묘화 장치 및 물품의 제조 방법
US9558916B2 (en) Lithography system and method of manufacturing articles
KR20150018397A (ko) 묘화 데이터 생성 방법, 처리 장치, 기억 매체, 묘화 장치, 및 물품의 제조 방법
US20150131075A1 (en) Drawing apparatus, and method of manufacturing article
US20150129779A1 (en) Drawing apparatus, and method of manufacturing article
US20160126061A1 (en) Drawing apparatus and device manufacturing method
US20150187540A1 (en) Drawing apparatus and method of manufacturing article
US20150001419A1 (en) Drawing apparatus, and method of manufacturing article
JP2016115811A (ja) 描画装置、及び物品の製造方法

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

PC1904 Unpaid initial registration fee

St.27 status event code: A-2-2-U10-U13-oth-PC1904

St.27 status event code: N-2-6-B10-B12-nap-PC1904

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000