KR20140120635A - Lighting device - Google Patents

Abstract

The present invention relates to a lighting device. The lighting device according to one embodiment of the present invention comprises: a light source module including a substrate having at least one hole and multiple light emitting elements disposed on the top of the substrate; a power supply unit which includes a support substrate having at least one extension substrate and supplies a power signal to the substrate of the light source module; and a soldering unit electrically connecting the substrate of the light source module and the extension substrate of the power supply unit, wherein the extension substrate is inserted into the hole of the substrate, with the end of the extension substrate disposed on the top surface of the substrate through the hole of the substrate. According to the embodiment described above, the electrical connection between the light source module and the power supply unit can be effectively done, and the manufacturing costs can be reduced since a separate wire or connector is not required for the electrical connection between the light source module and the power supply unit.

Description

LIGHTING DEVICE

An embodiment relates to a lighting device.

Light emitting diodes (LEDs) are a type of semiconductor devices that convert electrical energy into light. The light emitting diode has advantages of low power consumption, semi-permanent lifetime, fast response speed, safety, and environmental friendliness compared with conventional light sources such as fluorescent lamps and incandescent lamps. Therefore, much research has been conducted to replace conventional light sources with light emitting diodes. Light emitting diodes are increasingly used as light sources for various lamps used in indoor / outdoor, liquid crystal display devices, electric sign boards, streetlights, and the like .

The embodiments provide a lighting device capable of electrically connecting the light source module and the power supply unit effectively.

Further, it is an object of the present invention to provide an illumination device which does not require a separate wire or connector when electrically connecting the light source module and the power supply unit.

Further, the embodiment provides a lighting device capable of reducing manufacturing cost.

Further, the embodiment provides a lighting device capable of improving the heat radiation performance.

Further, the embodiment provides a lighting device capable of improving the appearance quality.

Further, the embodiment provides an illumination device capable of improving withstand voltage characteristics.

An illumination device according to an embodiment includes a light source module including a substrate having at least one hole and a plurality of light emitting elements arranged on an upper surface of the substrate; A power supply providing a power supply signal to a substrate of the light source module, the power supply providing at least one extension substrate; And a soldering portion for electrically connecting the substrate of the light source module and the extension substrate of the power supply portion, wherein the extension substrate is inserted into a hole of the substrate, and an end of the extension substrate passes through a hole of the substrate And is disposed on the upper surface of the substrate. According to the lighting apparatus of this embodiment, it is possible to electrically connect the light source module and the power supply unit effectively, and it is possible to reduce the manufacturing cost since a separate wire or connector is not required when the light source module and the power supply unit are electrically connected .

The use of the lighting apparatus according to the embodiment has an advantage that the light source module and the power supply unit can be electrically connected effectively.

Further, there is an advantage that a separate wire or connector is not required when the light source module is electrically connected to the power supply unit.

Further, there is an advantage that the manufacturing cost can be reduced.

Further, there is an advantage that the heat radiation performance can be improved.

Further, there is an advantage that the appearance quality can be improved.

In addition, there is an advantage that the withstand voltage characteristic can be improved.

1 is a perspective view of a lighting apparatus according to a first embodiment viewed from above;
2 is a perspective view of the lighting device shown in Fig. 1 as viewed from below.
3 is an exploded perspective view of the illumination device shown in Fig.
4 is an exploded perspective view of the illumination device shown in Fig.
5 is a cross-sectional view of the illumination device shown in Fig.
FIG. 6 is a perspective view showing a state where the light source module shown in FIG. 3 and the power supply unit are combined.
FIG. 7 is a perspective view showing a state where the light source module shown in FIG. 4 and the power supply unit are combined.
8 is a conceptual view for explaining the electrical connection between the substrate and the extension substrate shown in Figs. 3 and 4. Fig.
9 is a view for explaining a coupling structure of a connection part and a power supply part;
10 to 11 are views for explaining a coupling structure of a supporting substrate and a heat sink.
12 is a perspective view from above of a lighting apparatus according to a second embodiment;
13 is a perspective view of the lighting device shown in Fig. 12 as viewed from below. Fig.
14 is an exploded perspective view of the illumination device shown in Fig.
Fig. 15 is an exploded perspective view of the illumination device shown in Fig. 13; Fig.
16 is a cross-sectional view of the illumination device shown in Fig.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.

In the description of the embodiments according to the present invention, in the case where an element is described as being formed on "on or under" another element, the upper (upper) or lower (lower) (On or under) all include that the two elements are in direct contact with each other or that one or more other elements are indirectly formed between the two elements. Also, when expressed as 'on or under', it may include not only an upward direction but also a downward direction with respect to one element.

Hereinafter, a lighting apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings.

First Embodiment

1 is a perspective view of the lighting apparatus shown in Fig. 1, Fig. 3 is an exploded perspective view of the lighting apparatus shown in Fig. 1, Fig. 3 is an exploded perspective view of the lighting apparatus shown in Fig. 1, 4 is an exploded perspective view of the illumination device shown in Fig. 2, and Fig. 5 is a sectional view of the illumination device shown in Fig.

1 to 5, a lighting apparatus according to the first embodiment includes a cover 100, a light source module 200, a heat discharger 300, a power supply unit 400, and a socket 500 . Hereinafter, each component will be described in detail.

≪ Cover (100) >

The cover 100 has a bulb or hemispherical shape and has an opening 130 in which the hollow is hollow and the one portion is opened.

The cover 100 is optically coupled to the light source module 200. For example, the cover 100 may diffuse, scatter, or excite light emitted from the light source module 200.

The cover 100 is coupled to the heat discharging body 300. Specifically, the cover 100 may engage with the second heat dissipating unit 330 of the heat dissipating unit 300.

The cover 100 may have a coupling portion 110. The coupling portion 110 may be coupled to the heat discharging body 300. Specifically, the engaging portion 110 protrudes from the end of the cover 100 forming the opening 130, and may be plural. The plurality of coupling portions 110 may be spaced apart from each other by a predetermined distance. When the plurality of coupling portions 110 are spaced apart from each other by a predetermined distance, damage due to a force (lateral pressure or tensile force) generated when the coupling portion 110 is fitted in the heat sink 300 can be prevented.

The coupling portion 110 may have a threaded fastening structure corresponding to the threaded groove structure of the heat dissipator 300 although not shown in the figure. The threaded structure of the heat discharging body 300 and the threaded groove structure of the engaging portion 110 can facilitate the coupling of the cover 100 and the heat discharging body 300 and improve workability.

The material of the cover 100 may be PC (polycarbonate) for light diffusion in order to prevent the user's glare by the light emitted from the light source module 200. In addition, the cover 100 may be any one of glass, plastic, polypropylene (PP), and polyethylene (PE).

The inner surface of the cover 100 is corroded and a predetermined pattern is applied to the outer surface to scatter light emitted from the light source module 200. Therefore, the user's glare can be prevented.

The cover 100 can be manufactured by blow molding for post-light distribution.

<Light source module 200>

The light source module 200 includes a light emitting module 230 disposed on the heat emitting body 300 and emitting a predetermined light toward the cover 100.

More specifically, the light source module 200 may include a substrate 210 and a light emitting device 230 disposed on the substrate 210.

The substrate 210 may be a printed circuit pattern on an insulator. For example, a printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, . Further, the substrate 210 may be a printed circuit pattern as a transparent or opaque resin. Here, the resin may be a thin insulating sheet having the circuit pattern.

The surface of the substrate 210 may be a material that efficiently reflects light, or may be coated with a color in which light is efficiently reflected, for example, white, silver, or the like.

The substrate 210 may have a first hole H1 for coupling with the power supply unit 400. [ More specifically, the description will be made with reference to Figs. 6 to 8. Fig.

FIG. 6 is a perspective view showing a state where the light source module 200 and the power supply unit 400 shown in FIG. 3 are combined. FIG. 7 is a perspective view illustrating the light source module 200 and the power supply unit 400 shown in FIG. And FIG. 8 is a conceptual view for explaining the electrical connection between the substrate 210 and the extended substrate 450 shown in FIGS. 3 and 4. As shown in FIG.

3 to 8, the substrate 210 has a first hole H1, and the extended substrate 450 of the power supply unit 400 is inserted into the first hole H1.

8, the height D1 from the upper surface of the substrate 210 to the end of the extended substrate 450 passing through the first hole H1 of the substrate 210, or the height D1 of the extended substrate 450, The length D1 of the portion of the substrate 210 through the first hole H1 may be 1.5 mm or more and 2.0 mm or less. If D1 is less than 1.5 mm, it is difficult to electrically connect the substrate 210 and the extended substrate 450, so that a contact failure between the substrate 210 and the extended substrate 450 may occur. The terminal 210 of the substrate 210 and the terminal 451 of the extended substrate 450 are electrically connected to each other by soldering. (700). At this time, if D1 is less than 1.5 mm, the terminal 451 of the extension board 450 may not be in contact with the soldering portion 700 sufficiently. In this case, a contact failure may occur between the substrate 210 and the extended substrate 450. Therefore, D1 is preferably 1.5 mm or more. If D1 is larger than 2.0 mm, a dark portion may be generated when the light source module 200 is driven. Specifically, the arm portion may be formed around the extended substrate 450. [ Such a dark portion lowers the light efficiency of the lighting apparatus, and may cause a visual inconvenience to the users. Therefore, D1 is preferably 2.0 mm or less.

The shape of the first hole (H1) may correspond to the shape of the extended substrate (450). Here, the diameter of the first hole (H1) may be larger than the diameter of the extended substrate (450). That is, the first hole H1 may be of a sufficient size to allow the extension substrate 450 to be inserted. Accordingly, the extended substrate 450 inserted in the first hole H1 may not directly contact the substrate 210. [ In the first hole H1, the distance D2 between the substrate 210 and the extension substrate 450 may be greater than 0 and less than or equal to 0.2 mm. If D2 is 0, it is difficult to insert the extension substrate 450 into the first hole H1 of the substrate 210, and an electrical short circuit between the extension substrate 450 and the substrate 210 may occur unintentionally. If D2 exceeds 0.2 mm, solder material may flow through the first hole H1 to the support substrate 410 during soldering. In this case, the printed circuit formed on the support substrate 410 may be soldered There may arise a problem that the material may be electrically short-circuited, and it may be difficult to accurately place the extension substrate 450 in a position where it should be located in the first hole H1. Therefore, it is preferable that D2 is larger than 0 and smaller than or equal to 0.2 mm.

3 to 5, the substrate 210 has a second hole H2 for confirming the position of the substrate 210 accurately when the substrate 210 is mounted on the heat discharging body 300 . The projection P1 of the heat discharging body 300 is inserted into the second hole H2. The projecting portion P1 is disposed on the upper surface of the inner side portion 331 of the heat discharging body 300 and can guide the position of the substrate 210 with the heat discharging body 300. [

The substrate 210 may have a third hole H3 for fixing the substrate 210 to the heat discharging body 300. The fastening means such as a screw is inserted into the seventh hole H7 of the heat discharging body 300 through the third hole H3 of the substrate 210 so that the substrate 210 can be fixed to the heat discharging body 300 .

The plurality of light emitting devices 230 may be disposed on one side of the substrate 210. Here, the light emitting device 230 may be disposed on a predetermined region of the substrate 210 disposed on the upper portion 311 of the heat discharging body 300. That is, the light emitting device 230 may be disposed on the substrate 210, particularly on the upper portion 311 of the heat discharging body 300. When the light emitting device 230 is disposed on the upper portion 311 of the heat discharging body 300, the heat emitted from the light emitting element 230 is transmitted to the upper portion 311 of the heat emitting body 300, As shown in FIG. Therefore, the heat radiation performance can be improved.

The number of the light emitting devices 230 may be equal to or less than the number of the upper portions 311 of the heat discharging body 300. Specifically, the light emitting device 230 may correspond one-to-one with the upper portion 311 of the heat emitting element 300 or may be smaller than the number of the upper portions 311 of the heat emitting element 300.

The light emitting device 230 may be a light emitting diode chip that emits red, green, or blue light, or a light emitting diode chip that emits ultraviolet light. Here, the light emitting diode may be a lateral type or a vertical type.

The light emitting device 230 may be a HV (High-Voltage) LED package. HV LED The HV LED chip in the package is powered by DC power and is turned on at voltages greater than 20 volts (V). And, a high-voltage (HV) LED package has a high power consumption of about 1W. For reference, a typical conventional LED chip is turned on at 2 to 3 (V). Since the light emitting device 230 has a high power consumption of about 1 W in the HV LED package, it can have the same or similar performance as the conventional one with a small number of products, thereby reducing the production cost of the lighting device according to the embodiment .

A lens may be disposed on the light emitting element 230. The lens is arranged to cover the light emitting element 230. Such a lens can adjust the direction of light emitted from the light emitting device 230 or the direction of light. The lens is a hemispherical type and can be a light transmitting resin such as a silicone resin or an epoxy resin without an empty space. The light transmitting resin may include a phosphor dispersed wholly or partially.

When the light emitting element 230 is a blue light emitting diode, the phosphor included in the light transmitting resin may be a garnet (YAG, TAG), a silicate, a nitride, an oxynitride, Or a combination thereof.

Natural light (white light) can be realized by including only a yellow phosphor in the translucent resin. However, a green phosphor or a red phosphor may be further included to improve the color rendering index and reduce the color temperature.

When various kinds of phosphors are mixed in the light-transmitting resin, the addition ratio of the phosphors may be more green-based phosphors than red-based phosphors, and yellow phosphors may be used more than green-based phosphors. YAG, silicate, and oxynitride systems of the garnet system may be used as the yellow phosphor, silicate system and oxynitride system may be used as the green system phosphor, and nitrides may be used as the red system phosphor. have. A layer having a red-based phosphor, a layer having a green-based phosphor, and a layer having a yellow-based phosphor may be separately formed in addition to a mixture of various kinds of phosphors in the translucent resin.

<Heat Sink 300>

The heat discharging body 300 receives heat radiated from the light source module 200 and radiates heat. In addition, the heat discharging body 300 can dissipate heat by receiving the heat discharged from the power supply unit 400.

The heat dissipating unit 300 may include a first heat dissipating unit 310 and a second heat dissipating unit 330.

The material of the first heat dissipation unit 310 may be different from the material of the second heat dissipation unit 330. Specifically, the first heat dissipation unit 310 may be a non-insulation material, and the second heat dissipation unit 330 may be an insulation material. If the first heat dissipating part 310 is a non-insulating material, heat emitted from the light source module 200 can be dissipated quickly. If the second heat dissipating part 330 is an insulating material, the outer surface of the heat dissipating body 300 becomes an insulator , The withstand voltage characteristic can be improved, and the user can be protected from electric energy. For example, the material of the first heat dissipation unit 310 may be a metal such as aluminum, copper, and magnesium, and the second heat dissipation unit 330 may be formed of polycarbonate (PC), ABS (Acrylonitrile (AN) Butadiene (BD), styrene (SM)), and the like. Here, the second heat-radiating portion 330 made of resin may include metal powder. If the second heat-radiating portion 330 is made of a resin material, the heat-radiating body is made of a metal material and the appearance of the conventional heat-radiating body is easier than that of the conventional heat-radiating body 330. The advantage that appearance defects due to coating or anodizing of the conventional heat- .

The first thermal conductivity (W / (mk) or W / m ° C) of the material constituting the first heat radiation portion 310 may be greater than the second thermal conductivity of the material of the second heat radiation portion 330. Since the light source module 200 is disposed closer to the first heat radiation portion 310 than the second heat radiation portion 330 so that the thermal conductivity of the first heat radiation portion 310 is greater than the thermal conductivity of the second heat radiation portion 330 This is because it is advantageous to improve the heat radiation performance. For example, the first heat dissipation unit 310 may be aluminum having a high thermal conductivity, and the second heat dissipation unit 330 may be a PC having a thermal conductivity lower than the thermal conductivity of the first heat dissipation unit 310. Here, the first heat-radiating part 310 is not limited to aluminum and the second heat-radiating part 330 is not limited to PC.

The light source module 200 is disposed on the first heat dissipation unit 310. Specifically, the substrate 210 of the light source module 200 and the light emitting device 230 may be disposed on the upper portion 311 of the first heat dissipating unit 310.

The first heat dissipation unit 310 may include an upper portion 311 and a lower portion 313.

The upper portion 311 has a flat plate shape and the substrate 210 and the light emitting element 230 of the light source module 200 are disposed on the upper portion 311 to receive heat directly from the light source module 200. The upper portion 311 may discharge the heat received from the light source module 200 to the outside or may transmit the heat to the lower portion 313. [

The shape of the upper portion 311 is not limited to a flat plate shape. For example, the shape of the upper portion 311 may be a convex plate whose center portion is upward or downward, or a hemispherical plate. The shape of the upper portion 311 may be various shapes such as a circular shape or an elliptical shape.

The upper portion 311 may extend in a direction substantially perpendicular to the longitudinal direction of the lower portion 313 from the upper end of the lower portion 313. [ Here, the upper portion 311 and the lower portion 313 may be perpendicular, an acute angle, or an obtuse angle.

The upper portion 311 may be plural. Specifically, the number of the upper portions 311 may be equal to or greater than the number of the light emitting devices 230. A substrate 210 and a light emitting device 230 may be disposed on each upper portion 311.

At least two upper portions 311 of the plurality of upper portions 311 may be provided with a fourth hole H4 for fixing the first heat radiation portion 310 to the second heat radiation portion 330. [ A fastening means such as a screw may be inserted into the sixth hole H6 of the second heat dissipating unit 330 through the fourth hole H4.

The upper portion 311 may be disposed on the outer side portion 335 of the second heat dissipating portion 330. Specifically, the upper portion 311 may be disposed on the upper surface of the outer portion 335 of the second heat dissipating portion 330.

In addition, the upper portion 311 may be disposed in the cavity 335a of the second heat dissipating portion 330. The number of the upper portions 311 and the number of the cavities 335a may be the same.

A heat dissipating plate (not shown) or a heat dissipating grease may be disposed between the upper portion 311 and the substrate 210 of the light source module 200 to quickly conduct heat from the light source module 200 to the upper portion 311 have.

The lower portion 313 may be disposed inside the second heat radiation portion 330. Specifically, the lower portion 313 may be disposed on the first storage portion 333 of the second heat dissipating portion 330. [ When the lower portion 313 is disposed on the first housing portion 333 of the second heat dissipating portion 330, the lower portion 313 of the metal material is not disposed on the outer surface of the illumination device according to the first embodiment, It is possible to protect the user from the electric energy generated in the work 400. Since the heat radiator of the conventional lighting device is entirely made of metal and the appearance of the conventional lighting device is also a metal, the electric energy generated by the internal power supply can affect the user.

The lower portion 313 may be disposed between the inner portion 331 and the outer portion 335 of the second heat dissipating portion 330. If the lower portion 313 is disposed between the inner side portion 331 and the outer side portion 335 of the second heat dissipating portion 330, the lower portion 313 of the metal material is not disposed on the outer surface of the illuminating device according to the first embodiment , And protects the user from the electric energy generated in the power supply unit 400.

The lower portion 313 may have a hollow cylindrical shape. Or the lower portion 313 may be in the shape of a pipe. Specifically, the lower portion 313 may have a cylindrical shape, a different cylindrical shape, or a polygonal shape. The diameter of the lower portion 313 having a cylindrical shape can be constant. Specifically, the diameter of the lower portion 313 may be constant from the upper end to the lower end. When the diameter of the lower portion 313 is constant, when the lighting apparatus according to the first embodiment is manufactured, the first heat-radiating portion 310 is coupled to the second heat-radiating portion 330 and the first heat- The second heat sink 330 can be easily separated from the second heat sink 330.

The lower portion 313 may have a predetermined length along the longitudinal direction of the second heat radiating portion 330. The length of the lower portion 313 may extend from the upper end to the lower end of the second heat dissipating portion 330 or may extend only from the upper end to the middle portion of the second heat dissipating portion 330. Therefore, the length of the lower portion 313 is not limited to that shown in the drawings. As the length of the lower portion 313 is longer, the heat radiation performance can be further improved.

A pin or an embossing structure may be additionally disposed on at least one of the outer surface or the inner surface of the lower portion 313. [ When the fin or the embossed structure is disposed in the lower portion 313, the surface area of the lower portion 313 itself is widened, so that there is an advantage that the heat radiation area is widened. If the heat radiating area is widened, the heat radiation performance of the heat radiator 300 can be improved.

The upper portion 311 and the lower portion 313 may be integral. In this specification, the upper part 311 and the lower part 313 are integrated, meaning that the upper part 311 and the lower part 313 are separate from each other and the joint part between the upper part 311 and the lower part 313 is welded, The upper portion 311 and the lower portion 313 are connected to each other without physical breakage. Since the contact resistance between the upper portion 311 and the lower portion 313 is close to zero, if the upper portion 311 and the lower portion 313 are integrated, the heat transfer rate from the upper portion 311 to the lower portion 313 becomes There is a better advantage than if it is not an integral part. If the upper part 311 and the lower part 313 are integrated, there is no need for a process for joining the two parts together, for example, a pressing process, and thus there is an advantage of cost reduction in the manufacturing process.

The total surface area of the plurality of tops 311 may be equal to or greater than the surface area of the bottoms 313. Specifically, the total surface area of the plurality of upper portions 311 may be one to two times or less, based on the surface area of the lower portion 313. The total surface area of the upper portions 311 that receive heat directly from the light source module 200 is smaller than the surface area of the lower portion 313 because the total surface area of the plurality of upper portions 311 is less than 1 times the surface area of the lower portion 313. [ The heat transfer efficiency can be lowered. On the other hand, if the total surface area of the plurality of upper portions 311 exceeds twice the surface area of the lower portion 313, most of the heat is concentrated on the upper portion 311, which may deteriorate heat radiation efficiency.

The first heat-radiating portion 310, that is, the upper portion 311 and the lower portion 313 can be manufactured by the following method.

A cylindrical aluminum (Al) pipe is prepared, and the pipe is cut to a desired length by the designer. Then, the cut aluminum pipe is cut by a predetermined length from one end to the other end. The cutting process is repeated according to the number of the upper portions 311. Finally, the first heat-radiating portion 310 of the lighting device according to the first embodiment can be manufactured by folding the cut portions of the aluminum pipe in the outward direction.

The second heat dissipating unit 330 together with the cover 100 forms the appearance of the lighting apparatus according to the first embodiment and can accommodate the first heat dissipating unit 310 and the power supply unit 400.

The first heat dissipation unit 310 is disposed inside the second heat dissipation unit 330. The second heat dissipating unit 330 may have a cavity 335a for accommodating the upper portion 311 of the first heat dissipating unit 310 and a first accommodating unit 333 for accommodating the lower portion 313. The cavity 335a may be formed in a plurality of cavities 331 to accommodate the plurality of upper portions 311. The first cavity 333 may include an inner portion 331 and an outer portion 335 of the second radiating portion 330, And may have a predetermined depth as long as the length of the lower portion 313. The cavity 335a may be formed on the outer side 335 of the second heat dissipation part 330. [

The second heat dissipating unit 330 may have a second accommodating unit 331a for accommodating the power supply unit 400. Since the second housing portion 331a is formed of a non-insulating resin material unlike the housing portion of the conventional heat radiator of the lighting apparatus, the power supply unit 400 housed in the second housing portion 331a, Can be used as a non-isolated PSU. Since the non-insulated PSU has a lower unit cost than the insulated PSU, the manufacturing cost of the lighting apparatus according to the embodiment can be reduced.

The second heat dissipating unit 330 may include an inner unit 331, an outer unit 335, and a connecting unit 337.

The inner side portion 331 of the second heat dissipation portion 330 is surrounded by the first heat dissipation portion 310. The inner side portion 331 of the second heat dissipation portion 330 has a shape corresponding to the outer shape of the first heat dissipation portion 310.

The substrate 210 of the light source module 200 is disposed on the inner side portion 331.

The inner side portion 331 is disposed inside the lower portion 313 of the first heat releasing portion 310 and may have a second accommodating portion 331a for accommodating the power supply providing portion 400.

The inner side portion 331 may have a fifth hole H5 through which the extended substrate 450 of the power supply unit 400 disposed in the second storage portion 331a passes.

A protrusion P1 inserted into the second hole H2 of the substrate 210 may be formed on the upper surface of the inner side portion 331. [

The outer portion 335 of the second heat dissipating unit 330 surrounds the first heat dissipating unit 310. Here, the outer side portion 335 of the second heat dissipation portion 330 may have a shape corresponding to the outer shape of the first heat dissipation portion 310.

An upper portion of the first heat dissipation unit 310, a substrate 210 of the light source module 200, and a light emitting device 230 are sequentially disposed on the outer side portion 335.

The outer portion 335 may have a cavity 335a in which the upper portion 311 of the first heat radiation portion 310 is disposed.

The outer side portion 335 has a sixth hole H6 for fixing the upper portion 311 of the first heat dissipating portion 310 and a seventh hole H7 for fixing the substrate 210 of the light source module 200 .

The outer portion 335 may have a pin 335b. Since the fin 335b widens the surface area of the outer side portion 335 of the second heat dissipating portion 330, the heat dissipating performance of the heat dissipating body 300 can be improved.

The connection portion 337 of the second heat dissipation unit 330 may be connected to the lower end of the inner side portion 331 and the outer side portion 335. The connection portion 337 is engaged with the socket 500. The connection portion 337 may have a threaded structure corresponding to the thread groove formed in the socket 500. The connection portion 337 may form the second accommodating portion 331a together with the inner side portion 331. [

The connection portion 337 may be coupled to the power supply unit 400 to fix the power supply unit 400 in the second accommodating portion 331a. This will be described below with reference to FIG.

9 is a view for explaining a coupling structure of the connection portion 337 and the power supply unit 400. FIG.

Referring to Fig. 9, the connecting portion 337 has a fastening groove 337h. The fastening groove 337h has a predetermined diameter so that the protruding portion 470 of the supporting substrate 410 can be inserted. The fastening groove 337h may be formed in accordance with the number of protrusions 470 of the supporting substrate 410.

The support substrate 410 of the power supply unit 400 has a protrusion 470 coupled to the coupling groove 337h of the connection portion 337. [ The protrusions 470 may extend outward at both lower edges of the support substrate 410. The shape of the protruding portion 470 may be such that the supporting substrate 410 is easily accommodated in the second accommodating portion 331a and conversely the supporting substrate 410 is difficult to escape from the second accommodating portion 331a. For example, the protrusion 470 may have a hook shape.

When the protruding portion 470 of the supporting substrate 410 is coupled to the engaging groove 337h of the connecting portion 337, the supporting substrate 410 is difficult to escape out of the second accommodating portion 331a, And can be firmly fixed in the second accommodating portion 331a. Therefore, a separate additional operation, for example, a molding process of the power supply unit 400 is unnecessary, and thus the manufacturing cost of the lighting apparatus can be reduced.

1 to 5, the first accommodating portion 333 of the second heat dissipating portion 330 is formed between the inner side portion 331 and the outer side portion 335 of the second heat dissipating portion 330, The lower portion 313 of the first heat-radiating portion 310 is accommodated. The first accommodating portion 333 may have a predetermined depth corresponding to the length of the lower portion 313 of the first radiating portion 310. Here, the first accommodating portion 333 does not completely separate the inner side portion 331 and the outer side portion 335 from each other. That is, the first receiving portion 333 is not formed at the lower end of the inner portion 331 and the lower end of the outer portion 335, so that the inner portion 331 and the outer portion 335 can be connected to each other.

The first heat dissipation unit 310 and the second heat dissipation unit 330 may be separately manufactured and then the first heat dissipation unit 310 may be coupled to the second heat dissipation unit 330. [ The lower portion 313 of the first heat dissipating portion 310 is inserted into the first heat dissipating portion 333 of the second heat dissipating portion 330 and the upper portion 311 of the first heat dissipating portion 310 is inserted into the second heat dissipating portion 330 of the second heat dissipating portion 330. [ The first heat dissipation unit 310 and the second heat dissipation unit 330 may be coupled to each other through a bonding process or a fastening process after being inserted into the cavity 335a of the heat dissipation unit 330. [

The first heat dissipation unit 310 and the second heat dissipation unit 330 are formed integrally with each other. The first heat dissipation unit 310 and the second heat dissipation unit 330 may be separated from each other. Specifically, the first heat dissipation unit 310 and the second heat dissipation unit 330 are bonded to each other as a result of a predetermined process. Accordingly, the first heat dissipation unit 310 and the second heat dissipation unit 330 are difficult to separate from each other. It should be noted that the first heat dissipation unit 310 and the second heat dissipation unit 330 are separated from each other in FIGS. 3 to 4 for convenience of explanation. In this specification, the first heat dissipating unit 310 and the second heat dissipating unit 330 are integrally formed or the separation is restricted, which does not mean that they are not separated from each other by any force, For example, by a mechanical force. However, if the first heat-radiating portion 310 and the second heat-radiating portion 330 are separated by the predetermined force, It should be understood that it is difficult to return to the state.

If the first heat dissipation unit 310 and the second heat dissipation unit 330 are integrally formed or the first heat dissipation unit 310 and the second heat dissipation unit 330 are separated from each other, The contact resistance between the first portion 310 and the second heat dissipating portion 330 made of resin may be lower than the case where the first heat dissipating portion 310 and the second heat dissipating portion 330 are not integrated. The contact resistance is lowered, so that the same or similar heat dissipation performance as that of the conventional heat dissipation member (made of a metal material as a whole) can be secured. When the first heat dissipation unit 310 and the second heat dissipation unit 330 are integrated with each other, the first heat dissipation unit 310 and the second heat dissipation unit 330 are not integrated with each other, It is possible to further reduce breakage or damage of the battery 330.

In order to integrally form the first heat dissipating unit 310 and the second heat dissipating unit 330, an insert injection machining method can be used. The insert injection machining method is a method in which a previously manufactured first heat dissipating unit 310 is inserted into a mold for molding the second heat dissipating unit 330 and then the material constituting the second heat dissipating unit 330 is melted And injected into the mold.

&Lt; Power supply unit 400 >

The power supply unit 400 may include a support substrate 410 and a plurality of components 430.

The support substrate 410 may have a printed pattern that mounts a plurality of components 430 and receives a power supply signal provided through the socket 500 and provides a predetermined power supply signal to the light source module 200.

The supporting substrate 410 may have a rectangular plate shape. The support substrate 410 is accommodated in the second storage portion 331a of the second heat dissipation portion 330. More specifically, the description will be made with reference to Figs. 10 to 11. Fig.

FIGS. 10 to 11 are views for explaining a coupling structure of the supporting substrate 410 and the heat discharging body 300.

10 to 11, first and second guide portions 338a and 338b for guiding one side portion of the supporting substrate 410 on both sides are provided in the second accommodating portion 331a of the heat discharging body 300 Lt; / RTI &gt; A guide groove 338g may be formed between the first guide portion 338a and the second guide portion 338b to receive one side of the support substrate 410. [

W1 and W2 between the first guide portion 338a and the second guide portion 338b may become narrower as they enter the second storage portion 331a. Or the diameters W1 and W2 of the guide groove 338g may become narrower as they enter the second accommodating portion 331a. When the spaces W1 and W2 between the first guide portion 338a and the second guide portion 338b or the diameters W1 and W2 of the guide groove 338g become narrower as they enter the second housing portion 331a The step of inserting the supporting substrate 410 into the second housing part 331a is simplified and the supporting substrate 410 can be precisely coupled to the inside of the heat discharging body 300. [

The gap W1 between the first guide portion 338a and the second guide portion 338b at the entrance of the second storage portion 331a allows the support substrate 410 to be easily inserted into the second storage portion 331a It is preferable that the thickness of the support substrate 410 is larger than the thickness of the support substrate 410 by 1 mm. That is, the gap between one surface of the support substrate 410 and the first guide portion 338a is 0.5 mm or more.

The distance W2 between the first guide portion 338a and the second guide portion 338b on the bottom surface of the second housing portion 331a is set to be the same as the distance Which is greater than the thickness of the support substrate 410 and 0.1 mm plus the thickness of the support substrate 410. That is, the gap between one surface of the support substrate 410 and the first guide portion 338a may be 0.05 mm or less.

A connection groove 337h is formed between the first guide portion 338a and the second guide portion 338b in which the projecting portion 470 of the support substrate 410 is inserted. The connection groove 337h is formed between the first guide portion 338a and the second guide portion 338b so that the support substrate 410 can be disposed at a more accurate position and the support substrate 410 can be prevented from being separated .

The support substrate 410 may include an extension 450. The extended portion 450 extends outward from the upper end of the supporting substrate 410 and penetrates the fifth hole H5 of the heat discharging body 300 and the first hole H1 of the substrate 210, Lt; RTI ID = 0.0 &gt; 210 &lt; / RTI &gt;

The support substrate 410 may include a protrusion 470. The protrusion 470 extends outward from both sides of the lower end of the support substrate 410 and is coupled to the connection portion 337 of the heat dissipator 300.

A plurality of components 430 are mounted on the supporting substrate 410. The plurality of components 430 may include, for example, a DC converter that converts AC power supplied from an external power source to DC power, a driving chip that controls driving of the light source module 200, An electrostatic discharge (ESD) protection device, and the like, but the present invention is not limited thereto.

The power supply unit 400 may be a non-insulated PSU because the inner walls defining the second housing portion 331a of the second heat dissipating unit 330 are made of an insulating material, for example, a resin material. If the power supply unit 400 is a non-insulated PSU, the manufacturing cost of the entire lighting apparatus can be reduced.

&Lt; Socket (500) >

The socket 500 is coupled to the connection portion 337 of the heat discharging body 300 and is electrically connected to the power supply unit 400. The socket 500 delivers external AC power to the power supply unit 400.

The socket 500 may be the same size and shape as the socket of the conventional incandescent lamp. Since the socket 500 is the same size and shape as the socket of the conventional incandescent bulb, the lighting apparatus according to the first embodiment can replace the existing incandescent bulb.

Second Embodiment

FIG. 12 is a perspective view of the illumination apparatus according to the second embodiment viewed from above, FIG. 13 is a perspective view of the illumination apparatus shown in FIG. 12 viewed from below, FIG. 14 is an exploded perspective view of the illumination apparatus shown in FIG. 15 is an exploded perspective view of the illumination device shown in Fig. 13, and Fig. 16 is a sectional view of the illumination device shown in Fig.

In the illuminating device according to the second embodiment shown in Figs. 12 to 16, the same components as those of the illuminating device according to the first embodiment shown in Figs. 1 to 5 use the same reference numerals. Therefore, in the illuminating device according to the second embodiment shown in Figs. 12 to 16, the detailed description of the same components as those of the illuminating device according to the first embodiment shown in Figs. 1 to 5 will be omitted Hereinafter, the heat dissipator 300 'will be described in detail. In describing the heat discharging body 300 ', a description will be focused on a part different from the heat discharging body 300 according to the first embodiment, and the characteristics of the heat discharging body 300 according to the first embodiment will be described in the second embodiment It is to be understood that the heat discharging body 300 'according to the form is also included as it is. Further, the illumination apparatus according to the second embodiment shown in Figs. 12 to 16 may further include items shown in Figs. 6 to 11.

The heat dissipator 300 'includes a first heat dissipation unit 310' and a second heat dissipation unit 330 '. The first heat dissipating part 310'includes an upper part 311'and a lower part 313'and the second heat dissipating part 330'is formed of an inner part 331'and a first receiving part 333'and an outer part 335 'and a connecting portion 337. [

The substrate 210 of the light source module 200 is disposed on the upper portion 311 'of the first heat dissipating portion 310'. The upper portion 311 'may be a flat circular plate shape. However, the present invention is not limited thereto, and the upper portion 311 'may have a convex plate shape upward or downward, and the upper portion 311' may have an elliptical or polygonal plate shape.

The upper portion 311 'is disposed on the inner side portion 331' of the second heat releasing portion 330 '. The upper portion 311 'may have an eighth hole H8 through which the extended substrate 450 of the power supply unit 400 passes.

The lower portion 313 'of the first heat-radiating portion 310' may be a plate having a predetermined length. The top width and bottom width of the bottom 313 'may be different. In particular, the top width of the bottom 313 'may be greater than the bottom width of the bottom 313'. If the upper end of the lower portion 313 'is larger than the lower end of the lower portion 313', the shape of the lower portions 313 'may correspond to the shape of the outer portion 335' of the second heat- have.

The lower portion 313 'extends downward from the edge of the upper portion 311', and may be plural. The plurality of lower portions 313 'are spaced apart from each other, and a predetermined gap 313d' may be formed between two adjacent lower portions 313 '. The gap 313d 'may be generated during the manufacturing process of the first heat dissipation unit 310'. In order to manufacture the lower portion of the first heat-radiating portion without the gap 313d ', a drawing process is required to reduce the manufacturing cost and time. The lower portion 313' of the first heat-radiating portion 310 ' The lower part 313 'of the first heat dissipating part 310' can be manufactured by a bending method with less cost and time. A method of manufacturing the first heat dissipating unit 310 'will be described. First, a developed view of an upper portion 311' and a plurality of lower portions 313 'is prepared from an aluminum original plate, and then a plurality of lower portions 313' It can be bent.

The plurality of lower portions 313 'and the gaps 313d' can implement a tubular shape having different diameters at the upper and lower ends.

The number of the lower portions 313 'may vary depending on the shape and size of the upper portion 311'. For example, if the shape of the upper portion 311 'is circular as shown in the drawing, the number of the appropriate lower portions 313' may be selected according to the size thereof. If the shape of the upper portion 311 'is polygonal, The number of bottoms 313 'may be selected according to the number of sides.

The surface area of the upper portion 311 'may be equal to or greater than the total surface area of the plurality of lower portions 313'. Specifically, the surface area of the upper portion 311 'may be one to two times or less based on the total surface area of the plurality of lower portions 313'. If the surface area of the upper portion 311 'is less than 1 times the entire surface area of the plurality of lower portions 313', the surface area of the upper portion 311 ', which receives heat directly from the light source module 200, '), The heat transfer efficiency may be lowered. On the other hand, if the surface area of the upper portion 311 'exceeds twice the entire surface area of the plurality of lower portions 313', most of the heat is concentrated on the upper portion 311, which may deteriorate heat radiation efficiency.

The lower portion 313 'is received in the first receiving portion 333' of the second heat radiating portion 330 '.

The shape of the lower portion 313 'may correspond to the outer shape of the outer portion 335' of the second heat radiating portion 330 '. Specifically, the lower portion 313 'may have a predetermined curvature depending on the shape of the outer portion 335'. The lower portion 313 'may be disposed adjacent to the outer portion 335' of the second heat radiating portion 330 ', as shown in FIG.

The shape of the lower portion 313 'corresponds to the outer shape of the outer portion 335' of the second heat radiating portion 330 'and the lower portion 313' is disposed adjacent to the outer portion 335 ' ) To the outer surface of the outer surface 335 'is shortened, the heat radiation performance of the heat discharging body 300' can be further improved.

The thickness of the lower portion 313 'may be 1.0 T (mm) or more and 2.0 T or less. When the thickness of the lower portion 313 'is 1.0 T or more and 2.0 T or less, the moldability of the lower portion 313' is the most advantageous. That is, if the thickness of the lower portion 313 'is thinner than 1.0 T or larger than 2.0 T, it is difficult to process the lower portion 313' and it may be difficult to maintain the shape of the lower portion 313 '.

The thickness of the outer portion 335 'may be 0.5 T or more and 2.0 T or less. If the thickness of the outer portion 335 'is thinner than 0.5 T, the lower portion 313' of the first heat-radiating portion 310 'and the outer heat-dissipating path become thinner, And if the thickness of the outer portion 335 'is larger than 2.0 T, there is a problem that the heat radiation performance of the heat discharging body 300' is lowered.

The ratio of the thickness of the lower portion 313 'of the first radiating portion 310' to the thickness of the outside portion 335 'of the second radiating portion 330' may be 1: 1 or more and 2: 1 or less. If the thickness of the lower portion 313 'of the first radiating portion 310' is smaller than the thickness of the outside portion 335 'of the second radiating portion 330', there is a problem that the radiating performance of the radiator 300 ' And if the thickness of the lower portion 313 'of the first radiating portion 310' exceeds twice the thickness of the outside portion 335 'of the second radiating portion 330', the problem that the withstand voltage characteristic is deteriorated .

The outer portion 335 'of the second heat dissipating portion 330' may have the pin 335b shown in FIGS. 1 to 5 although not shown in the figure.

The substrate 210, the first heat dissipating unit 310 ', and the second heat dissipating unit 330' of the light source module 200 may be coupled to each other using fastening means (not shown) such as screws. Concretely, the fastening means is disposed on the third hole H3 of the substrate 210, the fourth hole H4 of the first heat dissipating unit 310 ', and the sixth hole H6 of the second heat dissipating unit 330' The substrate 210, the first heat dissipation unit 310 ', and the second heat dissipation unit 330' of the light source module 200 can be tightly coupled with each other.

The first heat dissipating unit 310 'and the second heat dissipating unit 330' are integrally formed, and the first heat dissipating unit 310 'and the second heat dissipating unit 330', which are coupled to each other, . Specifically, the first heat dissipating unit 310 'and the second heat dissipating unit 330' are fixed to each other as a result of a predetermined process. Accordingly, the first heat dissipating unit 310 'and the second heat dissipating unit 330' are difficult to separate from each other. Note that, for convenience of explanation, the first heat dissipating unit 310 'and the second heat dissipating unit 330' are separated from each other in FIGS. 14 to 15.

If the first heat dissipating part 310 'and the second heat dissipating part 330' are integrally formed or the first heat dissipating part 310 'and the second heat dissipating part 330' are separated from each other, The contact resistance between the first heat dissipating part 310 'of the first heat dissipating part 310' and the second heat dissipating part 330 'of the resin is higher than the contact resistance between the first heat dissipating part 310' and the second heat dissipating part 330 ' Can be lower. The contact resistance is lowered, so that the same or similar heat dissipation performance as that of the conventional heat dissipation member (made of a metal material as a whole) can be secured. If the first heat dissipating unit 310 'and the second heat dissipating unit 330' are integrated with each other, the first heat dissipating unit 310 'and the second heat dissipating unit 330' Breakage or damage of the second heat dissipating unit 330 'can be further reduced.

In order to integrally form the first heat dissipating unit 310 'and the second heat dissipating unit 330', an insert injection machining method can be used.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that various variations and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

100: cover
200: Light source module
300, 300 ': heat sink
400: Power supply
500: Socket

Claims (7)

A light source module including a substrate having at least one hole and a plurality of light emitting elements arranged on an upper surface of the substrate;
A power supply providing a power supply signal to a substrate of the light source module, the power supply providing at least one extension substrate; And
And a soldering portion for electrically connecting the substrate of the light source module and the extension substrate of the power supply portion,
The extension substrate is inserted into the hole of the substrate,
And an end of the extended substrate is disposed on an upper surface of the substrate through a hole of the substrate. The method according to claim 1,
Wherein the substrate comprises a terminal adjacent a hole in the substrate and disposed on an upper surface of the substrate,
Wherein the extension substrate includes terminals disposed on one side of the extension substrate,
And the soldering portion connects the terminal of the substrate and the terminal of the extension substrate. 3. The method according to claim 1 or 2,
Wherein a height from an upper surface of the substrate to an end of the extended substrate is 1.5 mm or more and 2.0 mm or less. 3. The method according to claim 1 or 2,
Wherein in the hole of the substrate, the distance between the substrate and the extension substrate is greater than 0 and not greater than 0.2 mm. 3. The method according to claim 1 or 2,
Further comprising a heat radiator having an upper surface on which the substrate is disposed and having a housing portion in which the power supply providing portion is disposed and having a hole for connecting the hole of the substrate and the housing portion,
And the extended substrate is inserted into the hole of the heat radiator and the hole of the substrate. 6. The method of claim 5,
Wherein the heat dissipator includes a first heat dissipation unit having a non-breaking material and a second heat dissipation unit having an insulating material,
The first heat dissipating unit is coupled to the second heat dissipating unit,
And the second radiation part has a hole of the radiator and the accommodation part. The method according to claim 6,
Wherein the power supply unit is a non-isolated power supply unit.

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