KR20140117462A - 통신 플랫폼을 위한 기판-레벨 열전달 장치 - Google Patents

통신 플랫폼을 위한 기판-레벨 열전달 장치 Download PDF

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Publication number
KR20140117462A
KR20140117462A KR1020147021207A KR20147021207A KR20140117462A KR 20140117462 A KR20140117462 A KR 20140117462A KR 1020147021207 A KR1020147021207 A KR 1020147021207A KR 20147021207 A KR20147021207 A KR 20147021207A KR 20140117462 A KR20140117462 A KR 20140117462A
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KR
South Korea
Prior art keywords
cooler
thermal interface
heat
electronic circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020147021207A
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English (en)
Korean (ko)
Inventor
웨이 링
살바토레 메사나
폴 로민스키
Original Assignee
알까뗄 루슨트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 알까뗄 루슨트 filed Critical 알까뗄 루슨트
Publication of KR20140117462A publication Critical patent/KR20140117462A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49817—Disassembling with other than ancillary treating or assembling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Landscapes

  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020147021207A 2012-01-30 2013-01-28 통신 플랫폼을 위한 기판-레벨 열전달 장치 Ceased KR20140117462A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/360,997 2012-01-30
US13/360,997 US8913391B2 (en) 2012-01-30 2012-01-30 Board-level heat transfer apparatus for communication platforms
PCT/US2013/023405 WO2013116143A1 (en) 2012-01-30 2013-01-28 A board-level heat transfer apparatus for communication platforms

Publications (1)

Publication Number Publication Date
KR20140117462A true KR20140117462A (ko) 2014-10-07

Family

ID=48870030

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147021207A Ceased KR20140117462A (ko) 2012-01-30 2013-01-28 통신 플랫폼을 위한 기판-레벨 열전달 장치

Country Status (7)

Country Link
US (1) US8913391B2 (enExample)
EP (1) EP2810544A1 (enExample)
JP (1) JP2015508919A (enExample)
KR (1) KR20140117462A (enExample)
CN (1) CN104081887A (enExample)
IN (1) IN2014DN05679A (enExample)
WO (1) WO2013116143A1 (enExample)

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DE102022202015A1 (de) * 2022-02-28 2023-08-31 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung mit austauschbaren Elektronikbaugruppen eines Kraftfahrzeugs

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Also Published As

Publication number Publication date
US8913391B2 (en) 2014-12-16
WO2013116143A1 (en) 2013-08-08
EP2810544A1 (en) 2014-12-10
IN2014DN05679A (enExample) 2015-04-03
JP2015508919A (ja) 2015-03-23
US20130194755A1 (en) 2013-08-01
CN104081887A (zh) 2014-10-01

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