CN104081887A - 用于通信平台的板级热传递设备 - Google Patents

用于通信平台的板级热传递设备 Download PDF

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Publication number
CN104081887A
CN104081887A CN201380007365.0A CN201380007365A CN104081887A CN 104081887 A CN104081887 A CN 104081887A CN 201380007365 A CN201380007365 A CN 201380007365A CN 104081887 A CN104081887 A CN 104081887A
Authority
CN
China
Prior art keywords
cooler
circuit board
electronic circuit
radiator
hot interface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201380007365.0A
Other languages
English (en)
Chinese (zh)
Inventor
卫·凌
萨尔瓦托雷·梅萨纳
保罗·罗敏斯奇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent SAS
Alcatel Optical Networks Israel Ltd
Original Assignee
Alcatel Optical Networks Israel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Optical Networks Israel Ltd filed Critical Alcatel Optical Networks Israel Ltd
Publication of CN104081887A publication Critical patent/CN104081887A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49817—Disassembling with other than ancillary treating or assembling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Landscapes

  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN201380007365.0A 2012-01-30 2013-01-28 用于通信平台的板级热传递设备 Pending CN104081887A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/360,997 2012-01-30
US13/360,997 US8913391B2 (en) 2012-01-30 2012-01-30 Board-level heat transfer apparatus for communication platforms
PCT/US2013/023405 WO2013116143A1 (en) 2012-01-30 2013-01-28 A board-level heat transfer apparatus for communication platforms

Publications (1)

Publication Number Publication Date
CN104081887A true CN104081887A (zh) 2014-10-01

Family

ID=48870030

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380007365.0A Pending CN104081887A (zh) 2012-01-30 2013-01-28 用于通信平台的板级热传递设备

Country Status (7)

Country Link
US (1) US8913391B2 (enExample)
EP (1) EP2810544A1 (enExample)
JP (1) JP2015508919A (enExample)
KR (1) KR20140117462A (enExample)
CN (1) CN104081887A (enExample)
IN (1) IN2014DN05679A (enExample)
WO (1) WO2013116143A1 (enExample)

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CN110914784A (zh) * 2017-07-19 2020-03-24 慧与发展有限责任合伙企业 用于高性能计算机的冷却系统

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GB2512378A (en) * 2013-03-28 2014-10-01 Ibm Device and method for cooling electronic components and for supplying power to the electronic components
US9414524B2 (en) * 2013-09-11 2016-08-09 Artesyn Embedded Computing, Inc. Extended heat frame for printed circuit board
US9603277B2 (en) * 2014-03-06 2017-03-21 Adtran, Inc. Field-reconfigurable backplane system
US9521782B2 (en) * 2014-06-26 2016-12-13 General Electric Company Systems and methods for passive cooling of components within electrical devices
US9433132B2 (en) * 2014-08-08 2016-08-30 Intel Corporation Recirculating dielectric fluid cooling
US9445531B1 (en) * 2015-05-01 2016-09-13 Baidu Usa Llc Air washing for open air cooling of data centers
US10098241B2 (en) * 2015-10-23 2018-10-09 International Business Machines Corporation Printed circuit board with edge soldering for high-density packages and assemblies
US10884203B2 (en) * 2015-11-16 2021-01-05 Accedian Networks Inc. Cooling apparatus for pluggable modules
CN207019343U (zh) 2016-02-08 2018-02-16 特灵国际有限公司 多盘管微通道蒸发器及包含其的制冷剂压缩系统
US10387278B2 (en) * 2017-03-31 2019-08-20 Cisco Technology, Inc. Method to display real-time module OIR time
US10375863B2 (en) * 2017-11-28 2019-08-06 Dell Products, L.P. Liquid cooled chassis
US10548245B2 (en) 2018-02-12 2020-01-28 Robert J Lipp Liquid cooled open compute project rack insert
DE102021203625A1 (de) * 2021-04-13 2022-10-13 Robert Bosch Gesellschaft mit beschränkter Haftung Elektronikbaugruppe eines Kraftfahrzeugs
CN113347505A (zh) * 2021-04-23 2021-09-03 微网优联科技(成都)有限公司 一种路由器的散热结构
DE102022202015A1 (de) * 2022-02-28 2023-08-31 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung mit austauschbaren Elektronikbaugruppen eines Kraftfahrzeugs

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JPH021959A (ja) * 1988-06-10 1990-01-08 Nec Corp 集積回路用冷却装置
JPH03246997A (ja) * 1990-02-26 1991-11-05 Fujitsu Ltd シェルフ実装の冷却構造
JPH07221479A (ja) * 1994-02-08 1995-08-18 Mitsubishi Electric Corp 電子機器
CN1299993A (zh) * 1999-12-13 2001-06-20 株式会社东芝 用于冷却发热电路组件的冷却单元及包括该冷却单元的电子设备
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CN101128092A (zh) * 2007-09-29 2008-02-20 航天东方红卫星有限公司 机电热一体化电子机箱
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110914784A (zh) * 2017-07-19 2020-03-24 慧与发展有限责任合伙企业 用于高性能计算机的冷却系统

Also Published As

Publication number Publication date
US8913391B2 (en) 2014-12-16
WO2013116143A1 (en) 2013-08-08
EP2810544A1 (en) 2014-12-10
IN2014DN05679A (enExample) 2015-04-03
KR20140117462A (ko) 2014-10-07
JP2015508919A (ja) 2015-03-23
US20130194755A1 (en) 2013-08-01

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20141001