JP2015508919A - 伝達プラットフォームのためのボードレベル熱移動装置 - Google Patents

伝達プラットフォームのためのボードレベル熱移動装置 Download PDF

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Publication number
JP2015508919A
JP2015508919A JP2014555606A JP2014555606A JP2015508919A JP 2015508919 A JP2015508919 A JP 2015508919A JP 2014555606 A JP2014555606 A JP 2014555606A JP 2014555606 A JP2014555606 A JP 2014555606A JP 2015508919 A JP2015508919 A JP 2015508919A
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Japan
Prior art keywords
heat
cooler
thermal interface
electronic circuit
circuit boards
Prior art date
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Pending
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JP2014555606A
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English (en)
Japanese (ja)
Inventor
リン，ウェイ
メッサーナ，サルヴァトーレ
ロミンスキー，ポール
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アルカテル−ルーセント
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Publication date
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Publication of JP2015508919A publication Critical patent/JP2015508919A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49817—Disassembling with other than ancillary treating or assembling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Landscapes

  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2014555606A 2012-01-30 2013-01-28 伝達プラットフォームのためのボードレベル熱移動装置 Pending JP2015508919A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/360,997 2012-01-30
US13/360,997 US8913391B2 (en) 2012-01-30 2012-01-30 Board-level heat transfer apparatus for communication platforms
PCT/US2013/023405 WO2013116143A1 (en) 2012-01-30 2013-01-28 A board-level heat transfer apparatus for communication platforms

Publications (1)

Publication Number Publication Date
JP2015508919A true JP2015508919A (ja) 2015-03-23

Family

ID=48870030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014555606A Pending JP2015508919A (ja) 2012-01-30 2013-01-28 伝達プラットフォームのためのボードレベル熱移動装置

Country Status (7)

Country Link
US (1) US8913391B2 (enExample)
EP (1) EP2810544A1 (enExample)
JP (1) JP2015508919A (enExample)
KR (1) KR20140117462A (enExample)
CN (1) CN104081887A (enExample)
IN (1) IN2014DN05679A (enExample)
WO (1) WO2013116143A1 (enExample)

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GB2512378A (en) * 2013-03-28 2014-10-01 Ibm Device and method for cooling electronic components and for supplying power to the electronic components
US9414524B2 (en) * 2013-09-11 2016-08-09 Artesyn Embedded Computing, Inc. Extended heat frame for printed circuit board
US9603277B2 (en) * 2014-03-06 2017-03-21 Adtran, Inc. Field-reconfigurable backplane system
US9521782B2 (en) * 2014-06-26 2016-12-13 General Electric Company Systems and methods for passive cooling of components within electrical devices
US9433132B2 (en) * 2014-08-08 2016-08-30 Intel Corporation Recirculating dielectric fluid cooling
US9445531B1 (en) * 2015-05-01 2016-09-13 Baidu Usa Llc Air washing for open air cooling of data centers
US10098241B2 (en) * 2015-10-23 2018-10-09 International Business Machines Corporation Printed circuit board with edge soldering for high-density packages and assemblies
US10884203B2 (en) * 2015-11-16 2021-01-05 Accedian Networks Inc. Cooling apparatus for pluggable modules
CN207019343U (zh) 2016-02-08 2018-02-16 特灵国际有限公司 多盘管微通道蒸发器及包含其的制冷剂压缩系统
US10387278B2 (en) * 2017-03-31 2019-08-20 Cisco Technology, Inc. Method to display real-time module OIR time
US10806056B2 (en) * 2017-07-19 2020-10-13 Hewlett Packard Enterprise Development Lp Cooling system for high-performance computer
US10375863B2 (en) * 2017-11-28 2019-08-06 Dell Products, L.P. Liquid cooled chassis
US10548245B2 (en) 2018-02-12 2020-01-28 Robert J Lipp Liquid cooled open compute project rack insert
DE102021203625A1 (de) * 2021-04-13 2022-10-13 Robert Bosch Gesellschaft mit beschränkter Haftung Elektronikbaugruppe eines Kraftfahrzeugs
CN113347505A (zh) * 2021-04-23 2021-09-03 微网优联科技(成都)有限公司 一种路由器的散热结构
DE102022202015A1 (de) * 2022-02-28 2023-08-31 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung mit austauschbaren Elektronikbaugruppen eines Kraftfahrzeugs

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JP2006254591A (ja) * 2005-03-10 2006-09-21 Toshiba Corp 静電アクチュエータおよび撮像装置
JP2011137663A (ja) * 2009-12-26 2011-07-14 Nidec-Read Corp 検査用治具、検査用治具の接続体及びその製造方法
JP2011129533A (ja) * 2011-02-17 2011-06-30 D D K Ltd コネクタ

Also Published As

Publication number Publication date
US8913391B2 (en) 2014-12-16
WO2013116143A1 (en) 2013-08-08
EP2810544A1 (en) 2014-12-10
IN2014DN05679A (enExample) 2015-04-03
KR20140117462A (ko) 2014-10-07
US20130194755A1 (en) 2013-08-01
CN104081887A (zh) 2014-10-01

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