KR20140087590A - Method and apparatus for ejecting a die - Google Patents

Abstract

In a method and an apparatus for ejecting a die, an ejecting unit includes an upper region, which is smaller than a die attached to a dicing tape, and a chamber with an open top portion. The ejecting unit is attached to a partial region of the lower surface of the dicing tape to which the die is attached. Sound pressure is provided for the inside of the chamber to separate a first region of the dicing tape corresponding to the center of the die from the die. Moreover, the ejecting unit ascends to separate a second region of the dicing tape corresponding the edge of the die from the die. Positive pressure is provided for the inside of the chamber to swell the first region of the dicing tape. Therefore, the die may ascend upward and be sufficiently separated from the dicing tape.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001]

Embodiments of the present invention relate to a die ejecting method and apparatus. More particularly, to a die ejecting method and apparatus for separating dies from a wafer to bond dies having semiconductor elements formed on the substrate in a semiconductor manufacturing process.

Generally, semiconductor devices can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the semiconductor devices formed as described above can be divided through a dicing process, Lt; / RTI >

The apparatus for performing the die bonding process may include a pick-up module for picking up and separating the dies from the wafer divided into dies formed with semiconductor elements, and a bonding module for attaching the picked-up semiconductor elements on the substrate . Wherein the pick-up module comprises: a stage unit for supporting the wafer ring on which the wafer is mounted; an ejecting device provided movably in a vertical direction for selectively separating the semiconductor element from the wafer supported on the stage unit; Up unit for picking up and attaching on a substrate.

Generally, the die ejecting apparatus includes an ejecting unit for vertically pushing up the semiconductor element to separate the semiconductor element from the dicing tape, a holder for receiving the ejecting unit, and a holder for holding the ejecting unit in a vertical direction A main body for accommodating the driving unit, and the like. Examples of such a die ejecting apparatus are disclosed in Korean Patent No. 10-0975500 and Korean Patent Laid-Open No. 10-2009-0108447.

However, recently, as the size of a die formed on a wafer becomes very wide and the thickness becomes thinner, a new type of die ejecting method and apparatus are required to cope with this.

Embodiments of the present invention are directed to a new type of die ejecting method and apparatus that can easily separate a die having a variety of sizes and thicknesses from a wafer.

According to an aspect of the present invention, there is provided a method of ejecting a die using an ejecting unit having an upper region smaller than a die attached to a dicing tape and a chamber having an upper portion opened, Attaching the ejecting unit to a partial area of the lower surface of the dicing tape to which the die is attached; providing a negative pressure in the chamber to define a first region of the dicing tape corresponding to a central portion of the die Separating the die from the die; raising the ejecting unit to separate a second region of the dicing tape corresponding to an edge portion of the die from the die; A step of swelling the first region of the singing tape and pushing up the die may be performed.

According to embodiments of the present invention, a hood having an opening through which the ejecting unit is inserted in the vertical direction and a plurality of vacuum holes around the opening is disposed, and the hood is connected to the dicing tape And can be brought into close contact with the lower surface.

According to the embodiments of the present invention, a third region outside the second region of the dicing tape can be adsorbed to the upper surface of the hood by using the vacuum holes.

According to embodiments of the present invention, a negative pressure can be provided beneath the second area of the dicing tape through the gap between the opening and the ejecting unit.

According to embodiments of the present invention, a support member is disposed within the chamber to partially support a central portion of the die positioned on the first region of the dicing tape while providing negative pressure within the chamber .

According to another aspect of the present invention, there is provided a die ejecting apparatus comprising: an ejecting unit having an upper region smaller than a die attached to a dicing tape and a chamber opened at an upper portion thereof; A main body including a hood having an opening inserted into the hood and a plurality of vacuum holes around the opening and a driving unit coupled to the hood and the ejecting unit and moving the ejecting unit in a vertical direction, And a pressure regulator for providing a negative pressure to the lower surface of the dicing tape through the vacuum holes and subsequently providing a positive pressure inside the chamber.

According to embodiments of the present invention, the hood and the ejecting unit may be further provided with a second driving unit for bringing the hood and the ejecting unit into close contact with the lower surface of the dicing tape.

According to embodiments of the present invention, the upper surface of the hood may be provided with at least one channel connecting the plurality of vacuum holes adjacent to the openings.

According to embodiments of the present invention, the hood may include an upper panel having the opening and the vacuum holes, and a housing extending downward from an edge of the upper panel and coupled with the main body. The vacuum holes may communicate with a second chamber defined by the upper panel and the housing, and the ejecting unit may be disposed inside the hood.

According to embodiments of the present invention, the opening may include a first opening having a size smaller than the die and a second opening communicating with the first opening and larger than the first opening. At this time, the ejecting unit may include a first member positioned in the first opening and a second member positioned in the second opening.

According to embodiments of the present invention, a groove for connecting the vacuum holes adjacent to the first opening to other vacuum holes may be provided on the inner upper portion of the second opening.

According to embodiments of the present invention, the second opening may be formed larger than the second member, and a guide ring corresponding to the second opening may be provided around the second member, And a second vacuum hole for communicating a part of the vacuum holes and the second chamber with each other.

According to embodiments of the present invention, a support member may be provided within the chamber to partially support a central portion of the die positioned on the dicing tape while providing a negative pressure inside the chamber.

According to embodiments of the present invention, the pressure regulator includes a first pipe connected to a vacuum source and providing a negative pressure inside the chamber, a first valve provided in the first pipe, A second valve provided in the second pipe, a third valve connected to the compressed air source and connected to the third pipe connected to the first pipe to provide a positive pressure inside the chamber, And a third valve provided in the third pipe.

According to the embodiments of the present invention as described above, by applying a negative pressure below the first region of the dicing tape corresponding to the central portion of the die attached to the dicing tape, Separating the second region of the dicing region from the die and subsequently releasing the second region of the dicing region corresponding to the edge portion of the die by lifting the ejecting unit and subsequently providing a positive pressure below the first region, So that the die can be sufficiently separated from the dicing tape. As a result, the separation of the die can be made more stable, and the process error in the die bonding process can be sufficiently reduced.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram for explaining a die ejecting apparatus according to an embodiment of the present invention; FIG.
2 is a schematic enlarged cross-sectional view for explaining the die ejecting apparatus shown in Fig.
Fig. 3 is a flowchart for explaining a method of ejecting a die using the die ejecting apparatus shown in Figs. 1 and 2. Fig.
FIGS. 4 to 7 are schematic views for explaining the die ejecting method shown in FIG.
8 is a schematic plan view for explaining the hood shown in Fig.
9 is a schematic plan view for explaining another example of the ejecting unit shown in Fig.
10 is a schematic sectional view for explaining the ejecting unit shown in Fig.
11 is a schematic exploded cross-sectional view for explaining another example of the ejecting unit shown in Fig.
12 is a schematic exploded cross-sectional view for explaining another example of the ejecting unit shown in Fig.

BRIEF DESCRIPTION OF THE DRAWINGS The invention will be described in more detail below with reference to the accompanying drawings showing embodiments of the invention. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

When an element is described as being placed on or connected to another element or layer, the element may be directly disposed or connected to the other element, and other elements or layers may be placed therebetween It is possible. Alternatively, if one element is described as being placed directly on or connected to another element, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Thus, changes from the shapes of the illustrations, e.g., changes in manufacturing methods and / or tolerances, are those that can be reasonably expected. Accordingly, the embodiments of the present invention should not be construed as being limited to the specific shapes of the areas illustrated in the drawings, but include deviations in the shapes, the areas described in the drawings being entirely schematic and their shapes Is not intended to illustrate the exact shape of the area and is not intended to limit the scope of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram for explaining a die ejecting apparatus according to an embodiment of the present invention; FIG.

Referring to FIG. 1, a die ejecting apparatus 100 according to an embodiment of the present invention separates the dies 20 from a wafer 10 made of dies 20 on which semiconductor elements are formed, It can be preferably used in a die bonding process for bonding. In particular, the wafer 10 may be provided attached to the dicing tape 32 and the dicing tape 32 may be mounted on the wafer ring 30 having a larger diameter than the wafer 10 have.

The wafer ring 30 may be held by a clamp 42 disposed on the stage 40 and the edge portion of the dicing tape 32 may be gripped by an extension ring 44 disposed on the stage 40, Lt; / RTI > The clamp 42 may move the wafer ring 30 vertically downward to expand the dicing tape 32 so that the dicing tape 32 is extended by the extension ring 44 . As a result, the distance between the dies 20 attached to the dicing tape 32 can be extended.

A lower die ejecting device 100 for selectively lifting the dies 20 to separate the dies 20 from the dicing tape 32 may be provided at the bottom of the stage 40 And a pickup device 50 for picking up the die 20 lifted by the die ejecting device 100 may be provided on the stage 40. [

The die ejecting apparatus 100 may be used to eject the dies 20 from the dicing tape 32.

2 is a schematic enlarged cross-sectional view for explaining the die ejecting apparatus shown in Fig.

Referring to FIG. 2, a die ejecting apparatus 100 according to an embodiment of the present invention includes an ejecting unit 110 for pushing up the dies 20 upward, And a main body 140 including a hood 120 for accommodating the ejecting unit 110 and a first driving unit 130 for moving the ejecting unit 110 in a vertical direction.

The ejecting unit 110 may have an upper region and a first chamber 112 open smaller than the die 20 attached to the dicing tape 32. The hood 120 may have an opening 126 into which the ejecting unit 120 is inserted and a plurality of vacuum holes 128 formed around the opening 126.

The ejecting unit 110 is movable in the vertical direction by the first driving unit 130. The first driving unit 130 is disposed inside the main body 140 to move the ejecting unit 110, And a driving shaft 134 for transmitting a driving force. Although not shown, the first driving unit 130 may further include a power providing unit (not shown) for providing the driving force. The power providing unit may include a motor, a cylinder, power transmission elements, And can be configured in various ways.

The ejecting unit 110 may push up one of the dies 20 to selectively eject one of the dies 20. The ejecting unit 110 includes an ejecting member 114 having a substantially quadrangular prism shape and an ejecting member 114 provided below the ejecting member 114 and coupled to the head 132 of the first driving unit 130. [ (Not shown). The permanent magnet 136 may be disposed on the head 132 of the first driving unit 130 and may be mounted on the head 132 by the magnetic force of the permanent magnet 136. [ It is preferable that it is made of a magnetic material.

The ejecting member 110 may be positioned within the opening 126 of the hood 120 and may be moved upwardly from the hood 120 by the first driving unit 130. At this time, the ejecting member 114 may have the upper region smaller than the die 20 and the first chamber 112.

The hood 120 includes an upper panel 122 having the opening 126 and the vacuum holes 128 and a housing extending downward from an edge of the upper panel 122 and coupled to the body 140 124). As an example, the top panel 122 may have a circular disk shape, and the housing 124 may have a cylindrical shape with an open bottom. That is, the hood 120 may include a second chamber 121, and the ejecting unit 110 may be disposed in the second chamber 121 as shown in FIG. The open bottom of the housing 124 may be coupled to the body 140 and the head 132 and the drive shaft 134 of the drive 130 may be moved vertically within the body 140 .

According to an embodiment of the present invention, although not shown, the die ejecting apparatus 100 may be configured to closely contact the hood 120 and the ejecting unit 110 with the lower surface of the dicing tape 32 And a second driving unit (not shown). The second driving unit may have a substantially rectangular coordinate robot shape and may move the ejecting unit 110 and the hood 120 in a horizontal direction to select one of the dies 20, The ejecting unit 110 and the hood 120 can be brought into close contact with the lower surface of the dicing tape 32 in order to eject the selected die 20.

According to an embodiment of the present invention, the die ejecting apparatus 100 provides negative pressure to the lower surface of the dicing tape 32 through the first chamber 112 and the vacuum holes 128 And a pressure regulator 150 for providing a positive pressure inside the first chamber 112. [

The pressure regulator 150 is connected to a vacuum source 164 such as a vacuum pump and includes a first pipe 152 for providing a negative pressure in the first chamber 112, A first valve 154 connected to the vacuum source 164 for applying a negative pressure to the lower surface of the dicing tape 32 through the second chamber 121 and the vacuum holes 128, A second valve 158 connected to the second pipe 156 and a compressed air source 166 connected to the first pipe 112 to provide positive pressure within the first chamber 112, A third pipe 160 connected to the pipe 152, and a third valve 162 provided to the third pipe 160.

Although not shown, the first, second and third valves 154, 158 and 162 may be controlled by a control unit (not shown), and the compressed air source 166 may be a pneumatic pump, Lt; / RTI >

FIG. 3 is a flowchart for explaining a method of ejecting a die using the die ejecting apparatus shown in FIGS. 1 and 2, and FIGS. 4 to 7 are flowcharts for explaining the die ejecting method shown in FIG. These are schematic diagrams.

Referring to FIGS. 1 to 7, in step S100, the ejecting unit 110 is closely contacted with a part of the lower surface of the dicing tape 32 to which the die 20 is attached, as shown in FIG. . At this time, the upper surface of the ejecting unit 110 may be closely attached to the lower surface of the dicing tape 32 together with the upper surface of the hood 120.

In step S102, negative pressure is applied to the inside of the first chamber 112 to separate the first area of the dicing tape 32 corresponding to the central area of the die 20 from the die 20. At this time, the negative pressure may be applied to the first chamber 112 and the second chamber 121 at the same time. That is, the first valve 154 and the second valve 158 can be opened at the same time, so that the negative pressure can be provided to the first chamber 112 and the second chamber 121. As a result, the negative pressure can be applied to the lower surface of the dicing tape 32 through the vacuum holes 128, so that the dicing tape 21 (corresponding to the edge area of the die 20) And the third region outside the second region may be adsorbed on the hood 120. [0035] Also, a first region of the dicing tape 32 positioned on the first chamber 112 as described above may be separated downwardly from the die 20, as shown in Fig.

Although not shown, a die attach film (DAF) may be provided on the back surface of the die 20. According to one embodiment of the present invention, even when the adhesion force of the die 20 is relatively large by the die attach film, the dicing tape 32 is attracted through the vacuum holes 128 as described above By applying a negative pressure also in the first chamber 112, the die attach film provided on the back surface of the die 20 and the dicing tape 32 can be easily separated.

In step S104, the ejecting unit 110 is raised to separate the second area corresponding to the edge portion of the die 20 from the die 20, as shown in Fig. The ejecting unit 110 may be lifted by the first driving unit 130 and the second area and the third area of the dicing tape 32 may be raised by the vacuum holes 128, The second region of the dicing tape 32 can be easily separated from the die 20 because the second region of the dicing tape 32 is attracted to the die 120.

The negative pressure applied to the second chamber 121 inside the hood 120 is transmitted to the dicing tape 32 through the gap between the opening 126 and the ejecting unit 110. [ So that the second area of the dicing tape 32 can be more easily separated from the edge of the die 20. In this way,

According to another embodiment of the present invention, a negative pressure is applied to the second chamber 121 to attract the third region of the dicing tape 32, and then the ejecting unit 110 is lifted, Separates the second region of the dicing tape 32 from the die 20 and then provides a negative pressure within the first chamber 112 to isolate the first region of the dicing tape 32 from the die 20 .

7, a positive pressure is applied to the first chamber 112 to swell the first region of the dicing tape 32 upward, thereby moving the die 20 Sufficiently separated from the dicing tape 32. At this time, the controller may close the first valve (154) and open the third valve (162) to provide compressed air to the first chamber (112).

As described above, after the die 20 is lifted up from the dicing tape 32 and sufficiently separated, the pick-up device 50 can easily pick up the die 20 in a vacuum adsorption manner.

According to an embodiment of the present invention as described above, a first region of the dicing tape 32 corresponding to the die 20 is first separated from the die 20 using negative pressure, The ejecting operation of the die 20 can be performed more stably by causing the positive pressure of the first region of the tape 32 to swell.

When the compressed air is supplied into the first chamber 112 of the ejecting unit 110 as described above, the compressed air is passed between the upper surface of the ejecting unit 110 and the dicing tape 32 There is a possibility of leakage in the direction of the vacuum holes 128. Therefore, it is necessary to improve the attraction force of the dicing tape 32 with respect to the second region in order to prevent or reduce the leakage of the compressed air.

8 is a schematic plan view for explaining the hood shown in Fig.

8, in order to improve the attraction force of the dicing tape 32 with respect to the second region, the upper panel 122 is provided with a plurality of vacuum holes 128, At least one channel 129 connecting the openings 126 and some of the vacuum holes 128 adjacent to each other may be provided.

Fig. 9 is a schematic plan view for explaining another example of the ejecting unit shown in Fig. 2, and Fig. 10 is a schematic sectional view for explaining the ejecting unit shown in Fig.

Referring to FIGS. 9 and 10, when the negative pressure is applied to the first chamber 112 as described above, cracks are generated in the die 20 due to the negative pressure, Or the like may be generated. According to an embodiment of the present invention, a support member 118 may be provided in the first chamber 112 of the ejecting unit 110 to support a central portion of the die 20.

The support member 118 may have a cross shape and the upper surface of the support member 118 to support the die 20 when negative pressure is applied to the first chamber 112 And may be located about 0.1 to 0.4 mm below the upper surface of the ejecting member 114. Meanwhile, since the shape of the support member 118 can be variously changed, the scope of the present invention is not limited thereto.

11 is a schematic exploded cross-sectional view for explaining another example of the ejecting unit shown in Fig.

11, when ejecting a relatively small-sized die 20, the ejecting unit 110 includes a first member 114A having an upper area smaller than that of the die 20, And a second member 114B positioned below the first member 114A. The upper panel 122 may include a first opening 126A through which the first member 114A is inserted and a second opening 126B through which the second member 114B is inserted. At this time, the first opening 126A may have a smaller size than the die 20 and may communicate with the second opening 126B.

The first opening 126A and the second opening 126B are formed in the upper portion of the second opening 126B so that negative pressure can be stably provided in the vacuum holes 128 adjacent to the first opening 126A. A groove 126C may be provided for connecting the adjacent vacuum holes 128 with other vacuum holes 128. [

12 is a schematic exploded cross-sectional view for explaining another example of the ejecting unit shown in Fig.

Referring to FIG. 12, the second opening 126B of the upper panel 122 may be formed to be larger than the second member 114B of the ejecting unit 110. Referring to FIG. In this case, a guide ring 114C corresponding to the second opening 126B may be provided around the second member 114B to guide the movement of the ejecting unit 110 in the vertical direction, The guide ring 114C is provided with second vacuum holes (not shown) for communicating a part of the vacuum holes 128, that is, the vacuum holes 128 adjacent to the first opening 126A, 114D may be provided.

According to the embodiments of the present invention as described above, by applying a negative pressure below the first region of the dicing tape corresponding to the central portion of the die attached to the dicing tape, Separating the second region of the dicing region from the die and subsequently releasing the second region of the dicing region corresponding to the edge portion of the die by lifting the ejecting unit and subsequently providing a positive pressure below the first region, So that the die can be sufficiently separated from the dicing tape. As a result, the separation of the die can be made more stable, and the process error in the die bonding process can be sufficiently reduced.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

10: wafer 20: die
32: dicing tape 100: die ejecting device
110: ejecting unit 112: first chamber
120: Hood 121: Second chamber
122: upper panel 124: housing
126: opening 128: vacuum hole
130: driving part 140:
150: Pressure regulator

Claims (14)

1. A method of ejecting a die using an ejecting unit having an upper region smaller than a die attached to a dicing tape and a chamber open at an upper portion,
Adhering the ejecting unit to a partial area of the lower surface of the dicing tape to which the die is attached;
Providing a negative pressure within the chamber to separate a first region of the dicing tape corresponding to a central portion of the die from the die;
Raising the ejecting unit to separate a second region of the dicing tape corresponding to an edge portion of the die from the die; And
And providing a positive pressure within the chamber to swell the first region of the dicing tape to push the die upward. ≪ Desc / Clms Page number 13 > The hood as claimed in claim 1, wherein a hood having an opening through which the ejecting unit is inserted in the vertical direction and a plurality of vacuum holes around the opening is disposed, and the hood is disposed on the lower surface of the dicing tape together with the ejecting unit Wherein the die-bonding step is carried out in the die-bonding step. The die ejecting method according to claim 2, wherein a third region outside the second region of the dicing tape is attracted to the upper surface of the hood using the vacuum holes. 4. The method of claim 3, wherein a negative pressure is provided beneath a second area of the dicing tape through a gap between the opening and the ejecting unit. The method of claim 1, further comprising disposing a support member within the chamber to partially support a central portion of the die positioned on a first region of the dicing tape while providing negative pressure within the chamber . An ejecting unit having an upper region smaller than the die attached to the dicing tape and a chamber open at the top;
A hood having an opening through which the ejecting unit is inserted in a vertical direction and a plurality of vacuum holes around the opening;
A body coupled to the hood and the ejecting unit and including a driving unit for moving the ejecting unit in a vertical direction; And
And a pressure regulator for providing a negative pressure to the lower surface of the dicing tape through the chamber and the vacuum holes and then providing a positive pressure inside the chamber. The die ejecting apparatus according to claim 6, further comprising a second driving section for bringing the hood and the ejecting unit into close contact with the lower surface of the dicing tape. The apparatus of claim 6, wherein the upper surface of the hood is provided with at least one channel for connecting some vacuum holes adjacent to the opening among the vacuum holes. 7. The hood according to claim 6,
An upper panel having the openings and the vacuum holes; And
And a housing extending downward from an edge of the upper panel and coupled with the body,
Wherein the vacuum holes are in communication with a second chamber defined by the top panel and the housing, and wherein the ejecting unit is disposed within the hood. 10. The device of claim 9, wherein the opening comprises a first opening having a size smaller than the die and a second opening communicating with the first opening and larger than the first opening,
Wherein the ejecting unit comprises a first member located within the first opening and a second member located within the second opening. 11. A die ejecting apparatus according to claim 10, wherein an inner upper portion of said second opening is provided with a groove for connecting vacuum holes adjacent to said first opening to other vacuum holes. The vacuum cleaner according to claim 10, wherein the second opening is formed to be larger than the second member, and a guide ring corresponding to the second opening is provided around the second member, And second vacuum holes for communicating the second chamber with each other. A die according to claim 6, characterized in that a support member for partially supporting a central portion of the die located on the dicing tape while providing negative pressure inside the chamber is provided inside the chamber. Device. [7] The apparatus of claim 6,
A first conduit connected to the vacuum source and providing a negative pressure inside the chamber;
A first valve provided in the first pipe;
A second conduit connected to the vacuum source and providing negative pressure through the vacuum holes;
A second valve provided in the second pipe;
A third conduit connected to the compressed air source and connected to the first conduit to provide positive pressure within the chamber; And
And a third valve provided in the third pipe.

Images