CN111312650A - Comb type chip on-film separation device - Google Patents
Comb type chip on-film separation device Download PDFInfo
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- CN111312650A CN111312650A CN202010123813.5A CN202010123813A CN111312650A CN 111312650 A CN111312650 A CN 111312650A CN 202010123813 A CN202010123813 A CN 202010123813A CN 111312650 A CN111312650 A CN 111312650A
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- chip
- comb
- vacuum suction
- separator
- air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Abstract
The invention provides a comb-type chip on-film separation device which comprises a vacuum suction head, a top wall of the vacuum suction head, a top rod arranged in the vacuum suction head, a separator connected with the top rod and a lifting device used for driving the top rod and the separator to lift, wherein the top wall of the vacuum suction head is provided with a central hole and suction holes arranged around the central hole, the separator is provided with two rows of comb teeth extending into the central hole and a driving mechanism capable of driving the two rows of comb teeth to be closed or opened. When the device is used, the vacuum suction head sucks the bottom surface of the viscous film, the comb teeth are driven to slightly jack up the viscous film, then the comb teeth are folded, the chip and the viscous film are gradually peeled off along with the movement of the comb teeth, and the suction nozzle above the chip can smoothly suck the chip away. By adopting the stripping mode, the problem of concentrated stress of the traditional steel thimble is solved, and the chip with the thickness of less than 100 micrometers can be stripped without damaging the chip.
Description
Technical Field
The invention relates to the field of semiconductor manufacturing, in particular to a comb-type chip on-film separation device.
Background
In the manufacturing process of semiconductor chips, after the whole wafer is manufactured, the wafer is firstly required to be attached to an adhesive film for scribing, the wafer is cut into individual chips, and then the individual chips are required to be taken down from the adhesive film and transferred to a tray, and a material belt or the individual chips are directly attached to a substrate. In the process of sucking the chip from the adhesive film, because the film has viscosity, the suction nozzle is directly used for sucking the chip from the film, and the vacuum force cannot overcome the adhesive force of the film and cannot be taken down. The chip is required to be jacked up from the film, so that most of the chip is separated from the film, and only the lower part of the chip is adhered to the film, so that the suction nozzle sucks the chip from the upper part, the adhesion force required to be overcome is small, and the chip can be smoothly sucked away. The existing method for lifting a chip from a film and peeling the chip from the film is mainly a method of a thimble, when the chip is lifted, a lifting seat is used for absorbing the film by vacuum, one or more thimbles with the diameter of 0.7mm are lifted from the position under the chip, the front ends of the thimbles are ground, and the needle points are made into circular arcs, so that the contact area can be reduced, and the film can not be broken. When the ejector pins lift up, the peripheral film is adsorbed on the lower lifting seat in a vacuum manner, only the ejector pins protrude to lift up the chip, the film on the periphery of the chip can be peeled off from the chip, only the film with a small area at the positions of the remaining ejector pins is still in contact with the chip, so that the adhesive force of the film is very weak, and the chip can be sucked away by the upper vacuum suction nozzle. The thimble method can correspond to the chip with the thickness of more than 100 microns, and the thick chip has better rigidity, and the thimble can not be cracked when being jacked. However, the chip with the thickness of 100 microns is very fragile due to the chip cost, and when the chip area is slightly larger, the thimble is lifted, and the chip is easily cracked under the interaction of the force of the thimble and the adhesive force of the film. Therefore, a new lift-up method is urgently required for peeling off the adhesive film for a thin chip having a thickness of 100 μm or less.
Disclosure of Invention
The invention aims to provide a novel comb-type chip on-film separation device which can peel off chips with the thickness of less than 100 millimeters without damaging the chips.
The invention solves the technical problem by the following modes:
the utility model provides a separation device on comb formula chip membrane, includes vacuum suction head, be equipped with the centre bore on vacuum suction head's the roof and encircle the suction opening that the centre bore was arranged, its characterized in that: the separator comprises two rows of comb teeth extending into the central hole and a driving device capable of driving the two rows of comb teeth to close or open, and the comb teeth can be higher than the top wall of the vacuum suction head under the driving of the lifting driving mechanism.
When the device is used, the vacuum suction head is moved to the position under the chip, the bottom surface of the viscous film is sucked by the vacuum suction head, the lifting driving mechanism drives the separator to ascend, the comb teeth slightly jack up the viscous film, then the driving device drives the comb teeth to fold, the chip and the viscous film are gradually peeled off along with the movement of the comb teeth, and the suction nozzle above the chip can smoothly suck the chip away. By adopting the stripping mode, the problem of concentrated stress of the traditional steel thimble is solved, and the chip with the thickness of less than 100 micrometers can be stripped without damaging the chip.
As a preferred embodiment of the present invention, the driving device includes a base, stoppers disposed on two sides of the base, a guide rod bridged between the stoppers on the two sides, two sliding blocks passing through the guide rod, and a return spring sleeved on the guide rod and having two ends respectively abutting against the two sliding blocks, the two rows of comb teeth are respectively disposed on top surfaces of the two sliding blocks, and the driving device further includes cylinder cavities disposed in the stoppers on the two sides, and a micro piston disposed in the cylinder cavity, the micro piston is connected to the sliding blocks, the cylinder cavity is communicated with the air intake mechanism, and the micro piston can move in the cylinder cavity under the driving of the air intake mechanism.
When the comb is in operation, the air inlet mechanism inflates the air cylinder cavity to drive the micro pistons at the two sides to move oppositely, so that the comb teeth are folded, and the chip is peeled from the adhesive film. After the chip is stripped, the air inlet mechanism is deflated, and the sliding block moves reversely under the action of the spring, so that the opening and resetting of the comb teeth are realized.
In a preferred embodiment of the present invention, the comb teeth are respectively disposed at the top edges of the two opposite sides of the two sliding blocks, and the structure is adopted to make the comb teeth have a smaller bottom area when being folded, so that the chip can be better peeled.
As a preferred embodiment of the invention, the vacuum suction head further comprises a C-shaped connecting seat, wherein the connecting seat comprises a bottom plate, a vertical plate connected to one end of the bottom plate, and a top plate connected to the top end of the vertical plate and arranged opposite to the bottom plate, a supporting cylinder is arranged on the top plate, and the vacuum suction head is connected to the supporting cylinder. By adopting the structure, space can be saved for the installation of the lifting driving mechanism, and installation conflict is avoided.
In a preferred embodiment of the present invention, an air nozzle is disposed on a side wall of the supporting cylinder, and the air nozzle is communicated with the vacuum suction head through a first air passage located in the supporting cylinder. The suction of the vacuum suction head to the viscous film is realized by air suction through the air nozzle.
As a preferred embodiment of the present invention, the lifting driving mechanism includes a top rod disposed in the supporting cylinder and a lifting device disposed on the connecting seat, a top end of the top rod is connected to a base of the separator, and the lifting device can drive the separator to lift through the top rod.
As a preferred embodiment of the present invention, the lifting device includes a third servo motor disposed on a vertical plate of the connecting seat, the third servo motor has a motor shaft extending into a lower portion of a top plate of the connecting seat, a cam is sleeved on the motor shaft, and the push rod penetrates through a through hole in the top plate and abuts against the cam. Therefore, the lifting of the ejector rod and the separator can be realized through the operation of the third servo motor.
As a preferred embodiment of the present invention, the air intake mechanism includes an air pipe joint disposed on the ejector rod, a second air passage disposed in the ejector rod, and a third air passage disposed in the base, the second air passage communicates the air pipe joint and the third air passage, and the third air passage communicates the cylinder cavity. When the comb is used, the air pipe connector is used for air inlet, air enters the air cylinder cavity through the second air passage and the third air passage, the pistons in the air cylinder cavity are driven to move oppositely, and the folding action of the comb teeth is realized.
As a preferred embodiment of the present invention, the air intake mechanism further includes an electromagnetic valve, and the electromagnetic valve is connected to the air pipe joint. Thereby realizing the inflation and deflation control of the air pipe joint.
By adopting the comb structure, the problem of concentrated stress of the traditional thimble is avoided, the chip with the thickness of less than 100 microns can be effectively stripped without damaging the chip, and the invention makes remarkable progress compared with the prior art.
Drawings
The invention is further illustrated below with reference to the figures:
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a partial enlarged view of portion A of the present invention;
FIG. 3 is a side view of the present invention;
FIG. 4 is a cross-sectional view taken along plane B-B of the present invention;
FIG. 5 is a partial enlarged view of portion B of the present invention;
FIG. 6 is a partial enlarged view of portion C of the present invention;
FIG. 7 is a cross-sectional view of a support cartridge according to the present invention;
FIG. 8 is a perspective view of the separator of the present invention;
FIG. 9 is a schematic view of the installation of the separator and the sliding bracket according to the present invention;
FIG. 10 is an internal view of a vacuum cleaner head according to the present invention;
FIG. 11 is a bottom view of the cover plate of the present invention;
FIG. 12 is an operational view of the puck of the present invention at an initial zero point;
FIG. 13 is a view of the puck of the present invention in operation at a predetermined angle A;
wherein: 100-transverse linear guide rail, 101-first rail, 102-first servo motor, 103-first lead screw, 104-first slide block, 200-longitudinal linear guide rail, 201-second rail, 202-second servo motor, 203-second lead screw, 204-second slide block, 310-connecting seat, 311-bottom plate, 312-vertical plate, 313-top plate, 314-through hole, 320-supporting cylinder, 321-air nozzle, 322-first air channel, 323-first air hole, 324-through hole, 325-blocking part, 330-vacuum suction head, 332-air suction hole, 333-central hole, 334-shell cylinder, 335-cover plate, 336-lug, 337-limit concave cavity, 338-locating hole, 340-third servo motor, 341-cam, 342-locating disk, 350-sensor, 351-induction groove, 360-bracket, 370-electromagnetic valve, 380-tank chain, 400-ejector rod, 401-convex end, 402-air pipe joint, 403-second air channel, 404-second air hole, 405-roller, 410-spring, 420-spacing sleeve, 510-spacing block, 511-boss, 512-strip through hole, 513-abdicating notch, 514-square platform, 515-step, 516-locating column, 520-guide rod, 600-connecting block, 601-containing cavity, 602-sealing ring, 603-sliding groove, 604-locating rod, 605-connecting hole, 606-ring-shaped magnet, 700-separator, 710-base, 711-cylinder cavity, 712-a third air passage, 713-a through groove, 714-a stop block, 715-a sealing plate, 720-a guide rod, 721-a return spring, 730-a micro piston, 740-a sliding block and 741-comb teeth.
Detailed Description
The invention is further illustrated by the following specific examples:
as shown in fig. 1 and 2, a comb-type on-chip-membrane separation apparatus includes an XY plane movement mechanism, a vacuum chuck 330 provided on a position movement mechanism, a separator 700 provided in the vacuum chuck, and a lift driving mechanism for driving the separator 700 to lift.
As shown in fig. 1, 3 and 4, the XY plane motion mechanism includes a transverse linear guide 100 and a longitudinal linear guide 200, where the transverse linear guide 100 includes a first rail 101, a first servo motor 102 disposed at one end of the first rail 101, a first lead screw 103 disposed in the first rail 101 and having one end connected to the first servo motor 102, and a first slider 104 disposed on the first lead screw 103 and engaged with the first lead screw 103. When the sliding mechanism is used, the first servo motor 102 drives the first lead screw 103 to rotate, and drives the first sliding block 104 to slide transversely. The longitudinal linear guide 200 includes a second track 201 disposed on the first slider 104 and perpendicular to the first track 101, a second servo motor 202 disposed at one end of the second track 201, a second lead screw 203 disposed in the second track 201 and having one end connected to the second servo 202 motor, and a second slider 204 disposed on the second lead screw 203 and engaged with the second lead screw 203. When the sliding device is used, the second servo motor 202 drives the second lead screw 203 to rotate, and drives the second sliding block 204 to slide longitudinally.
Accordingly, the fixed point movement of the vacuum cleaner head 330 on the XY plane can be realized by the cooperative operation of the first servomotor 102 and the second servomotor 202.
As shown in fig. 1, the second slider 204 is provided with a connecting seat 310. The connecting seat 310 is C-shaped, and includes a bottom plate 311 fixed on the top surface of the second slider 204, a vertical plate 312 connected to one side edge of the bottom plate 311, and a top plate 313 connected to the top edge of the vertical plate 312 and disposed opposite to the bottom plate 311. The top plate 313 is provided with a support cylinder 320, and a vacuum suction head 330 is fixed to the support cylinder 320.
The supporting cylinder 320 has a structure as shown in fig. 7, a gas nozzle 321 is disposed on a sidewall of the supporting cylinder, the gas nozzle 321 is connected to a first gas passage 322 in the supporting cylinder 320, and a first gas hole 323 communicating with the first gas passage 322 is disposed at the top of the supporting cylinder 320.
The vacuum cleaner head 330 is constructed as shown in FIGS. 1, 2 and 10 and includes a housing 334 and a cover plate 335. The shell 334 is a cylinder with open upper and lower end surfaces, the lower end of the shell 334 is mounted on the top of the support cylinder 320, two lugs 336 arranged oppositely are arranged on the inner wall of the shell 334 close to the top opening, and the cover plate 335 is mounted on the top opening of the shell 334 and fixed with the lugs 336 through bolts.
As shown in fig. 2 and 11, the top wall of the cover plate 335 is a flat surface, a rectangular array of air suction holes 332 are formed in the center of the top wall, a circle of grooves are formed in the edge of the top wall, and the air suction holes 332 are also uniformly distributed in the grooves. The array of suction holes 332 also has a square central hole 333 in the center surrounded by the suction holes 332, and the central hole 333 is shaped and sized to conform to the outline of the chip. The bottom surface of the cover plate 335 is provided with a limiting concave cavity 337 and a positioning hole 338 penetrating through the cover plate 335, and the positioning hole 338 is a kidney-shaped hole.
When the vacuum suction head 330 is in operation, the air nozzles 321 suck air to form a partial vacuum at the grooves of the cover plate 335 and the array of suction holes 332, thereby achieving suction of the adhesive film.
As shown in fig. 4, 6 and 9, the separator 700 includes a base 710, a sliding block 740, a guide rod 720, a micro-piston 730, a return spring 721, a sealing plate 715, a stopper 510 and a guide rod 520.
As shown in fig. 6 and 8, two stoppers 714 are disposed on two sides of the base 710, the guide rod 720 is erected on the stoppers 714 on two sides, the return spring 721 is sleeved on the guide rod 720, two sliding blocks 740 are respectively inserted into the guide rod 720, opposite sides of the two sliding blocks 740 abut against the return spring 721, and the top edges of the opposite sides of the two sliding blocks 740 have upwardly extending comb teeth 741.
As shown in fig. 6, the stopper 714 is provided with a transverse cylinder cavity 711, the micro pistons 730 are respectively disposed in the cylinder cavities 711 on both sides, and the two micro pistons 730 are respectively connected with the sliding block 740. The cylinder chamber 711 communicates with an intake mechanism. When the air inlet mechanism is used, air enters the air inlet mechanism to drive the micro piston 730 to drive the sliding block 740 to move oppositely, the comb teeth 741 are folded, after one round of operation is finished, the air inlet mechanism is deflated, the sliding block 740 resets under the action of the elastic force of the reset spring 721, and the comb teeth 741 are opened.
Of course, the mechanism for driving the comb teeth to close or open is not limited to the piston driving means, and may also be a hydraulic driving means, or a means driven by a guide rail, a lead screw, and a servo motor in a matching manner, which can achieve the effect of controlling the comb teeth to close or open. Piston control is the most preferable mode, so that the structure is more compact and the manufacturing cost is lower.
As shown in fig. 8 and 9, the guide rod 520 is inserted into the guide hole of the base 710, the bottom end of the guide rod 520 extends out of the base 710, a bolt head for limiting the base 710 is disposed at the bottom end, and the top end of the guide rod 520 is fixed to the limiting block 510 located above the base 710. The guide rod 520 is sleeved with a spring, and the spring is respectively propped against the base 710 and the limiting block 510, so that the base 710 and the limiting block 510 can keep an opening state under the condition of no external force.
As shown in fig. 9 and 10, the two sides of the limiting block 510 are provided with receding notches 513 forming gaps with the lugs 336 of the shell 334, the top wall of the limiting block 510 is provided with a boss 511 having an outer diameter slightly smaller than the limiting cavity 337 on the cover plate 335, the center of the boss 511 is provided with a square platform 514 capable of extending into the central hole 333 of the cover plate 335, the square platform 514 is provided with a strip-shaped through hole 512 vertically penetrating through the limiting block 510, and the comb teeth 741 can extend into the strip-shaped through hole 512. The top wall of the limiting block 510 outside the boss 511 is further provided with a step 515 and a positioning column 516 protruding from the top wall of the limiting block 510.
The positioning posts 516 are inserted into the positioning holes 338 of the cover plate 335 all the time during the process of lifting the separator 700, so as to prevent the separator 700 from spinning, and the step 515 and the relief notch 513 can still leave a gap for air to enter when the limiting block 510 abuts against the cover plate 335, thereby ensuring that the air path of the vacuum head 330 is smooth.
The overall operation of the separator 700 is as follows: the separator 700 is lifted under the driving of the lifting driving mechanism, so that the top end of the square table 514 on the limit block 510 slightly extends out of the central hole of the cover plate 335, the boss 511 on the limit block 510 abuts against the limit concave cavity 337 on the cover plate 335, at the moment, the limit block 510 is limited by the cover plate 335 and stops lifting, then the separator 700 continues to lift, the base 710 overcomes the elastic force of the spring and rises along the guide rod 520, and the comb teeth 741 installed in the base 710 extend out of the strip-shaped through holes 512 of the limit block 510.
As shown in fig. 3, 4, 5 and 6, the lifting driving mechanism includes a lifting device disposed on the connecting base 310, a top bar 400 disposed in the supporting cylinder 320, and a connecting block 600 for connecting the top bar 400 and a base 710 of the separator 700.
As shown in fig. 5 and 7, the top rod 400 is inserted into the through hole 324, the top rod 400 is sequentially sleeved with a limiting sleeve 420 and a spring 410 from top to bottom, the limiting sleeve 420 abuts against a blocking portion 325 at the top of the through hole 324, and the spring 410 abuts against a protruding end 401 at the bottom of the top rod 400. The protruding end 401 of the top bar 400 passes through the through hole 314 on the top plate 313 and extends into the connecting seat 310.
As shown in fig. 1 and 5, the lifting device includes a third servo motor 340, a cam 341, a positioning plate 342, and a sensor 350. The third servo motor 340 is fixed on the outer side of the vertical plate 312, a motor shaft thereof passes through the opening on the vertical plate and extends into the inner side of the connecting seat 310, and the cam 341 and the semicircular positioning plate 342 are sequentially sleeved on the motor shaft. The cam 341 abuts against the protruding end 401 of the top bar 400. The lifting of the base 710 is controlled through the transmission of the cam 341, the mandril 400 and the connecting block 600.
The sensor 350 is mounted on the vertical plate 312, a sensing groove 351 is formed in the middle of the sensor 350, and the positioning plate 342 can pass through the sensing groove 351 when rotating, so that the sensor 350 responds, and the controller of the third servo motor 340 can initialize the initial position of the separator 700 to accurately control the lifting height of the separator 700. In a specific method, as shown in fig. 12 and 13, the sensor 350 senses the diameter edge 342a of the puck 342 as an initial zero point, and controls the lift-up height of the separator 700 by sensing the rotation of the puck 342 by a predetermined angle a.
As shown in fig. 6, the bottom of the connecting block 600 has a receiving cavity 601, and the top end of the top rod 400 extends into the receiving cavity 601. The outer wall of the connecting block 600 is provided with a connecting hole 605 communicated with the accommodating cavity 601, and the top rod 400 and the connecting block 600 are fixed by a bolt penetrating through the connecting hole 605 and abutting against the outer wall of the top rod 400.
In order to avoid the rotation of the connecting block 600, the outer wall of the connecting block 600 is provided with a vertically arranged sliding groove 603, a positioning rod 604 is arranged in the sliding groove 603, and the positioning rod 604 is inserted into a positioning insertion hole formed in the top wall of the supporting cylinder 320. Thereby avoiding radial rotation of the connecting block 600 on the premise of not hindering the lifting of the connecting block.
As shown in fig. 2 and 6, the separator 700 has a placing chamber on the bottom surface of the base 710, a ring-shaped magnet 606 is provided in the placing chamber, and the top wall of the connecting block 600 is attached to the ring-shaped magnet 606. By adopting the structure, the connecting block 600 and the separator 700 can be conveniently disassembled and assembled, and the assembly is more convenient.
As shown in fig. 3 and 5, an air pipe connector 402 is provided in the protruding end 401 of the push rod 400, and a second air passage 403 communicated with the air pipe connector 402 is provided in the push rod 400. The second air passage 403 has an outlet at the top of the ram 400.
As shown in fig. 6, the connecting block 600 has a vertical through hole, the vertical through hole is communicated with the second air channel 403, and the second air channel 403 and the vertical through hole are sealed by a sealing ring arranged on the inner wall of the accommodating cavity 601 of the connecting block 600 and the outer wall of the push rod 400.
As shown in fig. 6, a third air passage 712 is disposed in the base 710, an inlet of the third air passage 712 is located in the placing cavity on the bottom surface of the base 710, the third air passage 712 is communicated with the vertical through hole of the connecting block 600 through the central hole of the ring-shaped magnet 606, and air tightness is achieved through the adsorption force of the ring-shaped magnet 606.
The third air passage 712 extends transversely through the entire base 710, and its outlet is located on the outer wall of the stopper 714 of the base 710. The stopper 714 has a through groove 713 on the outer wall thereof for communicating the cylinder chamber 711 with the third air passage 712. The channel 713 is closed by closure plates 715 mounted to the outer walls of the block 714.
As shown in fig. 1 and 3, a support 360 is disposed on the first slider 104, a plurality of electromagnetic valves 370 are disposed on the support 360 and respectively connect the air nozzle 321 and the air pipe connector 402, wherein one of the electromagnetic valves 370, the air pipe connector 402, the second air passage 403, the vertical through hole in the connecting block 600, the ring-shaped magnet 606, the third air passage 712 and the through groove 713 form an air intake mechanism communicating with the air cylinder cavity 711, and the air intake and exhaust of the air pipe connector 402 is controlled by the electromagnetic valve 370 to realize the driving control of the micro piston 730.
The bracket 360 is also provided with a tank chain 380 to realize the following movement of an electric line and a gas line.
With this configuration, the air path of the separator 700 and the air path of the vacuum nozzle 330 are relatively independent from each other and do not interfere with each other.
The above is the overall structure of the present invention, and in operation, the vacuum nozzle 330 is first moved to the position under the adhesive film on which the chip is placed, and the chip on the adhesive film is aligned at a uniform angle with respect to the center hole of the vacuum nozzle 330 by the movement of the adhesive film. Then, the vacuum suction nozzle above the adhesive film descends, and the vacuum suction nozzle is attached to the surface of the chip to start air suction, so that the chip is adsorbed. Then, the solenoid valve connected to the air nozzle 321 is opened to control the vacuum suction head 330 to suck the adhesive film from the bottom. Next, the separator 700 is moved upward in synchronization with the vacuum nozzle until the square table 514 of the separator 700 slightly protrudes from the surface of the separator 700, and the comb teeth 741 of the separator 700 slightly protrudes from the square table 514 and abuts against the lower surface of the adhesive film. Then, the electromagnetic valve 370 connected to the air pipe connector 402 is opened, air enters the cylinder cavity 711 through the second air passage 403, the third air passage 712 and the through groove 713, the micro-pistons 730 are driven to move in opposite directions, and further the comb teeth 741 are driven to move in opposite directions, and in the moving process of the comb teeth 741, a fall is formed on the adhesive film on the outer side of the comb teeth 741, and the adhesive film is peeled from the chip. When the comb teeth 741 move to the center, only a few films are adhered at the contact position of the comb teeth 741 and the chip, the adhesion force is small, and then the vacuum suction nozzle is driven to suck the chip away. Then the solenoid valve 370 controls the air pipe connector 402 to deflate, the separator 700 descends, the comb 741 opens, the device returns to the original state, and the next chip is aligned with the central hole of the vacuum suction head by moving the adhesive film, so as to strip the chip and the film in the next round.
The invention adopts the separator to replace the traditional steel thimble, has no problem of stress concentration, can strip the chip with the thickness of less than 100 microns without damaging the chip, and has obvious progress compared with the prior art.
However, those skilled in the art should realize that the above embodiments are illustrative only and not limiting to the present invention, and that changes and modifications to the above described embodiments are intended to fall within the scope of the appended claims, as long as they fall within the true spirit and scope of the present invention.
Claims (9)
1. A comb-type chip on-film separation apparatus comprising a vacuum suction head (330), a central hole (333) provided on a top wall of the vacuum suction head (330) and a suction hole (332) arranged around the central hole (333), characterized in that: the separator (700) is arranged in the vacuum suction head (330) and comprises a lifting driving mechanism for driving the separator (700) to lift, the separator (700) comprises two rows of comb teeth (741) extending into the central hole (333) and a driving device capable of driving the two rows of comb teeth (741) to close or open, and the comb teeth (741) can be driven by the lifting driving mechanism to be higher than the top wall of the vacuum suction head (330).
2. The comb-chip on-film separation device of claim 1, wherein: the driving device comprises a base (710), stop blocks (714) arranged on two sides of the base (710), a guide rod (720) bridged between the stop blocks (714) on the two sides, two sliding blocks (740) arranged on the guide rod (720) in a penetrating mode, a return spring (721) sleeved on the guide rod (720) and with two ends respectively abutted against the two sliding blocks (740), two rows of comb teeth (741) respectively arranged on the top surfaces of the two sliding blocks (740), a cylinder cavity (711) arranged in the stop blocks (714) on the two sides and a micro piston (730) arranged in the cylinder cavity (711), wherein the micro piston (730) is connected with the sliding blocks (740), the cylinder cavity (711) is communicated with an air inlet mechanism, and the micro piston (730) can move in the cylinder cavity (711) under the driving of the air inlet mechanism.
3. The comb-chip on-film separation device of claim 2, wherein: the comb teeth (741) are respectively arranged at the edges of the top surfaces of the opposite sides of the two sliding blocks (740).
4. The comb-chip on-film separation device of claim 1, wherein: still include C shape connecting seat (310), connecting seat (310) include bottom plate (311), connect in riser (312) of bottom plate (311) one end and connect in riser (312) top with roof (313) that bottom plate (311) were arranged relatively, be equipped with a support section of thick bamboo (320) on roof (313), vacuum suction head (330) connect in support on the section of thick bamboo (320).
5. The comb-chip on-film separation device of claim 4, wherein: an air nozzle (321) is arranged on the side wall of the supporting cylinder (320), and a first air passage (322) communicated with the air nozzle (321) and the vacuum suction head (330) is arranged in the supporting cylinder (320).
6. The comb-type chip on film separating device of claim 5, wherein the lifting driving mechanism comprises a top bar (400) arranged in the supporting cylinder (320) and a lifting device arranged on the connecting seat (310), the top end of the top bar (400) is connected with a base (710) of the separator (700), and the lifting device can drive the separator (700) to lift through the top bar (400).
7. The comb-type chip on-film separation device of claim 6, wherein the lifting device comprises a third servo motor (340) arranged on a vertical plate (312) of the connecting seat (310), the third servo motor (340) is provided with a motor shaft extending into the lower part of a top plate (313) of the connecting seat (310), a cam (341) is sleeved on the motor shaft, and the top rod (400) penetrates through a through hole (314) in the top plate (313) to abut against the cam (341).
8. The comb-chip on-film separation device of claim 7, wherein: the air inlet mechanism comprises an air pipe connector (402) arranged on the ejector rod (400), a second air passage (403) arranged in the ejector rod (400) and a third air passage (712) arranged in the base (710), the second air passage (403) is communicated with the air pipe connector (402) and the third air passage (712), and the third air passage (712) is communicated with the cylinder cavity (711).
9. The comb-chip on-film separation device of claim 8, wherein: the air inlet mechanism further comprises an electromagnetic valve (370), and the electromagnetic valve (370) is connected with the air pipe joint (402).
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| CN202010123813.5A CN111312650B (en) | 2020-02-27 | 2020-02-27 | Comb type chip on-film separation device |
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| CN202010123813.5A CN111312650B (en) | 2020-02-27 | 2020-02-27 | Comb type chip on-film separation device |
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| CN111312650B CN111312650B (en) | 2021-07-02 |
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Address after: 201600 Building 1, No. 76, Jinma Road, Jiuting Town, Songjiang District, Shanghai Patentee after: Shanghai Shiyu Precision Equipment Co.,Ltd. Address before: 201600 Room 101, building 3, no.1589, Lianfu Road, Jiuting Town, Songjiang District, Shanghai Patentee before: SHANGHAI SHIYU PRECISION MACHINERY Co.,Ltd. |