KR20140069940A - Rigid-flexible substrate having via structure connecting multilayers and manufacturing method thereof - Google Patents

Rigid-flexible substrate having via structure connecting multilayers and manufacturing method thereof Download PDF

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Publication number
KR20140069940A
KR20140069940A KR1020120137836A KR20120137836A KR20140069940A KR 20140069940 A KR20140069940 A KR 20140069940A KR 1020120137836 A KR1020120137836 A KR 1020120137836A KR 20120137836 A KR20120137836 A KR 20120137836A KR 20140069940 A KR20140069940 A KR 20140069940A
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KR
South Korea
Prior art keywords
layer
hole
conductive pattern
build
flexible substrate
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KR1020120137836A
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Korean (ko)
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조형주
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삼성전기주식회사
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Priority to KR1020120137836A priority Critical patent/KR20140069940A/en
Publication of KR20140069940A publication Critical patent/KR20140069940A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]

Abstract

The present invention relates to a rigid flexible substrate having a multilayer connection via structure and a manufacturing method thereof. According to an embodiment of the present invention, there is provided a flexible substrate including a flexible substrate and first and second conductive pattern layers formed on upper and lower surfaces of the flexible substrate; A build-up layer including a build-up insulation layer and a third conductive pattern layer formed on the build-up insulation layer, the build-up layer being stacked on at least one side of upper and lower portions of the flexible layer; And the first and second conductive pattern layers are connected to each other through the first and second end through-hole structures, the third conductive pattern layer and the build-up insulation layer, The diameter of the second end through hole connected to the stacked first or second conductive pattern layer is larger than the diameter of the first or second conductive pattern layer passing through the first or second conductive pattern layer and the flexible substrate, Hole having a size larger than the diameter of the first-end through-hole connecting the first through-hole and the second through-hole. A manufacturing method thereof is also proposed.

Description

TECHNICAL FIELD [0001] The present invention relates to a rigid flexible substrate having a multi-layer connection via structure and a method of manufacturing the same.

The present invention relates to a rigid flexible substrate having a multilayer connection via structure and a manufacturing method thereof. More specifically, the present invention relates to a rigid flexible substrate having a multi-layer connection via structure and a manufacturing method thereof.

As miniaturization, densification, and thinning of electronic parts have been made, studies on miniaturization and high functioning of PCB substrate are actively being carried out. In accordance with the high performance and miniaturization of electronic products, the use of rigid-flexible substrates is expanding.

The rigid-flexible substrate is composed of a flexible portion, that is, a flexible region, which can be easily folded with a rigid region in which an electronic component or the like is mounted. As the flexible area is easily folded, it is widely used in mobile terminals such as mobile phones, notebooks, and netbooks.

In addition, according to high-speed transmission of a portable mobile device, it is necessary to apply an IVH (Inner Via Hole) structure to a rigid flexible substrate.

At this time, as the core layer of the rigid flexible substrate, a flexible substrate such as flexible copper clad laminated (FCCL) is mainly used. Double-sided FCCLs are not easy to fill via and require a dedicated plating line for thin plates. Accordingly, a large amount of equipment investment costs will be incurred.

4 is a view showing a conventional rigid flexible substrate.

4, plating layers 25a and 25b are formed on the inner IVH 20 and the FCCL 10 through the FCCL 10 formed on the upper and lower surfaces of the copper foil layers 13 and 15 and the plating layers 25a and 25b are formed on the FCCL 10, Build-up layers 30a and 30b including a prepreg insulating layer 31 and a conductive pattern layer 35 are stacked on the inner IVH 20 and the prepreg insulating layer 31 is connected to the inner IVH 20, A via hole 52 is formed.

That is, in FIG. 4, in order to connect the upper and lower pattern layers 13 and 15 of the FCCL and the conductive pattern layers 35 of the build-up layers 30a and 30b, plating is required on both sides of the FCCL, It is necessary to construct a line dedicated to double-side FCCL plating.

Korean Patent Publication No. 10-2007-0076950 (published on July 25, 2007)

In order to solve the above-mentioned problems, there is a need to provide a rigid connection structure having a multi-layer connection via structure capable of integrally forming internal via via holes connecting the conductive pattern layer formed on the upper and lower portions of the flexible substrate and the conductive pattern layer formed on the build- A flexible substrate and a manufacturing method thereof are proposed.

That is, a rigid flexible substrate having a multilayer connection via structure capable of connecting a conductive pattern layer formed on upper and lower portions of a flexible substrate and a conductive pattern layer formed on a build-up insulating layer by batch plating with a general plating line and a manufacturing method thereof are proposed.

According to a first embodiment of the present invention, there is provided a flexible substrate including first and second conductive pattern layers formed on upper and lower surfaces of a flexible substrate and a flexible substrate, A build-up layer including a build-up insulation layer and a third conductive pattern layer formed on the build-up insulation layer, the build-up layer being stacked on at least one side of upper and lower portions of the flexible layer; And the first and second conductive pattern layers are connected to each other through the first and second end through-hole structures, the third conductive pattern layer and the build-up insulation layer, The diameter of the second end through hole connected to the stacked first or second conductive pattern layer is larger than the diameter of the first or second conductive pattern layer passing through the first or second conductive pattern layer and the flexible substrate, Hole having a size larger than the diameter of the first-end through-hole connecting the first through-hole and the second through-hole.

In this case, in one example, the first end through-hole passes through the first or second conductive pattern layer and the flexible substrate and does not penetrate the other of the first and second conductive pattern layers, Can be connected.

According to one example, the first or second conductive pattern layer to which the second end through-hole is connected includes the through-hole seating pad having the second end through-hole, and the first end through- Hole through the through-hole seating pad in the region where the second-stage through-hole is seated in the region of the pad.

In another example, the second end through-hole may be connected to a plating layer formed on the third conductive pattern layer.

Further, in one example, the build-up layer stacked on at least one side of the upper and lower sides of the flexible layer is a build-up multilayer structure in which a buildup insulating layer and a conductive pattern layer formed on the build- .

At this time, the second through-hole may be connected to the outermost or intermediate conductive pattern layer of the build-up layer structure or to the first or second conductive pattern layer.

In another example, the flexible substrate may be made of a polyimide material, and the build-up insulation layer may be a prepreg insulation layer.

Next, in order to solve the above problems, according to a second embodiment of the present invention, there is provided a method of manufacturing a flexible printed circuit board, comprising: preparing a flexible layer including first and second conductive pattern layers formed on upper and lower surfaces of a flexible substrate and a flexible substrate; A build-up insulating layer and a third conductive layer formed on the build-up insulating layer, on at least one side of upper and lower sides of the flexible layer; And connecting the third conductive layer, the second conductive pattern layer, and the first conductive pattern layer in the second end and the first end through-hole structure, through the third conductive layer and the build-up insulating layer to build up the third conductive layer, Wherein the first or second conductive pattern layer having the second end-contact hole connected thereto is connected to the first or second conductive pattern layer through the first or second conductive pattern layer, And forming an inner via hole having a size larger than the diameter of the first end through-hole connecting the conductive pattern layers. A method of manufacturing a rigid flexible substrate having a multilayer via-hole structure is proposed.

In one embodiment, the step of forming the through via holes may include: forming an inner through hole having a structure in which a first end open hole having a smaller diameter than the second end open hole and the second end open hole are stacked, A second end open hole penetrating the build-up insulating layer through the open region on the third conductive layer and exposing the first or second conductive pattern layer in which the build-up insulating layer is stacked, and a second end open hole exposed through the second end open hole And the first through-hole is formed so as to pass through the flexible substrate exposed in the region of the first or second conductive pattern layer and to expose the other one of the first and second conductive pattern layers to the a- ; And forming an internal via hole for connecting the third conductive layer, the second conductive pattern layer, and the first conductive pattern layer by filling the internal through hole with a conductive material.

At this time, in the step of preparing the flexible layer, a step of forming a first or second conductive pattern layer having an exposed region for exposing the flexible substrate in the region and including a through-hole seating pad to which the second- Wherein a buildup layer including a third conductive layer having an open region is stacked or a third conductive layer of a stacked buildup layer is processed to form an open region , The first end open hole passes through the flexible substrate of the exposed region exposed by the second end open hole in the region of the through hole seating pad, And the remaining one layer can be exposed to the aesthetic tube.

Further, according to one example, in the step of forming the inner via-hole, a large-diameter open hole and a small-diameter open hole, through which the inner via-hole is to be formed, are formed by CO 2 laser machining .

In another example, in the step of forming the inner via-hole, a plating layer may be formed on the third conductive layer, and the plating layer may be integrally plated to form the inner via-hole.

Further, in one example, after the step of forming the inner via-hole, a build-up additional layer including a build-up additional insulating layer and a conductive layer formed on the build-up additional insulating layer is formed as a build- On the substrate.

According to another example, in the step of laminating the build-up layers, the build-up layer is a build-up multilayer structure in which the conductive pattern layers formed on the build-up insulating layer and the build- In the step of forming the through-via-holes, the second through-hole may pass through from the outermost conductive pattern layer of the build-up multilayer structure to the first or second conductive pattern layer.

In one example, in the step of preparing the flexible layer, the first and second conductive pattern layers are formed on the flexible substrate made of polyimide material, and in the step of laminating the build-up layers, It can be laminated using a prepreg insulating layer.

According to the embodiment of the present invention, it is possible to collectively form the internal through-via holes for connecting the conductive pattern layer formed on the upper and lower portions of the flexible substrate and the conductive pattern layer formed on the build-

In one example, the conductive pattern layer formed on the upper and lower portions of the flexible substrate and the conductive pattern layer formed on the build-up insulating layer can be connected by performing general plating with a general plating line.

It is apparent that various effects not directly referred to in accordance with various embodiments of the present invention can be derived by those of ordinary skill in the art from the various configurations according to the embodiments of the present invention.

1 is a schematic view of a rigid flexible substrate having a multilayer connection via structure according to an embodiment of the present invention.
FIGS. 2A to 2E are views showing a process of manufacturing a rigid flexible substrate having a multilayer via-hole structure according to one example of the present invention.
3 is a view showing a rigid flexible substrate according to a comparative example of the present invention.
4 is a view showing a conventional rigid flexible substrate.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a block diagram showing the configuration of a first embodiment of the present invention; Fig. In the description, the same reference numerals denote the same components, and a detailed description may be omitted for the sake of understanding of the present invention to those skilled in the art.

As used herein, unless an element is referred to as being 'direct' in connection, combination, or placement with other elements, it is to be understood that not only are there forms of being 'directly connected, They may also be present in the form of being connected, bonded or disposed.

It should be noted that, even though a singular expression is described in this specification, it can be used as a concept representing the entire constitution unless it is contrary to, or obviously different from, or inconsistent with the concept of the invention. It is to be understood that the phrases "including", "having", "having", "including", and the like in the present specification are to be construed as present or absent from one or more other elements or combinations thereof.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings, in which: FIG.

In this specification, terms such as 'first', 'second', 'third' and the like are used to distinguish the components from each other.

First, a rigid flexible substrate having a multilayer via-hole structure according to a first embodiment of the present invention will be described in detail with reference to the drawings. Here, reference numerals not shown in the drawings to be referred to may be reference numerals in other drawings showing the same configuration.

1 is a schematic view of a rigid flexible substrate having a multilayer connection via structure according to an embodiment of the present invention.

Referring to FIG. 1, a rigid flexible substrate having a multilayered via structure according to one example includes a flexible layer 10, a build-up layer 30, and an internal via via hole 50. For example, a rigid flexible substrate having a multi-layer connection via structure can be used in high-performance small-sized electronic equipment. For example, a rigid flexible substrate having a multi-layer connection via structure can be used in a mobile device.

Specifically, the flexible layer 10 includes first and second conductive pattern layers 13 and 15 formed on the upper surface and the lower surface of the flexible substrate 11 and the flexible substrate 11, respectively. When the build-up layer 30 is laminated on the flexible layer 10, the flexible layer 10 can be a core layer. 1, the first conductive pattern layer 13 is formed on the lower surface of the flexible substrate 11 and the second conductive pattern layer 15 is formed on the upper surface of the flexible substrate 11, And the positions of the second conductive pattern layers 13 and 15 may be mutually changed. For example, the first and second conductive pattern layers 13 and 15 formed on the upper and lower surfaces of the flexible substrate 11 may be a patterned layer in which the copper foil layer is processed.

Further, in one example, the flexible substrate 11 may be made of a polyimide material, and the material of the flexible substrate 11 is not limited thereto.

1, the build-up layer 30 is laminated on at least one side of the upper and lower sides of the flexible layer 10. [ That is, the build-up layer 30 may be laminated on the upper or lower portion or the upper and lower portions of the flexible layer 10. 1 shows that a build-up layer 30 is stacked on top of the flexible layer 10. At this time, the build-up layer 30 includes a build-up insulating layer 31 and a third conductive pattern layer 35 formed on the build-up insulating layer 31. For example, when the flexible layer 10 is a core layer in the rigid-flexible substrate, the portion where the build-up layer 30 is laminated forms the rigid region, and the portion of the flexible layer 10 where the build- Regions. 1, a plating layer 45 may be further formed on the third conductive pattern layer 35. In this case, the third conductive pattern layer 35 and the plating layer 45 may be integrally formed with a circuit pattern . At this time, the plating layer 45 may be formed integrally with the through-via hole 50 to be described later. For example, the plating layer 45 and the inner via-hole 50 may be integrally formed through a plating process. The third conductive pattern layer 35 may be a layer including the circuit pattern 135 on which the copper foil layer is processed.

In one example, the build-up insulating layer 31 may be composed of a prepreg insulating layer, and the material of the build-up insulating layer 31 is not limited thereto. For example, the build-up insulating layer 31 may be formed of a prepreg, a bonding sheet, a curved layer, a polyimide, or a combination layer structure thereof

Next, referring to FIG. 1, the inner via hole 50 connects the first, second, and third conductive pattern layers 13, 15, and 35 to the first and second through hole structures. At this time, the second end through hole passes through the third conductive pattern layer 35 and the build-up insulating layer 31, and the first or second conductive pattern layer 13 or 15 And the third conductive pattern layer 35 are connected to each other. At this time, the diameter of the second end through-hole has a size larger than the diameter of the first end through-hole to be described later. Referring to FIG. 1, when the build-up insulating layer 31 is laminated on the second conductive pattern layer 15, the second end through-hole is formed in the third conductive pattern layer 35 ) And the second conductive pattern layer (15) under the build-up insulating layer (31). For example, the inner via-hole 50 may be formed by filling a conductive material into the first and second end open holes 31a for forming the first end and the second end through-hole. For example, the conductive material may be copper, but is not limited thereto.

In one example, the first or second conductive pattern layer 13, 15 to which the second end-contact hole is connected may include a through-hole seating pad 115a on which the second end-contact hole is seated. At this time, the through-hole seating pad 115a may include an exposed region that is opened inside the region and exposes the flexible substrate 11. At this time, the first through-hole to be described next may be formed extending from the exposed region of the through-hole seating pad 115a toward the flexible substrate 11 side.

For example, the second through hole may be connected to the plating layer 45 formed on the third conductive pattern layer 35. At this time, the second end through-hole may be integrated with the plating layer 45 together with the first end through-hole.

The first through hole passes through the first or second conductive pattern layer 13 or 15 connected to the second end through hole and the flexible substrate 11 and is electrically connected to the first and second conductive pattern layers 13 and 15 formed on the upper and lower surfaces of the flexible substrate 11, And the second conductive pattern layers 13 and 15 are connected. Referring to FIG. 1, the second end through hole connects the third conductive pattern layer 35 and the second conductive pattern layer 15, and the first end through-hole connects the second conductive pattern 15 The layer 15 and the first conductive pattern layer 13 are connected to each other. For example, referring to FIG. 1, the first through-hole may be formed to extend from the lower portion of the second through-hole. 1, when the build-up layer 30 is laminated under the flexible layer 10, a first through hole may be formed extending from the upper portion of the second end through-hole.

For example, the first-end through-hole may be formed in the first or second conductive pattern layer 13, 15, which is connected to the second-end through-hole and the first and second conductive pattern layers 13, And the first and second conductive pattern layers 13 and 15 formed on the upper and lower portions of the flexible substrate 11 may be connected.

Also, in one example, the first or second conductive pattern layer 13, 15 to which the second end through-hole is connected may include the through-hole seating pad 115a on which the second end through-hole is seated. At this time, the first end through-hole may pass through the through-hole seating pad 115a in a region where the second end through-hole is located in the region of the through-hole seating pad 115a.

In addition, although not shown, in one example, the build-up layer stacked on at least one side of the upper and lower sides of the flexible layer 10 may have a multi-layer structure. That is, the build-up layer may be a build-up multilayer structure (not shown) in which the buildup insulating layer 31 and the conductive pattern layer 35 formed on the build-up insulating layer 31 are repeated and stacked in multiple layers .

In this case, in one example, the second through-hole (not shown) may be connected to the first or second conductive pattern layer 13 or 15 from the outermost or intermediate conductive pattern layer of the build- .

On the other hand, Fig. 3 shows a rigid flexible substrate according to a comparative example.

3, the conductive pattern layer 35 of the build-up layer 30 stacked on the flexible substrate 11 and the conductive pattern layer 13 formed on the lower portion of the flexible substrate 11 are stacked in FIG. The process can be shortened as compared with the conventional FIG. 4, but the problem that the second conductive pattern layer 15 on the flexible substrate 11, which is the intermediate conductive pattern layer, should be skipped . If the interlayer eccentricity is formed at the time of forming the via hole for the via plating at one time without skipping, the via is clogged and the fill plating becomes impossible or unreliable, so that the reliability problem of the via may occur. The second conductive pattern layer 15 is skipped. At this time, the second conductive pattern layer 15 can not be fully utilized, and the degree of freedom of the pattern can be restricted as compared with the embodiment of the present invention.

1, the first and second conductive pattern layers 13 and 15 formed on the upper and lower sides of the flexible substrate 11 and the conductive pattern layer 35 of the build-up layer 30, The through-via holes 50 connecting both of the first through-hole 50 and the second through-hole 50 are formed at the same time. Therefore, the pattern freedom degree can be secured by utilizing the second conductive pattern layer 15 as compared with the case of FIG. 3, The first, second, and third conductive pattern layers 13, 15, and 35 can be connected at a time from one side at a time without requiring a hole forming process and a double-side plating process on both sides of the conductive pattern 10, thereby shortening the process. Furthermore, since the second conductive pattern layer 15 can be utilized, it can be realized in a thin structure as compared with FIG.

Next, a method of manufacturing a rigid flexible substrate having a multilayer connection via structure according to a second embodiment of the present invention will be described in detail with reference to the drawings. At this time, examples of a rigid flexible substrate having a multilayer via-hole structure according to the above-described first embodiment and Fig. 1 will be referred to, and thus redundant explanations can be omitted.

FIGS. 2A through 2E show a manufacturing process of a rigid flexible substrate having a multi-layer connection via structure according to one example of the present invention.

Referring to FIGS. 2A to 2C, a method of manufacturing a rigid flexible substrate having a multilayer via-hole structure according to one example includes a flexible layer preparation step (see FIG. 2A), a build-up layer stacking step (see FIG. 2B) (See Figures 2C-2E). For example, a rigid flexible substrate having a multilayer via-hole structure to be manufactured at this time can be used in high-performance small-sized electronic equipment and can be used, for example, in mobile equipment.

Specifically, referring to FIG. 2A, in the flexible layer preparation step, the flexible layer 10 is prepared. The flexible layer 10 includes first and second conductive pattern layers 13 and 15 formed on the upper and lower surfaces of the flexible substrate 11 and the flexible substrate 11. 2A shows a state before lamination of the flexible layer 10 and the build-up layer 30. FIG. That is, the flexible layer 10 is shown at the lower part of FIG. 2A, and the build-up layer 30 to be laminated to the flexible layer 10 prepared at the upper part of FIG. 2A is shown.

For example, in the flexible layer preparation step, first and second conductive layers are formed on the upper and lower surfaces of the prepared flexible substrate 11, and the first and second conductive layers are processed to form a pattern to form first and second conductive pattern layers 13 and 15 can be formed. Alternatively, in the flexible layer preparing step, the first and second conductive layers are formed on the upper and lower surfaces of the flexible substrate 11 and the first and second conductive layers are processed to form the first and second conductive pattern layers 13 and 15 . For example, the first and second conductive layers may be a copper foil layer, but are not limited thereto. At this time, the first and second conductive pattern layers 13 and 15 having patterns formed by etching the first and second conductive layers may be formed.

For example, referring to the lower side of FIG. 2A, the flexible layer preparing step may include a step of preparing a first or second conductive pattern layer 13, 15 including a through-hole seating pad 115a to which a second- To form a second layer. At this time, the through-hole seating pad 115a may have an exposed region in which the flexible substrate 11 is exposed. 2A illustrates that a buildup layer 30 is laminated on a second conductive pattern layer 15 formed on an upper surface of a flexible substrate 11. The second conductive pattern layer 15 has a through- And includes a hole seating pad 115a. At this time, the exposed region of the through-hole seating pad 115a may be an area where the first conductive pattern layer 13 is exposed through the through-via hole forming step (see FIG. 2C).

In one example, in the flexible layer preparation step, the first and second conductive pattern layers 13 and 15 can be formed on the flexible substrate 11 made of polyimide material.

Next, referring to FIG. 2B, in the build-up layer stacking step, the build-up layer 30 is stacked on at least one side of the upper and lower sides of the flexible layer 10. 2B shows that the build-up layer 30 is laminated on the upper part of the flexible layer 10. Alternatively, a build-up layer may be laminated on the lower part of the flexible layer 10, A build-up layer may be stacked on the upper and lower portions of the substrate. The build-up layer 30 includes a build-up insulation layer 31 and a third conductive layer 35 formed on the build-up insulation layer 31. At this time, the third conductive layer 35 may be in a state before the circuit pattern 135 is formed. 2A and 2B, reference numeral 35 in the build-up layer 30 indicates a third conductive layer. For example, the third conductive layer 35 may be a copper foil layer, but is not limited thereto.

At this time, in the build-up layer stacking step, the build-up insulating layer 31 may be laminated using a prepreg insulating layer, and the material of the build-up insulating layer 31 is not limited thereto.

2B, in the build-up layer laminating step, a build-up layer 30 including a third conductive layer 35 having an open region 35a is formed on the flexible layer 10, The third conductive layer 35 of the build-up layer 30 laminated on at least one side of the upper and lower portions of the build-up layer 30 may be processed to form the open region 35a. At this time, the open region 35a of the third conductive layer 35 becomes a region for perforating the second end open hole 31a. For example, the build-up insulating layer 31 of the open region 35a of the third conductive layer 35 can be perforated by CO 2 laser processing.

Next, referring to FIGS. 2C to 2E, the inner via hole 50 is formed in the inner through hole forming step. At this time, the inner through-via hole 50 connects the third conductive layer 35, the second conductive pattern layer 15, and the first conductive pattern layer 13 with the second end and the first end through-hole structure. 2D and 2E, the second through-hole of the through via hole 50 connects the third conductive layer or the third conductive pattern layer 35 and the second conductive pattern layer 15, The first through-hole of the through-via hole 50 may extend from the second through-hole to connect the second conductive pattern layer 15 and the first conductive pattern layer 13. At this time, the third conductive pattern layer 35 may be a layer in which the circuit pattern 135 is formed by processing the third conductive layer 35 formed on the build-up insulating layer 31. In FIG. 2D, reference numeral 35 denotes a third conductive layer 35 before the circuit pattern 135 is formed, reference numeral 135 in FIG. 2E denotes circuit patterns, reference numeral 35 in FIG. 2E denotes a circuit pattern The third conductive pattern layer 35 is formed as a third conductive layer in which the first conductive pattern layer 135 is formed.

The second through hole of the through via hole 50 penetrates through the third conductive layer 35 and the build-up insulating layer 31 and is electrically connected to the first or second conductive pattern 31, The layers 13 and 15 and the third conductive layer 35 are connected. The first end insulating layer of the through via hole 50 is electrically connected to the first or second conductive pattern layer 13 or 15 connected to the second end through hole through the flexible substrate 11, The pattern layers 13 and 15 are connected. At this time, the diameter of the second end through-hole is larger than the diameter of the first end through-hole.

For example, the inner via-hole 50 is formed of a conductive material. At this time, in one example, a large-diameter open hole, for example, a second-end open hole 31a and a small-diameter open hole, in which the inner via-hole 50 is to be formed by filling the conductive material, The open hole 11a can be formed at one time by CO 2 laser machining.

2C and 2D, in one example, the step of forming the inner via-hole includes the step of forming the inner through-hole (see FIG. 2C) and the step of forming the inner via-hole filled with the conductive material .

Referring to FIG. 2C, in the inner through-hole forming step, the first through-hole 11a having a smaller diameter than the second through-hole 31a and the second through- Holes can be formed. In this case, the second end open hole 31a penetrates the build-up insulating layer 31 through the open region 35a on the third conductive layer 35, and the first or second open hole 31a, The second conductive pattern layers 13 and 15 are exposed. 2B, the build-up insulating layer 31 is formed on the second conductive pattern layer 15, and the second conductive pattern layer 15 is exposed by the second end open hole 31a in FIG. 2C. The first end open hole 11a penetrates the flexible substrate 11 exposed in the region of the first or second conductive pattern layer 13 or 15 exposed by the second end open hole 31a The other one of the first and second conductive pattern layers 13 and 15 is exposed to the aesthetic tube. In FIG. 2C, the first conductive pattern layer 13 is not penetrated by the first end open hole 11a and is exposed.

At this time, according to one example, a through hole seating pad 115a having an exposed region 15a for exposing the flexible substrate 11 is formed in the flexible layer preparing step, and in the build-up layer stacking step, A case where an open region 35a is formed in the third conductive layer 35 to expose the first conductive layer 31 will be described. At this time, in the step of forming the internal through hole, the first end open hole 11a is formed in the exposed region 15a exposed by the second end open hole 31a of the region of the through hole seating pad 115a 11 and the other one of the first and second conductive pattern layers 13, 15 may be exposed to the aesthetic tube.

Further, in one example, the second stage open hole 31a and the first stage open hole 11a can be formed at once by CO 2 laser machining. That is, the through-hole seating pad 115a to be exposed by the second-stage open hole 31a, for example, in the region of the through-hole seating pad 115a of the second conductive pattern layer 15a in FIG. The flexible substrate 11 exposed in the open area 15a is penetrated by the first end open hole 11a. At this time, the second end open hole 31a and the first end open hole 11a can be formed by a single CO 2 laser drilling process. For example, when the CO 2 laser is used, the insulating layer excluding the metal conductive layer such as the copper foil layer can be processed. Therefore, as shown in FIG. 2C, the second end open hole 31a and the first end open hole 11a, Can be simultaneously processed.

Next, referring to FIG. 2D, in the step of forming the conductive via hole filled with the conductive material, the internal through hole is filled with the conductive material to form the third conductive layer 35, the second conductive pattern layer 15, An internal through-via hole 50 connecting the first conductive pattern layer 13 can be formed. For example, the inner via hole 50 may be formed by integrally plating an inner through hole. In addition, the conductive material may be copper, but is not limited thereto.

2D, another plating layer 45 is formed on the third conductive layer 35 and is integrally plated with the plating layer 45 to form an inner via hole (not shown) 50 can be formed. Accordingly, the through-via holes 50 connecting the first, second, and third conductive pattern layers 13, 15, and 35 are formed in the plating process without skipping the second conductive pattern layer 15, Can be integrally formed in the process.

2E, in one example, after forming the plating layer 45 on the third conductive layer 35 integrally with the inner via-hole 50 in the step of forming the inner via-hole, The circuit pattern 135 and the plating layer 45 may be integrally formed and etched, for example.

Although not shown, according to another example, a build-up layer of a build-up multilayer structure stacked in multiple layers in the build-up layer stacking step can be stacked. At this time, the build-up layer has a multilayer structure in which the build-up insulating layer 31 and the conductive pattern layer 35 formed on the build-up insulating layer 31 are repeated.

At this time, in the step of forming the internal via-hole, the second end through-hole may be connected from the outermost conductive pattern layer of the build-up multilayer structure to the first or second conductive pattern layer 13 or 15.

Further, although not shown, according to one example, after the step of forming the via-via-holes, a step of stacking a build-up additional layer on the build-up layer 30 may be further included. At this time, a build-up additional layer (not shown) includes a build-up additional insulating layer and a conductive layer formed on the build-up additional insulating layer. A build-up additional layer (not shown) is laminated on the build-up layer 30 on which the inner via-hole 50 is formed.

The foregoing embodiments and accompanying drawings are not intended to limit the scope of the present invention but to illustrate the present invention in order to facilitate understanding of the present invention by those skilled in the art. Embodiments in accordance with various combinations of the above-described configurations can also be implemented by those skilled in the art from the foregoing detailed description. Accordingly, various embodiments of the invention may be embodied in various forms without departing from the essential characteristics thereof, and the scope of the invention should be construed in accordance with the invention as set forth in the appended claims. Alternatives, and equivalents by those skilled in the art.

10: flexible layer 11: flexible substrate
11a: first end open hole 13: first conductive pattern layer
15: second conductive pattern layer 30: build-up layer
31: build-up insulating layer 31a: second stage open hole
35: third conductive layer or third conductive pattern layer 45: plating layer
50: internal via-hole 113, 115, 135: circuit pattern
115a: Through-hole seating pad

Claims (15)

A flexible layer including first and second conductive pattern layers formed on upper and lower surfaces of the flexible substrate and the flexible substrate;
A build-up layer including a build-up insulation layer and a third conductive pattern layer formed on the build-up insulation layer, the build-up layer being stacked on at least one side of upper and lower portions of the flexible layer; And
Wherein the first conductive pattern layer and the second conductive pattern layer are connected to each other through the first conductive pattern layer and the build-up insulating layer, Wherein a diameter of the second end through-hole connected to the first or second conductive pattern layer in which the build-up insulating layer is stacked passes through the first or second conductive pattern layer and the flexible substrate to which the second end- And an internal via via hole having a size larger than a diameter of the first end through-hole connecting the first and second conductive pattern layers,
A rigid flexible substrate having a multilayer connection via structure.
The method according to claim 1,
Wherein the first end through hole penetrates the first or second conductive pattern layer and the flexible substrate and does not penetrate the remaining one of the first and second conductive pattern layers and connects the first and second conductive pattern layers And a plurality of connection pads formed on the substrate.
The method according to claim 1,
And the first or second conductive pattern layer to which the second end through hole is connected includes a through hole seating pad having the second end through hole,
And the first end through-hole penetrates the through-hole seating pad in a region of the through-hole seating pad where the second end-through hole is seated. The rigid flexible substrate according to claim 1,
4. The method according to any one of claims 1 to 3,
And the second end through-hole is connected to a plating layer formed on the third conductive pattern layer.
4. The method according to any one of claims 1 to 3,
Wherein the build-up layer stacked on at least one side of the upper and lower sides of the flexible layer is a build-up multilayer structure in which the build-up insulation layer and the conductive pattern layer formed on the build- A rigid flexible substrate having a via-via structure.
The method of claim 5,
And the second end through hole is connected to the first or second conductive pattern layer from the outermost or intermediate conductive pattern layer of the build-up ultimate layer structure. .
4. The method according to any one of claims 1 to 3,
Wherein the flexible substrate is made of a polyimide material,
Wherein the build-up insulation layer has a multilayer connection via structure composed of a prepreg insulation layer.
Preparing a flexible layer including a flexible substrate and first and second conductive pattern layers formed on upper and lower surfaces of the flexible substrate;
Up layer including a build-up insulation layer and a third conductive layer formed on the build-up insulation layer on at least one side of upper and lower sides of the flexible layer; And
Wherein the third conductive layer, the second conductive pattern layer, and the first conductive pattern layer are connected to each other through the third conductive layer and the build- Wherein a diameter of the second end through-hole connecting the layer to the first or second conductive pattern layer in which the build-up insulating layer is stacked is larger than a diameter of the first or second conductive pattern layer and the flexible And forming an internal via hole having a size larger than a diameter of the first end through hole passing through the substrate and connecting the first and second conductive pattern layers.
A method of manufacturing a rigid flexible substrate having a multilayer connection via structure.
The method of claim 8,
The step of forming the through via-hole includes:
Wherein the first through-hole is formed by stacking a second end open hole and a first end open hole having a diameter smaller than that of the second end open hole, And the first or second conductive pattern layer exposed through the second open hole, the second open end hole exposing the first or second conductive pattern layer through which the build-up insulating layer is stacked, Forming the first through hole so that the first through hole is formed through the flexible substrate exposed in the region of the first conductive pattern layer and exposing the other one of the first and second conductive pattern layers to the aesthetic tube; And
And forming the internal through-via hole for connecting the third conductive layer, the second conductive pattern layer, and the first conductive pattern layer by filling the internal through-hole with a conductive material, Layer connection via via structure.
The method of claim 9,
Forming a first or second conductive pattern layer having an exposed region for exposing the flexible substrate in a region and including a through hole seating pad to which the second end through hole is to be seated, in the step of preparing the flexible layer; , ≪ / RTI >
Wherein the step of laminating the build-up layer comprises laminating the build-up layer including the third conductive layer having the open region or processing the third conductive layer of the build-up layer, Lt; / RTI >
Wherein the first end open hole passes through the flexible substrate of the exposed region exposed by the second end open hole in the region of the through hole seating pad, And the other of the second conductive pattern layers is exposed to the aesthetic tube.
The method according to any one of claims 8 to 10,
Wherein a large-diameter open hole and a small-diameter open hole, through which the internal via-hole is to be formed, are formed at one time by CO 2 laser machining by filling the conductive material in the step of forming the internal via- A method of manufacturing a rigid flexible substrate having a multilayer connection via structure.
The method according to any one of claims 8 to 10,
Wherein the step of forming the through via holes comprises forming a plating layer on the third conductive layer and plating the plating layer together with the plating layer to form the through via hole, .
The method according to any one of claims 8 to 10,
A build-up additional layer including a build-up additional insulating layer and a conductive layer formed on the build-up additional insulating layer is formed on the build-up layer on which the internal via hole is formed after the step of forming the internal via hole Wherein the step of forming the via-via structure further comprises the step of:
The method according to any one of claims 8 to 10,
Wherein the build-up layer is a build-up multilayer structure in which the build-up insulation layer and the conductive pattern layer formed on the build-up insulation layer are repeated and laminated in multiple layers,
Wherein the second through hole is formed so as to extend from the outermost conductive pattern layer of the build-up multilayer structure to the first or second conductive pattern layer in the step of forming the through via hole. A method of manufacturing a rigid flexible substrate having a via-via structure.
The method according to any one of claims 8 to 10,
Wherein the first and second conductive pattern layers are formed on the flexible substrate made of polyimide material in the step of preparing the flexible layer,
Wherein the step of laminating the build-up layers comprises laminating the build-up insulating layer using a prepreg insulating layer.
KR1020120137836A 2012-11-30 2012-11-30 Rigid-flexible substrate having via structure connecting multilayers and manufacturing method thereof KR20140069940A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018029173A (en) * 2016-08-18 2018-02-22 サムソン エレクトロ−メカニックス カンパニーリミテッド． Printed circuit board and manufacturing method for printed circuit board
KR101875066B1 (en) * 2016-12-19 2018-07-06 주식회사 액트로 Image stabilizing coil unit and manufacturing method of this
KR20200000921A (en) * 2018-06-26 2020-01-06 주식회사 모베이스전자 Flexible printed circuit board and method for manufacturing thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018029173A (en) * 2016-08-18 2018-02-22 サムソン エレクトロ−メカニックス カンパニーリミテッド． Printed circuit board and manufacturing method for printed circuit board
KR101875066B1 (en) * 2016-12-19 2018-07-06 주식회사 액트로 Image stabilizing coil unit and manufacturing method of this
KR20200000921A (en) * 2018-06-26 2020-01-06 주식회사 모베이스전자 Flexible printed circuit board and method for manufacturing thereof

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