KR20140066080A - 배열용 마스크 - Google Patents

배열용 마스크 Download PDF

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Publication number
KR20140066080A
KR20140066080A KR1020130096587A KR20130096587A KR20140066080A KR 20140066080 A KR20140066080 A KR 20140066080A KR 1020130096587 A KR1020130096587 A KR 1020130096587A KR 20130096587 A KR20130096587 A KR 20130096587A KR 20140066080 A KR20140066080 A KR 20140066080A
Authority
KR
South Korea
Prior art keywords
mask
opening
shape
work
solder ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020130096587A
Other languages
English (en)
Korean (ko)
Inventor
요시히로 고바야시
히로히토 다마루
Original Assignee
히다치 막셀 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 히다치 막셀 가부시키가이샤 filed Critical 히다치 막셀 가부시키가이샤
Publication of KR20140066080A publication Critical patent/KR20140066080A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10122—Auxiliary members for bump connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected
    • H01L2224/10135—Alignment aids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
KR1020130096587A 2012-11-22 2013-08-14 배열용 마스크 Ceased KR20140066080A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012256573A JP6150500B2 (ja) 2012-11-22 2012-11-22 配列用マスク
JPJP-P-2012-256573 2012-11-22

Publications (1)

Publication Number Publication Date
KR20140066080A true KR20140066080A (ko) 2014-05-30

Family

ID=50803223

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130096587A Ceased KR20140066080A (ko) 2012-11-22 2013-08-14 배열용 마스크

Country Status (3)

Country Link
JP (1) JP6150500B2 (enExample)
KR (1) KR20140066080A (enExample)
CN (1) CN103839843A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6381322B2 (ja) * 2014-07-07 2018-08-29 マクセルホールディングス株式会社 配列用マスク
TW201602715A (zh) * 2014-07-07 2016-01-16 Hitachi Maxell 配列用遮罩及其製造方法
TWI582873B (zh) * 2015-02-26 2017-05-11 Hitachi Maxell A masking method for manufacturing the same, and a method of manufacturing the solder bump
CN106981428B (zh) * 2016-01-19 2022-05-24 麦克赛尔株式会社 配列用掩膜及其制造方法、焊料凸块的形成方法
JP2018170529A (ja) * 2018-07-31 2018-11-01 マクセルホールディングス株式会社 配列用マスク
JP7170456B2 (ja) * 2018-08-09 2022-11-14 マクセル株式会社 配列用マスク
JP7256083B2 (ja) * 2019-07-02 2023-04-11 マクセル株式会社 配列用マスク

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3497550B2 (ja) * 1994-03-14 2004-02-16 株式会社東芝 バンプの形成方法
JPH08264932A (ja) * 1995-03-23 1996-10-11 Hitachi Techno Eng Co Ltd はんだバンプ形成法
JP2004253770A (ja) * 2003-01-31 2004-09-09 Hitachi Metals Ltd 導電性ボールの配列方法および配列装置
JP2009182068A (ja) * 2008-01-30 2009-08-13 Kyushu Hitachi Maxell Ltd 配列用マスク及びその製造方法
JP2012227466A (ja) * 2011-04-22 2012-11-15 Bonmaaku:Kk ボール搭載マスク

Also Published As

Publication number Publication date
JP6150500B2 (ja) 2017-06-21
JP2014107282A (ja) 2014-06-09
CN103839843A (zh) 2014-06-04

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