KR20140052609A - Dry film resist remove device of pcb - Google Patents

Dry film resist remove device of pcb Download PDF

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Publication number
KR20140052609A
KR20140052609A KR1020120118916A KR20120118916A KR20140052609A KR 20140052609 A KR20140052609 A KR 20140052609A KR 1020120118916 A KR1020120118916 A KR 1020120118916A KR 20120118916 A KR20120118916 A KR 20120118916A KR 20140052609 A KR20140052609 A KR 20140052609A
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KR
South Korea
Prior art keywords
substrate
chamber
sensor
processing apparatus
surface layer
Prior art date
Application number
KR1020120118916A
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Korean (ko)
Inventor
성기정
국승엽
이정한
Original Assignee
삼성전기주식회사
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Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020120118916A priority Critical patent/KR20140052609A/en
Publication of KR20140052609A publication Critical patent/KR20140052609A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
    • B05B13/0242—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts the objects being individually presented to the spray heads by a rotating element, e.g. turntable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/007—After-treatment

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  • Cleaning Or Drying Semiconductors (AREA)

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate post-processing apparatus, and more particularly, to a substrate post-processing apparatus having a reduced facility space for an etching and peeling process.
The present invention relates to a plasma processing apparatus comprising: a chamber; A transfer roller installed inside the chamber for transferring the substrate; A sensor for sensing a substrate transferred to the inside and outside of the chamber; A controller receiving a signal sensed by the sensor; A rotary member for rotating the substrate transferred into the chamber according to a signal of the control unit; A spray installed inside the chamber, spraying a medicine on the rotating member to peel the surface layer of the surface of the substrate; . ≪ / RTI >

Figure P1020120118916

Description

[0001] DRY FILM RESIST REMOVE DEVICE OF PCB [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate post-processing apparatus, and more particularly, to a substrate post-processing apparatus having a reduced facility space for an etching and peeling process.

Printed Circuit Board (PCB) is used to electrically connect components mounted through a circuit pattern formed on an insulating material such as a phenol resin insulating plate or an epoxy resin insulating plate, supply the power supply, and mechanically fix the components A printed circuit board has a single-sided PCB on which a circuit layer is formed on only one side of an insulating substrate, a double-sided PCB on which circuit layers are formed on both sides, and an MLB (Multi Layered Board) .

As a method of forming a circuit pattern on such a printed circuit board, there are a Subtractive method, an additive method, a Semi-additive method and a Modified semi-additive method ) Method, whereby a circuit pattern can be formed on one surface and both surfaces of the insulating material.

However, as the semiconductor substrate becomes a microcircuit, the microcircuit can no longer be formed by the subtractive process. Therefore, there is an increasing tendency to use SAP techniques to implement microcircuits.

Generally, a process for manufacturing a printed circuit board by a SAP method includes providing an insulating material having a copper foil on one surface, forming a via hole exposing the copper foil, and then forming a seed layer on one surface of the insulating material and an inner wall of the via hole. Thereafter, an electrolytic plating process is performed to form a plating layer, and patterning is performed to form a wiring pattern.

1, a photosensitive material such as a resist layer is coated on the substrate 1, and the surface of the substrate 1 to be transferred through the roller 2 after the foreign substances are removed is coated on the surface of the substrate 1, The chemical agent is sprayed onto the surface of the substrate 1 by using the spray 3 to remove the resist layer.

However, since a substrate using an SAP method requires a long separation line facility in the development of a circuit pattern and a product having a space of 1/10 micron or less, sufficient space is required, which increases the cost of constructing the facility .

Patent Document 1: Korean Patent Publication No. 2006-0003858

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems and provides a substrate post-processing apparatus capable of remarkably reducing the length of a substrate stripping line while maintaining the same stripping process, .

It is another object of the present invention to provide a substrate post-processing apparatus capable of improving the yield of a product by improving the peeling force of a microcircuit.

In order to achieve this object effectively, the present invention provides a plasma processing apparatus comprising: a chamber; A transfer roller installed inside the chamber for transferring the substrate; A sensor for sensing a substrate transferred to the inside and outside of the chamber; A controller receiving a signal sensed by the sensor; A rotary member for rotating the substrate transferred into the chamber according to a signal of the control unit; A spray installed inside the chamber, spraying a medicine on the rotating member to peel the surface layer of the surface of the substrate; . ≪ / RTI >

The conveying roller is disposed before and after the rotary member and can repeat rotation and stop according to the detection of the substrate of the sensor. The rotary member includes a plurality of blade pieces on which the substrate is placed, a drive shaft .

In addition, the driving shaft may be rotated 360 degrees in 5 to 30 minutes while the substrate is placed on the blade piece.

And the controller may cause the substrate to be stopped at the inlet side of 180 ° and the outlet side of 0 ° of the chamber.

On the other hand, the substrate processing apparatus of the present invention includes a chamber; A transfer roller installed inside the chamber for transferring the substrate; A sensor for sensing a substrate transferred to the inside and outside of the chamber; A controller receiving a signal sensed by the sensor; A rotary member for rotating the substrate transferred into the chamber according to a signal of the control unit; A spray installed inside the chamber and spraying medicine on the rotating member to peel the surface layer of the surface of the substrate; A peeling chamber connected to the transfer roller of the chamber, for transferring the peeled substrate to peel off the peeled substrate; . ≪ / RTI >

At this time, the post-separation chamber includes a driving roller for conveying the substrate; A second spray for spraying a medicine on the upper and lower sides of the driving roller to peel the surface layer of the substrate surface; . ≪ / RTI >

The substrate post-treatment apparatus according to the embodiment of the present invention can remarkably reduce the length of the substrate peeling line while maintaining the same peeling process of the substrate, so that the facility construction cost can be greatly reduced and the peeling force And the yield of the product is greatly improved.

In addition, since the peeling treatment time is increased in the same facility space, a more complete peeling effect can be expected.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an illustration showing a conventional substrate post-processing apparatus; FIG.
2 is a view showing an example of a substrate post-processing apparatus according to an embodiment of the present invention.
3 is an exemplary view showing a state in which a substrate post-processing apparatus according to an embodiment of the present invention is operated.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 is an exemplary view showing a substrate post-processing apparatus according to an embodiment of the present invention, and FIG. 3 is an exemplary view showing a state in which a substrate post-processing apparatus according to an embodiment of the present invention is operated.

The substrate post-processing apparatus 100 of the present invention includes a chamber 10 having an accommodating space therein, a conveying roller 20 installed inside the chamber 10, A control unit for receiving the signal of the sensor 30 and a rotary member 40 for stopping the rotation according to the signal of the control unit and a spray 50 for spraying the medicine at the upper part of the rotary member 40, .

The chamber 10 has a receiving space therein. In this accommodating space, a conveying roller 20 is provided. The transfer roller 20 is installed at the inlet side and the outlet side of the chamber 10 and transfers the substrate 70 that has undergone the pre-wet process to the inside of the chamber 10.

The number of revolutions of the conveying roller 20 is proportional to the conveying speed of the substrate 70 and is determined according to the processing speed at which the surface treatment of the substrate 70 is performed inside the chamber 10.

The substrate 70 thus moved along the conveying roller 20 is seated on the rotary member 40. The rotary member 40 includes a plurality of blade pieces 42 and a drive shaft 44 connected to the blade piece 42 so as to rotate the blade piece pieces 42.

The blade piece 42 may have a length equal to or greater than the width or length of the substrate 70. The edge piece 42 may be further provided with guard rails at both ends thereof so that the substrate 70 is not separated from the edge piece 42 in a state where the substrate 70 is seated.

The tip end of the blade piece 42 is connected to the drive shaft 44 and is rotated together when the drive shaft 44 rotates. The drive shaft 44 is rotated by receiving power through a drive motor (not shown).

The rotation speed of the blade piece 42 can be rotated 360 ° within 5 to 30 minutes and the rotation speed of the blade piece 42 can be rotated 360 ° at a position where the substrate 70 is seated on the blade piece 42, And when the blade piece 42 is positioned on the exit side transfer roller 20, the rotation is stopped for a predetermined time until the substrate 70 is seated without being rotated.

At this time, the rotation of the rotary member 40 is determined by the sensor 30 sensing the substrate 70 to be transferred to the inside and the outside of the chamber 10.

The sensor 30 is installed inside the chamber 10 or installed on the blade piece 42 of the rotary member 40 to sense the movement of the substrate 70.

In other words, when it is sensed that the substrate 70 is seated on the blade piece 42, the sensor 30 transmits a detection signal to the control unit to rotate the drive shaft 44 in the control unit, The sensor 30 transmits the position of the substrate 70 to the control unit to stop the drive shaft 44 in the control unit.

The substrate 70 rotated through the blade piece 42 is sprayed with NaOH or amine chemicals through the spray 50 to remove the surface layer formed on the surface of the substrate 70. At this time, the surface layer of the substrate may be, for example, a resist layer, a DFR (photosensitive layer), or the like.

The spray 50 injects the medicine in the vertical direction above the blade piece 42 of the rotary member 40. A plurality of such spray 50 may be provided on the upper part of the blade piece 42. The number and position of the sprayer 50 may vary according to the state in which the surface layer is removed from the surface of the substrate 70 through the spray 50.

On the other hand, a back separation chamber 60 is connected to the outer surface of the chamber 10. The post-separation chamber 60 then peels off the surface layer of the substrate 70 to be transferred out of the chamber 10 by the exit-side transfer roller 20.

This post-separation chamber 60 includes a drive roller 62 for moving the substrate 70 and a second spray 64 for spraying the medicine at the top and bottom of the drive roller 62.

The driving roller 62 may be installed inside the rear separation chamber 60 by a pair of upper and lower sides. The substrate 70 is transported along a pair of drive rollers 62. In the process of transferring the substrate 70 between the driving rollers 62, the surface layer of the surface of the substrate 70 is completely removed by the chemicals sprayed from the second spray 64 installed above and below the driving roller 62.

A plurality of second sprayers 64 are provided on the upper and lower portions of the drive roller 62, respectively, and spray OH or amine chemicals.

After the surface layer is completely separated from the substrate 70 through the second spray 64, it is subjected to a separate post-treatment process and then dried.

The post-processing apparatus of the substrate 70 according to the embodiment of the present invention configured as described above has the following functions.

The substrate 70 is moved into the chamber 10 in accordance with the rotation of the conveying roller 20 when the substrate 70 is placed on the conveying roller 20 during the operation of the conveying roller 20.

The substrate 70 transferred into the chamber 10 is seated on the blade piece 42 of the rotary member 40. At this time, the sensor 30 senses the substrate 70 that is introduced into the substrate 70, and is in a state of being stopped so that the blade piece 42 and the substrate 70 are juxtaposed.

When the substrate 70 is placed on the blade piece 42, the sensor 30 transmits the state of the substrate 70 to the control unit, and the control unit rotates the drive shaft 44. The drive shaft 44 is slowly moved for about 5 to 30 minutes until the blade piece 42 on the inlet side of the chamber 10 is rotated to the outlet side.

Here, when the substrate 70 is continuously supplied, the blade piece 42 has a waiting time until the substrate 70 is completely placed on the blade piece 42 every time the substrate 70 is supplied.

The substrate 70 is moved by the center of gravity to the adjacent blade piece 42 along the rotation direction at a position passing through 90 占 when rotating along the blade piece 42. [ Accordingly, the substrate 70 can spray the medicine sprayed from the spray 50 onto the opposite surface layer to partially remove the surface layer on both sides.

The sensor 30 transmits the position of the substrate 70 to the control unit and the control unit controls the position of the driving shaft 44 in the control unit Stop the rotation.

When the driving shaft 44 is stopped, the conveying roller 20 is rotated and the substrate 70 is conveyed to the post-separation chamber 60. The substrate 70 arriving at the post-separation chamber 60 is conveyed by the driving roller 62 and the chemical is sprayed in the upper and lower portions through the second spray 64 in the conveying process to remove all the surface layers.

Therefore, the substrate post-processing apparatus 100 of the present invention can significantly reduce the installation space for removing all the surface layers applied to the surface of the substrate 70. [

Although the substrate post-processing apparatus according to the embodiment of the present invention has been described above, the present invention is not limited thereto, and the present invention can be applied to the substrate post-processing apparatus.

10: chamber 20: conveying roller
30: sensor 40: rotating member
42: Day reorganization 44: Drive shaft
50: spray 60: after peeling chamber
62: drive roller 64: second spray
70: substrate 100: substrate post-processing apparatus

Claims (9)

chamber;
A transfer roller installed inside the chamber for transferring the substrate;
A sensor for sensing a substrate transferred to the inside and outside of the chamber;
A controller receiving a signal sensed by the sensor;
A rotary member for rotating the substrate transferred into the chamber according to a signal of the control unit; And
A spray provided inside the chamber and spraying a medicine on the rotating member to peel the surface layer of the substrate; And the substrate processing apparatus.
The method according to claim 1,
Wherein the feed roller is disposed before and after the rotary member, and repeats rotation and stop according to the substrate detection of the sensor.
The method according to claim 1,
Wherein the rotating member includes a plurality of blade pieces on which the substrate is placed, and a drive shaft for rotating the blade piece.
The method of claim 3,
Wherein the drive shaft is rotated 360 degrees within 5 to 30 minutes while the substrate is placed on the blade piece.
The method according to claim 1 or 3,
Wherein the controller causes the wing piece to stop at a position of the substrate at an inlet side of 180 ° and an outlet side of 0 ° of the chamber.
The method according to claim 1,
Wherein the surface layer of the substrate is any one of a resist layer and a DFR (photosensitive layer).
chamber;
A transfer roller installed inside the chamber for transferring the substrate;
A sensor for sensing a substrate transferred to the inside and outside of the chamber;
A controller receiving a signal sensed by the sensor;
A rotary member for rotating the substrate transferred into the chamber according to a signal of the control unit;
A spray provided inside the chamber and spraying a medicine on the rotating member to peel the surface layer of the substrate; And
A post-peeling chamber connected to the conveying roller of the chamber, for transferring the peeled substrate to peel off the peeled substrate; And the substrate processing apparatus.
8. The method of claim 7,
The post-separation chamber includes a driving roller for conveying the substrate;
A second spray for spraying a medicine on the upper and lower sides of the driving roller to peel the surface layer of the substrate surface; And the substrate processing apparatus.
8. The method of claim 7,
Wherein the surface layer of the substrate is any one of a resist layer and a DFR (photosensitive layer).

KR1020120118916A 2012-10-25 2012-10-25 Dry film resist remove device of pcb KR20140052609A (en)

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KR1020120118916A KR20140052609A (en) 2012-10-25 2012-10-25 Dry film resist remove device of pcb

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Application Number Priority Date Filing Date Title
KR1020120118916A KR20140052609A (en) 2012-10-25 2012-10-25 Dry film resist remove device of pcb

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113492127A (en) * 2021-06-21 2021-10-12 林广杰 Spraying system is used in crude drug processing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113492127A (en) * 2021-06-21 2021-10-12 林广杰 Spraying system is used in crude drug processing

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