KR20140040116A - 평면 기판, 특히 태양 전지용 처리 스테이션 - Google Patents

평면 기판, 특히 태양 전지용 처리 스테이션 Download PDF

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Publication number
KR20140040116A
KR20140040116A KR1020137023443A KR20137023443A KR20140040116A KR 20140040116 A KR20140040116 A KR 20140040116A KR 1020137023443 A KR1020137023443 A KR 1020137023443A KR 20137023443 A KR20137023443 A KR 20137023443A KR 20140040116 A KR20140040116 A KR 20140040116A
Authority
KR
South Korea
Prior art keywords
processing
actuators
processing tool
support surface
station
Prior art date
Application number
KR1020137023443A
Other languages
English (en)
Korean (ko)
Inventor
미카엘 라이헨바흐
Original Assignee
요트에르테 포토볼타익스 게엠베하 운트 코 카게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 요트에르테 포토볼타익스 게엠베하 운트 코 카게 filed Critical 요트에르테 포토볼타익스 게엠베하 운트 코 카게
Publication of KR20140040116A publication Critical patent/KR20140040116A/ko

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/02Manually-operable devices
    • B41F15/06Manually-operable devices with auxiliary equipment, e.g. for drying printed articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/08Machines
    • B41F15/0881Machines for printing on polyhedral articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/14Details
    • B41F15/34Screens, Frames; Holders therefor
    • B41F15/36Screens, Frames; Holders therefor flat
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41PINDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2215/00Screen printing machines
    • B41P2215/50Screen printing machines for particular purposes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Screen Printers (AREA)
KR1020137023443A 2011-03-04 2012-02-29 평면 기판, 특히 태양 전지용 처리 스테이션 KR20140040116A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102011005157A DE102011005157A1 (de) 2011-03-04 2011-03-04 Bearbeitungsstation für flächige Substrate, insbesondere Solarzellen
DE102011005157.0 2011-03-04
PCT/EP2012/053448 WO2012119904A1 (de) 2011-03-04 2012-02-29 Bearbeitungsstation für flächige substrate, insbesondere solarzellen

Publications (1)

Publication Number Publication Date
KR20140040116A true KR20140040116A (ko) 2014-04-02

Family

ID=45774228

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137023443A KR20140040116A (ko) 2011-03-04 2012-02-29 평면 기판, 특히 태양 전지용 처리 스테이션

Country Status (6)

Country Link
EP (1) EP2681761B1 (hu)
KR (1) KR20140040116A (hu)
CN (1) CN103477425B (hu)
DE (1) DE102011005157A1 (hu)
HU (1) HUE049486T2 (hu)
WO (1) WO2012119904A1 (hu)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190051827A (ko) * 2017-11-07 2019-05-15 에이에스엠 어셈블리 시스템스 싱가포르 피티이 리미티드 스텐실과 워크피스의 평면 정렬

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013205731A1 (de) * 2013-03-28 2014-10-02 JRT Photovoltaics GmbH & Co. KG Siebdruckanlage zum Bedrucken von flächigen Substraten, insbesondere Solarzellen und Verfahren zum Bedrucken von Substraten
EP4328028A1 (en) * 2022-08-23 2024-02-28 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Filling holes of a component carrier structure with controllable and alignable movable medium applicator

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61143144A (ja) * 1984-12-17 1986-06-30 Pilot Pen Co Ltd:The スクリ−ン印刷における被印刷物とスクリ−ン版の位置整合方法およびその装置
US5226366A (en) * 1992-02-11 1993-07-13 Screen Masters, Inc. Method and apparatus for aligning screens used for application of ink patterns to a substrate
JP4059305B2 (ja) * 1997-07-04 2008-03-12 株式会社日立プラズマパテントライセンシング スクリーン印刷装置
US6486941B1 (en) * 2000-04-24 2002-11-26 Nikon Corporation Guideless stage
DE10330506A1 (de) * 2003-07-05 2005-03-31 Leica Microsystems Semiconductor Gmbh Vorrichtung zur Waferinspektion
US7385679B2 (en) * 2004-12-29 2008-06-10 Asml Netherlands B.V. Lithographic apparatus and actuator
DE102005015627A1 (de) * 2005-04-06 2006-10-12 Carl Zeiss Smt Ag Optische Abbildungsvorrichtung
JP4899469B2 (ja) * 2005-12-22 2012-03-21 ウシオ電機株式会社 平面ステージ装置
DE102006034455A1 (de) * 2006-07-26 2008-01-31 Carl Zeiss Industrielle Messtechnik Gmbh Lageveränderliche Werkstückauflage für eine Maschine und Bearbeitungsanlage mit einer entsprechenden Werkstückauflage
JP2008162130A (ja) * 2006-12-28 2008-07-17 Matsushita Electric Ind Co Ltd スクリーン印刷装置およびスクリーン印刷方法
US7641467B2 (en) * 2007-05-02 2010-01-05 Asml Netherlands B.V. Imprint lithography
GB2458313B (en) * 2008-03-13 2012-05-23 Dek Int Gmbh Print head assembly, screen printing system and method
KR20100114538A (ko) * 2008-03-19 2010-10-25 가부시키가이샤 알박 기판 반송 처리 장치
IT1394811B1 (it) * 2009-07-08 2012-07-13 Applied Materials Inc Apparato e procedimento per la manipolazione di substrati danneggiati in sistemi di lavorazione substrati

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190051827A (ko) * 2017-11-07 2019-05-15 에이에스엠 어셈블리 시스템스 싱가포르 피티이 리미티드 스텐실과 워크피스의 평면 정렬
US10994527B2 (en) 2017-11-07 2021-05-04 Asm Assembly Systems Singapore Pte. Ltd. Planarity alignment of stencils and workpieces

Also Published As

Publication number Publication date
EP2681761B1 (de) 2020-02-19
EP2681761A1 (de) 2014-01-08
CN103477425B (zh) 2017-03-01
CN103477425A (zh) 2013-12-25
WO2012119904A1 (de) 2012-09-13
DE102011005157A1 (de) 2012-09-27
HUE049486T2 (hu) 2020-09-28

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