KR20140040116A - 평면 기판, 특히 태양 전지용 처리 스테이션 - Google Patents
평면 기판, 특히 태양 전지용 처리 스테이션 Download PDFInfo
- Publication number
- KR20140040116A KR20140040116A KR1020137023443A KR20137023443A KR20140040116A KR 20140040116 A KR20140040116 A KR 20140040116A KR 1020137023443 A KR1020137023443 A KR 1020137023443A KR 20137023443 A KR20137023443 A KR 20137023443A KR 20140040116 A KR20140040116 A KR 20140040116A
- Authority
- KR
- South Korea
- Prior art keywords
- processing
- actuators
- processing tool
- support surface
- station
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 claims description 14
- 238000006073 displacement reaction Methods 0.000 claims description 11
- 239000007787 solid Substances 0.000 claims description 5
- 230000005484 gravity Effects 0.000 claims description 3
- 238000003672 processing method Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 description 7
- 239000004020 conductor Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000001427 coherent effect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/02—Manually-operable devices
- B41F15/06—Manually-operable devices with auxiliary equipment, e.g. for drying printed articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/0881—Machines for printing on polyhedral articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/34—Screens, Frames; Holders therefor
- B41F15/36—Screens, Frames; Holders therefor flat
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
- B41P2215/00—Screen printing machines
- B41P2215/50—Screen printing machines for particular purposes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Screen Printers (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011005157A DE102011005157A1 (de) | 2011-03-04 | 2011-03-04 | Bearbeitungsstation für flächige Substrate, insbesondere Solarzellen |
DE102011005157.0 | 2011-03-04 | ||
PCT/EP2012/053448 WO2012119904A1 (de) | 2011-03-04 | 2012-02-29 | Bearbeitungsstation für flächige substrate, insbesondere solarzellen |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20140040116A true KR20140040116A (ko) | 2014-04-02 |
Family
ID=45774228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020137023443A KR20140040116A (ko) | 2011-03-04 | 2012-02-29 | 평면 기판, 특히 태양 전지용 처리 스테이션 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP2681761B1 (hu) |
KR (1) | KR20140040116A (hu) |
CN (1) | CN103477425B (hu) |
DE (1) | DE102011005157A1 (hu) |
HU (1) | HUE049486T2 (hu) |
WO (1) | WO2012119904A1 (hu) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190051827A (ko) * | 2017-11-07 | 2019-05-15 | 에이에스엠 어셈블리 시스템스 싱가포르 피티이 리미티드 | 스텐실과 워크피스의 평면 정렬 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013205731A1 (de) * | 2013-03-28 | 2014-10-02 | JRT Photovoltaics GmbH & Co. KG | Siebdruckanlage zum Bedrucken von flächigen Substraten, insbesondere Solarzellen und Verfahren zum Bedrucken von Substraten |
EP4328028A1 (en) * | 2022-08-23 | 2024-02-28 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Filling holes of a component carrier structure with controllable and alignable movable medium applicator |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61143144A (ja) * | 1984-12-17 | 1986-06-30 | Pilot Pen Co Ltd:The | スクリ−ン印刷における被印刷物とスクリ−ン版の位置整合方法およびその装置 |
US5226366A (en) * | 1992-02-11 | 1993-07-13 | Screen Masters, Inc. | Method and apparatus for aligning screens used for application of ink patterns to a substrate |
JP4059305B2 (ja) * | 1997-07-04 | 2008-03-12 | 株式会社日立プラズマパテントライセンシング | スクリーン印刷装置 |
US6486941B1 (en) * | 2000-04-24 | 2002-11-26 | Nikon Corporation | Guideless stage |
DE10330506A1 (de) * | 2003-07-05 | 2005-03-31 | Leica Microsystems Semiconductor Gmbh | Vorrichtung zur Waferinspektion |
US7385679B2 (en) * | 2004-12-29 | 2008-06-10 | Asml Netherlands B.V. | Lithographic apparatus and actuator |
DE102005015627A1 (de) * | 2005-04-06 | 2006-10-12 | Carl Zeiss Smt Ag | Optische Abbildungsvorrichtung |
JP4899469B2 (ja) * | 2005-12-22 | 2012-03-21 | ウシオ電機株式会社 | 平面ステージ装置 |
DE102006034455A1 (de) * | 2006-07-26 | 2008-01-31 | Carl Zeiss Industrielle Messtechnik Gmbh | Lageveränderliche Werkstückauflage für eine Maschine und Bearbeitungsanlage mit einer entsprechenden Werkstückauflage |
JP2008162130A (ja) * | 2006-12-28 | 2008-07-17 | Matsushita Electric Ind Co Ltd | スクリーン印刷装置およびスクリーン印刷方法 |
US7641467B2 (en) * | 2007-05-02 | 2010-01-05 | Asml Netherlands B.V. | Imprint lithography |
GB2458313B (en) * | 2008-03-13 | 2012-05-23 | Dek Int Gmbh | Print head assembly, screen printing system and method |
KR20100114538A (ko) * | 2008-03-19 | 2010-10-25 | 가부시키가이샤 알박 | 기판 반송 처리 장치 |
IT1394811B1 (it) * | 2009-07-08 | 2012-07-13 | Applied Materials Inc | Apparato e procedimento per la manipolazione di substrati danneggiati in sistemi di lavorazione substrati |
-
2011
- 2011-03-04 DE DE102011005157A patent/DE102011005157A1/de not_active Ceased
-
2012
- 2012-02-29 WO PCT/EP2012/053448 patent/WO2012119904A1/de active Application Filing
- 2012-02-29 CN CN201280011705.2A patent/CN103477425B/zh active Active
- 2012-02-29 HU HUE12706586A patent/HUE049486T2/hu unknown
- 2012-02-29 EP EP12706586.0A patent/EP2681761B1/de active Active
- 2012-02-29 KR KR1020137023443A patent/KR20140040116A/ko not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190051827A (ko) * | 2017-11-07 | 2019-05-15 | 에이에스엠 어셈블리 시스템스 싱가포르 피티이 리미티드 | 스텐실과 워크피스의 평면 정렬 |
US10994527B2 (en) | 2017-11-07 | 2021-05-04 | Asm Assembly Systems Singapore Pte. Ltd. | Planarity alignment of stencils and workpieces |
Also Published As
Publication number | Publication date |
---|---|
EP2681761B1 (de) | 2020-02-19 |
EP2681761A1 (de) | 2014-01-08 |
CN103477425B (zh) | 2017-03-01 |
CN103477425A (zh) | 2013-12-25 |
WO2012119904A1 (de) | 2012-09-13 |
DE102011005157A1 (de) | 2012-09-27 |
HUE049486T2 (hu) | 2020-09-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |