KR20130074490A - Bonded structural body between pcbs - Google Patents

Abstract

PURPOSE: A connection structure between printed circuit boards is provided to quickly easily perform a connection work by connecting an interval between the printed circuit boards with laser welding without solder. CONSTITUTION: A first connecting structure (100) is formed of a printed circuit board. A second connecting structure is welded to the end part of the first connecting structure. A mounting area mounts an element with a surface mounting technology (SMT) mode. A circuit wire (111) is covered with an insulating material. A first pad (110) is exposed to outside at the end part of the circuit wire.

Description

Bonded structural body between PCBs

The present invention relates to a connection structure between printed circuit boards.

As the multifunctionality and miniaturization of electronic products have been achieved, high integration of electronic devices entering the interior of electronic products has been required. To this end, conventionally, a method of using a printed circuit board to replace a lead frame (lead frame) for the electrical connection to the electronic device has attracted attention.

In particular, the vibration motor module generating vibration when the mobile communication terminal arrives is being converted into a flexible printed circuit board (FPCB) from a lead frame in which an input terminal of the vibration motor is connected to a wire according to the demand for thinning.

At this time, in order to connect with an external terminal for supplying power to an input terminal, a soldering method using solder is used, as described in Korean Patent Publication No. 10-0902600 (registered on June 5, 2009). .

However, the connection method using such a solder is applied to each of the input terminal or the external terminal solder and pressed using a thermocompression jig, etc., there is a problem that the manufacturing process is time-consuming and difficult to mass-produce.

In addition, a lot of heat is generated in the process of soldering and pressing using a thermocompression jig or the like, and this heat adversely affects other components mounted on the FPCB having the input terminal or the external terminal.

Specifically, in order to use the solder in the prior art, the working temperature must be relatively high. Such high temperatures cause thermal damage to other components mounted in the FPCB with input terminals or external terminals, thereby dramatically lowering the yield.

It is an object of the present invention to provide a connection structure for joining and connecting two printed circuit boards by laser welding without the need of solder to solve the above problems.

Connection structure between the printed circuit board according to the present invention for achieving the above object is a first connection structure consisting of a printed circuit board; And a second connection structure formed of a printed circuit board and connected to the end of the first connection structure by overlapping an end thereof.

In the connection structure between the printed circuit board according to the present invention, the first connection structure may include: a mounting region in which elements are mounted by a surface mounting technology (SMT) method; Circuit wiring extending from said mounting region and covered with an insulating material; And a first pad exposed to the outside at an end of the circuit wiring.

In the connection structure between the printed circuit board according to the present invention, the second connection structure includes a power supply pad to which external power is applied; And a circuit wiring extending from the power applying pad and having a second pad at an end thereof.

In the connection structure between the printed circuit board according to the present invention, the first connection structure or the second connection structure is provided with any one of a printed circuit board (PCB), a metal printed circuit board (MPCB), and a flexible printed circuit board (FPCB). do.

In the connection structure between the printed circuit boards according to the present invention, the second pad has a structure having an edge in an arc shape inwardly at an end portion, a structure having an edge projecting in an arc shape in an outward direction at an end portion, and penetrating therein. It is provided with at least one structure of the structure provided with a ball.

In the connection structure between the printed circuit boards according to the present invention, the second pad overlaps the first pad, and the width of the second pad is equal to the width of the first pad.

In the connection structure between the printed circuit boards according to the present invention, the second pad is overlapped and bonded to the first pad by laser welding.

The connection structure between the printed circuit board according to the present invention includes a conductive paste in an overlapping region of the second pad and the first pad.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to this, terms and words used in the present specification and claims should not be construed in a conventional, dictionary sense, and should not be construed as defining the concept of a term appropriately in order to describe the inventor in his or her best way. It should be construed in accordance with the meaning and concept consistent with the technical idea of the present invention.

Since the present invention is made quickly and easily by the superposition structure of the connecting structure and laser welding, the connection structure between the first connecting structure and the printed circuit board of the second connecting structure is better than the conventional bonding method using solder and thermocompression jig. It can be easily processed in large quantities.

1 is a plan view of a first connecting structure according to an embodiment of the present invention.
2 is a plan view of a second connecting structure according to an embodiment of the present invention.
3 is an exemplary diagram for explaining a structure in which a first connection structure and a second connection structure are bonded to each other according to an embodiment of the present invention.
4 is a plan view showing the bonding end of the second connecting structure according to another embodiment of the present invention.
5 is a plan view showing the bonding end of the second connecting structure according to another embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The objects, particular advantages and novel features of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. It should be noted that, in the present specification, the reference numerals are added to the constituent elements of the drawings, and the same constituent elements are assigned the same number as much as possible even if they are displayed on different drawings. Also, the terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a plan view of a first connection structure according to an embodiment of the present invention, Figure 2 is a plan view of a second connection structure according to an embodiment of the present invention, Figure 3 is a first view according to an embodiment of the present invention It is an illustration for demonstrating the structure which joined and bonded the 1st connection structure and the 2nd connection structure.

The connection structure between the printed circuit board according to the exemplary embodiment of the present invention includes the first connection structure 100 shown in FIG. 1 and the second connection structure 200 shown in FIG. 2 as shown in FIG. 3. Connect the ends of the overlap.

Specifically, the first connection structure 100 illustrated in FIG. 1 is formed using a printed circuit board including a printed circuit board (PCB), a metal printed circuit board (MPCB), a flexible printed circuit board (FPCB), and the like. .

The first connection structure 100 may include, for example, a mounting area A in which a vibration motor, a camera module, an electronic device, etc. are mounted by a surface mounting technology (SMT) method, and a circuit wiring extending from the mounting area A and covered with an insulating material. 111 and the first pad 110 exposed to the outside at the end of the circuit wiring 111.

The first connection structure 100 may receive power from the second connection structure 200 through the first pad 110 to drive a vibration motor, a camera module, an electronic device, and the like. Here, the mounting area A is illustrated in the form for mounting the vibration motor in FIG. 1, but is not limited thereto and may be provided in various forms according to the object to be mounted.

The first pad 110 is formed at the end of the circuit wiring 111 using the same electrically conductive material as the circuit wiring 111, and is formed to protrude outward without an insulating material covering the circuit wiring 111. The first pad 110 may be provided according to the number of circuit wires 111, and the width of the first pad 110 may be equal to the width of the second pad 210 of the second connection structure 200, which will be described later. Is formed identically.

The second connection structure 200 is similar to the first connection structure 100 by using a printed circuit board including a printed circuit board (PCB), a metal printed circuit board (MPCB), a flexible printed circuit board (FPCB), and the like. Is formed.

As shown in FIG. 2, the second connection structure 200 includes a power applying pad 220 to which external power is applied, and a second pad 210 extending from the power applying pad 220. It includes one circuit wiring.

The circuit wiring of the second connection structure 200 may extend from the power supply pad 220, and the remaining areas except the second pad 210 may be covered with an insulating material. Although the circuit wiring of the second connection structure 200 is shown in a bent form in FIG. 2, the circuit wiring of the second connection structure 200 is not limited thereto, and may be provided in various forms such as a straight line, similar to the circuit wiring 111 of the first connection structure 100. Can be.

The second pad 210 is provided in accordance with the number of the power applying pads 220, is exposed to the outside by the "B" region as shown in Figure 2, the end of the circular arc-shaped edge 211 in the inward direction Can have

The inner edge 211 may be formed to increase the bonding surface area of the conductive paste, which may be suitable for determining the overlapping position suitable for the process of the second pad 210 overlapping and bonding the first pad 110, or optionally used. Can be.

As described above, the first connection structure 100 and the second connection structure 200 are joined to each other by overlapping their ends.

Specifically, the second pad 210 of the second connection structure 200 overlaps the first pad 110 of the first connection structure 100, and in particular, only the “B” region of the second pad 210 is formed. 1 overlaps the pad 110.

In this state in which the first pad 110 and the second pad 210 are overlapped with each other, a laser using a laser such as a CO ₂ laser is applied to the overlapping portion of the first pad 110 and the second pad 210. Welding can be performed.

Since the bonding of the overlapping portion of the first pad 110 and the second pad 210 is quick and easy by laser welding, the first connection structure 100 and the bonding method using a solder, a thermocompression jig, and the like are conventionally used. The joint connection of the second connection structure 200 can be easily processed in large quantities.

In this case, after the conductive paste is optionally provided on the overlapping portion of the first pad 110 and the second pad 210, laser welding may be performed to further improve bonding.

That is, when the conductive paste is selectively used, the conductive paste is provided at the overlapping portion of the first pad 110 and the second pad 210 along the inner edge 211, thereby increasing the bonding surface area of the conductive paste. The bonding reliability of the first connection structure 100 and the second connection structure 200 may be improved.

Here, the bonding end portion including the second pad 210 of the second connection structure 200 may be selectively provided in the form shown in FIG. 4 or 5 in addition to the form shown in FIG. 2.

A junction end portion of the second connection structure according to another embodiment of the present invention shown in FIG. 4 has a difference in that the second pad 310 has an arc-shaped edge 311 protruding outward.

Since the second pad 310 shown in FIG. 4 has an arc-shaped edge 311 protruding outward, bonding of the conductive paste provided along the overlapping area or the edge 311 with respect to the first pad 110 is performed. By increasing the surface area, the bonding reliability to the first connection structure 100 can be improved.

Alternatively, the second pad 410 in the joint end portion of the second connecting structure according to another embodiment of the present invention shown in FIG. 5 is circular through hole in the rim and the overlapping portion of the arc shape in the inward direction There is a difference in having 412. Here, the second pad 410 illustrated in FIG. 5 is illustrated as having a circular edge 411 in the inward direction, but is not limited thereto, and the edge 411 may be curved or curved.

As described above, the second connection structure according to another embodiment of the present invention may easily identify the overlapping junction region of the first connection structure 100 using the through hole 412, or the conductive paste may have the through hole 412. It is provided along the edge of the to increase the bonding surface area of the conductive paste, it is possible to improve the bonding reliability for the first connection structure (100).

Although the technical idea of the present invention has been specifically described according to the above preferred embodiments, it is to be noted that the above-described embodiments are intended to be illustrative and not restrictive.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention.

100: first connecting structure 110: first pad
111: circuit wiring 200: second connection structure
210: second pad 211: border
220: power supply pad 412: through hole

Claims (10)

A first connection structure made of a printed circuit board; And
A second connecting structure made of a printed circuit board and connected to each other by overlapping ends of the first connecting structures;
Connection structure comprising a.
The method of claim 1,
The first connection structure is
A mounting area in which the device is mounted by an SMT (Surface Mounting Technology) method;
Circuit wiring extending from said mounting region and covered with an insulating material; And
A first pad exposed to the outside at an end of the circuit wiring;
Connection structure comprising a.
3. The method of claim 2,
The second connection structure
A power applying pad to which external power is applied; And
A circuit wiring extending from the power applying pad and having a second pad at an end thereof;
Connection structure comprising a.
The method of claim 1,
The first connection structure or the second connection structure is a connection structure provided with any one of a printed circuit board (PCB), a metal printed circuit board (MPCB), and a flexible printed circuit board (FPCB).
The method of claim 3, wherein
The second pad has a connecting structure having an edge in the form of an arc in the inward direction at the end.
The method of claim 3, wherein
The second pad has a connection structure having an edge projecting in an arc shape in the outward direction at the end.
The method of claim 3, wherein
The second pad has a connection structure having a through hole therein.
The method of claim 3, wherein
The second pad overlaps the first pad,
The width of the second pad is connected to the same structure as the width of the first pad.
The method of claim 3, wherein
And the second pad is bonded to the first pad by laser welding.
The method of claim 9,
And a conductive paste provided in an overlapping region of the second pad and the first pad.

Images