KR20130051866A - A system for exchanging capillary automatically - Google Patents
A system for exchanging capillary automatically Download PDFInfo
- Publication number
- KR20130051866A KR20130051866A KR1020120031093A KR20120031093A KR20130051866A KR 20130051866 A KR20130051866 A KR 20130051866A KR 1020120031093 A KR1020120031093 A KR 1020120031093A KR 20120031093 A KR20120031093 A KR 20120031093A KR 20130051866 A KR20130051866 A KR 20130051866A
- Authority
- KR
- South Korea
- Prior art keywords
- capillary
- unit
- axis
- clamping
- loader
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78308—Removable capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Clamping loader installed on the base and having a loader clamping portion for clamping the capillary at the tip, capillary supply and recovery unit having a grip portion for supplying or retrieving the capillary to the clamping loader side and selectively gripping the capillary , The x-axis transfer unit for transferring the capillary supply and recovery unit in the x-axis direction, the y-axis transfer unit for transferring the capillary supply and recovery unit in the y-axis direction, and the capillary supply and recovery unit for the z-axis direction. Capillary stopping unit, the clamping part to prevent the capillary from rising to the upper end of the clamping portion when the new capillary is supplied to the clamping portion by the z-axis transfer unit, capillary supply and recovery unit to be transferred to the Clamping release unit, which can be selectively locked or unlocked so that the capillary can be mounted or dismounted, Capping the capillary mounted unit and a capillary feed and return unit and a control unit for controlling the clamping unit is released through a filler Lee; the capillary automatic replacement system comprising: a is started.
Description
The present invention relates to an automatic capillary replacement system capable of automatically replacing the capillary.
The wire bond process is one of the processes to manufacture the semiconductor package. The wire bond process connects the semiconductor chip and the substrate with a gold wire to allow electrical signals to flow. It is the process of making a semiconductor have electrical characteristics.
Capillary used in the wire bond process is a tool used to directly bond the gold wire and create a wire loop. For example, the sewing machine used to make clothes is a capillary that acts like a needle, and a gold wire corresponds to a thread.
The capillary is a consumable item, which has a limit on the amount of use and needs to be replaced according to the limit of the amount of use. Looking at the conventional capillary replacement process, after entering the limit value of the capillary usage in the wire bond equipment, the wire bond equipment generates an alarm to call the worker when the limit value of the usage is reached. The operator then resets the capillary usage in the warned wire bond equipment, removes the captive screw that secures the capillary and installs the new capillary, ie replacing the conventional capillary is the manual This process was included a considerable part.
In actual semiconductor packaging process, because of the nature of the wire bond process, the wire bond equipment is often hundreds of units, there is a problem that a lot of effort is required because the capillaries of the various equipment must be replaced during the wire bonding process. In addition, since the process of removing and reinstalling the captive fixing screws for fixing the capillary takes a lot of time, there was a loss of time and money in the capillary replacement process.
The present invention has been made in view of the above, and an object thereof is to provide an improved capillary automatic replacement system for automating the installation and release of capillary through an automatic process.
Capillary automatic replacement system of the present invention for achieving the above object, the clamping loader is installed on the base, having a loader clamping portion for clamping the capillary at the tip; A capillary supply and recovery unit for supplying or recovering a capillary to the clamping loader side, the capillary supplying and recovering unit having a grip for selectively gripping the capillary; An x-axis transfer unit for transferring the capillary supply and recovery unit in the x-axis direction; A y-axis transfer unit for transferring the capillary supply and recovery unit in the y-axis direction; A z-axis transfer unit for transferring the capillary supply and recovery unit in a z-axis direction; A capillary stopper unit which prevents the capillary from rising to an upper end of the clamping portion when a new capillary is supplied to the clamping portion by the capillary supply and recovery unit; A clamping release unit for selectively locking or releasing the clamping portion to allow the capillary to be mounted or detached; A capillary mounting unit on which the capillary supplied or recovered to the clamping loader is mounted; And a control unit controlling the capillary supply and recovery unit and the clamping release unit.
Here, the control unit, by driving the x-axis, y-axis and z-axis transfer unit to move the capillary supply and recovery unit below the loader clamping portion of the clamping loader while rotating the clamping release unit to clamp the loader After controlling the expansion, the z-axis feed unit is driven to insert the capillary into the loader clamping portion, and then the clamping release unit is rotated in the opposite direction to control the loader clamping portion to be reduced so that the capillary is supported. Thereafter, the grip unit is extended and controlled, and then the z-axis transfer unit is controlled to move the grip portion downward, and then the gripper is controlled to be gripped again, and then the x-axis transfer unit is controlled to move the capillary upward. It is preferable to pressurize.
The control unit may control the capillary to limit upward movement of the z-axis transfer unit when the capillary stopper unit is no longer moved upward.
In addition, the capillary mounting unit, Stepping motor; It is preferable that the stepping motor is rotated at a predetermined rotational angle, the mounting rotating plate is formed with a mounting hole in which the capillary is inserted and mounted.
In addition, the station is provided with the capillary supply and recovery unit, x-axis transfer unit, y-axis transfer unit, z-axis transfer unit, capillary stopping unit, clamping release unit and capillary mounting unit; And an adjusting unit for adjusting the station to be rotated at a rotation angle θ having the x-axis, the y-axis, the z-axis movement, and the y-axis as the rotation axis.
In addition, the adjustment unit, the stationary plate fixed to the station; A θ rotating plate rotatably installed on the fixing plate; A y-axis plate adjustable in the y-axis direction to the θ rotating plate; And an x-axis plate adjustable in the x-axis direction on the y-axis plate.
According to the automatic capillary replacement system of the present invention, the capillary stopping unit can be controlled to maintain the position of the capillary before or after the replacement, so that the capillary is inserted or less than the clamping portion By inserting, it is possible to solve the problem that the defect rate increases due to the characteristics of the semiconductor to be precisely processed.
In addition, the position in the clamping portion of the capillary can be maintained more precisely, and thus the semiconductor can be precisely processed.
In addition, the adjustment unit can be used to finely adjust the station to the x-axis, the y-axis, and the z-axis using the adjustment unit according to the position and state of the clamping loader, which is fixed and impossible to adjust. It is possible to precisely control the filler supply and recovery unit.
1 is a block diagram showing a capillary automatic replacement system according to an embodiment of the present invention.
Figure 2a is a perspective view showing an automatic capillary replacement system according to an embodiment of the present invention.
2B and 2C are diagrams for explaining the operation of the capillary supply and recovery unit shown in FIG. 2A.
3 is a view for explaining an operation state by the clamping release unit in the clamping portion of the clamping loader shown in FIG.
4A is a perspective view showing the main portion of FIG.
4B is a schematic front view for explaining the clamping release unit shown in FIG. 2A.
Figure 5a is a view showing a state in which the capillary supply and recovery unit is moved toward the clamping portion to separate the capillary.
5B and 5C are schematic views for explaining a capillary release operation of the clamping release unit.
6 to 13 are views for explaining the operation of replacing the capillary using the capillary automatic replacement system of the present invention.
Hereinafter, an automatic capillary replacement system according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
1 to 13, the capillary automatic replacement system according to an embodiment of the present invention includes a
The
2A to 2C, the capillary supply and
The y-
The y-
The
The
The clamping
Referring to Figure 3, the
The lifting
The elevating
The
It is coupled to the
The
The
In more detail, the
At this time, when the capillary 11 is pressed upward, the upper end of the capillary 11 is interfered by the
In addition, the capillary automatic replacement system of the present invention, referring to Figures 14 to 16, the capillary supply and
The
The
By using the
Hereinafter will be described in detail the effect of the capillary automatic replacement system according to an embodiment of the present invention having the above configuration.
First, as shown in FIG. 4A, the
And the
Then, after rotating the
Then, the
Then, the
Then, the
Then, the capillary 11 is mounted to the clamping
On the other hand, after the capillary 11 is stably mounted in two steps as described above, as shown in FIG. 11D, the capillary 11 is rotated by an angle of 90 degrees to the
Then, as shown in FIGS. 12 and 13, the
As described above, according to the capillary automatic replacement system of the present invention, the capillary can be unstablely fixed to the clamping part by attaching the capillary sequentially to the clamping part in two steps. In addition, when the capillary is mounted in two steps, the capillary 11 is excessively raised by having a configuration in which the
In addition, unlike the prior art by being able to automatically replace the capillary 11, it is possible to reduce the time accordingly to reduce the cost and increase the productivity of the semiconductor.
While the invention has been shown and described in connection with preferred embodiments for illustrating the principles of the invention, the invention is not limited to the construction and operation as shown and described. Those skilled in the art will readily appreciate that many modifications and variations of the present invention are possible without departing from the spirit and scope of the appended claims.
11..
21. Clamping
120..
140..z-
160..Clamping
180..Control
Claims (6)
A capillary supply and recovery unit for supplying or recovering a capillary to the clamping loader side, the capillary supplying and recovering unit having a grip for selectively gripping the capillary;
An x-axis transfer unit for transferring the capillary supply and recovery unit in the x-axis direction;
A y-axis transfer unit for transferring the capillary supply and recovery unit in the y-axis direction;
A z-axis transfer unit for transferring the capillary supply and recovery unit in a z-axis direction;
A capillary stopper unit which prevents the capillary from rising to an upper end of the clamping portion when a new capillary is supplied to the clamping portion by the capillary supply and recovery unit;
A clamping release unit for selectively locking or releasing the clamping portion to allow the capillary to be mounted or detached;
A capillary mounting unit on which the capillary supplied or recovered to the clamping loader is mounted; And
And a control unit for controlling the capillary supply and recovery unit and the clamping release unit.
After driving the x-axis, y-axis and z-axis transfer unit to move the capillary supply and recovery unit to the lower portion of the loader clamping portion of the clamping loader while controlling the expansion of the loader clamping portion by rotating the clamping release unit After the capillary is inserted into and supplied to the loader clamping part by driving the z-axis transport unit, the clamping release unit is rotated in the opposite direction to control the loader clamping part to be reduced so that the capillary is supported, and then the grip part is expanded. After controlling to control the z-axis transfer unit to move the grip downwards and to control the capillary again, and then to control the x-axis transfer unit to press the capillary upwards Capillary automatic replacement system.
When the capillary is no longer moved upward by the capillary stopping unit, the capillary automatic replacement system, characterized in that the control to limit the upward movement of the z-axis transfer unit.
A stepping motor;
The capillary automatic replacement system, comprising: a mounting rotating plate is rotated by a stepping motor at a predetermined rotation angle, the mounting hole is formed is inserted into the capillary is mounted.
A station in which the capillary supply and recovery unit, the x-axis transfer unit, the y-axis transfer unit, the z-axis transfer unit, the capillary stopping unit, the clamping release unit, and the capillary mounting unit are installed; And
And an adjustment unit for adjusting the station to be rotated at a rotation angle θ having the x-axis, y-axis, z-axis movement, and y-axis as the rotation axis.
A fixed plate fixed to the station;
A θ rotating plate rotatably installed on the fixing plate;
A y-axis plate adjustable in the y-axis direction to the θ rotating plate; And
Capillary automatic replacement system comprising a; x-axis plate adjustable in the x-axis direction on the y-axis plate.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20110116806 | 2011-11-10 | ||
KR1020110116806 | 2011-11-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20130051866A true KR20130051866A (en) | 2013-05-21 |
KR101352586B1 KR101352586B1 (en) | 2014-01-20 |
Family
ID=48290199
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR20120031093A KR101352586B1 (en) | 2011-11-10 | 2012-03-27 | A system for exchanging capillary automatically |
Country Status (2)
Country | Link |
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KR (1) | KR101352586B1 (en) |
WO (1) | WO2013069857A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108695181A (en) * | 2017-04-05 | 2018-10-23 | 三星电子株式会社 | The method for replacing capillary |
US11205634B2 (en) * | 2018-07-16 | 2021-12-21 | Asm Technology Singapore Pte Ltd | Bonding apparatus with replaceable bonding tool |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101806147B1 (en) | 2015-09-14 | 2017-12-11 | 연근영 | A system for exchanging capillary automatically |
US11717912B2 (en) * | 2019-03-18 | 2023-08-08 | Shinkawa Ltd. | Capillary guide device and wire bonding apparatus |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3034774B2 (en) * | 1994-12-28 | 2000-04-17 | 株式会社カイジョー | Wire bonding equipment |
JP3201271B2 (en) * | 1996-08-22 | 2001-08-20 | 松下電器産業株式会社 | Method of changing bonding tool in bonding equipment |
JP4700595B2 (en) * | 2006-12-04 | 2011-06-15 | 株式会社新川 | Wire bonding apparatus, bonding tool exchange method and program for wire bonding apparatus |
KR20090011422U (en) * | 2008-05-06 | 2009-11-11 | 주식회사 하이닉스반도체 | Transducer of semiconductor for replacing a capillary automatically and capillary auto replacing system using the same |
-
2012
- 2012-03-27 KR KR20120031093A patent/KR101352586B1/en not_active IP Right Cessation
- 2012-04-25 WO PCT/KR2012/003190 patent/WO2013069857A1/en active Application Filing
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108695181A (en) * | 2017-04-05 | 2018-10-23 | 三星电子株式会社 | The method for replacing capillary |
US11205634B2 (en) * | 2018-07-16 | 2021-12-21 | Asm Technology Singapore Pte Ltd | Bonding apparatus with replaceable bonding tool |
Also Published As
Publication number | Publication date |
---|---|
WO2013069857A1 (en) | 2013-05-16 |
KR101352586B1 (en) | 2014-01-20 |
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