KR20130036457A - Electrical contact unit and probe assembly for electrical inspecting a device having the same - Google Patents

Abstract

PURPOSE: An electrical contact structure and a probe assembly for electricity test containing the same are provided to be equipped with a contact pattern and a wiring pattern as a single film structure. CONSTITUTION: A probe assembly for electricity test(100) is composed of the following parts: a wiring pattern(35) extended to face the front-end part(11a) of a base block(11); a protective film formed on the wiring pattern facing an electrode pad(21) to protect the wiring pattern; a contact pattern(37) arranged at the lower part of the wiring pattern to be electrically contacted with the electrode pad of a test object(200); and a via pattern(39) penetrating a first protective layer between the wiring pattern and the contact pattern.

Description

Electrical contact unit and probe assembly for electrical inspecting a device having the same

The present invention relates to an electrical contact structure and an electrical test probe assembly including the same, and more specifically, to an electrical contact with an electrode pad of an inspected object when performing an electrical reliability test on an inspected object such as a flat panel display element or the like. It relates to an electrical contact structure and an electrical inspection probe assembly comprising the same.

As an example of a flat panel display element as a test object, a liquid crystal display panel, a plasma display panel, an organic light emitting diode display panel, etc. are mentioned. In the case of the aforementioned flat panel display panel, an electrode pad for applying an electrical signal to an edge portion thereof is provided.

In the inspection of the electrical reliability of the flat panel display device mentioned above, the micro block is electrically connected to the electrode pad of the flat panel display panel while being electrically connected to the base block, the printed circuit board (PCB) disposed on the bottom surface of the base block, and the printed circuit board. A probe assembly having a tip or the like is used. Recently, a probe assembly having a contact pattern instead of a micro tip has been developed to correspond to an electrode pad of a flat display panel having a fine pitch. That is, a contact pattern having a film structure made of a flexible printed circuit board (FPCB) is used instead of the micro tip to be in electrical contact with the electrode pad of the flat panel display panel. Therefore, the aforementioned probe assembly includes a base block, a contact pattern of a flexible printed circuit board disposed at a front end of a lower surface of the base block, a wiring of a printed circuit board connected to a contact pattern while disposed at a rear end of a lower surface of the base block, and the like. do.

However, in the case of the probe assembly having the flexible printed circuit board of the contact pattern and the printed circuit board of the wiring, since there is a connection portion between the contact pattern and the wiring, the occurrence of electrical noise, short circuit, and misalignment at the connection portion ( structural defects such as miss align). In addition, in the case of a printed circuit board, the fabrication of the printed circuit board is not easy and the cost is high compared to a flexible printed circuit board having a film structure.

In addition, in the recent electrical inspection of flat panel display devices such as organic light emitting diode display panels having at least two different electrode pads having different rows or columns, electrical contact with the electrode pads must be repeated for every row or column. As a result, the inspection time tends to be a little longer, and as a result, it may act as a cause that causes a problem in productivity.

It is an object of the present invention to provide an electrical contact structure having a contact pattern and a wiring pattern as a single film structure and a probe assembly for electrical inspection including the same.

An electrical contact structure according to an embodiment of the present invention for achieving the above object is a wiring pattern extending toward the electrode pad of the test object, and a wiring pattern facing the electrode pad of the test object to protect the wiring pattern A protective film having a first protective film formed on the contact layer, a contact pattern disposed below one side of the wiring pattern to be in electrical contact with an electrode pad of the test object, and the electrical connection between the wiring pattern and the contact pattern; And a via pattern formed in the via hole penetrating the first passivation layer between the wiring pattern and the contact pattern.

In the electrical contact structure according to the embodiment of the present invention mentioned above, the contact pattern and the via pattern may be formed to have an integral structure.

In the electrical contact structure according to the embodiment of the present invention mentioned above, the contact pattern may have a structure that is pointed toward the end in contact with the electrode pad.

In the electrical contact structure according to an embodiment of the present invention mentioned above, the protective film may further include a second protective film formed on the wiring pattern opposite to the electrode pad of the test object to protect the wiring pattern.

In the electrical contact structure according to an embodiment of the present invention, the wiring pattern of the upper portion in which the contact pattern is disposed so that the contact pattern is pressed toward the electrode pad when the contact pattern is in electrical contact with the electrode pad And a pressing pattern between the second passivation layer and the second passivation layer.

Probe assembly for an electrical inspection according to an embodiment of the present invention for achieving the above object is provided with a base block having a front end facing in the direction in which the electrode pad formed on the object to be tested for electrical inspection; And a protective film including a wiring pattern extending toward the front end of the base block, a first protective film formed on the wiring pattern facing the electrode pad of the test object to protect the wiring pattern, and the electrode of the test object. A contact pattern disposed under one side of the wiring pattern to be in electrical contact with a pad, and a via hole penetrating through the first passivation layer between the wiring pattern and the contact pattern to electrically connect the wiring pattern and the contact pattern; Electrical contacts having via patterns.

In the above-described probe assembly for an electrical test according to an embodiment of the present invention, the via pattern penetrates through the first passivation layer and up to a wiring pattern formed on the first passivation layer and a contact pattern formed under the first passivation layer. It may be formed in the penetrating via hole.

In the electrical test probe assembly according to the embodiment of the present invention, the contact pattern and the via pattern may be formed to have an integral structure.

In the electrical test probe assembly according to the embodiment of the present invention, the contact pattern may have a structure that is pointed toward the end in contact with the electrode pad.

In the probe assembly for electrical inspection according to an embodiment of the present invention mentioned above, the protective film may include a coating film of an insulating material.

In the electrical probe probe assembly according to the embodiment of the present invention, the protective film may further include a second protective film formed on the wiring pattern facing the lower surface of the base block to protect the wiring pattern. .

In the above-described probe assembly for electrical inspection according to an embodiment of the present invention, the second passivation layer is formed under a portion interviewing the wiring pattern and a portion interviewing the wiring pattern, and only up to a portion where the contact pattern is formed. It may be provided as a multi-layered film having an extended portion, the portion to be interviewed with the wiring pattern may be provided with a coating film made of polyimide, polyester or a mixture thereof, the portion extending only to the portion where the contact pattern is formed It may be provided as a coating film of an insulating material.

In the probe assembly for electrical inspection according to an embodiment of the present invention mentioned above, the protective film may be disposed to be fixed to the lower surface of the base block using a bonding material made of an insulating material.

In the probe assembly for electrical inspection according to an embodiment of the present invention, the contact pattern is arranged so that the contact pattern is pressed toward the electrode pad when the contact pattern is in electrical contact with the electrode pad; A pressing pattern may be further provided between the first protective film and the second protective film of the protective film.

In the probe assembly for electrical inspection according to an embodiment of the present invention mentioned above, the pressing pattern may be made of the same material and structure as the contact pattern.

In the above-described probe assembly for an electrical test according to an embodiment of the present invention, when the inspected object includes at least two electrode pads positioned in different rows or columns, the contact pattern is in electrical contact with the electrode pad at the same time. Possibly arranged in at least two rows or columns.

In the electrical test probe assembly according to the embodiment of the present invention, the wiring pattern may extend only to a portion which does not protrude from the front end of the base block.

In the above-described probe assembly for an electrical test according to an embodiment of the present invention, the contact pattern is configured to absorb an impact applied to the contact pattern when the contact pattern is pressed by the electrical contact with the electrode pad. It may further include a shock absorbing portion formed to be interviewed on the lower surface of the front end of the base block opposite to the arrangement.

In the probe assembly for electrical inspection according to an embodiment of the present invention mentioned above, the shock absorbing portion may be made of a rubber material.

As mentioned, according to one embodiment of the present invention, the contact pattern and the wiring pattern are provided in a single film structure. That is, a single film structure includes a contact pattern in electrical contact with the object under test and a wiring pattern electrically connected to the contact pattern mentioned above.

As described above, in the case of the electrical contact structure and the probe assembly for the electrical inspection including the same, since the contact stripe and the wiring pattern are formed in a single film structure, the connection portion between the contact pattern and the wiring pattern can be omitted, thereby generating electrical noise. Problems caused by structural defects such as short circuits, misalignment at connection sites, etc. can be prevented in advance.

In addition, since only the flexible printed circuit board, which is a single film structure, may be applied to the contact pattern and the wiring pattern alone, it is possible to improve the price competitiveness and product productivity of the electrical contact structure and the electrical inspection probe assembly including the same. .

In addition, the probe assembly for the electrical inspection including the electrical contact according to the embodiment of the present invention mentioned above can be arranged in at least two rows or columns, at least two different electrode pads having different rows or columns. It can be used more actively for the electrical inspection of the flat panel display device such as the recent organic light emitting diode display panel having a.

Therefore, since one electrical test can be performed on the electrode pads positioned in at least two rows or columns, the time required for the electrical test can be sufficiently shortened, and as a result, an effect of improving productivity can be expected. In addition, since the electrical contact with the electrode pad is made of at least two rows or columns, the confirmation of misalignment can be reduced by that by reducing the number of times of electrical contact with the electrode pad. The effect of improving the reliability can be expected.

In addition, the electrical contact structure and the probe assembly for an electrical test including the same according to an embodiment of the present invention have a more stable structure because the contact pattern contacts not only the protective layer but also the via pattern, especially in the case of an integral structure. There is also an advantage to have.

1 is a schematic diagram illustrating an electrical test probe assembly according to an exemplary embodiment of the present invention.
2 is an enlarged view of a portion A in Fig.
3 is a schematic diagram illustrating the electrical contact of FIG. 1.
4 and 5 are schematic diagrams illustrating other examples of the electrical contact of FIG. 1.
FIG. 6 is a schematic diagram for describing a structure of the electrical contact of FIG. 1.
FIG. 7 is a diagram illustrating an arrangement of electrode pads of a test subject of FIG. 1.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings showing embodiments of the present invention. However, the present invention should not be construed as limited to the embodiments described below and may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

When an element is described as being placed on or connected to another element or layer, the element may be directly disposed or connected to the other element, and other elements or layers may be placed therebetween It is possible. Alternatively, if one element is described as being placed directly on or connected to another element, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the invention are described with reference to cross-sectional illustrations that are schematic illustrations of an ideal embodiment of the invention. Accordingly, changes from the shapes of the illustrations, such as changes in manufacturing methods and / or tolerances, are those that can be expected. Thus, embodiments of the present invention are not intended to be described as limited to the particular shapes of the areas described as illustrations, but include deviations in the shapes, the areas described in the figures being entirely schematic and their shapes It is not intended to describe the precise shape of the region nor is it intended to limit the scope of the invention.

Example

FIG. 1 is a schematic diagram illustrating an electrical test probe assembly according to an exemplary embodiment of the present disclosure, FIG. 2 is an enlarged view of a portion A of FIG. 1, and FIG. 3 is a schematic diagram illustrating the electrical contact of FIG. 1. Drawing.

1 to 3, the probe assembly 100 for electrical inspection is used to electrically contact the electrode pad 21 of the inspected object 200 to inspect the electrical reliability of the inspected object 200. Examples of the test object 200 mentioned above include a panel of a flat panel display element such as an organic light emitting diode display panel, a liquid crystal display panel, a plasma display panel, or the like. In particular, in the case of a flat panel display device such as an organic light emitting diode display panel, a plurality of electrode pads 21 having a predetermined interval are provided. In addition, the plurality of electrode pads 21 mentioned above are provided to be arranged with different rows or columns.

The electrical test probe assembly 100 according to the present invention has a base block 11 and an electrical contact 13 which is an electrical contact structure of the present invention. In particular, the electrical contact 13, which is an electrical contact structure, includes a wiring pattern 35, a protective film, a contact pattern 37, a via pattern 39, and the like. In addition, the electrical contact 13 may further include a pressing pattern 17, and the like, and the electrical test probe assembly 100 may further include a shock absorber 15.

In addition, as will be described later, the protective film includes the first protective film 33 and the second protective film 31, but if necessary, only the first protective film 33 may be provided alone. That is, the protective film may include the first protective film 33 alone or the first protective film 33 and the second protective film 31 together.

Specifically, the base block 11 mentioned above is for supporting and fixing the electrical contact portion 13, and the front end toward the direction in which the electrode pad 21 formed on the object 200 for electrical inspection is located. 11a).

And the electrical contact 13 is provided with a protective film. The protective film includes a first protective film 33 and a second protective film 31.

First, the second passivation layer 31 is provided to be disposed on the bottom surface of the base block 11. The first passivation layer 33 is disposed to be opposite to the second passivation layer 31. That is, the first passivation layer 33 is disposed at a portion facing the electrode pad 21 of the test subject 200 opposite to the second passivation layer 31. Here, each of the second protective film 31 and the first protective film 33 provided as a protective film is made of a coating film of an insulating material. In particular, the coating film of the insulating material mentioned above is not limited to the type of material if sufficient flexibility is secured with insulation. In addition, while the second passivation layer 31 has a single layer structure, the first passivation layer 33 may have a layered structure. Thus, the first passivation layer 33 is formed below the portion that is to be interviewed with the wiring pattern 35 of the electrical contact portion 13, which will be described later, and the portion where the contact pattern 37 is formed. It can only have a portion that extends. That is, the first passivation layer 33 is a coating film formed on a portion extending only to a portion where the coating film 33b and the contact pattern 37 are formed at the portion in contact with the wiring pattern 35 of the electrical contact portion 13. 33a can be provided. Here, in the case of the coating film 33b formed on the portion facing the lower surface of the base block 11, the portion is in contact with the wiring pattern 35, so that the polyimide to more stably protect the wiring pattern 35, It is preferable to provide with the coating film 33b which consists of polyester or mixtures thereof. It can be seen that the coating film 33b made of the mentioned polyester or a mixture thereof also has flexibility with insulation. In addition, in the case of the coating film 33a formed on a portion of the object 200 facing the electrode pad 21, that is, a portion extending only to a portion where the contact pattern 37 is formed, the insulating film is similar to the second protective layer 31. In addition, if sufficient flexibility is secured, it is not limited to the type of material.

As described above, in the case of the electrical contact part 13 mentioned above, since the protective film made of the second protective film 31 and the first protective film 33 is made of a material having flexibility with insulation, it has a flexible film structure. . Thus, the electrical contact 13 may have the same structure as the flexible printed circuit board (FPCB). That is, the electrical contact part 13 is the same flexible film as the flexible printed circuit board because the protective film made of a material having flexibility with insulation and the wiring pattern 35 of the electrical contact part 13 described later are made of a flexible metal. It may be provided as a structure.

Therefore, the probe assembly 100 for the electrical inspection of the present invention may be provided with an electrical contact 13 having the same flexible film structure as the flexible printed circuit board, unlike the conventional art.

In the case of the above-mentioned protective film, the first protective film 33 and the second protective film 31 are provided together, but the first protective film 33 may be provided alone. That is, the protective film may include the first passivation layer only on the wiring pattern 35 facing the electrode pad 21 of the inspected object 200 to protect the wiring pattern 35 facing the electrode pad 21 of the inspected object 200. 33 may also be provided. In other words, in the case of the electrical contact 13 and the electrical test probe assembly 100 including the same, the second passivation layer 31 may be omitted and the first passivation layer 33 may be provided alone. This is because the wiring pattern 35 facing the lower surface of the base block 11 may be protected by the lower surface of the base block 11 without being exposed when attached to the lower surface of the base block 11. to be.

As mentioned, in the present invention, only the first protective film 33 or the first protective film 33 and the first protective film 33 may be provided as the protective film in the electrical contact part 13 and the probe assembly 100 for electrical inspection including the same. The protective film 31 is provided together to prevent external exposure of the wiring pattern 35 to prevent particles such as dust from being adsorbed onto the wiring pattern 35 due to static electricity.

The wiring pattern 35 is interposed between the second protective film 31 and the first protective film 33. In other words, the second protective layer 31, the wiring pattern 35, and the first protective layer 33 may be sequentially stacked from the bottom surface of the base block 11 so that the wiring pattern 35 may have the second protective layer ( It is interposed between 31) and the first protective film 33. Here, the wiring pattern 35 has a structure extending toward the front end portion 11a of the base block 11. In addition, the rear end of the wiring pattern 35 has a structure that is connected to an external device such as a tester for providing an external electrical signal when performing an electrical test.

The contact pattern 37 is disposed below the wiring pattern 35 extending toward the front end portion 11a of the base block 11 so as to be in electrical contact with the electrode pad 21 of the object 200. do. That is, the contact pattern 37 is disposed below the end portion of the wiring pattern 35 extending toward the front end portion 11a of the base block 11 so that the wiring pattern 35 and the contact pattern 37 are formed. May be disposed perpendicular to each other. Thus, an electrical test is performed on the object 200 as an electrical signal connected between the contact pattern 37 and the wiring pattern 35. That is, when the contact pattern 37 is in electrical contact with the electrode pad 21 of the object under test 200, the test object 200 is confirmed by checking an electrical signal passing between the contact pattern 37 and the wiring pattern 35. An electrical test is done for. Therefore, the contact pattern 37 and the wiring pattern 35 mentioned above must be electrically connected.

Thus, in the present invention, the via pattern 39 is formed to electrically connect the contact pattern 37 and the wiring pattern 35. Therefore, the via pattern 39 is formed in the via hole penetrating the contact pattern 37, the first passivation layer 33, and the wiring pattern 35. That is, it is formed in the via hole penetrating the first passivation layer 33 and the wiring pattern 35 formed thereon from the central portion of the contact pattern 37. In this case, the via hole in which the via pattern 37 is formed may have a structure in which the surface of the second passivation layer 31 is mainly exposed. Therefore, the via pattern 39 according to the present invention has a structure in which a material of conductive material is sufficiently filled in the via hole which sequentially passes through the contact pattern 37, the first passivation layer 33, and the wiring pattern 35. As a result, the contact pattern 37 and the wiring pattern 35 are electrically connected to each other. In addition, the via pattern 39 may more stably fix the contact pattern 37 as well as the electrical connection between the contact pattern 37 and the wiring pattern 35. That is, when the contact pattern 37 and the wiring pattern 35 are directly connected, since the connection between the contact pattern 37 and the wiring pattern 35 is made by simple surface contact, the contact pattern 37 and the wiring pattern ( Not only is the strength of the connection part 35) weak, but also the connection part itself is exposed to the external environment, so that the connection part between the contact pattern 37 and the wiring pattern 35 becomes weaker by the continuous electrical test. It is because. In other words, when the contact pattern 37 is formed to be directly connected to the wiring pattern 35, the strength of the connection part is weak and the connection part is directly affected by the external environment such as oxidation. As described above, in the present invention, the via pattern 39 is formed in the via hole penetrating through the contact pattern 37, the first passivation layer 33, and the wiring pattern 35, thereby forming the contact pattern 37 and the wiring pattern 35. The electrical contact between the contact pattern 37 is formed so as to surround the via pattern 39 and the portion where the contact pattern 37 and the wiring pattern 35 are connected to each other can be minimized. Therefore, the contact pattern 37 and the wiring pattern 35 can be more stably fixed. That is, in the present invention, since the wiring pattern 35 and the via pattern 39 are not exposed to the external environment at all, and only the contact pattern 37 is exposed to the external environment, the contact pattern 37 and the wiring pattern 35 are exposed. It is possible to fix the space more stably. In particular, since the contact pattern 37 is formed to have a structure surrounding the via pattern 39, it is possible to secure the strength according to the contact better than the connection by the simple surface contact. Therefore, as mentioned, the via pattern 39 may more stably fix the contact pattern 37 and the wiring pattern 35.

In addition, since the electrical contact portion 13 is formed of a single film structure based on the foregoing, the contact pattern 37 may be omitted since the exposure of the portion where the contact pattern 37 and the wiring pattern 35 are directly connected may be omitted. And problems caused by structural defects such as electrical noise, short circuit, misalignment at the connection site, and the like, which are generated due to the exposure of the connection site of the wiring pattern 35, may be prevented in advance.

In addition, since the contact pattern 37 may be fixed using the via pattern 39, the size of the contact pattern 37 may be appropriately adjusted when the size of the via pattern 39 is appropriately adjusted.

Therefore, the probe assembly 100 for an electrical test according to the present invention has an advantage that an operator can arbitrarily appropriately adjust the size of the contact pattern 37, that is, the cross-sectional area of the contact pattern 37. As a result, by appropriately adjusting the cross-sectional area of the contact pattern 37, the distance between the contact patterns 37 adjacent to each other can be secured widely, and the interference between the contact patterns 37 can be reduced.

In addition, the formation of the protective film including the first protective film 33 and the second protective film 31 and the electrical contact portion 13 including the wiring pattern 35, the contact pattern 37, and the via pattern 39 may be performed by using a thin film. Since it can be easily understood by those skilled in the art as can be achieved by performing a process such as forming, patterning, and the like, a detailed description thereof will be omitted.

As mentioned, the electrical inspection probe assembly 100 of the present invention includes an electrical contact 13 having the same flexible film structure as the flexible printed circuit board on the bottom surface of the base block 11. Although not shown, the electrical contact 13 is fixedly disposed on the lower surface of the base block 11 using a bonding material made of an insulating material. In other words, the second protective film 31 of the electrical contact part 13 is fixedly disposed on the lower surface of the base block 11 by using a bonding material made of an insulating material. 13) to be fixedly placed. Here, the double-sided tape etc. are mentioned as an example of the bonding material mentioned. As described above, when the second passivation layer 31 is omitted, the wiring pattern 35 may be directly fixed to the lower surface of the base block 11.

Therefore, the probe assembly 100 for the electrical inspection of the present invention may be provided with an electrical contact 13 having the same flexible film structure as the flexible printed circuit board, unlike the conventional art. In particular, since the via pattern 39 is used to not only electrically connect the contact pattern 37 and the wiring pattern 35, but also to more stably fix the contact pattern 37, a flexible film structure unlike the conventional art. The electrical contact 13 can be provided alone. In addition, since the electrical contact portion 13 having the same flexible film structure as that of the flexible printed circuit board is provided alone, the structure of the lower surface of the base block 11 may not be affected. This is because even if the structure of the lower surface of the base block 11 has a structure with many bends, the characteristic of the flexible film structure of the electrical contact part 13 is utilized.

4 and 5 are schematic diagrams illustrating other examples of the electrical contact of FIG. 1.

4 has the same structure as the electrical contact 13 of FIGS. 1 to 3 except for the structure of the via pattern 39 and the structure of the via pattern 39 and the contact pattern 37 in FIG. 5. Therefore, the same reference numerals are used, and a detailed description thereof will be omitted.

First, referring to FIG. 4, the via pattern 39 is formed in the via hole penetrating the first passivation layer 33 between the wiring pattern 35 and the contact pattern 37, unlike in FIGS. 1 to 3. That is, in the electrical contact 13 of FIG. 4, the via pattern 39 is formed in the via hole penetrating the first passivation layer 33 between the wiring pattern 35 and the contact pattern 37 to form the wiring pattern 35. And the contact pattern 37 are electrically connected to each other.

In addition, when the via pattern 39 is formed in the via hole penetrating the first passivation layer 33 between the wiring pattern 35 and the contact pattern 37 as shown in FIG. 4, the via pattern 39 and the contact pattern ( 37) can also be formed integrally. That is, the conductive material is sufficiently filled in the via hole, the conductive material is deposited on the first passivation layer 33, and then the photo-etch process is performed to fill the via hole with the conductive material. ) And the via pattern 39 and the contact pattern 37 can be integrally formed by forming the conductive material deposited on the first passivation layer 33 as the contact pattern 37. In addition, in the case of the electrical contact 13 having the via pattern 39 of FIG. 4, the pressing pattern 17 may be further provided.

In addition, referring to FIG. 5, unlike in FIGS. 1 to 3 and 4, the contact pattern 37 is sharpened toward an end contacting the electrode pad 21 of the object 200. That is, in the electrical contact portion 13 in FIG. 5, the contact pattern 37 has a tip-shaped pyramid structure.

As such, when the contact pattern 37 is formed to have a tip-shaped pyramid structure, scrubbing is easier with the electrode pad 21, and as a result, it is more stable between the contact pattern 37 and the electrode pad 21. The electrical signal can be transferred to.

In addition, even in the case of the contact pattern 37 having a structure that is sharpened toward the end as shown in FIG. 5, the application is applied to both the electrical contact 13 in FIGS. 1 to 3 and the electrical contact 13 in FIG. 4. It is possible. In the case of the electrical contact 13 having the contact pattern 37 of FIG. 5, the pressing pattern 17 may be further provided.

In addition, although the electrical contact part 31 including the second protective film 31 is also described with reference to FIGS. 4 and 5, the second protective film, as mentioned in the case of the electrical contact part 13 in FIGS. 4 and 5, is also described. (31) may be omitted and only the first protective film 33 may be provided alone.

FIG. 6 is a schematic diagram for describing a structure of the electrical contact of FIG. 1.

Referring to FIG. 6, the contact pattern 37 in the present invention may be arranged in at least two rows or columns. That is, based on the front end portion 11a of the base block 11, the wiring pattern 35 is disposed so that one group extends closer to the front end portion 11a of the base block 11, and the other group is one group. Rather, the contact patterns 37 may be arranged in at least two rows or columns by being disposed to be spaced apart from the front end portion 11a of the base block 11. Here, as mentioned above, when the wiring patterns 35 are arranged in appropriate groups, the contact patterns 37 may be arranged in n (n is a natural number of two or more) rows or columns.

In this way, the contact patterns 37 are arranged in at least two rows or columns because the object 100 is provided with at least two electrode pads 21 positioned in different rows or columns. In particular, in the case of a flat panel display device such as an organic light emitting diode display panel and the like recently, at least two electrode pads 21 positioned in different rows or columns are provided.

FIG. 7 is a diagram illustrating an arrangement of electrode pads of a test subject of FIG. 1.

Referring to FIG. 7, an inspected object 200 having at least two electrode pads 21 positioned in different rows or columns is illustrated. Here, although the case where the said electrode pad 21 of the to-be-tested object 200 has four rows is demonstrated, it is not limited to this. As described above, in the present invention, the contact pattern 37 is arranged to have at least two rows or columns, so that even when the inspected object 200 includes at least two electrode pads 21 positioned in different rows or columns, the contact pattern 37 is appropriately provided. Can cope

Therefore, as shown in FIG. 7, the electrode pad 21 includes the electrode pad 21a in the first row, the electrode pad 21b in the second row, the electrode pad 21c in the third row, and the electrode pad 21d in the fourth term. In the case of having four rows as described above, the electrical contact portion 13 having the contact patterns 37 arranged in two rows can be used to perform two processes so that the electrical contact of the electrode pad 21 of the object 200 can be performed. The inspection will be performed, and the electrical contact 13 having the contact patterns 37 arranged in four rows allows the electrical inspection of the electrode pad 21 of the inspected object 200 to be performed in one process. Will be done. Therefore, according to the structure of the row or column in which the electrode pad 21 of the test object 200 is disposed, when the arrangement structure and the number of the contact patterns 37 of the electrical contact part 13 are appropriately adjusted, the electric test is more easily performed. This will be possible.

Therefore, when the electrical inspection probe assembly 100 having the electrical contact 13 having the contact pattern 37 mentioned above is used for electrical inspection, the process time can be shortened by two times or more as compared with the related art. In addition, when the electrical test probe assembly 100 of the present invention having the electrical contact 13 mentioned above is used for the electrical test, the electrical contact with the electrode pad 21 is made of at least two rows or columns. By reducing the number of times of electrical contact with the electrode pad 21, the confirmation of misalignment can be reduced by that much.

As described above, the electrical test probe assembly 100 according to the present invention has a contact pattern 37 of the electrical contact 13 when the test object 200 includes at least two electrode pads 21 positioned in different rows or columns. ) Can be easily corresponded to the electrode pads 21 by arranging them in at least two rows or columns to enable electrical contact at the same time.

Again, referring to FIGS. 1 to 3, the wiring pattern 35 is provided to extend only to a portion which does not protrude from the front end portion 11a of the base block 11. In other words, the electrical contact portion 13 is provided so as not to protrude from the front end portion 11a of the base block 11. If the electrical contact portion 13 is provided to protrude from the front end portion 11a of the base block 11 as in the prior art, since the protruding portion interferes with the outside when handling the probe assembly 100 for electrical inspection. Not. Thus, in the present invention, the electrical contact portion 13 is provided so as not to protrude from the front end portion 11a of the base block 11. The electrical contact 13 may be provided so as not to protrude from the front end portion 11a of the base block 11 because the via pattern 39 may be used to connect and fix the contact pattern 37. This is because the electrical contact portion 13 has a single soft film structure. As mentioned, the wiring pattern 35 of the electrical contact portion 13 is provided to extend only to a portion which does not protrude from the front end portion 11a of the base block 11. Ease of use can be ensured, and as a result, more stable electrical inspection is possible.

In addition, the pressing pattern 17 mentioned above is provided between the second passivation layer 31 and the first passivation layer 33 on the upper portion where the contact pattern 37 is disposed. Accordingly, the pressing pattern 17 may allow the contact pattern 37 to be more easily pressed toward the electrode pad when the contact pattern 37 is in electrical contact with the electrode pad 21. That is, when the contact pattern 37 contacts the electrode pad 21, the pressing pattern 17 formed on the opposite side sufficiently presses the contact pattern 37 so that the contact pattern 37 is more easily pressed, and as a result, The contact between the contact pattern 37 and the electrode pad 21 may be made more stable. Here, the pressing pattern 17 is not limited to the material and structure, but may be made of the same material and structure as the contact pattern 37. As such, forming the pressing pattern 17 with the same material and structure as the contact pattern 37 may include forming the pressing pattern 17 on the upper portion of the second protective layer 31 and the first protective layer on which the contact pattern 37 is disposed. The contact pattern 37 and the wiring pattern 35 may be electrically connected only when the pressing pattern 17 is formed of the same material as the contact pattern 37. Because there is. In addition, since the pressing pattern 17 is formed to have a structure surrounding the via pattern 39, the contact pattern 37 faces the electrode pad 21 when the contact pattern 37 is in electrical contact with the electrode pad 21. (37) can be pressurized more easily. That is, as mentioned by forming the pressing pattern 17 and the contact pattern 37 into a structure having the same structure as the upper and lower parts, when the contact pattern 37 is in electrical contact with the electrode pad 21, the electrode pad ( The contact pattern 37 can be pressed more easily toward 21.

In addition, the above-described shock absorbing portion 15 is formed to be interviewed on the lower surface of the front end portion 11a of the base block 11 on the opposite side where the contact pattern 37 is disposed. Accordingly, the shock absorber 15 may absorb the shock applied to the contact pattern 37 when the contact pattern 37 is pressed by the contact pattern 37 being in electrical contact with the electrode pad 21. As such, the contact pattern 37 may be absorbed by absorbing the impact applied to the contact pattern 37 when the contact pattern 37 is pressed by the electrical contact with the electrode pad 21 by providing the shock absorbing portion 15. More stable scrubbing between the electrode pads 21 can be achieved. Here, the shock absorbing portion 15 may be made of a rubber material as a material having elastic force because it must absorb the impact.

As such, the above-described electrical test probe assembly 100 includes a shock absorbing part 15 together with a pressing pattern 17, which makes contact patterns 37 and electrode pads 21 easier to perform when the electrical test is performed. A contact between them can be aimed at.

As mentioned, the electrical inspection probe assembly of the present invention may be provided alone with electrical contacts of the same flexible film structure as the flexible printed circuit board. That is, the probe assembly for electrical inspection of the present invention may be provided with an electrical contact of a flexible film structure, which is relatively inexpensive and simple in manufacture, compared to a printed circuit board.

Therefore, the price competitiveness and product productivity of the electrical inspection probe assembly can be expected. Thus, it can be seen that the electric inspection probe assembly of the present invention has a higher quality competitiveness when applied to the semiconductor industry, the flat panel display device industry, and the like.

In addition, the probe assembly for the electrical inspection of the present invention can omit a portion where the contact pattern and the wiring pattern are directly connected, thereby preventing a problem caused by the direct connection of the contact pattern and the wiring pattern in advance according to the electrical inspection. Even the improvement of reliability can be expected, and as a result, higher inspection data can be secured when applied to the semiconductor industry, flat panel display device industry, and the like.

In addition, since the aforementioned probe assembly for the electrical inspection of the present invention can arrange the contact pattern in at least two rows or columns, a recent organic light emitting diode display panel having at least two different electrode pads having different rows or columns is provided. The present invention can be more actively used for electrical inspection of flat panel display devices such as the like, and as a result, productivity improvement in the semiconductor industry, flat panel display device industry, and the like can be expected.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

11: base block 11a: front end
13: electrical contact 15: shock absorber
17: pressing pattern 21: electrode pad
31, 33: protective film 35: wiring pattern
37: contact pattern 39: via pattern
100 probe assembly 200 test object

Claims (19)

A wiring pattern extending toward the electrode pad of the object under test;
A protective film having a first protective film formed on a wiring pattern facing the electrode pad of the test object so as to protect the wiring pattern;
A contact pattern disposed under one side of the wiring pattern to be in electrical contact with the electrode pad of the object under test; And
And a via pattern formed in a via hole penetrating the first passivation layer between the wiring pattern and the contact pattern to electrically connect the wiring pattern and the contact pattern. The electrical contact structure of claim 1, wherein the contact pattern and the via pattern are formed to have an integral structure. The electrical contact structure of claim 1, wherein the contact pattern has a pointed structure toward an end contacting the electrode pad. The electrical contact structure according to claim 1, wherein the protective film further comprises a second protective film formed on the wiring pattern opposite to the electrode pad of the test object so as to protect the wiring pattern. 5. The pressing pattern of claim 4, wherein the contact pattern is disposed between the wiring pattern and the second passivation layer formed on the contact pattern such that the contact pattern is pressed toward the electrode pad when the contact pattern is in electrical contact with the electrode pad. Electrical contact structure, characterized in that it further comprises. A base block having a front end portion facing in a direction in which electrode pads formed on an object to be inspected are positioned; And
A protective film including a wiring pattern extending toward the front end of the base block, a first protective film formed on a wiring pattern facing the electrode pad of the test object so as to protect the wiring pattern, and an electrode pad of the test object A via formed in the via hole penetrating the first passivation layer between the contact pattern and the contact pattern and the contact pattern disposed under the one side of the wiring pattern to be in electrical contact with the wiring pattern and the contact pattern; An electrical inspection probe assembly comprising an electrical contact having a pattern. The electrical method of claim 6, wherein the via pattern penetrates through the first passivation layer and is formed in a via hole penetrating through a wiring pattern formed on the first passivation layer and a contact pattern formed under the first passivation layer. Probe assembly for inspection. The probe assembly of claim 6, wherein the contact pattern and the via pattern are formed to have an integral structure. The probe assembly of claim 6, wherein the contact pattern has a pointed structure toward an end contacting the electrode pad. The probe assembly of claim 6, wherein the protective film comprises a coating film of an insulating material. The probe assembly of claim 6, wherein the protective film further comprises a second protective film formed on a wiring pattern facing the lower surface of the base block to protect the wiring pattern. The semiconductor device of claim 11, wherein the second passivation layer is formed of a multilayer film having a portion interviewed with the wiring pattern and a portion formed below the portion interviewed with the wiring pattern and extending only to a portion where the contact pattern is formed. The part interviewed with the wiring pattern is provided with a coating film made of polyimide, polyester or a mixture thereof, and the part extending only to the part where the contact pattern is formed is provided with a coating film of insulating material. Probe assembly. The probe assembly of claim 11, wherein the protective film is disposed to be fixed to a lower surface of the base block by using a bonding material made of an insulating material. The method of claim 11, wherein the contact pattern is disposed between the first passivation layer and the second passivation layer of the upper protective film on which the contact pattern is pressed toward the electrode pad when the contact pattern is in electrical contact with the electrode pad. The probe assembly for electrical inspection, characterized in that it further comprises a pressing pattern. The probe assembly of claim 14, wherein the pressing pattern is formed of the same material and structure as the contact pattern. The contact pattern of claim 6, wherein the contact pattern is disposed in at least two rows or columns so as to be electrically contacted to the electrode pads at the same time when the inspected object includes at least two electrode pads positioned in different rows or columns. Probe assembly for electrical inspection. The probe assembly of claim 6, wherein the wiring pattern extends only to a portion which does not protrude from a front end portion of the base block. The lower portion of the base block front end of the opposite side of claim 6, wherein the contact pattern is disposed to absorb an impact applied to the contact pattern when the contact pattern is pressed by the contact pattern being in electrical contact with the electrode pad. Probe assembly for electrical inspection, characterized in that it further comprises a shock absorbing portion formed to be interviewed on the surface. 19. The probe assembly of claim 18, wherein the impact absorbing portion is made of a rubber material.

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