KR20130021300A - 발광소자, 발광소자 패키지, 및 라이트 유닛 - Google Patents

발광소자, 발광소자 패키지, 및 라이트 유닛 Download PDF

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Publication number
KR20130021300A
KR20130021300A KR1020110083723A KR20110083723A KR20130021300A KR 20130021300 A KR20130021300 A KR 20130021300A KR 1020110083723 A KR1020110083723 A KR 1020110083723A KR 20110083723 A KR20110083723 A KR 20110083723A KR 20130021300 A KR20130021300 A KR 20130021300A
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KR
South Korea
Prior art keywords
light emitting
layer
semiconductor layer
conductivity type
contact portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020110083723A
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English (en)
Korean (ko)
Inventor
정환희
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020110083723A priority Critical patent/KR20130021300A/ko
Priority to JP2012004810A priority patent/JP5960436B2/ja
Priority to EP12151102.6A priority patent/EP2562815B1/en
Priority to CN201210023389.2A priority patent/CN102956779B/zh
Priority to US13/442,102 priority patent/US9564422B2/en
Publication of KR20130021300A publication Critical patent/KR20130021300A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H10H20/835—Reflective materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Devices (AREA)
KR1020110083723A 2011-08-22 2011-08-22 발광소자, 발광소자 패키지, 및 라이트 유닛 Ceased KR20130021300A (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020110083723A KR20130021300A (ko) 2011-08-22 2011-08-22 발광소자, 발광소자 패키지, 및 라이트 유닛
JP2012004810A JP5960436B2 (ja) 2011-08-22 2012-01-13 発光素子及び発光素子パッケージ
EP12151102.6A EP2562815B1 (en) 2011-08-22 2012-01-13 Light emitting device and light emitting device package
CN201210023389.2A CN102956779B (zh) 2011-08-22 2012-02-02 发光器件及发光器件封装件
US13/442,102 US9564422B2 (en) 2011-08-22 2012-04-09 Light emitting device and light emitting device package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110083723A KR20130021300A (ko) 2011-08-22 2011-08-22 발광소자, 발광소자 패키지, 및 라이트 유닛

Publications (1)

Publication Number Publication Date
KR20130021300A true KR20130021300A (ko) 2013-03-05

Family

ID=45445968

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110083723A Ceased KR20130021300A (ko) 2011-08-22 2011-08-22 발광소자, 발광소자 패키지, 및 라이트 유닛

Country Status (5)

Country Link
US (1) US9564422B2 (enExample)
EP (1) EP2562815B1 (enExample)
JP (1) JP5960436B2 (enExample)
KR (1) KR20130021300A (enExample)
CN (1) CN102956779B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014178654A1 (ko) * 2013-04-30 2014-11-06 주식회사 세미콘라이트 반도체 발광소자, 반도체 발광소자의 제조방법 및 반도체 발광소자를 포함하는 백라이트 유닛
CN114078911A (zh) * 2020-08-14 2022-02-22 三星显示有限公司 显示设备和制造该显示设备的方法
KR20220045127A (ko) * 2017-05-02 2022-04-12 서울바이오시스 주식회사 자외선 발광 다이오드

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EP2755245A3 (en) * 2013-01-14 2016-05-04 LG Innotek Co., Ltd. Light emitting device
KR102098110B1 (ko) * 2013-04-11 2020-04-08 엘지이노텍 주식회사 발광소자, 발광소자 패키지 및 라이트 유닛
EP2985792B1 (en) * 2013-04-12 2019-09-18 Seoul Viosys Co., Ltd. Ultraviolet light-emitting device
KR101521574B1 (ko) * 2013-06-25 2015-05-19 비비에스에이 리미티드 반도체 발광소자를 제조하는 방법
KR101534941B1 (ko) * 2013-11-15 2015-07-07 현대자동차주식회사 도전성 전극패턴의 형성방법 및 이를 포함하는 태양전지의 제조방법
US10910350B2 (en) * 2014-05-24 2021-02-02 Hiphoton Co., Ltd. Structure of a semiconductor array
JP6462274B2 (ja) * 2014-08-21 2019-01-30 株式会社東芝 半導体発光素子
TWI552394B (zh) * 2014-11-18 2016-10-01 隆達電子股份有限公司 發光二極體結構與發光二極體模組
JP2017059638A (ja) * 2015-09-15 2017-03-23 株式会社東芝 半導体発光素子
TWI646706B (zh) 2015-09-21 2019-01-01 隆達電子股份有限公司 發光二極體晶片封裝體
JP6354799B2 (ja) * 2015-12-25 2018-07-11 日亜化学工業株式会社 発光素子
KR20180073866A (ko) * 2016-12-23 2018-07-03 엘지이노텍 주식회사 반도체 소자
CN109768134A (zh) * 2019-01-28 2019-05-17 华引芯（武汉）科技有限公司 一种发光高效率反转垂直结构高压芯片及其制备方法

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EP0926744B8 (en) * 1997-12-15 2008-05-21 Philips Lumileds Lighting Company, LLC. Light emitting device
US6222207B1 (en) * 1999-05-24 2001-04-24 Lumileds Lighting, U.S. Llc Diffusion barrier for increased mirror reflectivity in reflective solderable contacts on high power LED chip
TWI223460B (en) * 2003-09-23 2004-11-01 United Epitaxy Co Ltd Light emitting diodes in series connection and method of making the same
WO2006098545A2 (en) 2004-12-14 2006-09-21 Seoul Opto Device Co., Ltd. Light emitting device having a plurality of light emitting cells and package mounting the same
KR100928259B1 (ko) 2007-10-15 2009-11-24 엘지전자 주식회사 발광 장치 및 그 제조방법
US7985970B2 (en) * 2009-04-06 2011-07-26 Cree, Inc. High voltage low current surface-emitting LED
WO2009106063A1 (de) 2008-02-29 2009-09-03 Osram Opto Semiconductors Gmbh Monolithischer, optoelektronischer halbleiterkörper und verfahren zur herstellung eines solchen
JP5123269B2 (ja) * 2008-09-30 2013-01-23 ソウル オプト デバイス カンパニー リミテッド 発光素子及びその製造方法
DE102009006177A1 (de) * 2008-11-28 2010-06-02 Osram Opto Semiconductors Gmbh Strahlungsemittierender Halbleiterchip
TWM374153U (en) * 2009-03-19 2010-02-11 Intematix Technology Ct Corp Light emitting device applied to AC drive
WO2010114250A2 (en) * 2009-03-31 2010-10-07 Seoul Semiconductor Co., Ltd. Light emitting device having plurality of light emitting cells and method of fabricating the same
KR100986570B1 (ko) * 2009-08-31 2010-10-07 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
KR100986560B1 (ko) * 2010-02-11 2010-10-07 엘지이노텍 주식회사 발광소자 및 그 제조방법
JP2011199221A (ja) 2010-03-24 2011-10-06 Hitachi Cable Ltd 発光ダイオード
CN102859726B (zh) * 2010-04-06 2015-09-16 首尔伟傲世有限公司 发光二极管及其制造方法
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WO2012158709A1 (en) * 2011-05-16 2012-11-22 The Board Of Trustees Of The University Of Illinois Thermally managed led arrays assembled by printing

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014178654A1 (ko) * 2013-04-30 2014-11-06 주식회사 세미콘라이트 반도체 발광소자, 반도체 발광소자의 제조방법 및 반도체 발광소자를 포함하는 백라이트 유닛
KR20220045127A (ko) * 2017-05-02 2022-04-12 서울바이오시스 주식회사 자외선 발광 다이오드
CN114078911A (zh) * 2020-08-14 2022-02-22 三星显示有限公司 显示设备和制造该显示设备的方法

Also Published As

Publication number Publication date
JP2013046049A (ja) 2013-03-04
EP2562815A2 (en) 2013-02-27
EP2562815B1 (en) 2018-11-14
US20130049008A1 (en) 2013-02-28
CN102956779A (zh) 2013-03-06
EP2562815A3 (en) 2014-08-27
CN102956779B (zh) 2017-06-06
JP5960436B2 (ja) 2016-08-02
US9564422B2 (en) 2017-02-07

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