KR20120137309A - Back contact solar cell module and manufacturing method thereof - Google Patents

Abstract

PURPOSE: A back contact solar cell module and an insulating substrate and a manufacturing method thereof are provided to simplify a manufacturing process by melting an adhesive film and a filler together in a single lamination process after a laminate structure is formed. CONSTITUTION: A glass substrate is manufactured by forming wiring(20) on a glass substrate. An adhesive film(40) is coated on one side of the glass substrate on which an electrode of the solar cell is formed. A laminate structure is formed by laminating a solar cell, a filler, and a front substrate. An electrode(50) and wiring are electrically connected by laminating the laminate structure.

Description

BACK CONTACT SOLAR CELL MODULE AND MANUFACTURING METHOD THEREOF}

The present invention relates to a back electrode solar cell module and a method of manufacturing the same that can simplify the manufacturing process.

Electrodes of the solar cell may be formed on the front and rear of the solar cell, respectively, but the electrode formed on the front reduces the absorption rate of the solar cell to the sunlight. Therefore, in order to improve the efficiency of the solar cell, a rear electrode type solar cell having a solar cell electrode installed at the rear has been developed.

When glass is used as the front sheet of the solar cell module, low iron glass or high light transmittance may be used so that visible light is transmitted into the sheet so that the solar cell can collect sunlight. To make glass.

In order to manufacture a conventional back electrode solar cell module, first, a wiring is formed on an insulating substrate, an insulating resin is applied on the wiring, and a cell on which the electrode is formed is laminated on the insulating resin. The structure is disposed between the front substrate and the back substrate (back sheet), and the filling material is disposed between the front substrate and the structure, and between the rear substrate and the structure, and then through the lamination process to complete the back electrode type solar cell module.

The manufacturing process of such a back electrode solar cell module takes a lot of materials, and furthermore, since insulating substrates such as plastics, which are widely used, have a large difference in coefficient of thermal expansion when compared with solar cells, the cell and the wiring board are When integrated, an insulating substrate or the like can be deformed.

The present invention can simplify the manufacturing process and reduce the manufacturing cost, and to provide a method of manufacturing a high precision back electrode type solar cell module.

In addition, to provide a back-electrode solar cell manufactured by the above method.

According to one or more exemplary embodiments, a method of manufacturing a solar cell module includes: forming a wiring on a glass substrate to make a glass wiring substrate, an adhesive film and an electrode formed on the glass wiring substrate, a filler, and a front surface. Laminating a substrate to form a laminated structure, and laminating the laminated structure to melt the adhesive film and the filler to electrically connect the electrode and the wiring.

According to another aspect of the present invention, there is provided a method of manufacturing a solar cell module, comprising: forming a wiring on a glass substrate to make a glass wiring substrate, coating an adhesive film on one surface of an electrode of the solar cell, and the glass Stacking the solar cell, the filler and the front substrate on a wiring board to form a stacked structure, and laminating the stacked structure to electrically connect the electrode and the wiring.

According to another aspect of the present invention, there is provided a method of manufacturing a solar cell module, including forming a wire on a glass substrate to make a glass wiring substrate, coating or temporarily bonding an adhesive film on one surface of the electrode of the wiring or solar cell. The method may include: forming a primary stacked structure by stacking the solar cells on the glass wiring substrate; applying pressure to the primary stacked structure to electrically connect the wires and the electrodes; Stacking the filler and the front substrate on the electrically connected primary laminated structure to form a secondary laminated structure, and laminating the secondary laminated structure.

 In the lamination step or applying pressure to the primary laminated structure, the adhesive film may be melted and filled in the space between the glass wiring board and the cell.

The lamination step may be performed in a state where the glass wiring board is placed at the lowermost portion.

In the lamination step, the filler may be melted and filled in the space between the glass wiring board and the front substrate.

The pressure applied to the primary stacked structure to electrically connect the wires and the electrodes may be 0.1 MPa to 5 MPa.

The adhesive film may be an anisotropic conductive film.

The anisotropic conductive film may be made of any one selected from epoxy resin, acrylic resin, vinyl acetate ethylene, silicone, and combinations thereof.

The glass substrate may be made of tempered glass.

The front substrate may be ethylene tetra fluor ethylene.

The back electrode solar cell module according to the embodiment of the present invention may be made by the method described above.

According to the embodiment of the present invention, by using the glass substrate as the back substrate and the insulating substrate, it is not necessary to provide a separate insulating substrate can reduce the manufacturing cost.

In addition, by directly arranging the wiring on the glass substrate, the filler may not be laminated between the glass substrate and the wiring, thereby reducing the amount of filler used.

In addition, since the strength of the solar cell module is maintained using a glass substrate as the rear substrate, a thin film can be used for the front substrate, thereby reducing the absorption of light by the front substrate, thereby increasing the efficiency of the solar cell.

1 to 5 are flowcharts of a method of manufacturing a back electrode solar cell module according to an embodiment of the present invention.
6 to 10 are flowcharts of a method of manufacturing a back electrode solar cell module according to another embodiment of the present invention.
11 to 17 are flowcharts illustrating a method of manufacturing a back electrode solar cell module according to another embodiment of the present invention.
18 is a view showing a back electrode solar cell module according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. Like parts are designated with like reference numerals throughout the specification.

In the method of manufacturing a back electrode solar cell module according to an embodiment of the present invention, forming a glass wiring board on which wiring is disposed, laminating a cell, a filler, and a front substrate on which the adhesive film and the electrode are formed on the glass wiring board. Forming a laminated structure, and laminating the laminated structure to melt the adhesive film and the filler and electrically connect the electrode and the wiring.

Hereinafter, a method of manufacturing the solar cell module according to the present embodiment will be described in detail.

First, as shown in FIG. 1, a wire is formed on a back sheet made of glass to make a glass wiring board. The glass wiring board is made by placing a copper foil on the rear substrate 90 made of glass and patterning the copper foil to form the wiring 20 or by printing a metal such as silver on the glass rear substrate 90 and then electroplating. It can be made by forming wiring.

Embodiment of the present invention is characterized in that the rear substrate 90 is made of glass to improve the strength of the solar cell module.

The rear substrate 90 is a member that serves as an outer case of the solar cell module and is disposed at the lowermost layer in the laminated structure of the solar cell module. In addition, since the wiring is directly formed directly on the rear substrate 90, it serves as an insulating substrate as well as an external case.

In general, compared to the plastic film used as an insulating substrate, the glass does not have a large difference between the solar cell and the coefficient of thermal expansion. Therefore, when the back substrate 90 made of glass is used as an insulating substrate, the strain of the glass is smaller than that of the plastic film in the lamination process, so that the precision of the solar cell module is excellent.

In addition, since the rear substrate 90 made of glass also serves as an insulating substrate on which the wiring 20 is disposed, it may not include a separate insulating substrate, thereby reducing manufacturing costs.

In this case, tempered glass may be used as the rear substrate 90. In this case, there is an effect of increasing the strength of the solar cell module because it uses a strengthened glass with a strong strength compared to using the normal glass as the rear substrate (90).

Thereafter, the adhesive film 40 is laminated on the glass wiring board as shown in FIG. 2.

The adhesive film 40 is a member for electrically connecting the wiring 20 and the electrode 50. At the same time, the adhesive film 40 serves as a filler between the wiring 20 and the electrode 50.

At this time, the insulating film is used as the adhesive film 40 so that electricity is not connected between the electrodes 50 adjacent to each other, and only electricity is connected between the electrode 50 and the wiring 20 in contact with the electrodes.

Specifically, the adhesive film 40 may use a non-conductive film (NCF) or an anisotropic conductive film (ACF) film.

In the anisotropic conductive film, conductive particles are dispersed in an insulating resin at a concentration lower than a percolation threshold.

When the anisotropic conductive film is placed between the electrode 50 and the wiring 20 and pressure is applied to the film in the vertical direction, electricity can pass through the conductive particles between the electrode 50 and the wiring 20, and the electrode 50 The density of the conductive particles is low between the electrode and the electrode 50 so that electricity does not pass.

As the insulating resin used for the anisotropic conductive film, an epoxy resin, an acrylic resin, vinyl acetate ethylene (hereinafter referred to as "VAE"), silicone, or the like may be used.

Epoxy resin is a kind of thermosetting resin, which has good adhesive strength, is not affected by temperature, and has excellent electrical insulation. In addition, it has excellent properties such as durability, chemical resistance, water resistance and the like.

In addition, the epoxy resin may contain only a small amount of volatile organic compounds (VOC), thereby producing environment-friendly products.

Epoxy-based resin is a technique used to bond a semiconductor chip and a glass substrate (Chip On Class, hereinafter referred to as "COG"), a technique used to bond a semiconductor chip and FPCB ("FPCB"). Chip on Film (hereinafter referred to as "COF") or FPCB and glass substrate or printed circuit board (Printed Circuit Board, referred to as "PCB") is used in the technology used for bonding.

In the technique of connecting an electrode and wiring using an anisotropic conductive film, the technique is similar in terms of COG or COF and its function and material. Therefore, the electrode 50 and the wiring 20 can be easily connected using this technique.

Acrylic resins have a lower curing temperature than epoxy resins and there is no fear of electrode corrosion by impurities such as chlorine.

VAE is a complex of vinyl acetate and ethylene.

VAE can be synthesized in a colloidal form dispersed in water, and can be laminated on the wiring 20 in a solution state.

By dispersing and coating the filler such as silica and the conductive particles in the emulsion VAE, a thin and uniform anisotropic film can be produced. And when it is coated on the wiring 20 by various printing methods, an anisotropic conductive film can be selectively coated on the desired portion. In this case, the silica filler may function to adjust the viscosity of the coating solution and the coefficient of thermal expansion of the anisotropic conductive film.

Silicone is excellent in chemical resistance and does not react with other chemicals, and also has excellent weather resistance and heat resistance. In addition, silicon is an environmentally friendly material that does not generate a lot of harmful substances even when burned.

In addition, silicon is a proven material commonly used as a filler for solar cells. Silicone can be applied on the wiring in a liquid state, when using the silicone as an adhesive film, there is an effect that it is easy to laminate the adhesive film on the wiring.

On the other hand, the adhesive film 40 may be a plurality of layers are stacked. At this time, the adhesive film 40 may be made of each of the above-described anisotropic conductive film or insulating film, or may be used in combination.

Thereafter, as shown in FIG. 3, the cells 60 on which the electrodes 50 are formed are stacked on the adhesive film 40.

At this time, the size of the adhesive film 40 is larger than the size of the electrode 50 and the solar cell 60. Therefore, when aligning the adhesive film 40 and the solar cell to improve the precision of the solar cell module, the solar cell 60 is placed on the lower side and the adhesive film 40 is not laminated on the upper side. As shown in FIG. 3, the adhesive film 40 having a size larger than that of the solar cell 60 may be placed below, and the solar cell 60 having the electrode 50 formed thereon may be stacked thereon.

Thereafter, as shown in FIG. 4, the filler 80 and the front substrate 70 are stacked on the solar cell 60.

The filler 80 integrates the solar cell 60, the front substrate 70, and the rear substrate 90, and serves to protect the solar cell.

As the filler 80, ethylene vinyl acetate or poly vinyl butyral may be used. In addition, other known fillers such as silicone may be used.

The front substrate 70 serves as an outer case of the solar cell module like the rear substrate. In addition, the front substrate 70 also serves to condense sunlight. Therefore, the front substrate is made of a transparent substrate.

Ethylene Tetra Fluoro Ethylene (hereinafter referred to as “ETFE”) may be used as the front substrate 70.

ETFE is a colorless transparent resin with high light transmittance. It is excellent in chemical resistance, abrasion resistance, etc. and its thermal stability is not changed even if heat of about 300 ℃ is applied continuously.

Therefore, when ETFE is used as the outermost layer in the solar cell module and directly receives solar heat, the thermal stability is excellent. In addition, ETFE is superior in light transmittance than glass, so that when the glass is used as the front substrate 70 can be formed thinner while increasing the light transmittance, the efficiency of the solar cell module is increased.

In addition, as described above, the glass substrate may be used as the back substrate, and the thickness of the solar cell module may be reduced by using the ETFE as the front substrate 70.

Specifically, in the case of using the glass substrate as the front substrate 70, there is a problem that the light transmittance is lowered, but the front substrate was formed thick in consideration of the strength of the solar cell module.

However, when the glass substrate is used as the rear substrate as described above, the rear substrate can be formed thick to support the strength of the solar cell module. Therefore, the use of thin ETFE on the front substrate can reduce the thickness of the solar cell module. In addition, there is an effect that the light transmittance is improved by thinning the front substrate.

In addition, when using a glass substrate as a conventional front substrate, low iron glass was used to improve light transmittance. However, when the glass substrate is used as the rear substrate 90, it is not necessary to consider the light transmittance through the glass substrate, thereby avoiding the need to use a low iron glass substrate.

On the other hand, since the wiring 20 is in direct contact with the rear substrate 90 in the present embodiment, the laminated structure may not be inverted before the lamination process of the laminated structure.

In the past, the primary structure was formed and then turned upside down and laminated between the front substrate and the rear substrate. In the lamination process, since the fin member is placed on the bottom surface, a member having a rigid property must be positioned downward in order to prevent deformation of the solar cell module due to the fin member. Therefore, lamination is performed with the rigid front substrate lower than the rear substrate, and thus the primary structure formed by stacking the solar cells 60 with the electrodes 50 facing downward is turned upside down and laminated on the front substrate. As such, the process of inverting the primary structure was required.

However, in the method of manufacturing the solar cell module according to the embodiment of the present invention, since the adhesive film 40 and the solar cell 60 are laminated on the lower surface of the rear substrate 90 made of glass, The process of reversing the structure may be omitted. Therefore, the manufacturing process is simplified.

In addition, conventionally, a solar cell is disposed between the front substrate and the rear substrate, the first filler is laminated between the front substrate and the solar cell in order to integrate the solar display cell, the front substrate and the back substrate, and the solar cell and The second filler was laminated between the rear substrates. Subsequently, in the lamination process, the first filler and the second filler were melted to integrate the solar cell, the front substrate, and the rear substrate.

However, in the embodiment of the present invention, the wiring 20 is directly stacked on the glass substrate 90 as the glass wiring substrate is used as the insulating substrate and the rear substrate, so that the filler may not be separately stacked on the rear substrate. Therefore, it is possible to reduce the amount of filler used, thereby reducing the manufacturing cost.

Thereafter, the laminated structure is laminated to melt the adhesive film 40 and the filler 80 (FIG. 5).

In the lamination process, the adhesive film 40 is melted and filled in the space between the wiring 20, the electrode 50, or the cell. As such, the adhesive film 40 connects the electrode 50 and the wiring 20 and serves as a filler between the cell 60 and the wiring 20.

At the same time, as described above, the adhesive film 40 is made of an insulating film or an anisotropic conductive film, so that electricity does not pass between neighboring electrodes 50, and the electrode 50 and the wiring 20 that are relatively close to each other. Are in contact with each other, or let the electricity through the conductive particles of the anisotropic conductive film.

In this case, the filler 80 is also melted and filled in the space between the glass rear substrate 90 and the front substrate 70 to integrate the laminated structure.

As such, the adhesive film 40 and the filler 80 may be melted through the same lamination process without integrating a separate lamination process to integrate the laminated structure, thereby simplifying the manufacturing process.

In addition, instead of laminating in the middle of the solar cell module manufacturing process to melt the adhesive film, after forming a laminated structure as a whole, the adhesive film and the filler can be melted together in one lamination process to simplify the manufacturing process have.

6 to 10 show a flowchart of a method for manufacturing a back electrode solar cell module according to another embodiment of the present invention.

Hereinafter, a method of manufacturing the solar cell module according to the present embodiment will be described in detail.

As shown in FIG. 6, the wiring 20 is formed on the rear substrate 90 made of glass to form a glass wiring substrate. The process of forming the wiring 20 is substantially the same as the embodiment shown in Figs.

Subsequently, as shown in FIG. 7, the adhesive film 40 is formed on the solar cell 60 in which the electrode 50 is formed. In this case, the solar cell 60 is disposed so that the electrode 50 faces upward, and the adhesive film 40 made of a liquid is coated on the surface of the electrode 50 and the solar cell 60.

A liquid adhesive film 40 is put in a storage container and sprayed on the solar cell 60 to coat the adhesive film 40 on the solar cell 60, or a roller having an adhesive film applied thereto (not shown). The adhesive film 40 may be coated on the solar cell 60 by passing through the solar cell 60. When using a liquid adhesive film, in particular, in the case of using a printing method such as screen printing can be used only in the required portion, there is an advantage that the user can adjust the amount.

At this time, the adhesive film 40 made of an anisotropic conductive film is coated only on the portion where the electrode 50 is formed, and the surface where the electrode 50 is not formed, that is, the surface of the solar cell 60 has conductive particles. An adhesive film 40 made of an insulating resin not included may be coated. In this case, the amount of the anisotropic conductive film containing the conductive particles may be reduced, thereby reducing the manufacturing cost.

Alternatively, the adhesive film 40 made of an anisotropic conductive film may be coated on the surface of the electrode 50 and the solar cell 60. In this case, since the adhesive film 40 is made of a single material, the coating process may be simplified.

Subsequently, as illustrated in FIG. 8, the solar cell 60 is laminated on the glass wiring substrate.

At this time, since the wiring 20 formed on the glass wiring board and the electrode 50 formed on the solar cell 60 should be electrically connected through the adhesive film 40, the glass cell is turned upside down by the solar cell 60. Laminate on the substrate. That is, the glass wiring board is disposed so that the wiring 20 faces upward, and the solar cell 60 is stacked so that the electrode 50 faces the wiring 20 thereon.

Subsequently, as shown in FIG. 9, the filler 80 and the front substrate 70 are sequentially stacked on the solar cell 60 to form a stacked structure.

Then, the laminated structure is laminated to form a solar cell module (see FIG. 10).

The configuration and lamination process of the filler 80 and the front substrate 70 according to the present embodiment are substantially the same as those shown in FIGS. 1 to 5.

In addition, many configurations shown in FIGS. 1 to 5 may be applied to the present embodiment.

11 to 17 are flowcharts illustrating a method of manufacturing a back electrode solar cell module according to another embodiment of the present invention.

Hereinafter, a method of manufacturing the solar cell module according to the present embodiment will be described in detail.

As shown in FIG. 11, the wiring 20 is formed on the rear substrate 90 made of glass to form a glass wiring substrate. The process of forming the wiring 20 is substantially the same as the embodiment shown in Figs.

Thereafter, the adhesive film 40 is laminated on the glass wiring substrate as shown in FIG. 12. However, the adhesive film 40 may be coated on the solar cell 60 in which the electrode 50 is formed (see FIG. 7).

Subsequently, as shown in FIG. 13, the solar cell 60 is stacked on the glass wiring board to form a primary stacked structure, and as shown in FIG. 14, a pressure is applied to the primary stacked structure as shown in FIG. 14. The wiring 20 is electrically connected. At this time, heat may be applied simultaneously. This melts the adhesive film 40 as shown in FIG. 15 and fills the space between the glass wiring board and the cell 60.

In FIG. 14, the pressure applied to the primary laminated structure is 0.1 MPa to 5 MPa. If the pressure applied to the primary laminated structure is less than 0.1 MPa, it is difficult to secure a sufficiently low connection resistance when the electrode 50 and the wiring 20 are electrically connected. If the pressure is greater than 5 MPa, the cell 60 is compressed during the compression process. Can be broken.

It is currently difficult to apply a pressure exceeding 0.1 MPa using equipment that pressurizes / heats the module in vacuum. However, as shown in FIG. 14, since the process of pressurizing / heating the primary laminated structure does not need to proceed in a vacuum state, pressure of 0.1 MPa or more can be applied without using expensive equipment. For example, a pressure of 0.1 MPa to 5 MPa can be applied to the module of FIG. 14 using a coating machine used in a home or office.

Therefore, according to the present embodiment, it is possible to ensure the electrical connection between the electrode 50 and the wiring 20 stably while ensuring a sufficiently low connection resistance.

Thereafter, as shown in FIG. 16, the filler 80 and the front substrate 70 are sequentially stacked on the solar cell 60 to form a secondary stacked structure. Thereafter, the secondary laminated structure is laminated to form a solar cell module (see FIG. 17).

The configuration of the embodiment shown in Figs. 1 to 10 can be applied to this embodiment as it is.

18 is a view showing a back electrode solar cell module according to an embodiment of the present invention.

In the back electrode solar cell module according to the exemplary embodiment of the present invention, the rear substrate 90, the wiring 20, the electrode 50, the solar cell 60 and the front substrate 70 made of glass substrates are sequentially formed. It is stacked. The filler 80 is filled in the space between the front substrate 70 and the rear substrate 90 to surround the wiring 20, the electrode 50, and the solar cell 60. In addition, the adhesive film 40 is filled in the space between the wiring 20, the electrode 50, and the solar cell 60.

According to this embodiment, since the glass substrate can function as both the rear substrate 90 and the insulating substrate, there is no need for a separate insulating substrate, thereby reducing the manufacturing cost.

ETFE may be used as the front substrate 70. In this case, ETFE is superior in light transmittance when compared to the same thickness as the glass substrate compared to the glass substrate generally used as the front substrate 70. Therefore, when the ETFE is used as the front substrate, the light transmittance may be increased, and the thickness of the solar cell module may be thinner than when the glass substrate is used.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, Of the right.

Claims (13)

Forming a glass wiring board by forming a wiring on the glass substrate,
Forming a laminated structure by laminating an adhesive film, a solar cell on which an electrode is formed, a filler and a front substrate on the glass wiring substrate, and
Laminating the laminated structure to melt the adhesive film and the filler to electrically connect the electrode and the wire.
Method of manufacturing a back electrode solar cell module comprising a. Forming a glass wiring board by forming a wiring on the glass substrate,
Coating an adhesive film on one surface of the solar cell electrode,
Stacking the solar cell, the filler and the front substrate on the glass wiring substrate to form a laminated structure, and
Laminating the stacked structure to electrically connect the electrode and the wire.
Method of manufacturing a back electrode solar cell module comprising a. Forming a glass wiring board by forming a wiring on the silicon substrate;
Coating or temporarily bonding an adhesive film to one surface of the wiring or the electrode of the solar cell,
Stacking the solar cells on the glass wiring substrate to form a first stacked structure;
Applying pressure to the primary stacked structure to electrically connect the wires and the electrodes;
Stacking a filler and a front substrate on the first stacked structure in which the wires and the electrodes are electrically connected to form a second stacked structure, and
Laminating the secondary laminate
Method of manufacturing a back electrode solar cell module comprising a. 3. The method according to claim 1 or 2,
In the lamination step, the adhesive film is melted and filled in the space between the glass wiring substrate and the cell manufacturing method of the back electrode solar cell module. 4. The method according to any one of claims 1 to 3,
The lamination step is a manufacturing method of a back electrode solar cell module which is performed in a state where the glass wiring substrate is placed on the bottom. 4. The method according to any one of claims 1 to 3,
The lamination step, the manufacturing method of the back electrode solar cell module is melted and the filler is filled in the space between the glass wiring substrate and the front substrate. 4. The method of claim 3,
When the pressure is applied to the primary laminated structure, the adhesive film is melted and filled in the space between the glass wiring board and the cell manufacturing method of the back electrode solar cell module. 4. The method of claim 3,
The pressure applied to the primary laminated structure to electrically connect the wiring and the electrode is a manufacturing method of a back electrode solar cell module of 0.1MPa to 5MPa. A back electrode solar cell module made by the method of any one of claims 1 to 3. The method of claim 9,
The adhesive film is an anisotropic conductive film back electrode type solar cell module. 11. The method of claim 10,
The anisotropic conductive film, an epoxy resin, acrylic resin, vinyl acetate ethylene, silicon and any one selected from a combination thereof back electrode type solar cell module. The method of claim 9,
The glass substrate is a rear electrode solar cell module comprising a tempered glass. The method of claim 9,
The front substrate is an ethylene tetra fluoro ethylene back electrode type solar cell module.

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