CN113410313A - Conductive circuit film, preparation method thereof and photovoltaic cell - Google Patents
Conductive circuit film, preparation method thereof and photovoltaic cell Download PDFInfo
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Classifications
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application relates to the technical field of photovoltaics, and provides a preparation method of a conducting circuit film, which comprises the following steps: providing a film, and forming a conducting circuit groove on the surface of the film; and providing a conductive glue stock, and filling the conductive glue stock in the conductive circuit groove to form a circuit pattern to obtain the conductive circuit film. According to the method, on one hand, the aspect ratio of the obtained circuit is controlled by controlling the specification of the groove of the conductive circuit, so that the conductive circuit with a finer line width is obtained, and the power generation capacity of the heterojunction component is improved; on the other hand, the method is a one-step forming method, and the battery surface electrode grid line, the battery interconnection grid line and even the bus grid line can be formed only by one process of vacuum hot pressing. The method greatly simplifies the flow, reduces the thermal process, improves the preparation efficiency, simplifies the preparation flow and improves the application universality.
Description
Technical Field
The application belongs to the technical field of photovoltaics, and particularly relates to a conductive circuit film, a preparation method of the conductive circuit film and a photovoltaic module.
Background
The heterojunction battery HIT can remarkably improve the conversion efficiency of the battery through a unique heterojunction structure, and the mass production efficiency is broken through by 23 percent at present. The advantages are mainly as follows: (1) the efficiency improvement potential is high, and the highest efficiency can reach more than 25% and 28% respectively by overlapping IBC or perovskite technology; (2) the cost reduction space is large, and the silicon wafer flaking is easier to realize by the low-temperature process and the N-type battery; (3) the double-sided battery pack has higher double-sided rate (85% at present, 98% in the future and 82% at PERC) due to double-sided symmetry, and can obtain more than 10% of annual energy production gain; (4) compared with PERC battery, the light-induced attenuation is lower than 3% for HIT in 10 years, and the reduction of 25-year power generation is only 8%.
The main grid and the auxiliary grid of the heterojunction cell HIT are mainly used for collecting current energy of the surface TCO layer, and low resistance and small light shielding area are required, so that the size of the heterojunction cell HIT is required to have the largest possible height-width ratio. The height-width ratio is difficult to break through 0.3 at present due to the limitation of the traditional screen printing mode and the low-temperature silver paste.
In a conventional solar cell module, a cell needs to be welded or bonded with a conductive material again on a main grid to form a cell string with satisfactory I-V characteristics, such as a tiling technique (two front and rear cells are stacked together with a conductive adhesive), a stitch welding technique (two front and rear cells are overlapped to a certain size and then welded together with a solder ribbon), and a splicing technique (two front and rear cells are welded together with a fillet). Any manufacturing technique has one more process, and one more material means the reduction of cost, yield and efficiency.
In the production process of the photovoltaic module at the present stage, thermoplastic resin such as EVA or POE is needed to bond the battery string on the module panel, and the process of assembling the module is carried out in a vacuum hot pressing mode at the temperature of 150-. The heterojunction battery and battery string structure comprises various conductive circuit structures such as a main grid, an auxiliary grid, an interconnection bar and a bus bar on the surface of the battery, which are all completed one by different process procedures such as printing, baking, welding and the like. The above processes require baking in the atmospheric environment during the preparation of photovoltaic cells and modules, the performance of the heterojunction photovoltaic cell is high after being heated for many times, and base metals such as copper and the like which are easily oxidized at high temperature cannot be directly used, so that the preparation method of the heterojunction photovoltaic cell is too complex, and the whole price and performance of the heterojunction photovoltaic cell are difficult to be commercialized in a large range.
Disclosure of Invention
The application aims to provide a conductive circuit thin film, a preparation method thereof and a photovoltaic module, and aims to solve the problem that in the prior art, the preparation method of a heterojunction battery is too complex, and the wide use is influenced.
In order to achieve the purpose of the application, the technical scheme adopted by the application is as follows:
in a first aspect, the present application provides a method for manufacturing a conductive circuit thin film, including the following steps:
providing a film, and forming a conducting circuit groove on the surface of the film;
and providing a conductive glue stock, and filling the conductive glue stock in the conductive circuit groove to form a circuit pattern to obtain the conductive circuit film.
In a second aspect, the present application provides a conductive circuit thin film, which is prepared by the conductive circuit thin film preparation method.
In a third aspect, the present application provides a photovoltaic cell, where the photovoltaic cell includes a substrate, a first conductive line thin film stacked on the surface of the substrate, a heterojunction solar cell with a TCO conductive layer stacked and combined on a surface of the first conductive line thin film facing away from the substrate, and a second conductive line thin film stacked and combined on a surface of the heterojunction solar cell facing away from the first conductive line thin film; the first conductive circuit film and the second conductive circuit film are both prepared by the conductive circuit film preparation method according to any one of claims 1 to 8.
According to the preparation method of the conductive circuit film, the conductive circuit groove is formed in the surface of the film, and the slurry is filled in the conductive circuit groove to form a circuit pattern; on the other hand, the method is a one-step forming method, and the battery surface electrode grid line, the battery interconnection grid line and even the bus grid line can be formed only by one-step vacuum hot pressing process. The method greatly simplifies the flow, reduces the thermal process, improves the preparation efficiency, simplifies the preparation flow and improves the application universality.
According to the conductive circuit film provided by the second aspect of the application, the conductive circuit film is obtained by the preparation method of the conductive circuit film, the conductive circuit film obtained by the method can obtain a more tiny and more delicate line width conductive circuit according to requirements, the power generation capacity of the heterojunction component in the use process is further improved, the preparation process is simplified, and the obtained product is beneficial to wide application.
According to the photovoltaic cell provided by the third aspect of the application, the conductive circuit film with the circuit pattern is directly attached to the surface of the heterojunction solar cell piece with the TCO conductive layer on the surface, and the photovoltaic cell with high line precision, good conductivity, excellent contact resistance and no damage to a cell object can be obtained without any printing and heat treatment on the electrode piece.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic diagram of a photovoltaic cell provided in an embodiment of the present application.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application more clearly apparent, the present application is further described in detail below with reference to the embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
In this application, the term "and/or" describes an association relationship of associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a is present alone, A and B are present simultaneously, and B is present alone. Wherein A and B can be singular or plural. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.
In the present application, "at least one" means one or more, "a plurality" means two or more. "at least one of the following" or similar expressions refer to any combination of these items, including any combination of the singular or plural items. For example, "at least one (a), b, or c", or "at least one (a), b, and c", may each represent: a, b, c, a-b (i.e., a and b), a-c, b-c, or a-b-c, wherein a, b, and c may be single or plural, respectively.
It should be understood that, in various embodiments of the present application, the sequence numbers of the above-mentioned processes do not mean the execution sequence, some or all of the steps may be executed in parallel or executed sequentially, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.
The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
The weight of the related components mentioned in the description of the embodiments of the present application may not only refer to the specific content of each component, but also represent the proportional relationship of the weight among the components, and therefore, the content of the related components is scaled up or down within the scope disclosed in the description of the embodiments of the present application as long as it is scaled up or down according to the description of the embodiments of the present application. Specifically, the mass described in the specification of the embodiments of the present application may be a mass unit known in the chemical industry field such as μ g, mg, g, kg, etc.
The terms "first" and "second" are used for descriptive purposes only and are used for distinguishing purposes such as substances from one another, and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. For example, a first XX may also be referred to as a second XX, and similarly, a second XX may also be referred to as a first XX, without departing from the scope of embodiments of the present application. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.
A first aspect of an embodiment of the present application provides a method for manufacturing a conductive line thin film, including the following steps:
s01, providing a thin film, and forming a conducting circuit groove on the surface of the thin film;
and S02, providing a conductive adhesive material, and filling the conductive adhesive material into the conductive circuit groove to form a circuit pattern to obtain the conductive circuit film.
According to the preparation method of the conductive circuit film, the conductive circuit groove is formed in the surface of the film, and the slurry is filled in the conductive circuit groove to form a circuit pattern, so that on one hand, the specification of the conductive circuit groove is controlled to further control the height-width ratio of the obtained circuit, the conductive circuit with a smaller and more detailed line width is obtained, and the power generation capacity of the heterojunction component is improved; on the other hand, the method is a one-step forming method, and the battery surface electrode grid line, the battery interconnection grid line and even the bus grid line can be formed only by one-step vacuum hot pressing process. The method greatly simplifies the flow, reduces the thermal process, improves the preparation efficiency, simplifies the preparation flow and improves the application universality.
In step S01, a film is provided. In some embodiments, a thermoplastic film is provided that facilitates subsequent photovoltaic cell production due to its good flexibility, impact resistance, low temperature resistance, environmental stress crack resistance, good optical properties, and non-toxic characteristics.
In some embodiments, the film is at least one selected from EVA, POE, PVB, and silicone resin, and any one selected as the film can provide a better film substrate, which is beneficial for the preparation of circuit patterns and the assembly of batteries. The thickness and size of the film are determined according to the circuit condition without limitation.
Specifically, form the conducting wire recess on the surface of film, directly carry out the fluting at the film surface and form the conducting wire recess, be favorable to the preparation and the formation of conducting wire, and simultaneously, because the height and the width of the unable better control circuit of traditional circuit printing method, and then the size of uncontrollable resistance, it is relatively poor to cause electrically conductive effect, and in this application embodiment, directly form the conducting wire recess on the surface of film, the conducting wire recess of formation can be according to the height and the width of demand control circuit, and then the resistance that control obtained is less, guarantee that electrically conductive property is excellent.
In some embodiments, the conductive trace groove has a height of 30 to 60 microns and a width of 20 to 50 microns. Furthermore, the ratio of the height to the width of the conductive circuit obtained by control is 0.5-2.0, and the height-width ratio of the circuit obtained by control is further controlled by setting the size of the groove, so that the resistance of the formed circuit is ensured to be small, and the conductivity of the product is improved.
In some embodiments, the step of forming the conductive circuit groove on the surface of the thin film includes forming the conductive circuit groove on the surface of the thin film by using a laser processing method or a rapid hot pressing method using a mold. And (3) according to the size of the arranged groove, performing grooving treatment on the surface of the film by adopting a conventional laser treatment or hot pressing method to obtain the groove of the conductive circuit.
Further, in the step of forming the conductive circuit groove on the surface of the film by adopting a laser processing method, the laser processing conditions are as follows: adopting one laser of infrared, ultraviolet and green light with power of 5-40W, and controlling the spot diameter to be less than 20 μm for processing. Further, in the step of forming the conducting circuit groove on the surface of the film by adopting a rapid hot pressing method of a die, the conditions of the rapid hot pressing are as follows: the hot pressing temperature is 160-220 ℃, the softening point of the film material is guaranteed to be higher than 10 ℃, and the hot pressing time is 1-60 seconds.
In some embodiments, further comprising: set up the protection film that can peel off in the front (being laser processing face) of conducting wire recess, set up the circuit that the protection film can protect and obtain, make the conductive adhesive material of follow-up joining can not spill over simultaneously to make conductive paste be a little higher than the thermoplastic film, and at the in-process of plugging thick liquids, the remaining thick liquids of other parts except the recess on membrane material surface can be taken away through tearing the process, are favorable to follow-up using.
In step S02, a conductive glue is provided, and the conductive glue is filled in the conductive circuit groove to form a circuit pattern, so as to obtain a conductive circuit film.
In some embodiments, the conductive paste comprises the following components in parts by weight:
the conductive rubber material takes conductive metal particles as raw materials, is compounded and combined with resin, and is added with curing agent and auxiliary agent, so that the rubber material with conductive performance can be obtained, and can be used for filling the groove of the conductive circuit.
In some embodiments, the conductive rubber material comprises 70-95 parts of conductive metal particles, and the weight parts of the conductive metal particles are controlled to be more, so that the conductive effect of the obtained conductive circuit is better. In specific embodiments of the present application, the fraction of the conductive metal particles is selected from 70 parts, 75 parts, 85 parts, 95 parts.
In some embodiments, the conductive metal particles are selected from at least one of silver, copper, tin, bismuth, lead, nickel, aluminum, zinc, gold, and alloys thereof; the metal particles are selected to have good conductivity, ensuring excellent conductivity of the formed lines.
In some embodiments, the particle size of the conductive metal particles is 10 nanometers to 20 micrometers, and the particle size of the conductive metal particles is controlled to ensure that the conductive metal particles can exert a good conductive effect. If the particle size of the conductive metal particles is too large, the conductive metal particles cannot be completely filled into the groove of the conductive circuit, and the conductive effect is further influenced; if the particle diameter of the conductive metal particles is too small, the particles may aggregate into clusters, which also affects the conductive effect.
In the embodiment of the present application, the particle size of the conductive metal particles is controlled to be 200 nm, so that the conductive metal particles can be completely filled into the conductive circuit grooves, and the conductive metal particles have good conductive effect and sintering capability.
In some embodiments, the conductive adhesive comprises 4-25 parts of resin, and the resin is added and can be crosslinked with a curing agent to form an adhesive, so that the conductive circuit can be firmly cured on the surface of the film. In the specific examples of the present application, the addition parts of the resin are selected from 4 parts, 12 parts, 15 parts and 25 parts.
In some embodiments, the resin is selected from at least one of epoxy resins, silicone resins, acrylate resins, polyester resins, polyurethane resins. . The provided resin is a matrix resin of the conductive sizing material, has excellent physical properties and strong adhesive property, can react with a curing agent to form a highly crosslinked network structure, and improves the thermal stability and rigidity of the material.
In some embodiments, the conductive rubber material comprises 0.5-5 parts of a curing agent, and the curing agent is provided to perform a crosslinking reaction with the resin in a heating process so as to form a highly crosslinked network structure, so that the thermal stability and rigidity of the material are improved. In the specific embodiment of the application, the addition part of the curing agent is selected from 0.5 part, 0.9 part, 1 part and 5 parts.
In some embodiments, the curing agent is selected from at least one of amino resins, imidazoles, organic anhydrides, lewis acids, cationic initiators, peroxide initiators, azo initiators. The curing agent can be well stored with resin, and ensures that the cured resin has good physical and mechanical properties at a proper baking temperature.
In some embodiments, the conductive rubber compound comprises 0.1-5 parts of an auxiliary agent, wherein the auxiliary agent is selected from at least one of a wetting agent, a dispersing agent, a defoaming agent, a thixotropic agent, a thickening agent, an organic acid, a surface tension control agent and a polymerization inhibitor,
the wetting agent and the dispersing agent are added to facilitate the uniform dispersion of all components among materials, and the defoaming agent is added to facilitate the discharge of bubbles in the slurry and improve the stability of the conductive rubber material. In the specific examples of the application, the addition parts of the auxiliary agent are selected from 0.1 part, 2 parts, 2.5 parts and 5 parts.
And further, filling the conductive rubber material in the conductive circuit groove to form a circuit pattern, so as to obtain the conductive circuit film.
In some embodiments, the conductive paste is filled in the conductive line groove by a method including, but not limited to, printing, spraying, extruding, and the like.
In some embodiments, in the step of filling the conductive rubber material in the conductive circuit groove to form the circuit pattern, a heating treatment method is adopted, the heating treatment temperature is 90-120 ℃, and the heating treatment time is 5-20 minutes. The heating temperature is controlled to be 90-120 ℃, and the heating treatment is carried out at the temperature, so that the obtained conductive rubber material can be ensured to be in a semi-cured state, namely, the conductive rubber material has certain flexibility and moderate strength; the obtained material can be ensured to be the conductive circuit with the same shape as the groove of the conductive circuit, and the condition of deformation or bonding can not occur. The heating time is controlled to be 5-20 minutes, so that the conductive rubber material in a semi-cured state can be formed under the treatment of short heating time, certain flexibility is realized, a circuit pattern can be formed, and the conductive circuit film is obtained.
Further, the method for preparing the conductive circuit film further comprises the following steps: the soft silver protective coating or the soft gold protective coating is prepared on the outer surface of the circuit pattern by adopting an electroplating or chemical plating method, and the protective coating is provided to protect the circuit pattern, reduce the contact resistance and prevent oxidation.
In some embodiments, if the side of the groove of the film is covered with the peelable protective film, the protective film needs to be uncovered, so that the conductive adhesive in the groove is slightly higher than the plane of the film, and then a soft silver protective coating or a soft gold protective coating is prepared on the outer surface of the circuit pattern by adopting an electroplating or chemical plating method, so that the obtained product is beneficial to better contact between the electrode and the battery, and the contact resistance is reduced.
The second aspect of the embodiment of the present application provides a conductive circuit thin film, which is prepared by a conductive circuit thin film preparation method.
According to the conductive circuit film provided by the second aspect of the application, the conductive circuit film is obtained by the preparation method of the conductive circuit film, the conductive circuit film obtained by the method can obtain a more tiny and more delicate line width conductive circuit according to requirements, the power generation capacity of the heterojunction component in the use process is further improved, the preparation process is simplified, and the obtained product is beneficial to wide application.
A third aspect of the embodiment of the present application provides a photovoltaic cell, where the photovoltaic cell includes a substrate 1, a first conductive circuit thin film 2 stacked on a surface of the substrate 1, a heterojunction solar cell sheet 3 stacked and combined on a surface of the first conductive circuit thin film 2 away from the substrate 1 and having a TCO conductive layer, and a second conductive circuit thin film 4 stacked and combined on a surface of the heterojunction solar cell sheet 3 away from the first conductive circuit thin film 2; the first conductive circuit film 2 and the second conductive circuit film 4 are both prepared by adopting a conductive circuit film preparation method.
According to the photovoltaic cell provided by the third aspect of the application, the conductive circuit film with the circuit pattern is directly attached to the surface of the heterojunction solar cell piece with the TCO conductive layer on the surface, and the photovoltaic cell with high line precision, good conductivity, excellent contact resistance and no damage to a cell object can be obtained without any printing and heat treatment on the electrode piece.
In some embodiments, in the photovoltaic cell, the conductive circuit patterns formed in the first conductive circuit film and the second conductive circuit film are both arranged in contact with the heterojunction solar cell piece with the TCO conductive layer on the surface. In some implementations, in the preparation method of the photovoltaic cell, the heterojunction solar cell with the TCO conductive layer on the surface is placed on the surfaces of the first conductive circuit film 2 and the second conductive circuit film 4 according to the circuit position, wherein the protruding conductive circuits of the first conductive circuit film 2 and the second conductive circuit film 4 are in contact with the solar cell, and the cell with the circuit on the surface is obtained by performing pressing treatment by using a vacuum hot pressing treatment method.
In some implementations, the step of performing the pressing process by using a vacuum hot pressing process is performed at a temperature of 140-220 ℃.
The following description will be given with reference to specific examples.
Example 1
Conductive circuit film, preparation method thereof and photovoltaic cell
Conductive circuit film and preparation method thereof
The preparation method of the conducting circuit film comprises the following steps:
providing a PVB film, and forming a conductive circuit groove on the surface of the PVB film by adopting a laser treatment method, wherein the height of the conductive circuit groove is 60 micrometers, and the width of the conductive circuit groove is 50 micrometers;
providing a conductive sizing material, filling the conductive sizing material into a groove of a conductive circuit, carrying out heating treatment for 10 minutes at 90 ℃ to form a circuit pattern, and preparing a soft silver protective coating on the outer surface of the circuit pattern by adopting an electroplating method to obtain a conductive circuit film;
the conductive rubber material comprises the following components in parts by weight:
the conductive metal particles are selected from a mixture of aluminum and zinc, and the particle size is 10 microns; the resin is selected from acrylate resin; the curing agent is peroxide curing agent; the auxiliary agent is selected from polymerization inhibitor and thixotropic agent.
Photovoltaic cell
The photovoltaic cell comprises a substrate 1, a first conducting circuit thin film 2, a heterojunction solar cell piece 3 and a second conducting circuit thin film 4, wherein the first conducting circuit thin film 2 is stacked on the surface of the substrate 1, the heterojunction solar cell piece 3 is combined on the first conducting circuit thin film 2 in a stacked mode and deviates from the surface of the substrate 1 and is provided with a TCO conducting layer, and the second conducting circuit thin film 4 is combined on the heterojunction solar cell piece 3 in a stacked mode and deviates from the first conducting circuit thin film 2; the first conductive circuit film 2 and the second conductive circuit film 4 are both conductive circuit films provided in embodiment 1.
Example 2
Conductive circuit film, preparation method thereof and photovoltaic cell
Conductive circuit film and preparation method thereof
The preparation method of the conducting circuit film comprises the following steps:
providing an organic silicon resin film, and forming a conductive circuit groove on the surface of the film by adopting a laser processing method, wherein the height of the conductive circuit groove is 50 microns, and the width of the conductive circuit groove is 40 microns;
providing a conductive sizing material, filling the conductive sizing material into a groove of a conductive circuit, carrying out heating treatment at 100 ℃ for 12 minutes to form a circuit pattern, and preparing a soft silver protective coating on the outer surface of the circuit pattern by adopting an electroplating method to obtain a conductive circuit film;
the conductive rubber material comprises the following components in parts by weight:
the conductive metal particles are selected from alloys of tin and bismuth, and the particle size is 5 microns; the resin is selected from epoxy resin; the curing agent is selected from imidazole curing agents; the auxiliary agent is selected from organic acids and thixotropic agents.
Photovoltaic cell
The photovoltaic cell comprises a substrate 1, a first conducting circuit thin film 2, a heterojunction solar cell piece 3 and a second conducting circuit thin film 4, wherein the first conducting circuit thin film 2 is stacked on the surface of the substrate 1, the heterojunction solar cell piece 3 is combined on the first conducting circuit thin film 2 in a stacked mode and deviates from the surface of the substrate 1 and is provided with a TCO conducting layer, and the second conducting circuit thin film 4 is combined on the heterojunction solar cell piece 3 in a stacked mode and deviates from the first conducting circuit thin film 2; the first conductive circuit film 2 and the second conductive circuit film 4 are both conductive circuit films provided in embodiment 2.
Example 3
Conductive circuit film, preparation method thereof and photovoltaic cell
Conductive circuit film and preparation method thereof
The preparation method of the conducting circuit film comprises the following steps:
providing an EVA film, and forming a conductive circuit groove on the surface of the film by adopting a laser processing method, wherein the height of the conductive circuit groove is 40 micrometers, and the width of the conductive circuit groove is 30 micrometers;
providing a conductive adhesive material, filling the conductive adhesive material into the groove of the conductive circuit, carrying out heating treatment for 15 minutes at 110 ℃ to form a circuit pattern, and preparing a soft gold protective coating on the outer surface of the circuit pattern by adopting a chemical plating method to obtain a conductive circuit film;
the conductive rubber material comprises the following components in parts by weight:
the conductive metal particles are selected from copper particles, and the particle size is 50 nanometers; the resin is selected from epoxy resin; the curing agent is selected from cationic curing agents; the auxiliary agent is selected from surface tension control agents and dispersing agents.
Photovoltaic cell
The photovoltaic cell comprises a substrate 1, a first conducting circuit thin film 2, a heterojunction solar cell piece 3 and a second conducting circuit thin film 4, wherein the first conducting circuit thin film 2 is stacked on the surface of the substrate 1, the heterojunction solar cell piece 3 is combined on the first conducting circuit thin film 2 in a stacked mode and deviates from the surface of the substrate 1 and is provided with a TCO conducting layer, and the second conducting circuit thin film 4 is combined on the heterojunction solar cell piece 3 in a stacked mode and deviates from the first conducting circuit thin film 2; the first conductive circuit film 2 and the second conductive circuit film 4 are both the conductive circuit films provided in embodiment 3.
Example 4
Conductive circuit film, preparation method thereof and photovoltaic cell
Conductive circuit film and preparation method thereof
The preparation method of the conducting circuit film comprises the following steps:
providing a POE film, and forming a conductive circuit groove on the surface of the POE film by adopting a laser processing method, wherein the height of the conductive circuit groove is 30 microns, and the width of the conductive circuit groove is 20 microns;
providing a conductive adhesive material, filling the conductive adhesive material into the conductive circuit groove, and carrying out heating treatment at 120 ℃ for 20 minutes to form a circuit pattern to obtain a conductive circuit film;
the conductive rubber material comprises the following components in parts by weight:
the conductive metal particles are selected from silver particles with the particle size of 200 nanometers; the resin is selected from acrylate resin; the curing agent is selected from azo initiators; the auxiliary agent is selected from dispersing agents.
Photovoltaic cell
The photovoltaic cell comprises a substrate 1, a first conducting circuit thin film 2, a heterojunction solar cell piece 3 and a second conducting circuit thin film 4, wherein the first conducting circuit thin film 2 is stacked on the surface of the substrate 1, the heterojunction solar cell piece 3 is combined on the first conducting circuit thin film 2 in a stacked mode and deviates from the surface of the substrate 1 and is provided with a TCO conducting layer, and the second conducting circuit thin film 4 is combined on the heterojunction solar cell piece 3 in a stacked mode and deviates from the first conducting circuit thin film 2; the first conductive circuit film 2 and the second conductive circuit film 4 are both conductive circuit films provided in embodiment 4.
Comparative example 1
A heterojunction photovoltaic cell assembly assembled by adopting a circuit route obtained by printing, baking and welding is provided.
Performance testing and results analysis
The conversion efficiencies of the photovoltaic cells obtained in examples 1 to 4 and the photovoltaic cell module provided in comparative example 1 were measured, and the measurement results are shown in table 1, where the conversion efficiency of the photovoltaic cell provided in example 1 is 22.9%, the conversion efficiency of the photovoltaic cell provided in example 2 is 22.9%, the conversion efficiency of the photovoltaic cell provided in example 3 is 23.6%, the conversion efficiency of the photovoltaic cell provided in example 4 is 24.3%, and the conversion efficiency of the photovoltaic cell provided in comparative example 1 is 22.8%, which is lower than the conversion efficiencies of the photovoltaic cells obtained in examples 1 to 4, and therefore, it can be seen that, according to the method for manufacturing the conductive line film provided by the present application, the conductive line groove is provided on the surface of the film, and the circuit pattern is formed after the conductive line groove is filled with the paste, and on one hand, the method controls the aspect ratio of the obtained line by controlling the specification of the conductive line groove, the conducting circuit with smaller and finer line width is obtained, and the power generation capacity of the heterojunction component is further improved; on the other hand, the method is a one-step forming method, and the battery surface electrode grid line, the battery interconnection grid line and even the bus grid line can be formed only by one-step vacuum hot pressing process. The method greatly simplifies the flow, reduces the thermal process, improves the preparation efficiency, simplifies the preparation flow and improves the application universality.
TABLE 1
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. A preparation method of a conducting circuit film is characterized by comprising the following steps:
providing a film, and forming a conducting circuit groove on the surface of the film;
and providing a conductive glue stock, and filling the conductive glue stock in the conductive circuit groove to form a circuit pattern to obtain the conductive circuit film.
2. The method for manufacturing a conductive circuit film according to claim 1, wherein the conductive circuit groove has a height of 30 to 60 μm and a width of 20 to 50 μm.
3. The method for preparing the conductive circuit film according to claim 1, wherein the step of forming the conductive circuit groove on the surface of the film comprises forming the conductive circuit groove on the surface of the film by a laser processing method or a rapid hot pressing method using a mold.
4. The method for producing an electroconductive wire film according to any one of claims 1 to 3, wherein the film is at least one selected from the group consisting of EVA, POE, PVB, and silicone resin.
5. The method for preparing the conductive circuit film according to any one of claims 1 to 3, wherein the conductive rubber comprises the following components in parts by weight:
6. the method for forming an electrically conductive wiring film according to claim 5, wherein the electrically conductive metal particles are at least one selected from the group consisting of silver, copper, tin, bismuth, lead, nickel, aluminum, zinc, gold, and alloys thereof; and/or the presence of a gas in the gas,
the particle size of the conductive metal particles is 10 nanometers to 20 micrometers; and/or the presence of a gas in the gas,
the resin is at least one of epoxy resin, organic silicon resin, acrylate resin, polyester resin and polyurethane resin; and/or the presence of a gas in the gas,
the curing agent is selected from at least one of amino resin, imidazole, organic acid anhydride, Lewis acid, a cationic initiator, a peroxide initiator and an azo initiator; and/or the presence of a gas in the gas,
the auxiliary agent is at least one selected from wetting agent, dispersing agent, defoaming agent, thixotropic agent, thickening agent, organic acid, surface tension control agent and polymerization inhibitor.
7. The method for preparing the conductive circuit film according to any one of claims 1 to 3, wherein in the step of filling the conductive rubber material in the conductive circuit groove to form the circuit pattern, a heating treatment method is adopted, and the heating treatment temperature is 90 to 120 ℃ for 5 to 20 minutes.
8. The method for manufacturing an electrically conductive wiring film according to any one of claims 1 to 3, further comprising: and preparing a soft silver protective coating or a soft gold protective coating on the outer surface of the circuit pattern by adopting an electroplating or chemical plating method.
9. An electrically conductive circuit film, characterized in that the electrically conductive circuit film is prepared by the electrically conductive circuit film preparation method according to any one of claims 1 to 8.
10. A photovoltaic cell is characterized by comprising a substrate, a first conducting circuit thin film, a heterojunction solar cell piece and a second conducting circuit thin film, wherein the first conducting circuit thin film is stacked on the surface of the substrate, the surface of the heterojunction solar cell piece is combined with the surface, away from the substrate, of the first conducting circuit thin film in a stacked mode, the heterojunction solar cell piece is provided with a TCO conducting layer, and the second conducting circuit thin film is combined with the surface, away from the first conducting circuit thin film, of the heterojunction solar cell piece in a stacked mode; the first conductive circuit film and the second conductive circuit film are both prepared by the conductive circuit film preparation method according to any one of claims 1 to 8.
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Application publication date: 20210917 |