KR20120135043A - Coating device and coating method - Google Patents

Abstract

PURPOSE: A coating apparatus and a coating method are provided to prevent a coated resist film from being irregular and to suppress the floated amount change of a substrate. CONSTITUTION: A coating apparatus includes a coating part(3), a floating part, and a driving part. The coating part includes a nozzle. The floating part includes a guiding side, a gas supplying part, and a suction part. The driving part faces a floated substrate and the tip end part of the nozzle and drives at least either the substrate or the nozzle. The nozzle discharges liquid through the tip end part toward the substrate. The guiding side of the floating part guides the substrate. The gas supplying part floats the substrate with respect to the guiding side.

Description

Coating device and coating method {COATING DEVICE AND COATING METHOD}

The present invention relates to a coating apparatus and a coating method.

Fine patterns, such as a wiring pattern and an electrode pattern, are formed on the glass substrate which comprises display panels, such as a liquid crystal display. Generally, such a pattern is formed by techniques, such as photolithography. In the photolithography method, a step of forming a resist film on a glass substrate, a step of pattern exposing the resist film, and a step of developing the resist film thereafter are performed.

As a device for applying a resist film on the surface of a substrate, a coating device is known in which a resist is applied to a glass substrate from a slit nozzle while relatively moving the slit nozzle and the glass substrate while the glass substrate is floating. As such a floating type coating apparatus, the structure which adjusts the floating amount of a board | substrate by blowing a gas on a stage at the predetermined pressure, for example, and attracting | sucking on the said stage is known. In this case, in order to apply a resist so that thickness may be uniform on a board | substrate, it was necessary to raise a board | substrate with a uniform float amount.

Japanese Unexamined Patent Publication No. 2007-88201

However, as the substrate moves on the stage, the stage is temporarily blocked by the substrate. For this reason, there exists a possibility that the blowing pressure and suction pressure of gas may change temporarily, and the flow volume of the gas sprayed and the flow volume of the gas to be sucked may change temporarily. In this case, the floating amount of the substrate varies, making it difficult to apply the resist uniformly.

In view of the above circumstances, an object of the present invention is to provide a coating apparatus and a coating method that can suppress a variation in the amount of substrate floating.

A coating device according to the first aspect of the present invention has a coating portion having a nozzle for discharging a liquid body from a tip portion with respect to a substrate, a guide surface for guiding the substrate, and a substrate for floating the substrate against the guide surface. And a driving portion for driving at least one of the substrate and the nozzle while opposing the substrate and the tip portion in an injured state with the floating portion formed with a supply portion and a suction portion, wherein the gas supply portion includes a plurality of gases formed on the guide surface. A gas supply source for supplying gas to a plurality of gas supply ports, a first gas supply path whose one end is connected to the gas supply source, and branched from the other end of the first gas supply path to supply a plurality of the gases It has a 2nd gas supply path connected to each of the sphere, The said suction part is a some suction formed in the said guide surface. And a suction source for sucking the plurality of suction ports, a first suction path whose one end is connected to the suction source, and a second branch branched from the other end of the first suction path and connected to each of the plurality of suction ports. An atmospheric opening portion having a suction path and capable of opening the air is formed in a portion of at least one of the first gas supply path and the first suction path.

In this case, since at least one of the first gas supply path and the first suction path has a part of an air opening capable of opening the air, a change in at least one of the flow rate of the gas to be ejected and the flow rate of the gas to be sucked is provided. It can be mitigated. Thereby, the fluctuation | variation of the board | substrate flotation amount can be suppressed.

In the said coating apparatus, the said air | atmosphere opening part has the branching path branched from a part of the said path | path, and the air | atmosphere opening is formed in the front-end | tip of the said branching path.

In this case, since the atmospheric opening has a branching path branched from a part of the path, and an atmospheric opening is formed at the tip of the branching path, a change in at least one of the gas supply amount and the suction amount through the branching path and the atmospheric opening. It can be alleviated. Thereby, the fluctuation | variation of the floating amount can be suppressed.

In the above-mentioned coating apparatus, the said atmospheric opening part has the adjustment valve which can adjust the opening degree of the said atmospheric opening.

In this case, since the air opening part has a control valve which can adjust the opening degree of the air opening, the gas supply amount and the suction amount can be finely adjusted.

In the above-mentioned coating apparatus, the said atmospheric opening part has a flowmeter which measures the flow volume of the gas which distributes the said atmospheric opening.

In this case, since the atmospheric opening part has a flowmeter which measures the flow volume of the gas which flows through the atmospheric opening, the adjustment amount of the board | substrate flotation amount can be grasped | ascertained.

In the above-mentioned coating apparatus, the said air | atmosphere opening part is formed in the said gas supply path, and the said flowmeter measures the flow volume of the gas which flows out from the said air | atmosphere opening to air | atmosphere.

In this case, since the air opening part is formed in the gas supply path and the flowmeter measures the flow rate of the gas which flows out from the air opening to the atmosphere, the adjustment amount of the gas blowing amount can be grasped.

In the above-mentioned coating apparatus, the said atmospheric opening part is based on the adjustment valve which can adjust the opening degree of the said atmospheric opening, the flowmeter which measures the flow volume of the gas which distributes the said atmospheric opening, and the measurement result by the said flowmeter It has a valve control part which controls the adjustment amount of an adjustment valve.

In this case, the valve control part which controls an adjustment amount of an adjustment valve based on the adjustment valve which an atmospheric opening part can adjust the opening degree of an atmospheric opening, the flowmeter which measures the flow volume of the gas which distribute | circulates an atmospheric opening, and the measurement result by a flowmeter. Because of this, the gas ejection amount and the suction amount can be adjusted automatically.

In the above-mentioned coating apparatus, the said floating part has the stage formed in the position corresponding to the said coating part, and the said guide surface is formed in the said stage.

In this case, when the board | substrate floats the guide surface formed in the stage, the fluctuation | variation of the floating amount can be suppressed.

A coating method according to a second aspect of the present invention has a coating portion having a nozzle for discharging a liquid body from a tip portion with respect to a substrate, a guide surface for guiding the substrate, and a substrate for floating the substrate against the guide surface. And a driving portion for driving at least one of the substrate and the nozzle while opposing the substrate and the tip portion in an injured state with the floating portion formed with a supply portion and a suction portion, wherein the gas supply portion includes a plurality of gases formed on the guide surface. A gas supply source for supplying gas to a plurality of gas supply ports, a first gas supply path whose one end is connected to the gas supply source, and branched from the other end of the first gas supply path to supply a plurality of the gases It has a 2nd gas supply path connected to each of the sphere, The said suction part is a some suction formed in the said guide surface. And a suction source for sucking the plurality of suction ports, a first suction path whose one end is connected to the suction source, and a second branch branched from the other end of the first suction path and connected to each of the plurality of suction ports. An application method using an applicator having a suction path, wherein at least one of the first gas supply path and the at least one path of the first suction path is provided with an air opening, wherein a part of the path is opened to the atmosphere. Operating the gas source and the suction source in a state to form a layer of gas between the substrate and the guide surface through the gas supply port and the suction port, and to float the substrate onto the layer of gas; The said board | substrate is driven by driving at least one of the said board | substrate and the said nozzle, opposing the said board | substrate of the state which floated, and the said front-end | tip part. While moving the stage and the substrate and the nozzle for moving the nozzle relative to the relative and relative to said substrate comprising the step of discharging the liquid material from the tip portion of the nozzle.

In this case, the gas source and the suction source are operated with a part of the path open to the atmosphere to form a layer of gas between the substrate and the guide surface through the gas supply port and the suction port, and float the substrate onto the layer of the gas. Since it comprises the step of making it, it becomes possible to mitigate the change of at least one of the flow volume of the gas which is blown off, and the flow volume of the gas which is aspirated. Thereby, the fluctuation | variation of the board | substrate flotation amount can be suppressed.

In the application method described above, the step of floating the substrate includes adjusting the opening degree of the atmospheric opening formed in the atmospheric opening.

In this case, since the opening degree of the atmospheric opening formed in the atmospheric opening is adjusted, the gas supply amount and the suction amount are finely adjusted.

In the coating method, the step of floating the substrate includes measuring the flow rate of the gas flowing through the atmospheric opening formed in the atmospheric opening.

In this case, since the flow rate of the gas which flows out from the air | atmosphere opening into the atmosphere or the flow rate of the gas which draws in from air | atmosphere is measured, it is possible to grasp the adjustment amount of a gas blowing amount or a suction amount.

In the application method described above, the step of floating the substrate includes measuring at least one of a flow rate of the gas flowing out of the atmospheric opening to the atmosphere and a flow rate of the gas sucked from the atmosphere.

In this case, at least one of the flow rate of the gas which flows out from the air | atmosphere opening into the atmosphere and the flow rate of the gas which draw | induces from air | atmosphere is measured, and the adjustment amount of the gas blowing amount can be grasped | ascertained.

In the coating method, the step of floating the substrate, measuring the flow rate of the gas flowing through the atmospheric opening formed in the atmospheric opening, the opening degree of the atmospheric opening in accordance with the measurement result of the flow rate of the gas Including adjusting.

In this case, since the opening degree of the atmospheric opening is adjusted based on the measurement result by the flowmeter, the gas ejection amount and the suction amount can be adjusted automatically.

According to this invention, the fluctuation | variation of the board | substrate flotation amount can be suppressed.

1 is a perspective view showing the configuration of a coating apparatus according to the present embodiment.
2 is a front view illustrating the configuration of the coating apparatus according to the present embodiment.
3 is a plan view showing the configuration of a coating apparatus according to the present embodiment.
4 is a side view illustrating the configuration of the coating apparatus according to the present embodiment.
FIG. 5 is a diagram illustrating the configuration of main parts of the conveying machine. FIG.
FIG. 6: is a figure which shows the structure of the gas blowing mechanism and the suction mechanism of the processing stage of the coating device which concerns on this embodiment.
FIG. 7: is a figure which shows the structure of the gas blowing mechanism and the suction mechanism of the processing stage of the coating device which concerns on this embodiment.
8 is a diagram illustrating the operation of the coating apparatus according to the present embodiment.
9 is a diagram illustrating the same operation.
10 is the same operation diagram.
11 is a diagram illustrating the same operation.
12 is a table showing a relationship between the shielding rate of the processing stage, the total flow rate of the gas blown out to the processing stage, and the flow rate of the gas flowing out of the atmospheric opening.
13 is a same operation diagram.
14 is the same operation diagram.
It is a figure which shows the structure of the conveyance mechanism which concerns on a modification.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described based on drawing.

1 is a perspective view of the coating device 1 according to the present embodiment.

As shown in FIG. 1, the coating apparatus 1 which concerns on this embodiment is a coating apparatus which apply | coats a resist on the glass substrate used for a liquid crystal panel etc., for example, A board | substrate conveyance part 2 and an application part ( 3), the management part 4, and the control part CONT are main components.

In the coating device 1, a resist is applied onto the substrate by the coating unit 3 while the substrate is lifted and transported by the substrate transfer unit 2, and the application unit 3 is applied by the management unit 4. State is managed. The control part CONT controls each part of the coating device 1 collectively.

2 is a front view of the coating device 1, FIG. 3 is a plan view of the coating device 1, and FIG. 4 is a side view of the coating device 1. With reference to these drawings, the detailed structure of the coating device 1 is demonstrated.

(Substrate conveying part)

First, the structure of the board | substrate conveyance part 2 is demonstrated.

The board | substrate conveyance part 2 has the board | substrate loading area | region 20, the coating process area | region 21, the board | substrate carrying out area | region 22, the conveyance mechanism 23, and the frame part 24 which supports these. . In this board | substrate conveyance part 2, the board | substrate S is conveyed by the conveyance mechanism 23 to the board | substrate carrying in area 20, the coating process area | region 21, and the board | substrate carrying out area 22 in order. The board | substrate loading area | region 20, the coating process area | region 21, and the board | substrate carrying out area | region 22 are arrange | positioned in this order from the upstream side to the downstream side of a board | substrate conveyance direction. The conveyance mechanism 23 is formed in one side of each said part so that it may apply to each part of the board | substrate carrying in area 20, the coating process area | region 21, and the board | substrate carrying out area 22. As shown in FIG.

Hereinafter, in explaining the structure of the coating device 1, in order to simplify notation, the direction in a figure is demonstrated using an XYZ coordinate system. As a longitudinal direction of the board | substrate conveyance part 2, the conveyance direction of a board | substrate is described with an X direction. The direction orthogonal to the X direction (substrate conveyance direction) is described as a Y direction by planar view. The direction perpendicular to the plane including the X direction axis and the Y direction axis is referred to as Z direction. In addition, in the X direction, the Y direction, and the Z direction, it is assumed that the arrow direction in the figure is the + direction and the direction opposite to the arrow direction is the-direction.

The board | substrate loading area 20 is a site | part which carries in the board | substrate S conveyed from the exterior of the apparatus, and has the carry-in side stage 25 and the lift mechanism 26. As shown in FIG.

The carrying-in side stage 25 is formed in the upper part of the frame part 24, and is a rectangular plate-shaped member seen from the plane which consists of SUS etc., for example. This carry-in side stage 25 is long in the X direction. In the carry-in side stage 25, the gas blowing port 25a and the lift pin gushing-hole 25b are respectively formed in multiple numbers. These gas ejection openings 25a and the lifting pin projection holes 25b are formed to penetrate the carry-in side stage 25.

The gas ejection port 25a is a hole which ejects gas on the stage surface (conveying surface) 25c of the carry-in side stage 25, for example, the area | region through which the board | substrate S passes in the carry-in side stage 25, for example. Are arranged in a matrix in plan view. The gas supply source which is not shown in figure is connected to this gas blowing port 25a. In this carrying-in side stage 25, the board | substrate S can be made to float to + Z direction by the gas blown out from the gas blowing port 25a.

The lifting pin projection holes 25b are formed in a region into which the substrate S is loaded in the carry-in side stage 25. The lifting pin gushing holes 25b have a configuration in which gas supplied to the stage surface 25c does not leak.

25 d of alignment apparatuses are formed in the both ends of the Y direction among this carry-in stage 25 one by one. The alignment device 25d is a device for aligning the position of the substrate S carried in the carry-in side stage 25. Each alignment device 25d has a long hole and a positioning member formed in the long hole, and mechanically sandwiches the substrate carried in the carry-in stage 25 from both sides.

The lift mechanism 26 is formed in the back surface side of the board | substrate carrying in position of the carry-in side stage 25. As shown in FIG. This lift mechanism 26 has a lifting member 26a and a plurality of lifting pins 26b. The lifting member 26a is connected to a drive mechanism (not shown), and the lifting member 26a is moved in the Z direction by the drive of the drive mechanism. The plurality of lifting pins 26b are provided to stand in the carrying-in side stage 25 from the upper surface of the lifting member 26a. Each lifting pin 26b is arrange | positioned at the position which overlaps with the said lifting pin recessed hole 25b in planar view, respectively. As the elevating member 26a moves in the Z direction, each elevating pin 26b is projected from the elevating pin recess 25b onto the stage surface 25c. The edge part of the + Z direction of each lifting pin 26b is formed so that the position on a Z direction may respectively correspond, and it is possible to hold | maintain the board | substrate S conveyed from the apparatus exterior in a horizontal state.

The application | coating process area | region 21 is the site | part in which application | coating of a resist is performed, and the process stage 27 which floats and supports the board | substrate S is formed. The processing stage 27 is a rectangular plate-like member viewed in a plane covered with a light absorbing material mainly composed of hard alumite, for example, where the stage surface (carrying surface) 27c is + X relative to the carry-in stage 25. It is formed in the direction side.

In the part covered with the light absorbing material in the processing stage 27, reflection of light such as laser light is suppressed. This processing stage 27 is long in the Y direction. The dimension of the Y direction of the processing stage 27 is made substantially the same as the dimension of the Y direction of the carry-in side stage 25. In the processing stage 27, a plurality of gas ejection openings 27a for ejecting gas on the stage surface 27c and a plurality of suction ports 27b for sucking gas on the stage surface 27c are formed. These gas blowing ports 27a and suction ports 27b are formed to penetrate the processing stage 27. In addition, a plurality of grooves (not shown) for providing resistance to the pressure of the gas passing through the gas blowing port 27a and the suction port 27b are formed inside the processing stage 27. These grooves are connected to the gas blowing port 27a and the suction port 27b inside the stage.

In the processing stage 27, the pitch of the gas ejection opening 27a is narrower than the pitch of the gas ejection opening 25a formed in the carry-in side stage 25, and the gas ejection opening 27a is denser than the carry-in stage 25. Formed. In the processing stage 27, the suction port 27b is densely formed together with the gas blowing port 27a. As a result, in the processing stage 27, the floating amount of the substrate can be adjusted with high precision compared to other stages, and the floating amount of the substrate can be controlled to be, for example, 100 µm or less, preferably 50 µm or less. have. In the processing stage 27, the detection part MS which can detect the distance between the stage surface 27c and the board | substrate S is provided.

The board | substrate carrying out area | region 22 is a site | part which carries out the board | substrate S to which the resist was apply | coated to the exterior of the apparatus, and has the carrying-out side stage 28 and the lift mechanism 29. As shown in FIG. This carrying-out stage 28 is formed in the + X direction side with respect to the process stage 27, and is comprised by the material and dimension substantially the same as the carrying-in side stage 25 formed in the board | substrate carrying-in area 20. FIG. The gas ejection opening 28a and the lift pin gushing hole 28b are formed in the carrying out side stage 28 similarly to the carrying in side stage 25. The lift mechanism 29 is formed in the back surface side of the board | substrate carrying out position of the carrying-out stage 28, and is supported by the frame part 24, for example. The elevating member 29a and the elevating pin 29b of the lift mechanism 29 have the same configuration as each part of the lift mechanism 26 formed in the substrate loading area 20. When carrying out the board | substrate S on the carrying-out stage 28 to an external apparatus, this lift mechanism 29 can lift the board | substrate S by the lifting pin 29b in order to exchange board | substrate S. It is supposed to be.

The conveyance mechanism 23 is equipped with the 1st conveyance mechanism 60 and the 2nd conveyance mechanism 61, as shown in FIG. 3, the 1st conveyance mechanism 60 has shown the state which hold | maintained the board | substrate S, and the illustration of the 2nd conveyance mechanism 61 arrange | positioned under the 1st conveyance mechanism 60 is abbreviate | omitted. It was.

The 1st conveyance mechanism 60 can move on the surface parallel to the conveyance surface of the board | substrate S with the conveyer 60a, the vacuum pad 60b, the rail 60c, and the conveyer 60a. It has the moving mechanism 63 which makes it let. Moreover, the 2nd conveyance mechanism 61 is the lifting mechanism 62 which enables raising / lowering (up-down operation) of the conveyer 61a, the vacuum pad 61b, the rail 61c, and the conveyer 61a. Have The rails 60c and 61c extend to the side of the carry-in stage 25, the processing stage 27, and the carry-out stage 28 over each stage.

The conveyers 60a and 61a have a structure in which a linear motor is formed inside, for example, and each of the conveyers 60a and 61a moves on the rails 60c and 61c by the linear motor being driven. It is possible to move along the stage. That is, the conveyers 60a and 61a are equipped with the function as a holding part which hold | maintains the board | substrate S, and the function as a drive part which drives the holding part. The conveyers 60a and 61a are arranged so that the predetermined portions 60d and 61d overlap the end portions in the -Y direction of the substrate S in plan view. The parts 60d and 61d which overlap with this board | substrate S are arrange | positioned in the position lower than the height position of the back surface of the board | substrate at the time of making the board | substrate S float.

The 2nd conveyance mechanism 61 is arrange | positioned at the lower end of the stepped part 24a of the step part of the frame part 24 compared with the 1st conveyance mechanism 60, as shown in FIG. Moreover, in plan view, the 2nd conveyance mechanism 61 is arrange | positioned with respect to the 1st conveyance mechanism 60 at the stage side.

As shown in FIG. 4, the 2nd conveyance mechanism 61 is able to access the board | substrate S by raising the conveyer 61a by the said lifting mechanism 62. As shown in FIG. On the other hand, the 1st conveyance mechanism 60 is able to access the board | substrate S by horizontally moving the conveyer 60a on the surface parallel to the conveyance surface of the board | substrate S by the said moving mechanism 63. have. The conveyer 60a of the 1st conveyance mechanism 60 and the conveyer 61a of the 2nd conveyance mechanism 61 are each independently movable.

In addition, for example, when the 1st conveyance mechanism 60 is holding the board | substrate S, the conveyance machine 61a of the 2nd conveyance mechanism 61 which does not hold the board | substrate S is a lifting mechanism. As 62 descends, it waits below and is evacuated from the conveyance path | route of the 1st conveyance mechanism 60 (conveyor 60a). In addition, when the 2nd conveyance mechanism 61 is holding the board | substrate S, the conveyer 60a of the 1st conveyance mechanism 60 which does not hold the board | substrate S is moved to the moving mechanism 63. Thereby moving in the -Y direction and being evacuated from the conveying path of the second conveying mechanism 61 (the conveying machine 61a).

As illustrated in FIG. 3, a plurality of vacuum pads 60b are provided along the conveyance direction of the substrate S in a portion 60d overlapping with the substrate S in the conveyer 60a (three in this embodiment). ) Is placed. This vacuum pad 60b has the adsorption surface for vacuum-suctioning the board | substrate S, and is arrange | positioned so that the said adsorption surface may face upward. The vacuum pad 60b can hold | maintain the said board | substrate S by the adsorption surface attracting the back surface edge part of the board | substrate S. As shown in FIG. It is preferable to keep these vacuum pad 60b within 250 mm from the edge part of the conveyance direction front side of the board | substrate S, and to set it as 80 mm or less. Specifically, in this embodiment, the conveyer 60a is holding the board | substrate S so that the distance W from the edge part of the conveyance direction front of the board | substrate S to the vacuum pad 60b may be within 80 mm. . Thereby, the board | substrate S is hold | maintained uniformly by the conveyer 60a, and the board | substrate edge part is prevented from falling down and it can convey in the state which floated the board | substrate S uniformly. Therefore, nonuniformity is prevented from occurring in the film which solidified the resist apply | coated on the board | substrate S. FIG.

In addition, although the structure of the conveyer 61a in the 2nd conveyance mechanism 61 is not shown in FIG. 3, it has the same structure as the said conveyer 60a. That is, three vacuum pads 61b in the conveyer 61a are arrange | positioned along the conveyance direction of the board | substrate S in the part which overlaps with the said board | substrate S. As shown in FIG.

Here, the main part structure of the conveyers 60a and 61a is demonstrated. In addition, as mentioned above, since the conveyers 60a and 61a have the same structure, respectively, in this description, the conveyance machine 60a is taken as an example and the structure is demonstrated, referring FIG. In addition, FIG.5 (a) is a figure which shows the planar structure of the principal part of the conveyer 60a, and FIG.5 (b) is a figure which shows the cross-sectional structure of the principal part of the conveyer 60a.

As shown in FIG.5 (a), the contact part with the board | substrate S becomes substantially elliptical in the plane of the vacuum pad 60b formed in the conveyer 60a. And the exhaust hole 65 connected to the vacuum pump etc. which are not shown in figure is formed inside the vacuum pad 60b. The vacuum pad 60b is capable of vacuum suction of the board | substrate S by exhausting the sealed space which arises between the vacuum pad 60b and the board | substrate S through this exhaust hole 65. FIG.

Moreover, as shown to FIG. 5 (b), the stopper member 66 which regulates the position of the board | substrate S in conveyance is provided in the side of the vacuum pad 60b formed on the conveyer 60a. This stopper member 66 is provided with the convex part 66a which opposes the side surface S1 of the board | substrate S, and opposes the lower surface side of the board | substrate S. As shown in FIG. This convex portion 66a functions as a stopper for restricting warping of the substrate S downward. The convex part 66a is formed in the state which enclosed the outer peripheral part of the vacuum pad 60b in frame shape, as shown to FIG. 5 (a). It is preferable to set the upper surface of the convex part 66a to -30 micrometers with respect to the upper surface of the carry-in side stage 25, and to set it as -20 micrometer vicinity. In addition, as for the positional relationship of the convex part 66a and the vacuum pad 60b, it is preferable to set the vacuum pad 60b about 0-1 mm upwards.

In addition, the convex part 66a may surround the structure where the convex part 66a is arrange | positioned between the adjacent vacuum pad 60b, ie, four sides of each vacuum pad 60b.

The vacuum pad 60b which concerns on this embodiment is able to displace with respect to the board | substrate S. FIG. In this specific embodiment, the vacuum pad 60b has the wrinkle box part 67 which consists of a wrinkle box structure. Thereby, for example, even when the height of the board | substrate S fluctuates because a curvature generate | occur | produces in the edge part of the board | substrate S, the vacuum pad 60b follows the movement of the board | substrate S to the said board | substrate S. Adsorption can be maintained reliably. Moreover, even when the floating amount of the board | substrate S on the stage changes the vacuum pad 60b, the wrinkles box part 67 displaces and can adsorb | suck the board | substrate S favorably.

(Application department)

Next, the structure of the application part 3 is demonstrated.

The application part 3 is a part which apply | coats a resist on the board | substrate S, and has the sentence frame 31 and the nozzle 32. As shown in FIG.

The sentence frame 31 has the support member 31a and the bridge | crosslinking member 31b, and is formed so that the process stage 27 may be hung in the Y direction. The strut members 31a are formed one by one in the Y direction side of the processing stage 27, and each strut member 31a is supported by both side surfaces of the frame portion 24 on the Y direction side, respectively. Each strut member 31a is formed so that the height position of an upper end part may correspond. The bridge | crosslinking member 31b is bridge | crosslinked between the upper end parts of each strut member 31a, and is able to raise / lower the said strut member 31a.

The door frame 31 is connected to the movement mechanism 31c, and can move in the X direction. This moving mechanism 31c allows the door frame 31 to move between the management part 4. That is, the nozzle 32 formed in the door frame 31 is able to move between the management part 4. The door frame 31 is also movable in the Z direction by a moving mechanism not shown.

The nozzle 32 is comprised in the elongate shape of one direction, and is formed in the surface of the cross-sectional member 31b of the sentence-shaped frame 31 at the side of the -Z direction. At the tip of the nozzle 32 in the -Z direction, a slit-like opening 32a is formed along its longitudinal direction, and a resist is discharged from the opening 32a. The nozzle 32 is arrange | positioned so that the longitudinal direction of the opening part 32a may be parallel to a Y direction, and the said opening part 32a opposes the processing stage 27. As shown in FIG. The dimension of the longitudinal direction of the opening part 32a is smaller than the dimension of the Y direction of the board | substrate S conveyed, and the resist is not apply | coated to the peripheral area of the board | substrate S. FIG. Inside the nozzle 32, a flow path (not shown) for flowing a resist through the opening 32a is formed, and a resist supply source (not shown) is connected to the flow path. This resist supply source has a pump not shown, for example, and resist is discharged from the opening part 32a by pushing a resist into the opening part 32a with this pump. The strut member 31a is provided with the movement mechanism not shown, and the nozzle 32 hold | maintained by the bridge | crosslinking member 31b can move to Z direction by the said movement mechanism. A moving mechanism (not shown) is formed in the nozzle 32, and the moving mechanism allows the nozzle 32 to move in the Z direction with respect to the crosslinking member 31b. On the lower surface of the crosslinked member 31b of the door-shaped frame 31, the distance in the Z direction between the opening 32a of the nozzle 32, that is, the front end of the nozzle 32 and the opposing surface opposite to the front end of the nozzle is measured. The sensor 33 is attached.

(Management)

The structure of the management part 4 is demonstrated.

The management part 4 is a site | part which manages the nozzle 32 so that the discharge amount of the resist (liquid body) discharged to the board | substrate S may become constant, and -X with respect to the application | coating part 3 of the board | substrate conveyance part 2 is -X. It is formed in the direction side (upstream side of a board | substrate conveyance direction). This management part 4 comprises the preliminary discharge mechanism 41, the dip tank 42, the nozzle cleaning device 43, the accommodating part 44 which accommodates these, and the holding member 45 holding the said accommodating part. Have The holding member 45 is connected to the moving mechanism 45a. By the said moving mechanism 45a, the accommodating part 44 is able to move to a X direction.

The preliminary ejection mechanism 41, the dip tank 42, and the nozzle cleaning device 43 are arranged in this order on the -X direction side. Each dimension of the preliminary discharge mechanism 41, the dip tank 42, and the nozzle cleaning device 43 in the Y direction is smaller than the distance between the strut members 31a of the sentence frame 31, and the sentence frame ( 31) It is accessible over each site.

The preliminary ejection mechanism 41 is a part which ejects a resist preliminarily. The preliminary ejection mechanism 41 is formed nearest to the nozzle 32. The dip tank 42 is a liquid tank in which solvent, such as thinner, was stored inside. The nozzle cleaning device 43 is a device for rinsing and cleaning the vicinity of the opening 32a of the nozzle 32. The nozzle cleaning device 43 has a washing mechanism (not shown) moving in the Y direction and a moving mechanism (not shown) for moving the washing mechanism. have. This movement mechanism is formed in the -X direction side rather than the washing | cleaning mechanism. The nozzle cleaning device 43 has a larger dimension in the X direction than the preliminary discharge mechanism 41 and the dip tank 42 as long as the moving mechanism is formed. In addition, about arrangement | positioning of the preliminary discharge mechanism 41, the dip tank 42, and the nozzle washing | cleaning apparatus 43, it is not limited to the arrangement | positioning of this embodiment, Any other arrangement | positioning may be sufficient. In addition, about the preliminary discharge mechanism 41, the dip tank 42, and the nozzle washing | cleaning apparatus 43, it is not limited to the case where all are arrange | positioned, The structure which part was abbreviate | omitted may be sufficient.

(Gas blowing mechanism, suction mechanism)

FIG. 6: is a figure which shows the structure of the gas blowing mechanism and the suction mechanism of the carrying-in side stage 25, the processing stage 27, and the carrying out side stage 28. As shown in FIG. Based on the same figure, the structure regarding gas blowing and gas suction of each said stage is demonstrated.

Only the gas blowing mechanisms 150 and 155 are formed in the carry-in stage 25 and the carry-out stage 28, and the suction mechanism is not formed. The configurations of the gas blowing mechanisms 150 and 155 are the same in both stages. These gas blowing mechanisms 150 and 155 have blowers 151 and 156, temperature control units 152 and 157 and manifolds 153 and 158, respectively.

From each blower 151,156, it is connected to the temperature control unit 152,157 by piping 150a, 155a, respectively. The temperature control units 152 and 157 are provided with, for example, cooling mechanisms such as refrigerant mechanisms and heating mechanisms such as heating wires, and the cooling mechanisms and heating mechanisms are configured such that the temperature of the gas supplied can be adjusted. It is. In the temperature control unit 152 and the temperature control unit 157, the temperature of a gas can be adjusted independently. The temperature control units 152 and 157 are connected to the manifolds 153 and 158 by piping 150b and 155b, respectively.

The temperature sensors 154 and 159 are attached to the manifolds 153 and 158, respectively.

The temperature sensors 154 and 159 measure the temperature of the gas in the manifolds 153 and 158, and transmit the measurement result to the temperature control units 152 and 157, respectively. In the temperature control units 152 and 157, the measurement results of the temperature sensors 154 and 159 are fed back so that the temperature of the gas can be adjusted. In this way, the temperature control units 152 and 157 and the temperature sensors 154 and 159 respectively constitute temperature control mechanisms 181 and 182 which feed back and adjust the temperature of the gas.

Pressure gauges are attached to the pipes 150b and 155b and are connected to the carry-in stage 25 and the carry-out stage 28 by pipes 150c and 155c, respectively. Various valves are formed in each of the pipes 150a to 150c and 155a to 155c. In addition, you may provide the air particle amount measuring device which measures the particle amount in air | atmosphere in piping 150a-150c and 155a-155c.

On the other hand, the suction stage 170 is formed in the processing stage 27 in addition to the gas blowing mechanism 160.

FIG. 7: is a figure which shows the structure of the gas blowing mechanism 160 and the suction mechanism 170 formed in the process stage 27. As shown in FIG. As shown in the figure, the gas blowing mechanism 160 includes a blower 161, a temperature control unit 162, a filter 163, an auto pressure controller (APC) 164, a manifold 165, and a temperature sensor. 166 and the ejection amount monitoring port 167.

The blower 161 is a gas supply source which supplies gas to a gas blowing mechanism, and is connected to the temperature control unit 162 by the piping 160a. As the gas supply source, a gas supply line such as a factory may be connected instead of the blower 161.

The temperature control unit 162 is a unit which adjusts the temperature of the gas supplied, for example. In the gas distribution part in the temperature control unit 162, cooling mechanisms, such as a refrigerant mechanism, and heating mechanisms, such as a heating wire, are formed, for example. These cooling mechanisms and heating mechanisms are capable of raising or lowering the temperature of the gas. In the temperature control unit 162, the temperature of the gas can be adjusted independently of the temperature control units 152 and 157 described above. The temperature control unit 162 is connected to the APC 164 by the piping 160b.

The filter 163 is formed in the pipe 160b. The filter 163 is a site for removing foreign matter mixed with the gas to be supplied. In addition, the structure which forms the relief valve not shown in the piping 160b may be sufficient.

The APC 164 is a unit for adjusting the supply amount of gas. The APC 164 has a butterfly valve 164a and a controller 164b. The controller 164b can adjust the opening degree of the butterfly valve 164a, and can adjust the supply amount of gas by adjusting the opening degree of the said butterfly valve 164a. The APC 164 is connected to the manifold 165 via the pipe 160c.

The flowmeter 169a and the pressure gauge 169b are attached to the pipe 160c. The flow rate and pressure of the gas in the piping 160c are measured by these flowmeters 169a and 169b. Each measurement result is sent to the APC 164, for example.

The manifold 165 is a unit which branches off the gas which distributes the piping 160c. In the manifold 165, the pipe 160c is connected to a plurality of branched pipes 160d. Each pipe 160d is connected to the gas blowing port 27a of the processing stage 27.

The temperature sensor 166 is a sensor for measuring the temperature of the gas in the manifold 165. The temperature data of the gas measured by the temperature sensor 166 is transmitted to the temperature control unit 162 via, for example, a communication line. In the temperature control unit 162, the temperature of the gas can be adjusted by feeding back the measurement result of the temperature sensor 166. Thus, the temperature control unit 162 and the temperature sensor 166 comprise the temperature control mechanism 183 which feeds back and adjusts the temperature of a gas.

The blowing amount monitoring port 167 has a configuration having a gas flow rate detecting port, and the gas flow rate detecting port can detect a gas flow rate equivalent to the gas ejection port 27a of the processing stage 27. have. The flow rate monitoring port 167 is provided with a flow meter 167a and a pressure gauge 167b, so that the flow rate and pressure of the gas blown out from the gas blowing port 27a can be measured. In addition, about the measurement result by the flowmeter 167a and the pressure gauge 167b, the structure transmitted to the controller 164b in the APC 164 may be sufficient.

Various valves etc. are attached to said pipe | tube 160a-160e, and the opening degree can be adjusted suitably in each valve | bulb. In addition, the atmospheric opening 191 is connected to the pipe 160c.

The atmospheric opening 191 has a branch pipe 191a, a gas flow regulating valve 191b, and a flow meter 191c. The branch piping 191a is branched from the piping 160c, and becomes the atmospheric opening 191d in which the tip was opened to the atmosphere. The gas flow rate adjusting valve 191b can adjust the opening degree of the atmospheric opening 191d by adjusting the diameter of the flow path in the branch pipe 191a.

The gas flow rate adjusting valve 191b can adjust the flow rate of the gas which flows out from the atmospheric opening 191d to the atmosphere with the flow of the branch pipe 191a by adjusting the opening degree of the atmospheric opening 191d. The flowmeter 191c measures the flow volume of the gas which flows through the branch pipe 191a, and flows out from the atmospheric opening 191d to the atmosphere. The control part CONT adjusts the gas flow rate adjusting valve 191b based on the measurement result of the flowmeter 191c.

The suction mechanism 170 has a blower 171, an auto pressure controller (APC) 172, a trap tank 173, a manifold 174, and a suction amount monitoring port 175. The blower 171, the APC 172, the trap tank 173, and the manifold 174 are connected to each other by piping 170a-c, and each valve 170a-c is equipped with various valves. . In addition, a gas suction line such as a factory may be used instead of the blower 171. In addition, the structure in which the manifold 174 is not formed may be sufficient.

The manifold 174 is connected to the plurality of branched pipes 170d. Each pipe 170d is connected to a suction port 27b of the processing stage 27.

The APC 172 is provided with a butterfly valve 172a and a controller 172b for adjusting the gas supply amount. The suction amount monitoring port 175 is connected to the processing stage 27 by the piping 170e, and is configured with the port for gas flow rate detection connected to the connection portion. In the suction amount monitoring port 175, the gas flow rate immediately below the processing stage 27 can be detected by the flow rate detection port. In addition, the suction amount monitoring port 175 is equipped with a flow meter 175a and a pressure gauge 175b, and the suction port 27b can detect the gas flow rate equivalent to the gas ejection port 27a of the processing stage 27. It is supposed to be. In addition, about the measurement result by the flowmeter 175a and the pressure gauge 175b, the structure sent to the controller 172b in the APC 172 may be sufficient.

In addition, a flowmeter may be provided between the APC 172 and the suction port 27b, and the measurement result may be fed back to the controller 172b in the APC 172.

In addition, the atmospheric opening part 192 is connected to the piping 170c. The atmospheric opening part 192 has the branch piping 192a, the gas flow regulating valve 192b, and the flowmeter 192c. The branch piping 192a is branched from the piping 170c, and becomes the atmospheric opening 192d by which the front end was opened to the atmosphere. The gas flow rate adjustment valve 192b can adjust the opening degree of the atmospheric opening 192d by adjusting the diameter of the flow path in the branch pipe 192a.

The gas flow rate adjustment valve 192b can adjust the flow volume of the gas which draws in the branch pipe 192a from the atmosphere with the flow of the branch piping 192a by adjusting the opening degree of the atmospheric opening 192d. The flowmeter 192c measures the flow volume of the gas which flows through the branch piping 192a, and flows in from the air | atmosphere opening 192d. The control part CONT adjusts the gas flow rate adjusting valve 192b based on the measurement result of the flowmeter 192c.

Next, operation | movement of the coating device 1 comprised as mentioned above is demonstrated.

8-14 is a top view which shows the operation process of the coating device 1. With reference to each drawing, the operation | movement which apply | coats a resist to the board | substrate S is demonstrated. In this operation, the board | substrate S is carried in the board | substrate carrying-in area | region 20, the resist is apply | coated in the coating process area | region 21, floating and conveying the said board | substrate S, and the board | substrate S which apply | coated this resist was applied. Is carried out from the substrate carrying-out area 22. 8-10, only the outline of the sentence frame 31 and the management part 4 was shown with the broken line, and it was easy to distinguish the structure of the nozzle 32 and the processing stage 27. As shown in FIG. The detailed operation in each part is described below.

Before carrying in a board | substrate to the board | substrate carrying-in area 20, the coating device 1 is standby. Specifically, the conveyance machine 60a of the 1st conveyance mechanism 60 is arrange | positioned at the -Y direction side of the board | substrate carrying-in position of the carry-in side stage 25, and the height position of the vacuum pad 60b is the floating height of a board | substrate. While maintaining the position, the gas ejection opening 25a of the carry-in stage 25, the gas ejection opening 27a of the processing stage 27, the suction port 27b and the gas ejection opening 28a of the carrying-out stage 28 are provided. The gas is blown out or sucked from each other, and the gas is supplied so that the substrate floats on the surface of each stage.

In this state, when the board | substrate S is conveyed to the board | substrate carrying-in position shown in FIG. 3 from the exterior by the conveyance arm etc. which are not shown in figure, for example, the lifting member 26a is moved to + Z direction, and the lifting pin 26b is carried out. Is projected from the lifting pin recess 25b to the stage surface 25c. And the board | substrate S is lifted up by the lifting pin 26b, and the said board | substrate S is received. Moreover, the positioning member protrudes to the stage surface 25c from the long hole of the alignment apparatus 25d.

After receiving the substrate S, the elevating member 26a is lowered to accommodate the elevating pin 26b in the elevating pin recess 25b. At this time, since the layer of gas is formed in the stage surface 25c, the board | substrate S is hold | maintained in the state which floated with respect to the stage surface 25c by the said gas. When the board | substrate S reaches the surface of a base layer, the alignment of the board | substrate S is performed by the alignment member of the alignment apparatus 25d, and the 1st conveyance arrange | positioned at the -Y direction side of a board | substrate loading position. By the moving mechanism 63 of the mechanism 60, the vacuum pad 60b of the conveyer 60a can be vacuum-suctioned to the edge part of the board | substrate S at the -Y direction side (FIG. 3). After the -Y direction side edge part of the board | substrate S is attracted by the vacuum pad 60b, the conveyer 60a is moved along the rail 60c. Since the board | substrate S is in the floating state, even if the drive force of the conveyer 60a is made comparatively small, the board | substrate S will move smoothly along the rail 60c.

When the front end of the board | substrate S reaches the position of the opening part 32a of the nozzle 32, as shown in FIG. 8, a resist is moved toward the board | substrate S from the opening part 32a of the nozzle 32. As shown in FIG. Discharge. Discharge of a resist is performed, fixing the position of the nozzle 32, and conveying the board | substrate S by the conveyer 60a.

In this embodiment, in the middle of performing resist coating with respect to the board | substrate S conveyed by the 1st conveyance mechanism 60, the board | substrate (the board | substrate which differs from the exterior in the board | substrate loading position by the conveyance arm etc. which are not shown, for example) S ') exchanges. After receiving the substrate S ', the lifting member 26a is lowered to accommodate the lifting pin 26b in the lifting pin recess 25b, whereby the substrate S' is attached to the stage surface 25c by gas. It will remain injured.

When the substrate S 'reaches the surface of the substrate layer, the substrate S' is aligned by the alignment member of the alignment device 25d, and the substrate S 'is placed on the -Z direction side of the substrate loading position. The conveying machine 61a is raised by the elevating mechanism 62 of the 2nd conveyance mechanism 61, and a vacuum pad 61b is vacuum-suctioned to the edge part of the board | substrate S 'at the -Y direction side. The control part CONT makes appropriate detection of the floating amount also about the said board | substrate S 'similarly to the said board | substrate S.

Thus, in this embodiment, since the conveyance machine 60a of the 1st conveyance mechanism 60 and the conveyance machine 61a of the 2nd conveyance mechanism 61 are each independently movable, the 1st conveyance mechanism ( Before the process of resist coating with respect to the board | substrate S conveyed by 60) is complete | finished, the other board | substrate S 'can be conveyed on the stage by the 2nd conveyance mechanism 61. FIG. Therefore, a resist can be favorably apply | coated on the board | substrate S and S 'conveyed sequentially in a cantilever state, and high throughput can be obtained in a resist coating process.

With the movement of the board | substrate S, the resist film R is apply | coated on the board | substrate S as shown in FIG. The resist film R is formed in the predetermined area | region of the board | substrate S by the board | substrate S passing under the opening part 32a which discharges a resist. Moreover, the conveyer 61a of the 2nd conveyance mechanism 61 moves the board | substrate S 'below the opening part 32a.

The board | substrate S in which the resist film R was formed is conveyed to the carrying out side stage 28 by the conveyer 60a. In the carrying out side stage 28, the board | substrate S is conveyed to the board | substrate carrying out position shown in FIG. 10 in the state floated with respect to the stage surface 28c. Moreover, the resist film R is formed in the predetermined | prescribed area | region of the other board | substrate S 'by the other board | substrate S' conveyed by the conveyer 61a passing under the opening part 32a.

When the substrate S reaches the substrate unloading position, the suction of the vacuum pad 60b is released and the lifting member 29a of the lift mechanism 29 is moved in the + Z direction. Then, the lifting pin 29b protrudes from the lifting pin projection hole 28b to the back surface of the substrate S, and the substrate S is lifted by the lifting pin 29b. In this state, the external conveyance arm formed in the + X direction side of the carrying out stage 28, for example, accesses the carrying out stage 28, and receives the board | substrate S. FIG. After passing the board | substrate S to the conveyance arm, the 1st conveyance mechanism 60 is withdrawn by the moving mechanism 63 from the lower side of the board | substrate S for the conveyer 60a (vacuum pad 60b). The evacuation is carried out from the conveyance path (moving path) of the second conveyance mechanism 61 that is conveying the other substrate S '.

And the 1st conveyance mechanism 60 returns to the board | substrate carrying-in position of the loading side stage 25 again, and waits until the next board | substrate is conveyed. At this time, as shown in FIG. 10, although the resist application | coating is performed with respect to the board | substrate S 'conveyed to the 2nd conveyance mechanism 61, the 1st conveyance mechanism 60 is 2nd as mentioned above. Since it is withdrawn from the conveyance path | route of the conveyance mechanism 61, it does not contact the 2nd conveyance mechanism 61, and does not disturb the conveyance of another board | substrate S ', to the board | substrate loading position of the carry-in side stage 25. You can come back.

Moreover, when the board | substrate S 'conveyed by the 2nd conveyance mechanism 61 reaches | attains the board | substrate carrying out position, the external conveyance arm similarly accesses the carrying-out side stage 28, and receives the board | substrate S. FIG. And it returns to the board | substrate carrying-in position of the carry-in side stage 25 again, and waits until the next board | substrate S is conveyed.

11 (a) to 11 (d) are diagrams showing how the substrate S moves from the carry-in stage 25 to the carry-out stage 28 via the processing stage 27.

As shown in FIG. 11A, when the substrate S moves on the carrying-in stage 25 and does not reach the processing stage 27, the processing stage 27 is blocked by the substrate S. It does not exist. From this state, as shown to FIG. 11 (b)-FIG. 11 (d), when the board | substrate S moves on the process stage 27, the said process stage 27 image is temporarily moved by the board | substrate S. FIG. Will be blocked.

When the phase of the processing stage 27 is blocked by the substrate S, the blowing pressure and the suction pressure of the gas of the portion are temporarily changed, and the flow rate of the gas to be ejected and the flow rate of the gas to be sucked may be changed temporarily. . As a result, the floating amount of the substrate S may fluctuate, which may make it difficult to apply the resist film R uniformly.

On the other hand, in this embodiment, when conveying the board | substrate S, before the board | substrate S reaches on the process stage 27, the control part CONT is the air | atmosphere opening part of the gas blowing mechanism 160 ( The gas flow rate adjustment valve 191b formed in 191 is opened, and the atmospheric opening 191d is opened. In addition, the control part CONT opens the gas flow rate adjustment valve 192b formed in the air | atmosphere opening part 192 of the suction mechanism 170, and waits before the board | substrate S reaches the process stage 27, The opening 192d is left open.

By making the air opening 191d open, the gas blowing mechanism 160 can eject gas from the air opening 191d in addition to the gas blowing port 27a. In this structure, even when the process stage 27 is interrupted | blocked, it can export to the atmospheric opening 191d. Therefore, when the board | substrate S is conveyed on the process stage 27, the fluctuation | variation of the gas ejection pressure in the gas ejection opening 27a is suppressed, and the fluctuation | variation of the gas flow volume ejected from the gas ejection opening 27a is suppressed. .

Similarly, by making the air opening 192d open, the suction mechanism 170 can suck the air from the air opening 192d in addition to the suction opening 27b. In this structure, even when the process stage 27 is interrupted | blocked, the suction amount can be replenished from the atmospheric opening 192d. Therefore, when the board | substrate S is conveyed on the process stage 27, the fluctuation | variation of the suction pressure in the suction port 27b is suppressed, and the fluctuation | variation of the gas flow volume sucked from the suction port 27b is suppressed.

FIG. 12: is a table | surface which shows the relationship of the shielding ratio of the processing stage 27, the total flow volume of the gas blown into the processing stage 27, and the flow volume of the gas which flows out from the atmospheric opening 191d. In addition, in this embodiment, when the dimension of the X direction of the processing stage 27 is t1, and the dimension of the X direction of the part which overlaps with the processing stage 27 in the board | substrate S is t2, the processing stage ( 27) shielding rate,

Shielding ratio = (t2 / t1) × 100 (%)

The case is described as an example.

When the substrate S does not reach the processing stage 27, that is, when the shielding rate of the processing stage 27 is 0%, the controller CONT controls the total amount of the gas blown out to the processing stage 27. The flow rate is, for example, 300 l per minute. In addition, the flow volume of the gas which flows out from the air | atmosphere opening 191d shall be 2000 L per minute, for example.

In this state, when the substrate S is conveyed and discharge of the resist film R is started by the nozzle 32 as shown in FIG. 11B, the substrate S is X in the processing stage 27. Almost half of the area in the direction is shielded. As described above, when the shielding rate of the processing stage 27 becomes almost 50%, the upper surface of the processing stage 27 is shielded by the substrate S, and the ejection pressure and the suction pressure of the gas increase by that amount.

Therefore, the control part CONT opens the gas flow regulating valve 191b and enlarges the opening degree of the atmospheric opening 191d. By this operation, the total flow rate of the gas blown out to the processing stage 27 is maintained at 300 L per minute, and the flow rate of the gas flowing out from the atmospheric opening 191d increases to 2500 L per minute, for example.

As shown in Fig. 11 (c), the discharge of the resist film R is further performed on the substrate S, so that the substrate S is almost 75% of the region in the X direction in the processing stage 27. In the state of shielding the gas, the blowing pressure and the suction pressure of the gas are further increased as compared with the case of Fig. 11B.

Therefore, the control part CONT opens the gas flow regulating valve 191b and makes the opening degree of the atmospheric opening 191d further larger. By this operation, the total flow rate of the gas blown out to the processing stage 27 is maintained at 300 L per minute, and the flow rate of the gas flowing out from the atmospheric opening 191d increases to 2750 L per minute, for example.

In this state, as shown in FIG. 11 (d), the discharge of the resist film R is further performed on the substrate S, so that the substrate S is 100% in the X direction in the processing stage 27. In the state of shielding the region of, the blowing pressure and the suction pressure of the gas are further increased as compared with the case of Fig. 11C.

Therefore, the control part CONT opens the gas flow regulating valve 191b and makes the opening degree of the atmospheric opening 191d further larger. By this operation, the total flow rate of the gas blown out to the processing stage 27 is maintained at 300 L per minute, and the flow rate of the gas flowing out from the atmospheric opening 191d increases to 3000 L per minute, for example.

After this, the substrate S moves in the + X direction, and as the shielding rate of the processing stage 27 decreases, the control unit CONT closes the gas flow rate adjusting valve 191b, and the atmospheric opening 191d. The opening degree of) is made small. By this operation, the total flow rate of the gas blown into the processing stage 27 is maintained at 300 l per minute.

The control part CONT measures the flow volume of the gas which flows through the atmospheric opening 191d, 192d by the flowmeters 191c and 192c, when performing the floating operation | movement of the board | substrate S, and the said flowmeters 191c and 192c. Based on the measurement result, the gas flow rate adjusting valves 191b and 192d may be adjusted.

In this case, for example, the target value data of the gas flow rate flowing through the atmospheric openings 191d and 192d are stored in the control unit CONT, and the control unit CONT controls the gas flow rate adjusting valve ( The control aspect which adjusts 191b, 192b is mentioned. As said target value data, it can obtain | require previously by experiment, simulation, etc.

Next, the management operation by the management unit 4 will be described.

As mentioned above, the board | substrate is conveyed to the application | coating part 3 at the time interval. For this reason, the control part CONT makes the application | coating part 3 implement the management operation for maintaining or improving the discharge state of the nozzle 32 using the period in which a board | substrate is not conveyed. The management unit 4 is used for the management operation.

As shown in FIG. 13, the control unit CONT moves the sentence frame 31 to the position of the management unit 4 by the moving mechanism 31c in the -X direction. After moving the sentence frame 31 to the position of the management part 4, the position of the sentence frame 31 is adjusted first, and the front-end | tip of the nozzle 32 is made to access the nozzle cleaning apparatus 43, and the said nozzle cleaning apparatus The nozzle tip 32c is cleaned by (43).

After the nozzle tip 32c has been cleaned, the nozzle 32 is accessed by the preliminary ejection mechanism 41. In the preliminary ejection mechanism 41, the opening 32a of the tip 32c of the nozzle 32 is moved to a predetermined position in the Z direction while measuring the distance between the opening 32a and the preliminary ejection surface, and the nozzle 32 The resist is preliminarily ejected from the opening 32a while moving in the -X direction.

After performing the preliminary ejection operation, the sentence frame 31 is returned to its original position. When the next board | substrate S is conveyed, as shown in FIG. 14, the nozzle 32 is moved to the predetermined position on a Z direction. In this manner, by repeatedly performing the coating operation and the preliminary ejecting operation of applying the resist film R to the substrate S, a high quality resist film R is formed on the substrate S. FIG.

As needed, for example, the nozzle 32 may be accessed in the dip tank 42 each time the manager 4 is accessed a predetermined number of times. In the dip tank 42, the drying of the nozzle 32 is prevented by exposing the opening 32a of the nozzle 32 to the vapor atmosphere of the solvent (thinner) stored in the dip tank 42.

As described above, according to the present embodiment, since the air openings 191 and 192 capable of opening the air are formed in the gas supply path of the gas blowing mechanism 160 and the suction path of the suction mechanism 170, At least one of the flow rate of the gas and the flow rate of the gas to be sucked can be alleviated. Thereby, the fluctuation | variation of the floating amount of the board | substrate S can be suppressed.

The technical scope of this invention is not limited to the said embodiment, A change can be suitably added in the range which does not deviate from the meaning of this invention.

For example, in the said embodiment, although the structure which provided the 1st conveyance mechanism 60 and the 2nd conveyance mechanism 61 each with the conveyers 60a, 61a was demonstrated, this invention is limited to this. There is no case.

As shown in FIG. 15, it can be set as the structure in which three conveyers 60a were formed in the rail 60c as the 1st conveyance mechanism 60. As shown in FIG. In addition, although illustration is abbreviate | omitted in FIG. 15, it can be set as the structure provided with three conveyers 61a also about the 2nd conveyance mechanism 61. As shown in FIG. In addition, in this description, the structure provided with three conveyers 60a and 61a is demonstrated, but this invention is not limited to this, Two or four or more conveyers 60a, 61a are provided in this description. It is applicable also to the structure provided with each.

In the structure shown in FIG. 15, it describes with the 1st conveyance machine 261, the 2nd conveyance machine 262, and the 3rd conveying machine 263 in order from the conveyance direction upstream of the board | substrate S. FIG. In addition, when these are named generically, it expresses with the conveyers 261, 262, and 263. FIG.

These conveyers 261, 262, 263 move on the rail 60c in a state in which each of them is synchronized at the time of conveyance of the substrate S. As shown in FIG. In addition, each conveyer 261, 262, 263 is capable of moving independently on the rail 60c at the time of non-conveying of the substrate S. FIG. According to this structure, the holding position of the board | substrate S in each conveyer 261, 262, 263 can be set arbitrarily according to the length of the board | substrate S to convey.

It is preferable to hold the vacuum pad 60b of the conveyer 261 within 250 mm from the edge part of the conveyance direction front side of the board | substrate S, and to make it within 80 mm. Specifically, the conveyer 261 holds the board | substrate S so that the distance W1 from the edge part of the conveyance direction front of the board | substrate S to the vacuum pad 60b may be within 80 mm.

In addition, it is preferable to keep the vacuum pad 60b of the conveyer 263 within 250 mm from the edge part of the conveyance direction back side of the board | substrate S, and to make it within 80 mm. Specifically, the conveyer 263 holds the board | substrate S so that the distance W2 from the edge part of the conveyance direction back of the board | substrate S to the vacuum pad 60b may be within 80 mm.

The substrates S are held uniformly by these carriers 261, 262, and 263, and the end of the substrate is prevented from sagging, and the large substrate S can be conveyed in a uniformly floating state. Therefore, it can prevent that a nonuniformity generate | occur | produces in the film which solidified the resist apply | coated on the large sized board | substrate S. FIG.

In addition, in the said embodiment, although the structure which the atmospheric opening 191, 192 was formed in both the gas blowing mechanism 160 and the suction mechanism 170 was demonstrated as an example, it is not limited to this. If the atmosphere opening is formed in at least one of the gas blowing mechanism 160 and the suction mechanism 170, compared with the conventional structure, the change of the floating amount of the board | substrate S can be suppressed.

In addition, in the said embodiment, when the dimension of the X direction of the processing stage 27 is t1, and the dimension of the X direction of the part which overlaps with the processing stage 27 in the board | substrate S is t2, the processing stage Although the case where the shielding ratio of (27) was made into shielding ratio = (t2 / t1) x 100 (%) was demonstrated as an example, it is not limited to this. For example, when the area of the stage surface 27c of the processing stage 27 when viewed from the Z direction is set to P1, and the area of the portion overlapping with the processing stage 27 in the substrate S is set to P2, It is good also as shielding ratio = (P2 / P1) * 100 (%).

CONT: control unit
S: Substrate
R: resist film
1: coating device
2: board | substrate conveyance part
3: coating part
27: processing stage
27c: stage surface
27a: gas outlet
27b: suction port
32: Nozzle
160: gas blowing mechanism
160c, 170c: Piping
170: suction mechanism
191, 192: atmospheric opening
191a, 192a: branch piping
191b, 192b: Gas Flow Adjustment Valve
191c, 192c: Flowmeter
191d, 192d: atmospheric opening

Claims (12)

An application portion having a nozzle for discharging the liquid body from the tip portion with respect to the substrate,
A floating portion having a guide surface for guiding the substrate and having a gas supply portion and a suction portion for floating the substrate with respect to the guide surface;
And a driving unit for driving at least one of the substrate and the nozzle while opposing the substrate and the tip portion in a floating state.
The gas supply unit includes a plurality of gas supply ports formed on the guide surface, a gas supply source for supplying gas to the plurality of gas supply ports, a first gas supply path whose one end is connected to the gas supply source, and the first gas supply Has a second gas supply path branched from the other end of the path and connected to each of the plurality of gas supply ports,
The suction part is branched from a plurality of suction ports formed on the guide surface, a suction source for sucking the plurality of suction ports, a first suction path having one end connected to the suction source, and the other end of the first suction path. Has a second suction path connected to each of the plurality of suction ports,
An application apparatus according to claim 1, wherein at least one of at least one of the first gas supply path and the first suction path is formed with an air opening capable of opening the air. The method of claim 1,
The atmospheric opening has a branching path branched from a portion of the path,
An application device wherein an atmospheric opening is formed at the tip of the branch path. The method of claim 2,
The said atmospheric opening part is a coating apparatus which has an adjustment valve which can adjust the opening degree of the said atmospheric opening. The method according to claim 2 or 3,
The said atmospheric opening part is a coating apparatus which has a flowmeter which measures the flow volume of the gas which distributes the said atmospheric opening. The method of claim 4, wherein
The atmospheric opening part is formed in the gas supply path,
The flow meter measures the flow rate of the gas flowing out of the air opening to the atmosphere. 6. The method according to any one of claims 2 to 5,
The atmospheric opening portion,
An adjustment valve capable of adjusting the opening degree of the atmospheric opening;
A flow meter for measuring the flow rate of the gas flowing through the atmospheric opening;
And a valve control unit for controlling the adjustment amount of the adjustment valve based on the measurement result by the flow meter. 7. The method according to any one of claims 1 to 6,
The floating portion has a stage formed at a position corresponding to the application portion,
The guide surface is formed on the stage. An application portion having a nozzle for discharging the liquid body from the tip portion with respect to the substrate,
A floating portion having a guide surface for guiding the substrate and having a gas supply portion and a suction portion for floating the substrate with respect to the guide surface;
And a driving unit for driving at least one of the substrate and the nozzle while opposing the substrate and the tip portion in a floating state.
The gas supply unit includes a plurality of gas supply ports formed on the guide surface, a gas supply source for supplying gas to the plurality of gas supply ports, a first gas supply path whose one end is connected to the gas supply source, and the first gas supply Has a second gas supply path branched from the other end of the path and connected to each of the plurality of gas supply ports,
The suction part is branched from a plurality of suction ports formed on the guide surface, a suction source for sucking the plurality of suction ports, a first suction path having one end connected to the suction source, and the other end of the first suction path. Has a second suction path connected to each of the plurality of suction ports,
As a coating method using the coating device in which the atmospheric opening part which can open | release air is formed in a part of at least one path | route of the said 1st gas supply path and the said 1st suction path,
The gas source and the suction source are operated with a portion of the path open to the atmosphere to form a layer of gas between the substrate and the guide surface through the gas supply port and the suction port, Floating the substrate with;
Moving the substrate and the nozzle relatively by driving at least one of the substrate and the nozzle while opposing the substrate and the tip portion in an injured state;
And discharging said liquid body from said tip portion of said nozzle with respect to said substrate, while moving said substrate and said nozzle relatively. The method of claim 8,
Floating the substrate includes adjusting the opening degree of an atmosphere opening formed in the atmosphere opening. 10. The method according to claim 8 or 9,
Floating the substrate, the coating method comprising measuring the flow rate of the gas flowing through the atmospheric opening formed in the atmospheric opening. 11. The method of claim 10,
Floating the substrate includes measuring at least one of a flow rate of the gas flowing out of the atmospheric opening to the atmosphere and a flow rate of the gas drawn from the atmosphere. The method according to any one of claims 8 to 11,
Floating the substrate,
Measuring the flow rate of the gas flowing through the atmospheric opening formed in the atmospheric opening;
The coating method which includes adjusting the opening degree of the said atmospheric opening opening according to the measurement result of the flow volume of the said gas.

Images