KR20120102504A - Evaporation source and deposition apparatus - Google Patents

Abstract

PURPOSE: An evaporator and a deposition apparatus are provided to reduce the length of a spray part by positioning the leading end of the spray part in an evaporating unit rather than a heat shielding unit. CONSTITUTION: An evaporator comprises a spray part, a heat shielding unit, and an anti-deposition unit. The spray part is installed in an evaporating unit, which heats and evaporates a deposition material, and sprays the evaporated deposition material toward a deposited body. The heat shielding unit has a plurality of metal plates(15) arranged in parallel and is installed closer to the deposited body than the leading end of the spray part is. The anti-deposition unit is formed into one body with a part of the metal plates to block the interval between the spray part and the heat shielding unit.

Description

Evaporation Source and Deposition Apparatus {EVAPORATION SOURCE AND DEPOSITION APPARATUS}

The present invention relates to an evaporation source and a vapor deposition apparatus for depositing a predetermined vapor deposition material on an object to be deposited.

As an apparatus which forms and forms a vapor deposition film in a predetermined | prescribed object, organic electroluminescent display, organic electroluminescent illumination, etc. are mentioned. Among these, organic EL displays are often used as low power consumption and light weight thin image display devices that do not require a backlight. As the structure, a predetermined vapor deposition film is formed as a thin film layer on a transparent glass substrate. Examples of the thin film layer include an organic EL thin film layer such as a light emitting layer, an injection layer, a transport layer, and an electrode layer for forming a metal wiring.

The vacuum vapor deposition method is mainly used for formation of each layer to the board | substrate. The vacuum vapor deposition method arrange | positions the evaporation source which discharge | releases the molecule | numerator of vapor deposition material to the chamber which maintained the high vacuum state of 10 <^-3> -10 <^-5> Pa. The evaporation source is composed of a crucible for encapsulating the vapor deposition material and a heater end face member. The crucible is heated at high temperature by a heater to evaporate or sublimate (hereinafter, evaporate) the vapor deposition material, and the nozzle of the crucible releases the molecules of the vapor deposition material outward. In the chamber, a substrate and a deposition mask (metal mask) in close contact with the substrate are disposed, and the deposition material evaporated from the crucible is deposited on the substrate. An opening of a predetermined pattern is formed in the deposition mask, whereby a thin film layer of the predetermined pattern is formed on the substrate.

The vapor deposition material is basically solid at room temperature, and is heated to a high temperature inside the crucible under high vacuum to evaporate. For this reason, radiation is generated from the nozzle part of an evaporation source, and it becomes a cause of the temperature rise of the board | substrate and vapor deposition mask arrange | positioned in this chamber. The substrate is a glass material, and the deposition mask is generally a metal material of low thermal expansion. Inva material, super inva material, 42-alloy, etc. are used as the material. In addition, more and more manufacturers aiming to produce TV boards are expanding today, and one side is more than 1.0m or 1.5m. For this reason, the misalignment of the vapor deposition mask and the board | substrate gradually increased.

The pattern of the thin film layer formed on a board | substrate requires very high precision, when dividing a thin film layer for every light emission color. For this reason, between a board | substrate and a vapor deposition mask, alignment (positioning) is strictly performed beforehand and it is closely_contact | adhered, and vapor deposition should be performed, maintaining this alignment precision. At this time, if a difference in thermal expansion between the substrate and the deposition mask is caused by the action of radiant heat, a dimension shift occurs between the pattern of the substrate and the deposition mask. In particular, when both of them become high temperature due to the radiant heat, a large position shift occurs, and accurate pattern formation cannot be performed.

The technique which arrange | positioned the heat insulation member (spinning stopper) on the crucible upper part is disclosed by this patent document 1 about this problem. In this technique, a radiation stopper for preventing the radiant heat of the crucible from acting on the substrate is provided on the top of the crucible. The crucible is provided with a projection for injecting vapor deposition material, and a radiation stopper is disposed around the projection. In order to prevent the evaporated vapor deposition material from adhering to the radiation stopper, the radiation stopper is provided at the same height or lower position than the ejection side opening of the projection.

Japanese Laid-Open Patent Publication No. 2004-214185

The exit side opening of the protrusion part of patent document 1 is comprised so that it may protrude more than a radiation stopper, or it will become the same height position. For this reason, the front end part of a protrusion part is exposed toward a board | substrate and a vapor deposition mask from a radiation stopper. Since the protrusions radiate heat to the surroundings, a temperature decrease occurs.

The protrusion is a passage path for the evaporated evaporation material, and if it is a high temperature, there is no particular problem, but the deposition material attached to the inner surface of the hole of the protrusion is deposited with a temperature drop below a certain temperature. Then, the deposition material precipitated on the inner surface of the hole gradually grows, finally blocking the vicinity of the tip of the hole of the protruding portion, causing clogging. If the protrusion is clogged, the vapor deposition operation cannot be continued, and the vacuum state of the vacuum chamber must be released to perform maintenance.

In addition, since the crucible is in a very high temperature state, in order to prevent the action of radiant heat from reaching the substrate or the deposition mask, it is necessary to give the radiation blocking member a high heat shielding function. Usually, the radiation stopper called the reflector which laminated | stacked and laminated | stacked the mirror which is a mirror surface of two or more sheets is formed, but when it consists of one sheet, the thickness of the board | plate material of material with low thermal expansion rate should be made thick. Therefore, it is difficult to make it thin as the total thickness of a radiation stopper.

In the conventional method, the protrusions protrude more than the radiation stopper, and therefore the length of the protrusions should be configured to be longer than the thickness of the radiation stopper. For this reason, the total length of the protrusion which becomes the passage path of vaporized vapor deposition material becomes long. For this reason, the longer the protrusion, the greater the heat dissipation due to radiation to the surroundings, and the more easily the deposition material is deposited inside the hole, and the more easily the blockage occurs at the protrusion (particularly in the region near the tip).

Therefore, an object of the present invention is to block radiant heat of the crucible and to prevent clogging of the nozzle.

In order to solve the above problem, the 1st evaporation source of this invention is provided in the evaporation means which heats and vaporizes a vapor deposition material, and arrange | positions in parallel with the injection part which injects the vaporized vapor deposition material toward a vapor deposition object, A heat shield means having a plurality of metal plates, the metal plate being the closest to the vapor-deposited body among the metal plates at a position closer to the vapor-deposited body than the distal end surface of the injection section, and a part of the plurality of metal plates constituting the heat shield; It is comprised so that it is equipped with the anti-glare means which closes between the said injection part and the said heat shield means.

According to this evaporation source, the distal end face of the injection portion is located on the inner layer side than the outermost layer of the heat shielding means. Thereby, since the injection part can be arrange | positioned in the high temperature area inside a heat shield means, and the length of an injection part can be comprised shortly, clogging | blocking in an injection part does not arise. Since the vapor deposition material evaporated from the injection portion is blocked by the adhesion means, it is not attached to the heat shield means. In addition, since the adhesion means becomes a high temperature state by the heat of the heat shielding means, the deposition material is deposited on the adhesion means and there is no solidification.

Moreover, a 2nd evaporation source is a 1st evaporation source, The said adhesion means was comprised using the metal plate of 1 sheet among the some metal plate which comprises the said heat shield means.

According to this evaporation source, since the same metal plate as the metal plate of a heat shield means is used as an adhesion means, the heat which a heat shield means has can be transmitted to an adhesion means efficiently. In addition, since there is no need to prepare a dedicated metal plate for the adhesion means, the configuration is simplified.

The third evaporation source is a second evaporation source, and the deposition means has a concave shape in which the opening area on the evaporation means side is the narrowest and the opening area gradually widens toward the deposition target side.

According to this evaporation source, the attachment means has a concave shape in which the opening area gradually widens. Since the vapor deposition material injected from the injection portion diffuses and scatters, the vapor deposition means does not limit the scattering direction of the vapor deposition material by increasing the opening area of the vapor deposition means.

Moreover, the 4th evaporation source is a 3rd evaporation source, It characterized by protruding the front end surface of the said injection part from the site | part of the base end side of the said adhesion means.

According to this evaporation source, since the front end surface of the injection part protrudes from the adhesion means, the vapor deposition material injected by the injection part does not adhere to the inside of the adhesion means.

The fifth evaporation source is a third evaporation source, characterized by protruding a portion of the distal end side of the anti-deposition means from a surface of the housing means that accommodates the heat shielding means to face the deposition target.

According to this evaporation source, by adhering the front end side of the adhesion means to the substrate facing surface of the housing means, it is possible to suppress the deposition material from adhering to the housing means.

In addition, the sixth evaporation source is a second evaporation source, and the metal plate constituting the adhesion means is a metal plate constituting the heat shielding means at which the deposition material is not solidified, and the metal plate having the lowest temperature is used. Characterized in that configured.

According to this evaporation source, the metal plate of the adhesion means can avoid clogging of the injection section by selecting a metal plate having heat that the vapor deposition material does not solidify. In addition, by selecting the metal plate of the lowest temperature among the metal plates having heat that the vapor deposition material does not solidify, it is possible to prevent excessively high temperature of the deposition preventing means exposed to the external space.

The seventh evaporation source is characterized in that the tip end surface of the injection section is positioned at a position of a metal plate having a temperature at which the deposition material is not solidified among the plurality of metal plates constituting the heat shielding means.

According to this evaporation source, the entire length of the injection section is limited to the length to be placed under a temperature condition in which the vapor deposition material does not solidify, thereby preventing clogging of the injection section. In addition, by allowing the injection section to be formed up to the position, it is possible to give a predetermined directivity to the vapor deposition material to be injected.

Moreover, the vapor deposition apparatus of this invention becomes a vapor deposition apparatus which arrange | positioned the evaporation source in any one of 1st-7th. The evaporation source of the present invention can be applied to a vapor deposition apparatus for producing an organic EL device such as an organic EL display or organic EL illumination.

In the present invention, since the distal end face of the injection portion is provided on the evaporation means side rather than the heat shield means for blocking heat of the evaporation means, the entire injection portion can be arranged in a high temperature state, and the length of the injection portion can be shortened. As a result, the radiant heat is shielded and clogging of the injection portion is prevented. In addition, since the deposition prevention means for closing the injection portion and the evaporation means is provided, the deposition material does not adhere to the heat shielding means, and since the deposition protection means is in a high temperature state, the deposition material is solidified in the deposition protection means. Work disappears, too.

1 is a diagram illustrating a configuration of an evaporation source.
FIG. 2 is a diagram in which the deposition material is deposited from the evaporation source toward the side.
3 is a cross-sectional view of the evaporation source.
It is a figure explaining an example which used the metal plate of the reflector as a cover member.
It is a figure explaining the other example which used the metal plate of the reflector as a cover member.
6 is a view for explaining an example in which the cover member is joined to the reflector by welding.
FIG. 7 is a diagram illustrating a configuration of an evaporation source when the cover member is configured in a funnel shape. FIG.
8 is a diagram in which the deposition material is deposited upward from the evaporation source.
9 is a view for explaining an example of the vacuum deposition apparatus.
10 is a schematic diagram of a system having a plurality of vacuum deposition chambers.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described with reference to drawings. FIG. 1 shows the outline of the evaporation source 1 of the present invention, and FIG. 2 shows an example in the case of performing vapor deposition using the evaporation source 1. In the arrows shown in FIGS. 1 and 2, the Z direction is the gravity direction, and two directions of X and Y form the horizontal plane direction. In addition, although the case where a predetermined organic thin film layer is deposited on the board | substrate which comprises an organic electroluminescent display is demonstrated below, it is not limited to this. For example, a metal thin film layer, an inorganic thin film layer, or the like may be deposited. In addition, the organic thin film layer constituting the organic EL illumination may be deposited instead of the organic EL display.

As shown in FIG. 2, the evaporation source 1 is an apparatus for depositing the vapor deposition material M onto the substrate 2. The substrate 2 is a vapor-deposited body for depositing the vapor deposition material M, and deposits the vapor deposition mask (metal mask) 3 in close contact with the substrate. In the deposition mask 3, a predetermined mask pattern 3A is formed as a through region, and the deposition material M is deposited on the substrate 2 through the mask pattern 3A. In the case of the organic thin film layer which comprises an organic electroluminescent display, materials, such as a light emitting layer, an injection layer, a transport layer, become a vapor deposition material M, and in the case of the electrode layer which forms a metal wiring, this material becomes a vapor deposition material M. FIG.

The substrate 2 should be formed with an accurate pattern. For this purpose, the substrate 2 and the deposition mask 3 are strictly aligned. The substrate 2 is a glass material, and the deposition mask 3 is a metal material (for example, a nickel-based alloy (Inba) or the like). Therefore, the vapor deposition mask 3 which is a metal material has a lower thermal expansion coefficient than the board | substrate 2 which is a glass material. Thereby, when high temperature acts on the board | substrate 2 or the vapor deposition mask 3, the position shift based on the difference of a thermal expansion coefficient between the board | substrate 2 and the vapor deposition mask 3 will arise.

As shown in FIG. 1, the evaporation source 1 is roughly comprised with the crucible 5, the reflector 6, the housing | casing 7, and the cover member 8. As shown in FIG. The crucible 5 is a vapor-shaped evaporation means in which a vapor deposition material M is provided inside. This vapor deposition material M is previously filled in the crucible 5 in a solid state or the like. On the outer circumferential surface of the crucible 5, a heater 11 is provided as a heating means for heating the crucible 5. By the heating action of the heater 11, the crucible 5 is brought to a high temperature state, and the internal vapor deposition material M is evaporated.

In the figure, the crucible 5 has four surfaces (upper surface 5A, lower surface 5B, first side surface 5C, and second side surface 5D). Among these, the heater 11 is attached to the upper surface 5A and the lower surface 5B. Of course, you may make it attach the heater 11 to arbitrary surfaces. The nozzles 12 are arranged in the first direction 5C in one row in the Y direction. The nozzle 12 is an injector for injecting the deposition material M, the proximal end of which is opened in the crucible 5, and the evaporation material M evaporated from the distal end surface (the nozzle distal end surface 13) is sprayed. do. The through hole is formed in the nozzle 12, and directivity is provided to the vapor deposition material M to which this through hole is injected. Therefore, the nozzle 12 has a length sufficient to impart directivity.

The reflector 6 (6A-6D) is a heat shielding means for insulating the radiant heat of the crucible 5 (heater 11), and is arrange | positioned so that the crucible 5 may be enclosed. The reflector 6 is comprised from the some metal plate 15, and each metal plate 15 is a metal material made from stainless steel, molybdenum, tungsten, or the like. And the surface of each metal plate 15 is mirror-polished, and the energy of the radiant heat radiated | emitted outside is reduced by making emissivity small.

The reflector 6 has the structure which arrange | positioned the some metal plate 15 in parallel at predetermined intervals, and has the structure where the metal plate 15 and the space were laminated | stacked in multiple layers. For this reason, although the thickness of the single-piece | plate of the metal plate 15 is comprised thinly, as a whole, the thickness of the reflector 6 becomes thick. The reflector 6 is arrange | positioned so that the circumference | surroundings of the crucible 5 may be made, and the reflector 6 of the point corresponding to each surface 5A-5D of the crucible 5 shall be 6A-6D. In the example of FIG. 1, although the reflectors 6A-6D are provided separately, you may comprise each metal plate 15 of the reflectors 6A-6D each. Among these, the reflector 6C is provided with a strip | belt-shaped opening part (reflector opening part 6E). The reflector opening 6E is formed at the point where the nozzles 12 arranged in one row are exposed to the crucible 5.

The housing 7 is a housing means for receiving the reflector 6 (and the crucible 5). The housing 7 has a box shape, and the surface corresponding to the surface 7C (the first side surface 5C) of the four peripheral surfaces 7A to 7D (corresponding to 5A to 5D) is opposed to the substrate. A narrow opening (housing opening 7E) is formed in a part of strip | belt form. The housing opening 7E is provided on the side of the same surface as the reflector opening 6E, and the nozzle 12 is exposed to the external space through the housing opening 7E and the reflector opening 6E. In addition, the housing opening 7E has a larger opening area than the reflector opening 6E.

As shown in FIG. 3, the cover member 8 closes between the nozzle 12 (the nozzle tip surface 13) and the reflector 6, so that the vapor deposition material M injected from the nozzle 12 is reflected ( 6) Anti-corrosion member installed so as not to attach to. The cover member 8 is detachably attached to the housing 7, and can be maintained by removing the cover 7 and the cover member 8. Moreover, the reflector 6 is also attached to the housing 7 so that attachment and detachment are possible, and it is possible to remove the reflector 6 and perform maintenance.

The cover member 8 is comprised using the metal plate 15 of one piece among the some metal plate 15 which comprises the reflector 6C. The cover member 8 is formed in a concave shape, and is formed so that the opening area gradually widens from the proximal side (the side near the crucible 5) toward the distal end side (the side near the substrate 2). Therefore, the tapered surface 8T is formed in the cover member 8.

In the structure of the surface 7C side of the housing 7, the area | region of the reflector 6C has a structure which laminated | stacked the some metal plate 15 at predetermined space | interval, but the site | part of the cover member 8 is one metal plate. (15) is provided. Therefore, when looking at the housing 7 on the basis of the board | substrate 2, the thickness of the cover member 8 becomes thinner than the thickness of the reflector 6C.

In order not to directly affect the high heat of the crucible 5 on the cover member 8, the cover member 8 and the crucible 5 are installed in a non-contact manner. On the other hand, the nozzle tip surface 13 of the nozzle 12 is made to protrude in the outer space (the space which the board | substrate 2 faces) of the cover member 8. As shown in FIG. To this end, nozzle exposure holes 16 for protruding the nozzle 12 are formed in the proximal end of the cover member 8 so as to be arranged in one row in the Y direction. In the example of FIG. 1 and FIG. 3, the bottom surface is formed in the base end side of the cover member 8, and the nozzle exposure hole 16 is formed in the bottom surface. Thereby, the nozzle 12 can protrude toward the external space from each nozzle exposure hole 16. The nozzle exposure hole 16 has a diameter slightly larger than that of the nozzle 12 so that the gap between the cover member 8 and the nozzle 12 is as far as possible while making the cover member 8 and the nozzle 12 non-contact. It is small.

In the present invention, the metal plate 15 (metal plate 15 close to the most substrate 2 closest) of the outermost layer of the reflector 6C is disposed closer to the substrate 2 than the nozzle tip surface 13 of the nozzle 12. Doing. In other words, the nozzle front end surface 13 is comprised so that it may be located in the inner layer side rather than the metal plate 15 of the outermost layer of the reflector 6. As shown in FIG. The reflector 6C has a multilayered laminated structure of the metal plate 15 and the space, and the heat flow rate decreases for each layer. Thereby, even if the temperature of the crucible 5 is very high temperature, the heat is hardly transmitted to the outermost layer of the reflector 6C. Accordingly, in the reflector 6C, the temperature is gradually increased from the outermost layer (layer closest to the substrate 2) to the innermost layer (layer closest to the crucible 5).

Here, the inner surface of the hole of the nozzle 12 is a passage path of the vapor deposition material M. As shown in FIG. When the nozzle 12 is in a low temperature state, the deposition material M attached to the inner surface of the hole is cooled and precipitated. Then, the deposited and solidified deposition material M gradually grows, thereby clogging the nozzle 12 and finally causing nozzle clogging. Thereby, the vapor deposition operation | work on the board | substrate 2 cannot continue, and it is necessary to cancel a vacuum state and to perform maintenance.

As described above, the reflector 6C is gradually changing in temperature, and each stage radiates energy radiantly proportional to the fourth power of each temperature, for example, when the surface states are the same, that is, the emissivity is the same. In this case, the discharge energy to the outside of the crucible 5 can be reduced to one (single +1). For this reason, the influence which the heat dissipation state of an outermost layer has on the crucible 5 can be reduced. When the temperature of the n-stage reflector is conducted to the cover member 8 by using the temperature decrease in this step, the nozzle 12 is prevented from cooling, and the deposition material M attached to the inner surface of the hole precipitates. There is no solidification. Thereby, occurrence of nozzle clogging can be avoided.

The nozzle 12 is not affected by the thickness of the reflector 6C. That is, since the nozzle front end surface 13 of the nozzle 12 should be located in the inner layer side rather than the metal plate 15 of the outermost layer of the reflector 6C, the thickness of the reflector 6C is improved in order to improve the heat shield function. Even if the thickness is extremely thick, the entire length of the nozzle 12 need not be configured long. Thereby, the whole length of the nozzle 12 can be comprised short, and the heat radiation from the nozzle 12 can be suppressed.

At this time, at least one metal plate 15 of the reflector 6 is located on the substrate 2 side than the nozzle tip surface 13. Thereby, since the metal plate 15 is located in the injection direction of the vapor deposition material M, there exists a possibility that the vapor deposition material M may adhere to the reflector 6. If the vapor deposition material M adheres to the metal plate 15, heat insulation function will fall and it will become impossible to shield radiant heat. Therefore, the cover member 8 as an adhesion member is interposed between the nozzle 12 and the reflector 6. Thereby, since the cover member 8 protects the reflector 6, the vapor deposition material M does not adhere to the reflector 6. As shown in FIG. The cover member 8 is provided in order not to adhere the vapor deposition material M to the reflector 6 to the last, and does not have a heat shield function. Therefore, even if the vapor deposition material M is affixed on an adhesion member, there is no influence on heat shielding function.

And the cover member 8 is comprised using the metal plate 15 of 1 sheet among the reflectors 6C. That is, one metal plate 15 of the plurality of metal plates 15 has the functions of both the cover member 8 and the reflector 6, in other words, a part of the metal plate 15 constituting the reflector 6. ) Is integrally formed with the cover member 8. As described above, the metal plate 15 is subjected to the action of heat by the heat shielding function, and although the temperature is different step by step, each metal plate 15 maintains a high temperature state.

By using the metal plate 15 of this high temperature state as the cover member 8, the cover member 8 can be made into a high temperature state. The cover member 8 is attached with the deposition material M sprayed from the nozzle 12. When the cover member 8 is in a low temperature state, the deposited deposition material M is precipitated and solidified. When the solidified deposition material M grows slowly, the nozzle tip surface 13 is blocked, which results in the same result as clogging of the nozzle. Therefore, by using the one metal plate 15 constituting the reflector 6 as the cover member 8 to maintain a high temperature state, even if the vapor deposition material M adheres to the cover member 8, it evaporates and precipitates. Work disappears.

In addition, the cover member 8 has the narrowest opening area at the proximal end and gradually enlarges the opening area toward the distal end side. For this purpose, the metal plate 15 which has the function of both the reflector 6C and the cover member 8 is made into the shape toward the board | substrate at the periphery of the housing opening 7E. And the taper surface 8T which faces the crucible 5 from the front end is formed.

The vapor deposition material M injected from the nozzle front end surface 13 scatters so that it may diffuse. The nozzle front end surface 13 is provided in the recessed position with reference to the surface 7C of the housing 7, and the cover member 8 is located in the scattering direction. Therefore, by forming the opening area of the cover member 8 so as to gradually expand from the base end side toward the tip side, the cover member 8 does not restrict the scattering direction of the vapor deposition material M. FIG. Thereby, the vapor deposition material M can be vapor-deposited in the desired range of the board | substrate 2, and it can prevent that unnecessary vapor deposition material M adheres to the cover member 8. As shown in FIG.

In this regard, if the inclination angle of the tapered surface 8T of the cover member 8 is made larger than the diffusion angle of the vapor deposition material M to be injected, it is possible to prevent the deposition material M from adhering to the cover member 8 further. Can be. However, in this case, the opening area of the housing opening 7E of the housing 7 becomes large, and there is a possibility of raising the temperature unnecessarily in the external space. Thus, by making the inclination angle of the tapered surface of the cover member 8 parallel (or approximately parallel angle) to the diffusion angle of the deposition material M, the temperature is not unnecessarily raised in the external space and the deposition material M It is not necessary to limit the scattering direction of).

Moreover, the cover member 8 is comprised integrally with the metal plate 15 of the reflector 6 of a high temperature state, and is non-contact with the housing 7. The housing 7 is exposed to the external space, and ideally maintains a normal temperature state. For this reason, when the housing 7 and the cover member 8 come into contact with each other, heat applied to the cover member 8 is dispersed in the housing 7, the temperature of the housing 7 rises, and the cover member 8 ) Decreases in temperature. Thereby, there exists a possibility that the vapor deposition material M adhering to the cover member 8 may precipitate and solidify. For this reason, by making the cover member 8 non-contact with the housing 7, the temperature fall of the cover member 8 by heat dispersion can be avoided.

The nozzle front end surface 13 of the nozzle 12 is made to protrude more than the nozzle exposure hole 16 provided in the base end side of the cover member 8. Thereby, the vapor deposition material M injected from the nozzle front end surface 13 does not return from the inner side of the cover member 8 (inner side of the housing 7), and adheres to the reflector 6.

Moreover, the site | part of the front end side of the cover member 8 is projected toward the board | substrate 2 rather than the surface 7C (surface facing the board | substrate 2) of the housing | casing 7. As shown in FIG. The vapor deposition material M sprayed from the nozzle 12 has directivity, and the vapor deposition material M after spraying is hardly attached to the housing 7, but an extremely small amount of vapor deposition material M is retained in the housing 7. ) May be attached. Therefore, since the housing 7 is behind the cover member 8 by protruding the site | part of the front end side of the cover member 8, there exists no possibility of being attached.

In addition, as mentioned above, although the cover member 8 is comprised using one piece of each metal plate 15 of the reflector 6C, you may use arbitrary metal plates 15 as the cover member 8. Although the outermost layer metal plate 15 is used as the cover member 8 in FIG. 4, you may make it use the 2nd layer from an outermost layer like FIG. However, the metal plate 15 of the outermost layer is the lowest temperature, and the metal plate 15 of the innermost layer is the highest temperature. Therefore, the optimum metal plate 15 is selected from each metal plate 15 and used as the cover member 8.

The metal plate 15 of the reflector 6C is used as the cover member 8 in order to keep the cover member 8 at a high temperature and not to solidify the deposited vapor deposition material M. FIG. Therefore, what is necessary is just to make the cover member 8 have the minimum temperature which vapor deposition material M does not solidify, and it is not necessary to provide more temperature. On the contrary, when the cover member 8 is unnecessarily high in temperature, extra heat is applied to the external space. Since the temperature of the reflector 6C decreases step by step from the innermost layer toward the outermost layer, the metal plate 15 positioned in the layer having the temperature at which the evaporation material M is not solidified is used. As a result, it is possible to prevent the deposition of the vapor deposition material M while not giving an unnecessary temperature rise to the external space.

The temperature at which the deposition material M is precipitated and solidified depends on the type of the deposition material M. Therefore, according to the kind of vapor deposition material M which filled the crucible 5, the metal plate 15 which can supply the heat amount of the minimum temperature which does not solidify to the cover member 8 can be selected from the some metal plate 15. FIG. . Thereby, the optimal metal plate 15 according to the vapor deposition material M can be selected.

Moreover, the nozzle 12 can be comprised by the length to the position of the metal plate 15 which has the temperature which vapor deposition material M does not solidify. In order to avoid unnecessary heat dissipation, the length of the nozzle 12 is preferably short. However, in order to give directivity to the vapor deposition material to be sprayed, the length of the nozzle 12 is set to a certain length. It is permitted to make the temperature situation high surface nozzle 12 long in which the vapor deposition material M does not solidify. Thereby, sufficient directivity can be provided to the vapor deposition material M sprayed from the nozzle 12, and it can prevent that the nozzle 12 is clogged.

Although the cover member 8 mentioned above used one of the metal plates 15 which comprise the reflector 6, as shown in FIG. 6, the metal plate 21 different from the reflector 6 is prepared, and the said metal plate You may integrate 21 with the arbitrary metal plate 15 of the metal plate 15 of the reflector 6 by welding. Thereby, heat is transmitted from the metal plate 15 of the reflector 6 to the integrated metal plate 21, and it can be made high temperature.

In addition, as shown in FIG. 7, the cover member 8 can also be comprised in funnel shape. The nozzle 12 is configured to be inserted into the funnel-shaped tip portion (the portion where the opening area does not change) 8A, and the tip portion 8A and the nozzle 12 are brought into close contact with each other while maintaining non-contact. . Thereby, the reflector 6C and the nozzle 12 become very close. By this structure, the opening area of the reflector opening 6E can be narrowed, and the influence of radiant heat can be minimized. In addition, by providing the cover member 8 (a portion in which the opening area of the opening does not change) along the nozzle 12, the gap between the reflector 6C can be closed.

At this time, it is preferable that the nozzle tip surface 13 is located at a portion that moves from the tip portion 8A of the funnel-shaped cover member 8 to the portion of the tapered surface 8T. As a result, the opening area of the reflector opening 6E can be minimized, and the gap between the reflector 6C can be closed.

In the example of FIG. 1, although the vapor deposition material M was injected from the evaporation source 1 toward the side (horizontal direction), as shown in FIG. 8, the evaporation source 1 is comprised so that the nozzle 12 may face upward. You may also At this time, the substrate 2 and the deposition mask 3 are disposed above the evaporation source 1, and the vapor deposition material M is injected from the evaporation source 1 upwards (vertical direction).

9 shows an example of the vacuum deposition apparatus 30 including the evaporation source 1. The vacuum vapor deposition apparatus 30 comprises the predetermined | prescribed chamber (vacuum vapor deposition chamber), and the internal space is made into a vacuum state by the vacuum pump 31 (VP in the figure) being air purged. The board | substrate 2 and the vapor deposition mask 3 are conveyed in the state which stood in the vertical direction, and are stopped at the predetermined position of the vacuum vapor deposition apparatus 30. FIG. The evaporation source 1 is fixed to the moving table 32 and mounted, and the moving table 32 moves along the rail 33 provided on the wall surface of the vacuum deposition apparatus 30. The ball screw 34 is provided as a drive means, and the movement table 32 moves to a vertical direction by extending the rail 33 to a vertical direction (Z direction). Therefore, the evaporation source 1 mounted on the movement table 32 also moves in the vertical direction.

The board | substrate 2 has a large area, and moves by moving the moving table 32 to which the evaporation source 1 was fixed, and performs vapor deposition. In this example, the evaporation source 1 is movable, but the substrate 2 may be moved. The evaporation source 1 is provided with a rate sensor 35 for measuring the film thickness of the injected vapor deposition material M, and monitors the deposition status.

10 shows an example of a system 40 constituted by a plurality of vacuum deposition apparatuses 30. In this system 40, the board | substrate movement apparatus 41-43, the relay chamber 44-47, and the vacuum deposition chamber (vacuum vapor deposition apparatus) 48-59 are comprised. Each vacuum deposition chamber 48 to 59 deposits a different deposition material M onto the substrate 2, respectively. For example, a hole injection layer or an electron injection layer for an injection layer, a hole transport layer or an electron transport layer for a transport layer, and a light emitting layer of three colors of R (red), G (green), and B (blue) for an emission layer, or an anode layer for an electrode layer. Like the and the cathode layer, different deposition materials M are deposited respectively.

In the example of FIG. 10, four vacuum deposition chambers 48-51, 52-55, and 56-59 comprise one stage, and the stage structure of a total of three stages is carried out. The substrate transfer device 41 moves the substrate to each chamber of the stage of the first stage, 42 of each chamber of the stage of the second stage, and 43 of each chamber of the stage of the third stage. The relay chambers 44 to 47 are provided as relay points for transferring the substrate to the next stage.

In the case of the organic EL display, a plurality of organic thin film layers are formed on the substrate 2 so that the organic thin film layer can be sequentially stacked on the substrate 2 by constructing the system 40 as shown in FIG. do.

1 Evaporation Source 2 Substrate
3 deposition masks and 5 crucibles
6 Reflector 6E Reflector Opening
7 Housing 7E Housing Opening
8 Cover member 11 Heater
12 Nozzle 13 Nozzle Tip
15 metal plate 16 nozzle exposed hole
30 vacuum deposition apparatus 40 system
M deposition material

Claims (8)

An injection unit which is provided in the evaporation means for heating and evaporating the evaporation material, and injects the evaporated evaporation material toward the deposition object;
Heat shielding means having a plurality of metal plates arranged in parallel and having a metal plate closest to the vapor deposition body among the metal plates at a position closer to the vapor deposition body than the distal end surface of the injection section;
An evaporation source comprising integrally with a part of a plurality of metal plates constituting said heat shield means, and anti-glare means for blocking between said injection portion and said heat shield means. The method of claim 1,
The said anti-sticking means was comprised using the metal plate of 1 sheet among the some metal plate which comprises the said heat shielding means, The evaporation source characterized by the above-mentioned. The method of claim 2,
The vapor deposition means is configured to have a concave shape in which the opening area on the evaporation means side is the narrowest and the opening area gradually widens toward the vapor deposition body side. The method of claim 3,
An evaporation source characterized by protruding the distal end surface of the jetting portion from a portion at the most proximal end side of the adhesion means. The method of claim 3,
An evaporation source characterized by protruding a portion of the most proximal side of the anti-deposition means from a surface of the housing means that accommodates the heat shield means to face the deposition target. The method of claim 2,
The metal plate which comprises the said adhesion means is the evaporation source comprised using the metal plate which is the temperature which the said vapor deposition material does not solidify among the metal plates which comprise the said heat shield means, and has the lowest temperature among them. The method of claim 2,
An evaporation source, characterized in that the distal end surface of the injection section is positioned at a position of a metal plate having a temperature at which the deposition material is not solidified among the plurality of metal plates constituting the heat shielding means. The vapor deposition apparatus which arrange | positioned the evaporation source in any one of Claims 1-7.

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