JP2015021170A - Vacuum vapor deposition device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vacuum vapor deposition device capable of stably reducing temperature rise of a substrate due to radiation heat from an environment inside a vacuum vessel for a long time.SOLUTION: The vacuum vapor deposition device has: an adhesion prevention part for preventing a vapor deposition material radiated from an evaporation source from being adhered to an inner wall of a vacuum vessel; and a heat shielding part having a frame part, an opening provided on the frame and introducing the vapor deposition material radiated from the evaporation source to the adhesion prevention part, a vane part provided on one part of an outer periphery of the opening, and adhesion prevention means for absorbing radiation heat from the adhesion prevention part, and preventing the vapor deposition material radiated from the evaporation source from being adhered to the vane part, and isolated from the adhesion prevention part.

Description

  The present invention relates to a vacuum deposition apparatus for forming a deposition material on a substrate or the like when producing an organic electroluminescence (EL) display or organic EL lighting.

  In recent years, organic EL elements have attracted attention as a new industrial field. Organic EL displays are expected as next-generation displays that replace liquid crystal displays and plasma displays, and organic EL lighting is expected as next-generation lighting along with LED lighting.

  An organic EL device has a structure in which a multilayer structure in which a light emitting layer made of an organic compound, a hole injection layer, a hole transport layer, an electron transport layer, an electron injection layer and the like are stacked is sandwiched between electrode pairs composed of an anode and a cathode. ing. By applying a voltage to the electrode, holes are injected from the anode side and electrons are injected from the cathode side into the light emitting layer, and light is emitted by deactivation of excitons (excitons) generated by recombination.

  The organic material forming the light emitting layer includes a high molecular material and a low molecular material. Among these, low molecular weight materials, which are currently mainstream, are formed by vacuum deposition. Vacuum deposition is also used when forming other layers. In order to improve performance, doping or alloying by co-evaporation is also performed.

  An evaporation source used for vacuum deposition includes a crucible that encloses a deposition material, an opening that ejects (radiates) the deposition material, a heater that heats the crucible, a crucible, and a housing that stores the heater. Each layer is formed by evaporating or sublimating the vapor deposition material from a crucible heated by a heater and spraying the vapor deposition material vaporized from a nozzle onto a substrate placed in a vacuum vessel. In order to create an organic EL element for color display, an organic EL material that emits light of different colors is formed separately for each pixel while the substrate and the evaporation mask are aligned.

As one of background arts in this technical field, there are, for example, Patent Document 1 and Patent Document 2.
In Patent Document 1, in order to prevent the evaporated vapor deposition material from being deposited at the portion where the temperature of the opening of the vapor deposition source decreases, “the cell 11 in which the vapor deposition material M is housed and the side wall member 13 are contained. The heating means 13A is provided between the cell cap 12 and the cell cap 12 in which the vapor discharge opening 12A for the vapor deposition material is formed in the upper part of the cell 11, and the opening corresponding to the vapor discharge opening formed in the cell cap. A heat shield plate 16 made of SUS or tantalum and having an opening corresponding to the vapor discharge opening is provided between the lid 15 and the lid 15. The heat shield plate made of a material having low thermal conductivity is provided around the opening. It is described that it is possible to appropriately maintain the temperature and prevent the phenomenon of solidifying around the opening due to a decrease in temperature.

  In Patent Document 2, in a film forming apparatus that forms a film on an object by attaching particles from a material source to the object, peeling of a film formed on a surface other than the film formation surface of the object is sufficiently suppressed. For this reason, it is described as “including a deposition plate 5 in which a plurality of fins 52 arranged in an angle direction smaller than a state perpendicular to the particle flying direction and arranged in the chamber 1 are arranged”. Yes.

JP 2005-54270 A JP 2008-144214 A

  Recently, with the increase in size and definition of organic EL displays, thermal expansion of the evaporation mask due to radiant heat from the evaporation source in the vacuum evaporation apparatus and misalignment between the thermally expanded evaporation mask and the substrate become more problematic. Yes. In particular, when depositing a metal film, it is necessary to reduce the temperature rise by radiant heat to the substrate of the evaporation source in order to prevent the temperature rise damage of the organic layer deposited on the substrate in the previous process, especially the vapor pressure is low. This is an important issue in metal deposition that requires high-temperature heating. It is also important to prevent device characteristics from deteriorating due to contamination of the organic layer due to contamination in the vacuum container storing the evaporation source, the substrate, and the like. Reduction of contamination in the vacuum vessel is also important for facilitating maintenance of the vapor deposition apparatus.

  Patent Document 1 describes a vapor deposition source including a heat shield plate that prevents solidification around the opening of the vapor deposition material. In Patent Document 2, particles (evaporation material) flying on the surface other than the film formation surface of the object are actively deposited on a plurality of fins, the vapor deposition area is enlarged, and formed on the surface other than the film formation surface of the object. A technique for reducing the film thickness and suppressing film peeling is described.

  However, Patent Document 1 and Patent Document 2 do not consider the temperature rise of the substrate due to radiant heat from the environment inside the vacuum vessel.

  Therefore, the present invention provides a vacuum vapor deposition apparatus that can stably reduce at least one of substrate temperature rise due to radiant heat from the environment inside the vacuum vessel and thermal expansion of the vapor deposition mask over a long period of time.

  In order to solve the above problems, for example, the configuration described in the claims is adopted. The present application includes a plurality of means for solving the above-described problems. If a first example is given, an adhesion preventing portion that prevents the vapor deposition material radiated from the evaporation source from adhering to the inner wall of the vacuum vessel. An opening for guiding the vapor deposition material provided on the frame, the frame, and radiated from the evaporation source, to the anti-adhesion, and a vane provided on an outer periphery of the opening and the anti-adhesion An adhesion preventing means that absorbs radiant heat from the portion and prevents the vapor deposition material radiated from the evaporation source from adhering to the wing plate portion, and is provided with a shield provided apart from the adhesion preventing portion. And a heat part.

  Further, as a second example, an adhesion preventing portion that prevents the vapor deposition material radiated from the evaporation source from adhering to the inner wall of the vacuum vessel, and radiant heat radiated from the evaporation source are guided to the adhesion preventing portion. A plurality of openings, a slat that absorbs radiant heat from the adhesion-preventing part, and a frame that includes the plurality of openings and the slats, and from the evaporation source through the openings. The wing plate is disposed so that the deposition part can be desired and the deposition target cannot be desired from the deposition part, and a heat shield part provided apart from the deposition part; It is characterized by having.

  Furthermore, as a third example, the deposition material for preventing the vapor deposition material radiated from the evaporation source from adhering to the inner wall of the vacuum vessel, and absorbing the radiation heat from the deposition portion, And a heat shield part provided with an adhesion preventing means for preventing the vapor deposition material radiated from the evaporation source from adhering to the blade part.

  ADVANTAGE OF THE INVENTION According to this invention, the vacuum evaporation system which can reduce the board | substrate temperature rising by the radiant heat from the environment in a vacuum vessel can be provided. As a result, particularly in the case of metal film vapor deposition, it is possible to prevent the organic layer formed on the substrate in the previous process from being damaged by heating, and to provide a highly reliable vacuum vapor deposition apparatus.

Moreover, according to this invention, the thermal expansion of the vapor deposition mask by the radiant heat from the environment in a vacuum vessel can be reduced. As a result, it is possible to provide a vacuum deposition apparatus that can reduce misalignment between the deposition mask and the substrate and can manufacture a high-definition organic EL display.
Problems, configurations, and effects other than those described above will be clarified by the following description of embodiments.

1 is a schematic diagram illustrating a configuration of a vacuum vapor deposition apparatus in Example 1. FIG. It is a schematic diagram which shows the structure of the heat shield part shown in FIG. It is a figure which shows the behavior of a radiant heat from the evaporation source with respect to the thermal-insulation part shown in FIG. It is a schematic diagram which shows the structure of the slat part shown in FIG. It is a figure which shows the behavior of the radiant heat from the blade part shown in FIG. 4 to a board | substrate. It is the figure which showed the mode of film peeling in the schematic diagram shown in FIG. FIG. 6 is a schematic diagram showing a configuration of a slat in Example 2. 6 is a schematic diagram showing a part of a vacuum vapor deposition apparatus in Example 3. FIG.

Embodiments will be described below with reference to the drawings.
Below, the example applied to manufacture of an organic EL device is demonstrated as an example of the vacuum evaporation system of this invention. The following description shows specific examples of the contents of the present invention, and the present invention is not limited only to these descriptions. Various modifications by those skilled in the art within the scope of the technical idea disclosed in this specification will be described. Changes and modifications are possible.

Example 1
In this embodiment, an example of a vacuum deposition apparatus capable of reducing the temperature rise of a substrate to be deposited due to radiant heat from the environment inside the vacuum vessel will be described.
FIG. 1 is a schematic diagram showing a schematic configuration of the vacuum vapor deposition apparatus of the present embodiment. The vacuum deposition apparatus shown in the present embodiment includes at least a vacuum container 1, a substrate 2, an evaporation source 3, a deposition preventing part 4, and a heat shielding part 5. In this embodiment, a metal material (Ag, Al, Mg, etc.) is used as the vapor deposition material 9 (see FIG. 3), and the film is formed on the substrate 2 placed substantially horizontally from the stationary evaporation source 3 facing substantially vertically. The structure to perform is demonstrated.

  The vacuum container 1 is a film forming chamber for forming a film of the vapor deposition material 9 stored in the evaporation source 3 on the substrate 2. In order to prevent the vapor deposition material 9 scattered other than the substrate 2 to be deposited from adhering to the inner surface of the vacuum container 1, the vacuum container 1 has an adhesion preventing portion 4. An exhaust system (not shown) is connected to the vacuum container 1, and the inside of the vacuum container 1 is maintained in a vacuum during film formation. A substrate transport system (not shown) is connected to the vacuum container 1, and the substrate 2 is transported into the vacuum container 1 through the substrate transport system.

  The substrate 2 is positioned with respect to a vapor deposition mask (not shown) and fixed to a substrate fixing base (not shown). The vapor deposition mask is generally subjected to hole processing so that vapor deposition and film formation can be performed on a predetermined pixel or region of the substrate 2, and a tension is applied so that the metal mask is not loosened and the metal mask is not loosened. It consists of a frame to apply.

  The evaporation source 3 includes a crucible that is a container that encloses the vapor deposition material 9, a heater that is a heating unit around the crucible, and a plurality of reflectors that improve the heat retaining property of the crucible at least on the outer periphery of the heater. The radiant heat 10 from the heater is stored in a container cooled so as not to leak outside the evaporation source 3. The crucible has a nozzle that radiates the vapor deposition material 9 on the surface facing the substrate 2. The evaporation source 3 has a deposition shutter for opening and closing the nozzle and a film thickness monitor for controlling the power of the deposition rate.

  By heating the crucible with the heating means, the vapor deposition material 9 accommodated in the crucible is melted or sublimated, the inside of the crucible is filled with the vapor of the vapor deposition material 9, and the vapor is ejected from the nozzle to the substrate 2 side. A deposition material 9 is deposited on the region of the substrate 2 patterned by the deposition mask 4.

  In order to form a uniform thin film on the substrate 2, it is necessary to radiate the vapor deposition material 9 from the nozzle over a wider range than the substrate 2. Therefore, the vapor deposition material 9 radiated toward other than the substrate 2 is scattered in the vacuum vessel 1.

  If the film formation is continued for a long time, for example, 168 hours, the deposition amount of the vapor deposition material 9 in the vacuum vessel 1 increases, and film peeling 13 is likely to occur due to film stress. The film peeling 13 becomes a generation source of dust and fine particles, and when attached to the substrate 2, it adversely affects the characteristics of the device. In order to prevent film peeling 13, a method is generally known in which a deposition preventing portion 4 is installed in the vacuum vessel 1 and the deposition preventing portion 4 is periodically replaced or maintained. Moreover, in order to prevent film peeling 13, a method is generally known in which the adhesion preventing portion 4 is made uneven by blasting or spraying.

  Incidentally, light (electromagnetic wave) having radiant heat 10 is emitted from the evaporation source 3 together with the vapor deposition material 9. In particular, in metal vapor deposition that requires high-temperature heating with a low vapor pressure, it is an important issue to reduce the temperature rise due to the radiant heat 10 applied to the substrate 2 of the evaporation source 3.

  In a thermal equilibrium state, if radiant heat is radiated from a certain object at a certain rate (radiation rate), the object absorbs radiant heat at the same rate (absorption rate). That is, radiation rate = absorption rate. In addition, when radiant heat is incident on a certain object, it is absorbed at a predetermined rate, reflected, or transmitted at a predetermined rate. If the latter two are assumed to be reflectance and transmittance, the sum of these three rates is 1. Since the deposition preventing plate 4 and the heat shield 5 do not transmit, the radiation rate + reflectance = 1.

  The radiant heat 10 radiated from the evaporation source 3 includes components that are directly absorbed by the substrate 2, components that are transmitted or reflected by the substrate 2, and components that are radiated to other than the substrate 2. Components that are not absorbed by the substrate 2 but are reflected, transmitted, or radiated to other than the substrate 2 are gradually absorbed by the vacuum vessel 1, the deposition preventing portion 4, the substrate 2, and the like while being repeatedly reflected in the vacuum vessel 1. As a result, the radiant heat 10 absorbed net by the substrate 2 contributes to the temperature rise of the substrate 2. Similarly, the radiant heat 10 causes thermal expansion of the vapor deposition mask, resulting in misalignment between the substrate 2 and the vapor deposition mask.

  Furthermore, when considering the radiant heat 10 from the environment inside the vacuum vessel 1, it is necessary to consider a change with time due to adhesion of the vapor deposition material 9 to the environment inside the vacuum vessel 1. In the vacuum vessel 1, the deposition material 9 radiated from the evaporation source 3 adheres to the adhesion preventing portion 4 in the vacuum vessel 1, and thus the reflectance of the adhesion preventing portion 4 tends to increase. As the film formation continues for a long time, the vapor deposition material 9 gradually adheres to the inner wall and the deposition preventing plate of the vacuum vessel 1 and the reflectance increases. When the reflectance of the environment inside the vacuum vessel 1 increases, the radiation absorption rate of the vacuum vessel 1 decreases accordingly, and the ratio of the radiant heat 10 that reflects inside the vacuum vessel 1 increases. As a result, there is a problem that the absorption rate of the substrate 2 is relatively increased and the temperature of the substrate 2 is increased. Further, when the reflectance of the deposition preventing portion 4 is increased, the radiation rate is decreased, that is, the absorptance is decreased and it is difficult to absorb heat in the first place. It will be weakened.

The heat shield 5 is at least part of the area between the evaporation source 3 and the deposition preventive part 4, in this embodiment, as shown in FIG. Is provided.

  FIG. 2 is a schematic diagram showing the heat shield 5 shown in FIG. The heat shield 5 includes a frame 6, a plurality of blades 7 fixed to the frame 6 with a predetermined inclination angle, and a plurality of openings 8 provided between the adjacent blades 7. And have.

  FIG. 3 is a diagram illustrating the behavior of the radiant heat 10a from the evaporation source 3 with respect to the heat shield 5 and the adhesion preventer 4 illustrated in FIG. Radiant heat 10a indicated by dot lines is radiated radially from the evaporation source 3 together with the evaporation material 9 indicated by broken lines. In the following description, when referring to radiant heat in general, 10 is simply used as a symbol. To indicate specific radiant heat, the suffixes a and b are added.

  The inclination angle of the wing plate portion 7 is set so as to be substantially parallel to the flight direction of the radiant heat 10 a radiated from the evaporation source 3, and when the heat shield portion 5 is viewed from the evaporation source 3, From the opening 8 between the plate parts 7, the deposition preventing part 4 or the inner wall of the vacuum vessel 1 can be desired. At the same time, when the substrate 2 is viewed from the deposition preventing portion 4, the substrate 2 cannot be desired from the opening 8 between the wing plate portions 7. Providing the inclination angle of the wing plate portion 7 so as to be substantially parallel to the flight direction of the radiant heat 10 a is a means for preventing the deposition material 9 from adhering to the wing plate portion 7.

  That is, in the configuration of the present embodiment, since the inclination angle of the wing plate portion 7 of the heat shield 5 is substantially parallel to the flight direction of the radiant heat 10a, the heat is released from the evaporation source 3 toward the heat shield 5. Most of the vapor deposition material 9 and the radiant heat 10 a pass through the opening 8 of the heat shield 5 and reach the deposition part 4 in the vacuum vessel 1. At this time, the vapor deposition material 9 reaching the deposition preventing portion 4 adheres to the wall surface. On the other hand, a part of the radiant heat 10a reaching the deposition preventing part 4 is absorbed according to the absorption rate of the wall surface, but the rest is reflected. In particular, in the deposition preventing part 4 to which the vapor deposition material 9 is thickly attached due to the film formation for a long time, the reflectance is increased, so that the ratio of the reflected radiant heat 10a is increased.

In the conventional vacuum vapor deposition apparatus, the radiant heat 10 b contributes to the temperature increase of the substrate 2 from the environment inside the vacuum vessel 1.
However, in the configuration of the present embodiment, the radiant heat 10 b reflected by the adhesion preventing portion 4 is absorbed or reflected by the wing plate portion 7 of the heat shield portion 5. In this way, the heat shield 5 absorbs the radiant heat 10b from the deposition preventing part 4 with the wing plate part 7, whereby the temperature rise of the substrate 2 can be reduced. It is desirable that the adhesion preventing portion 4 side of the slat portion 7 has a high absorption rate. Most of the radiant heat 10 c from the slat part 7 is also pushed back between the deposition preventing parts 4, reflected again by the slat part 7, and absorbed by the slat part 7.

  As described above, the deposition function 9 and the thermal insulation function are separated into the adhesion prevention unit 4 and the thermal insulation unit 5, so that the deposition material 9 adheres to the adhesion prevention unit 4 in the vacuum vessel 1 and prevents the deposition. Even if the reflectance of the landing part 4 increases, the temperature rise of the substrate 2 can be stably suppressed by absorbing the radiant heat 10 by the wing plate part 7.

  Further, in order to enhance the effect of suppressing the temperature rise of the substrate 2, as shown in FIG. 4, the surface facing the substrate 2 among the surfaces of the wing plate portion 7 of this embodiment has a low emissivity (reflectance). Has a high surface. This is to prevent the heat absorbed from the surface of the wing plate 7 facing the adhesion-preventing portion side from flowing out of the surface facing the substrate 2 side. In order to increase the reflectivity, for example, the surface facing the substrate 2 side is polished, a material having a high reflectivity is coated, or a sheet having a high reflectivity is stretched on the surface. On the other hand, the surface opposite to the substrate side of the wing plate portion 7, that is, the surface facing the deposition preventing portion 4, is desirably provided with a surface with high absorptance (low reflectance) as described above. In order to reduce the reflectance, for example, the surface facing the deposition preventing portion 4 may be roughened by thermal spraying or a sambra, or may be oxidized and blackened.

  As a result, as shown in FIG. 5, the radiant heat 10d from the wing plate 7 to the substrate 2 can be suppressed by the surface modification of the wing plate 7 described above. Moreover, the radiant heat 10b from the deposition preventing part 4 can be efficiently absorbed. These can obtain the corresponding effect even when the surface of only one of the surfaces is modified, and the temperature rise of the substrate 2 due to the radiant heat 10 from the environment inside the vacuum vessel 1 can be reduced.

  The heat shield part 5 of the present embodiment has a cooling part 12 shown in FIG. By cooling the heat shield 5, it is possible to reduce the radiant heat 10 d from the wing plate 7 to the substrate 2 and promote the exhaust heat of the radiant heat 10 b absorbed from the deposition preventing part 4. Moreover, in the present Example, the adhesion prevention part 4 and the heat-insulation part 5 which are different components can be cooled independently. Furthermore, if only the heat shield 5 is cooled, the heat capacity can be made smaller than when both are cooled, so that the cooling efficiency can be improved.

  Moreover, the heat shield part 5 of the present embodiment can be arranged at a certain distance from the adhesion preventing part 4. When the deposition preventing part 4 and the heat shielding part 5 are in close contact with each other, the film peeling 13 generated in the deposition preventing part 4 can pass through the opening 8 in the heat shielding part 5 and fall to the evaporation source 3 or the substrate 2 side. There is sex. However, as shown in FIG. 6, by maintaining a certain distance between the heat shield 5 and the deposition preventive part 4, dust and fine particles generated by the film peeling 13 of the deposition preventive part 4 are removed from the evaporation source 3 and the substrate. It is possible to block the scattering to the 2 side. As a measure of the distance between the heat shield 5 and the adhesion preventing part 4, the effect can be obtained if there is a distance greater than the distance between the slats 7.

  For example, a metal plate such as SUS, Mo, Ti, or Ta can be used as the material of the heat shield 5 of this embodiment, particularly the slat 7. The wing plate portion 7 may be a structure integrated with the frame portion 6 or a separable structure.

  As a structure in which the wing plate portion 7 and the frame portion 6 are integrated as shown in FIG. 8 to be described later, for example, an integral metal plate can be used. One side of the metal plate is polished or mirrored, and the back side is roughened by thermal spraying or blasting. The surface-treated metal plate is cut in a U-shape and bent. By creating the wing plate portion 7 in this way, one side functions as a surface having a high reflectance and the back surface thereof has a low reflectance. In this case, there is an advantage that the heat shield 5 can be easily created.

On the other hand, as a structure in which the slat part 7 and the frame part 6 can be separated as shown in FIG. 1, for example, a metal or ceramic frame part 6 is prepared as the heat shield part 5 and the slat part 7 is fixed. A fixing part is provided for this purpose. For example, a metal plate is used for the wing plate portion 7 and is fixed to the frame portion 6 described above. In this case, there is an advantage that there is no restriction on the size of the wing plate portion 7 as in the case of making a cut in a single metal plate.
Of course, the wing plate portion 7 of this embodiment is not limited to the production method described here, and various modifications are possible. For example, it has been described that the inclination angle of the wing plate portion 7 is preferably substantially parallel to the flying direction of the radiant heat 10 radiated from the evaporation source 3, but the wing plate is within a predetermined angle. Although adhesion to the portion 7 occurs, it is possible to obtain an effect such as a reduction in temperature rise of the substrate 2 due to the radiant heat 10 described below.

As described above, according to this embodiment, the temperature rise of the substrate 2 due to the radiant heat 10 from one environment in the vacuum vessel can be reduced. As a result, especially during metal film deposition, even for long-time film formation,
The organic layer deposited on the substrate in the previous process can be prevented from being damaged by heating, and a highly reliable vacuum deposition apparatus can be provided.

  Moreover, according to this invention, the thermal expansion of the vapor deposition mask by the radiant heat from the environment in a vacuum vessel can be reduced similarly to temperature rising of a board | substrate. As a result, it is possible to provide a vacuum deposition apparatus that can reduce misalignment between the deposition mask and the substrate and can manufacture a high-definition organic EL display.

(Example 2)
In this embodiment, an example of a vacuum vapor deposition apparatus having an oxidation preventing function for the slat portion 7 will be described.
FIG. 1 is a diagram illustrating a vacuum vapor deposition apparatus according to the third embodiment. The vacuum deposition apparatus includes at least a vacuum container 1, a substrate 2, an evaporation source 3, a deposition preventing part 4, and a heat shielding part 5. In the vacuum vapor deposition apparatus of FIG. 1, the heat shield part 5 having the blade part 7 of FIG. 4 is changed to the heat shield part 5 having the blade part 7 of FIG. Other configurations have the same functions as the configurations denoted by the same reference numerals shown in FIG. 1 and have not been described.

  During maintenance, the inside of the vacuum vessel 1 is opened to the atmosphere. If the surface of the wing plate portion 7 on the substrate side is oxidized, there is a possibility that the emissivity increases (reflectance decreases). As a result, the radiant heat 10d radiated to the substrate 2 increases.

  Therefore, the heat shield portion 5 of this embodiment is made of a material (TiN, SiN, ZrN, TaN, CrOx, SiO2) which is transparent in the infrared region and has oxidation resistance on the low reflection surface side of the wing plate portion 7. ), Or a protective film 14 made of a noble metal material (Ag, Au, Pt, platinum group, etc.) that changes little even when oxidized. As a result, surface oxidation can be suppressed. In the case of coating a noble metal, the cost can be reduced by reducing the film thickness to about 50 nm to 100 nm.

Example 3
FIG. 8 is a schematic view showing a part of the vacuum vapor deposition apparatus in Example 3. The vacuum vapor deposition apparatus includes at least a vacuum vessel 1, a substrate 2, an evaporation source 3, a deposition preventing part 4, and a heat shielding part 15. In Example 3, the wing plate portion 7 of the heat shield portion 5 is changed to the wing plate portion 17 of the heat shield portion 15 in a part of the vacuum vapor deposition apparatus described with reference to FIG. Other configurations have the same functions as the configurations denoted by the same reference numerals shown in FIG. 1 and have not been described.

  In this embodiment, as shown in FIG. 1, the heat shielding portions 15 are provided on both sides of the evaporation source 3, and the vapor deposition material 9 adheres to the wing plate portion 17 at the end portion of each wing plate portion 17 on the evaporation source 3 side. A collar 16 is provided as a prevention means.

  Further, the flange portion 16 may be attached to only one of the surface side facing the substrate 2 or the surface side facing the adhesion preventing portion 4. Furthermore, the collar part 16 may not be provided in the heat shield part 15 on both sides, and only one of them may be attached. Furthermore, regardless of the heat shield part 15 on both sides, the heat shield part 15 may be provided with the wing plate part 7 shown in FIG.

The vacuum vessel 1 or the adhesion preventing part 4 can be desired from the evaporation source 3 through the opening 8 without being hidden by the flange part 16 of the blade part 17 in the direction between the blade parts 17 of the flange part 16. The length is limited. By providing the flange portion 16 at the end portion of the wing plate portion 17 on the evaporation source 3 side, before the vapor deposition material 9 radiated from the evaporation source 3 toward the heat shield portion 15 passes through the opening portion 8, the wing plate portion 17. The deposition material 9 is reduced from adhering to the surface. As a result, it is possible to greatly reduce the possibility that the vapor deposition material 9 adheres to the wing plate portion 17 and decreases the absorption rate of radiant heat.

  In addition, if the length of the flange portion 16 in the direction between the wing plate portions 17 is increased, the degree of freedom in setting the inclination angle of the wing plate portion 17 can be increased, for example, to the same angle. However, if the length is increased, the vapor deposition material 9 adheres to the flange 16. Considering these points, it is necessary to determine the length of the flange portion 16 in the direction between the blade portions 17.

  According to Example 3, the adhesion of the vapor deposition material 9 to the slat portion 17 is suppressed, and the surface state of the slat portion 17 is maintained for a longer time with a high radiant heat absorption rate from the deposition preventing portion 4. Can be maintained.

  In Examples 1 to 3, the deposition preventing part 4 and the heat shielding part 5 are provided apart from each other. However, even if the deposition preventing part 4 and the heat shielding part 5 are provided in contact with each other, it is extremely important. In other words, even if the slats are provided directly on the deposition preventing part 3, it is possible to obtain the effect of suppressing the temperature rise of the substrate 2 by the radiant heat from the deposits. In this case, it is necessary to provide an adhesion preventing means such as providing the wing plate portion substantially parallel to the flight direction of the radiant heat 10 radiated from the evaporation source 3. According to the present embodiment, the temperature rise suppression effect of the substrate 2 due to radiant heat from the deposit can be obtained with a simpler structure.

  Further, in the above-described Examples 1 to 3, a so-called horizontal type vacuum vapor deposition apparatus in which a substrate and a vapor deposition mask are arranged horizontally and vapor deposition is performed by an evaporation source provided below them has been described. The present invention is not limited to this, and the present invention can also be applied to a so-called vertical type vacuum vapor deposition apparatus in which a substrate and a vapor deposition mask are arranged vertically and vapor deposition is performed by an evaporation source provided on the lateral side thereof.

  In addition, this invention is not limited to an above-described Example, Various modifications are included. For example, the above-described embodiments have been described in detail for easy understanding of the present invention, and are not necessarily limited to those having all the configurations described.

  Further, a part of the configuration of one embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of one embodiment. Furthermore, it is possible to add, delete, and replace other configurations for a part of the configuration of each embodiment.

1: Vacuum container 2: Substrate 3: Evaporation source 4: Protection part 5: Heat shield part 6: Frame part 7: Blade part 8: Opening part 9: Evaporating material 10: Radiant heat 12: Cooling part 13: Film peeling 14 : Protective film (Example 2) 15: Heat shield (Example 3)
16: buttock (Example 3) 17: slat (Example 3)

Claims (10)

A vacuum deposition apparatus for forming a deposition material on a deposition target by an evaporation source in a vacuum container,
An adhesion preventing portion that prevents the vapor deposition material radiated from the evaporation source from adhering to the inner wall of the vacuum vessel;
A frame portion, an opening portion provided in the frame portion for guiding the vapor deposition material radiated from the evaporation source to the adhesion preventing portion, a slat portion provided in a part of an outer periphery of the opening portion, and the prevention portion An adhesion preventing means that absorbs radiant heat from the attachment portion and prevents the vapor deposition material radiated from the evaporation source from adhering to the wing plate portion, and is provided apart from the adhesion prevention portion. A heat shield,
A vacuum evaporation apparatus characterized by comprising: A vacuum deposition apparatus for forming a deposition material on a deposition target by an evaporation source in a vacuum container,
An adhesion preventing portion that prevents the vapor deposition material radiated from the evaporation source from adhering to the inner wall of the vacuum vessel;
A plurality of openings for guiding radiant heat radiated from the evaporation source to the deposition preventing part, a slat for absorbing radiant heat from the deposition preventing part, a plurality of the openings and a plurality of the slats A frame portion, and the vane plate portion is arranged so that the deposition source can be desired from the evaporation source through the opening, and the deposition target cannot be desired from the deposition portion, A heat shield provided apart from the adhesion preventing part,
A vacuum evaporation apparatus characterized by comprising: A vacuum deposition apparatus for forming a deposition material on a deposition target by an evaporation source in a vacuum container,
An adhesion preventing portion that prevents the vapor deposition material radiated from the evaporation source from adhering to the inner wall of the vacuum vessel;
Absorbing means that absorbs radiant heat from the deposition preventing portion and is fixed to the deposition preventing portion, and prevents the vapor deposition material emitted from the evaporation source from adhering to the vane portion. A heat shield part to be provided;
A vacuum evaporation apparatus characterized by comprising: In the vacuum evaporation system according to claim 1 or 3,
The vacuum deposition apparatus, wherein the adhesion preventing means is set so that an inclination angle of the wing plate portion is substantially parallel to a flight direction of the deposition material radiated from the evaporation source. In the vacuum evaporation system according to claim 1 or 3,
The vacuum deposition apparatus according to claim 1, wherein the adhesion preventing means is a gutter provided at an end of the slat portion on the evaporation source side. In the vacuum evaporation system in any one of Claims 1 thru | or 5,
The wing plate portion has a first surface that desires the deposition target side and a second surface that desires the deposition preventing portion, and the first surface has a higher reflectance than the second surface. A vacuum evaporation apparatus characterized by that. In the vacuum evaporation system according to claim 1 or 2,
The said heat-shielding part is equipped with the cooling mechanism, The vacuum evaporation system characterized by the above-mentioned. In the vacuum evaporation system in any one of Claims 1 thru | or 7,
The vacuum deposition apparatus characterized in that the slat part is made of at least one metal of SUS, Mo, Ti, and Ta. In the vacuum evaporation system according to claim 6,
A vacuum deposition apparatus comprising a protective layer having oxidation resistance on the first surface of the slat portion. In the vacuum evaporation system according to claim 9,
The protective film is a transparent and oxidation-resistant material (TiN, SiN, ZrN, TaN, CrOx, SiO2) in the infrared region, or a noble metal material (Ag, Au, Pt, platinum) that changes little when oxidized. A vacuum deposition apparatus comprising at least one material.

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