KR20120081163A - Hybrid relay - Google Patents

Abstract

In providing a hybrid relay capable of preventing the semiconductor switch from becoming hot, the hybrid relay according to the present invention has a mechanical contact switch 12 in which a contact is opened and closed by a driving unit, and parallel with the mechanical contact switch 12. And a semiconductor feeder 13 connected to the power supply path for supplying the load from the power supply to the load, wherein the first feed path by the mechanical contact switch 12 and the second feed path by the semiconductor switch 13 are connected in parallel. One hybrid relay is provided with, for example, a thermal fuse F1 as a safety circuit part that closes the converter when the temperature of the semiconductor switch reaches a predetermined temperature or more.

Description

HYBRID RELAY

The present invention relates to a hybrid relay having a mechanical contact switch and a semiconductor switch.

Conventionally, in order to switch supply and interruption of electric power to the load provided with the inverter circuit which performs inverter control, such as a lighting fixture, the hybrid relay of the structure which connected the mechanical contact switch and the semiconductor switch in parallel is used. By the way, in the load provided with an inverter circuit, a large capacity smoothing capacitor is provided in order to convert an AC voltage into a DC voltage, and a large current flows into this smoothing capacitor when power is supplied from the AC power supply to the load. For this reason, the inrush current to a load generate | occur | produces. In particular, in a situation where the power supply voltage is high and the load becomes high, the inrush current flowing into the load increases, so that a large current based on this inrush current also flows in the hybrid relay connected between the load and the AC power supply.

For this reason, in the hybrid relay connected to such a load, the semiconductor switch and the mechanical contact switch are switched at the ON state and in the normal state. First, only the semiconductor switch is turned ON (closed), and when the inrush current flows through the semiconductor switch, the mechanical contact switch is turned ON (closed) when the current supplied to the load is in a steady state (Patent Document 1). By operating in this way, it can suppress that a large electric current flows in the mechanical contact switch in a hybrid relay, and can prevent contact welding by generation | occurrence | production of the arc just before contact of a contact pair. In this way, the hybrid relay has a structure provided with a semiconductor switch in order to prevent contact welding in the mechanical contact switch. The mechanical relay switch is turned ON, the semiconductor switch is turned OFF (open), and the load is applied. Start supplying power to the furnace.

Japanese Patent Laid-Open No. 11-238441

In this way, in the hybrid relay including the mechanical contact switch and the semiconductor switch, in order to prevent contact welding of the mechanical contact switch like the hybrid relay of Patent Literature 1, in the case of power supply, the semiconductor switch is first turned ON, In the case of disconnection, the semiconductor switch is turned off later. For this reason, since an inrush current flows into a semiconductor switch for every switching operation of a hybrid relay, compared with a mechanical contact switch, the lifetime of a semiconductor switch becomes short. When the semiconductor switch is short-lived due to its life, the semiconductor switch is always in an energized state, and thus the semiconductor switch may become hot and cause fire.

This invention is made | formed in view of the said situation, and an object of this invention is to provide the hybrid relay which can prevent a semiconductor switch from becoming high temperature.

In order to achieve the above object, a hybrid relay according to the present invention includes a mechanical contact switch in which a contact is opened and closed by a driving unit, and a semiconductor switch connected in parallel with the mechanical contact switch, and a power supply path for supplying power from a power supply to a load. As a hybrid relay in which the first feed path by a mechanical contact switch and the second feed path by a semiconductor switch are connected in parallel, the hybrid relay includes a safety circuit unit that performs power supply control when the temperature of the semiconductor switch reaches a predetermined temperature or more. It features.

In addition, the present invention includes the hybrid relay, wherein the safety circuit portion is a thermal fuse that is disconnected when the temperature of the semiconductor switch reaches a predetermined temperature or more.

In addition, the present invention includes the above-mentioned hybrid relay, wherein a thermal fuse is provided on the second feed path.

In addition, the present invention includes the hybrid relay, wherein the safety circuit portion includes a temperature switch that operates the driving portion to close the contact of the mechanical contact switch when the temperature of the semiconductor switch reaches a predetermined temperature or more.

In addition, the present invention is the hybrid relay, wherein the safety circuit unit, the temperature sensor for detecting the temperature of the semiconductor switch, and when the temperature of the semiconductor switch detected by the temperature sensor is more than a predetermined temperature, the drive unit is operated to operate the mechanical contact switch. It includes having a control unit for closing the contact.

Moreover, this invention is the said hybrid relay, The said mechanical contact switch is equipped with the 1st, 2nd mechanical contact switch which a contact opens and closes by a drive part, As a feed path which supplies from a power supply to a load, A 1st mechanical contact switch It includes the 1st feed path by which and the 2nd feed path which connected the 2nd mechanical contact switch and the semiconductor switch in series are comprised in parallel.

Moreover, this invention includes the thing provided with the temperature switch which closes the contact of a 1st mechanical contact switch by operating the drive part of a 1st mechanical contact switch as said hybrid relay when the temperature of a semiconductor switch becomes more than predetermined temperature.

Moreover, this invention includes the thing provided in the upper surface of the package convex part of a semiconductor switch as said hybrid relay.

In addition, the present invention includes the hybrid relay, wherein the safety circuit portion is a thermal fuse, and one of the lead terminals of the thermal fuse is disposed in close contact with the center of the package of the semiconductor switch.

The present invention further includes the hybrid relay, further comprising a notification unit that notifies the outside of abnormalities when the semiconductor switch reaches a predetermined temperature or more.

In the structure provided with the said safety circuit part, when a semiconductor switch becomes abnormal temperature more than predetermined temperature, since a power supply path is interrupted | blocked, a semiconductor switch is further heated and it does not burn out or ignite.

1 is a schematic circuit diagram showing an internal configuration of a hybrid relay of Embodiment 1 of the present invention;
2 (a) and 2 (b) are schematic circuit diagrams showing the internal structure of a modification of the hybrid relay of Embodiment 1 of the present invention, respectively;
3 is a schematic circuit diagram showing an internal configuration of a hybrid relay of Embodiment 2 of the present invention;
4 is a schematic circuit diagram showing an internal configuration of a hybrid relay of Embodiment 3 of the present invention;
5 (a) and 5 (b) are schematic circuit diagrams each showing an internal configuration of a hybrid relay of Embodiment 4 of the present invention;
6 (a) and 6 (b) are schematic circuit diagrams each illustrating an internal configuration of a modification of the hybrid relay of Embodiment 4 of the present invention;
7 (a) and 7 (b) are schematic circuit diagrams showing the internal structure of another modified example of the hybrid relay of Embodiment 4 of the present invention, respectively;
8 (a) and 8 (b) are schematic circuit diagrams showing the internal structure of the hybrid relay of Embodiment 5 of the present invention, respectively;
9 is a schematic circuit diagram showing an internal configuration of a hybrid relay of Embodiment 6 of the present invention;
10 is a schematic circuit diagram showing an internal configuration of a hybrid relay of Embodiment 7 of the present invention;
11 is a schematic circuit diagram showing an internal configuration of a hybrid relay of Embodiment 8 of the present invention;
12 is a top view of a printed wiring board in which a temperature fuse F1 is provided in each of the semiconductor switches of the hybrid relay of Embodiment 9 of the present invention;
It is a figure which shows the principal part of the hybrid relay of Embodiment 9 of this invention, (a) is a front view of a semiconductor switch and a thermal fuse, (b) is a side view.

EMBODIMENT OF THE INVENTION The hybrid relay which implemented this invention is demonstrated with reference to drawings.

(Embodiment Mode 1)

1 is a schematic circuit diagram showing an internal configuration of an embodiment.

As shown in FIG. 1, the hybrid relay 1 connects the first feed path by the mechanical contact switch 12 and the second feed path by the semiconductor switch 13 in parallel to each other, and the semiconductor switch 13. The temperature supply F1 is provided in this 2nd power supply path as a safety circuit part which closes a power supply path when the temperature of () becomes more than predetermined temperature.

The hybrid relay 1 is connected to the terminals 10 and 11 which are end portions of each of the AC power supply 2 and the load 3 connected in series, thereby closing the AC power supply 2 and the load 3 and the closed circuit. Form. That is, the supply and interruption of the power supply from the AC power supply 2 to the load 3 are determined by ON (closed) / OFF (opening) of the hybrid relay 1. The AC power supply 2 is, for example, a commercial power supply of 100 V or the like, and the load 3 is, for example, a lighting device or a fan including a fluorescent lamp and an incandescent bulb.

That is, the hybrid relay 1 includes a terminal 10 connected to the other end of the AC power supply 2 having one end connected to one end of the load 3, and a terminal 11 connected to the other end of the load 3. And a mechanical contact switch 12, a semiconductor switch 13, and a signal processing circuit 15, both ends of which are connected to the terminals 10, 11 and connected in parallel with each other. And this mechanical contact switch 12 has a contact part S1. In addition, the semiconductor switch 13 has a triac S2 and is connected in parallel with the contact portion S1 by connecting both ends of the mechanical contact switch 12 and the terminals 10, 11. The signal processing circuit 15 performs ON (closed) / OFF (open) control of the mechanical contact switch 12 and the semiconductor switch 13, respectively. The mechanical contact switch 12 is comprised by the contact part S1 and the magnetic coil L1 which produces the electromagnetic force which opens and closes the contact part S1. The magnetic coil L1 is supplied with a power supply potential at one end thereof and connected to the drain of the transistor Tr1 at the other end thereof. In the transistor Tr1, a control signal from the signal processing circuit 15 is input to the base electrode, and the emitter electrode is grounded. In this manner, the signal processing circuit 15 and the transistor Tr1 connected thereto perform the opening and closing of the mechanical contact switch 12 as a driving unit.

The semiconductor switch 13 includes a triac S2 and a phototriac coupler 14. In this triac S2, an electrode is connected to the terminal 10 via a thermal fuse F1, and the other electrode is connected to the terminal 11. The phototriac coupler 14 has a zero cross phototriac S3 and a light emitting diode LD for irradiating an optical signal to the phototriac S3. The zero cross type photo triac S3 is connected between the other electrode of the triac S2 and the gate electrode. The power supply potential is applied to the anode electrode of the light emitting diode LD, and the drain electrode of the npn type transistor Tr2, which is a switching element, is connected to the cathode electrode. The control signal from the signal processing circuit 15 is input to the base electrode of the transistor Tr2, and the emitter electrode is grounded.

The operation at the time of performing each of power supply and interruption from the AC power supply 2 to the load 3 in the hybrid relay 1 will be briefly described below. First, when power is supplied from the AC power supply 2 to the load 3, a control signal is applied from the signal processing circuit 15 to the base electrode of the transistor Tr2, and the transistor Tr2 is turned on (ON). ) Thereby, in the semiconductor switch 13, the optical signal from the light emitting diode LD is incident on the phototriac S3, and the phototriac S3 is turned ON. Moreover, since phototriac S3 has a zero cross function, when it detects that the alternating voltage from the alternating current power supply 2 became the center voltage (reference voltage), phototriac S3 turns ON. .

The conduction of the phototriac S3 causes the alternating current from the alternating current power source 2 to flow through the phototriac S3, thereby supplying a current to the gate electrode of the triac S2, thereby providing a phototriac. The liquid S3 is turned ON. Thereby, since the load 3 is electrically connected with the AC power supply 2 via the semiconductor switch 13 in the hybrid relay 1, the power supply by the AC power supply 2 is input to the load 3 do. In this way, after the triac S2 in the semiconductor switch 13 is turned ON and the power from the AC power supply 2 is input to the load 3, the signal processing circuit 15 is the base of the transistor Tr1. The control signal is applied to the electrode, the transistor Tr1 is turned ON, and the driving current is supplied to the magnetic coil L1. Therefore, the electromagnetic force of the magnetic coil L1 is generated, and the contact portion S1 is turned on.

And when electric power supply to the load 3 by the AC power supply 2 through the contact part S1 of this mechanical contact switch 12 is started, in order to interrupt the power supply path in the semiconductor switch 13, The signal processing circuit 15 puts the transistor Tr2 into the non-conducting state (OFF) and stops supplying the current to the light emitting diode LD. For this reason, since the light emission operation | movement of the light emitting diode LD stops and irradiation of the optical signal to the phototriac S3 is stopped, the phototriac S3 does not have the alternating voltage from the alternating current power supply 2; When the center voltage (reference voltage) is reached, the operation is stopped and turned off. When the phototriac S3 is turned OFF, the current supply is lost to the gate electrode of the triac S2, so that the triac S2 is in a non-conductive state, and the semiconductor switch 13 is turned OFF. .

On the other hand, when the power supply is interrupted from the AC power supply 2 to the load 3, the signal processing circuit 15 gives a control signal to the base electrode of the transistor Tr2, and turns the transistor Tr2 ON. An optical signal from the light emitting diode LD is incident on the phototriac S3. Accordingly, by turning on the phototriac S3, the triac S2 is turned on, and in addition to the feed passage (first feed passage) through the mechanical contact switch 12, the feed through the semiconductor switch 13 is achieved. A furnace (second feed path) is formed in the hybrid relay 1. Then, the signal processing circuit 15 turns off the transistor Tr1, stops the supply of the drive current to the electromagnetic coil L1, and opens the contact portion S1 in the open (OFF) state. Thereby, the feed path (first feed path) through the mechanical contact switch 12 which becomes a main feed path can be interrupted | blocked. Thereafter, the signal processing circuit 15 turns off the transistor Tr2 and turns off the phototriac S3 by stopping supply of current to the light emitting diode LD. As a result, since the triac S2 is turned off, the feed path by the semiconductor switch 13 is cut off, and the power supply from the AC power supply 2 to the load 3 is cut off.

The thermal fuse F1 is fixed to the surface or the vicinity of the triac S2 in order to function as a temperature detection element for detecting the abnormal temperature of the triac S2. When the temperature of the triac S2 reaches an abnormal temperature higher than the operating temperature, the thermal fuse F1 flows in, for example, a rush current or the like, or the triac S2 When short-circuited by life, it disconnects and the supply of electric current to triac S2 and photo triac S3 is interrupted. Although the arrangement | positioning of this thermal fuse F1 is mentioned later, it arrange | positions near the semiconductor switch 13 so that a mechanical load may not be applied. Here, the thermal fuse F1 is disposed on the upper surface of the convex portion of the package of the semiconductor switch 13 such that one of the lead terminals of the thermal fuse closely adheres to the center of the package of the semiconductor switch 13.

Thereby, the triac S2 and the photo triac S3 can be protected from thermal breakdown, and the occurrence of a fire and the like can be prevented. Here, the feed path cut off by the thermal fuse F1 is only a feed path (second feed path) by the semiconductor switch 13, and the feed path by the mechanical contact switch 12 as the main contact (first feed path). The furnace can be opened and closed, so that even after the thermal fuse is disconnected, power supply to the load 3 and interruption can be executed by controlling the opening and closing of the mechanical contact switch 12.

Moreover, in the said embodiment, although the structure which connected the temperature fuse F1 between the connection node of the triac S2 and the phototriac S3, and the terminal 10 was demonstrated, as a modification, FIG. Like 2 (a), the temperature fuse F2 for detecting the abnormal temperature of the triac S2 may be connected between one electrode of the triac S2 and the terminal 10. In addition, as shown in Fig. 2 (b), a temperature fuse for detecting an abnormal temperature of the triac S2 between one electrode of the phototriac S3 and one electrode of the triac S2. You may connect (F3). 1, 2 (a) or (b), the temperature fuses F1 and F2 detect not only the triac S2 but also the abnormal temperature of the phototriac S3. You may adjust an arrangement position so that it may be.

(Embodiment 2)

Next, Embodiment 2 of this invention is described with reference to drawings. 3 is a schematic circuit diagram showing an internal configuration of a hybrid relay according to the second embodiment. In addition, the same code | symbol is attached | subjected about the part same as the hybrid relay of Embodiment 1 shown in FIG. 1, and the detailed description is abbreviate | omitted.

As shown in FIG. 3, the hybrid relay has a temperature switch S4 connected between the emitter and the collector of the transistor Tr1 except for the thermal fuse F1 from the configuration of the first embodiment shown in FIG. 1. It is a configuration installed. Therefore, since the operation based on temperature switch S4 differs only from the relay switch of Embodiment 1 shown in FIG. 1, about another structure and operation | movement, it is the same as that of Embodiment of FIG. Omitted. Hereinafter, the operation based on the temperature switch S4 will be described.

The temperature switch S4 is constituted by a switch which performs the opening and closing operation in response to the detected temperature, such as a bimetal switch, and the triac in the semiconductor switch 13 similarly to the hybrid relay of the first embodiment of FIG. 1. In order to detect the temperature of (S2), it fixes to the surface or vicinity of triac S2.

When the triac S2 is within the prescribed temperature, the temperature switch S4 is in the OFF (open) state, and supply / disconnection of the drive current of the magnetic coil L1 is controlled by ON / OFF of the transistor Tr1. do. On the other hand, when the temperature of the triac S2 becomes higher than the prescribed temperature, the temperature switch S4 is turned on (closed), and a driving current is forcibly supplied to the magnetic coil L1. As a result, an electromagnetic force generated by the magnetic coil L1 is generated, and the contact S1 of the mechanical contact switch 12 is forcibly turned ON, so that the feed path by the mechanical contact switch 12 is formed as the main feed path. As a result, the amount of current flowing through the power feeding path by the semiconductor switch 13 is suppressed. Therefore, since the amount of current flowing through each of the triac S2 and the phototriac S3 constituting the semiconductor switch 13 is reduced, generation of high heat by the semiconductor switch 13 can be prevented.

In addition, another embodiment will be described with reference to the drawings. 4 is a schematic circuit diagram showing an internal configuration of another embodiment. In addition, the same code | symbol is attached | subjected about the same part as embodiment of FIG. 1, and the detailed description is abbreviate | omitted.

(Embodiment 3)

Next, the hybrid relay of Embodiment 3 of the present invention will be described. In this example, as shown in FIG. 4, the temperature sensor T1 which measures the temperature of the semiconductor switch 13 except the temperature fuse F1 from the hybrid relay of Embodiment 1 shown in FIG. 1, It becomes the structure which provided the notification part 16 which notifies outside when the temperature of the semiconductor switch 13 becomes abnormal temperature. Therefore, about the structure common to the hybrid relay of embodiment of FIG. 1, the same code | symbol is attached | subjected and description is abbreviate | omitted and the temperature sensor is demonstrated below.

The temperature sensor T1 is composed of a thermosensitive element such as a thermistor or the like, and similarly to the temperature fuse F1 in the hybrid relay of the embodiment of FIG. 1, the triac S2 in the semiconductor switch 13 is used. In order to detect the temperature of, it is fixed at or near the surface of the triac S2. And the temperature sensor T1 notifies the signal processing part 15 of the measured temperature of the semiconductor switch 13 every predetermined measurement timing.

The signal processing unit 15 is connected to a sounding unit such as a speaker or a buzzer, or a notification unit 16 constituted by a display device such as a light emitting diode (LED) or a liquid crystal monitor, so that an abnormality of the semiconductor switch 13 occurs. This is notified outside.

That is, the temperature of the semiconductor switch 13 is detected by the temperature sensor T1, and if the temperature is abnormal, the notification unit 16 is driven to notify the outside of the abnormal occurrence.

At this time, the signal processing unit 15 may be configured to provide a control signal to the base electrode of the transistor Tr1, turn the transistor Tr1 ON, and close the mechanical contact switch 12. In this way, the feed path by the mechanical contact switch 12 is forcibly formed as a main feed path, and the amount of current flowing through the feed path by the semiconductor switch 13 can be suppressed. Therefore, the amount of current flowing through each of the triac S2 and the phototriac S3 constituting the semiconductor switch 13 can be reduced, and generation of high heat by the semiconductor switch 13 can be prevented. In addition, by performing the notification operation by the notification unit 16, the semiconductor switch 13 can be notified to the outside that the temperature is abnormal, and the user can be informed promptly of the life of the semiconductor switch 13. have.

In this case, you may use together with the thermal fuse F1 of Embodiment 1. FIG. At this time, by setting the temperature of the thermal fuse F1 to be higher than the temperature at which the temperature sensor T1 drives the notification unit 16, it is possible to promptly notify the occurrence of high heat.

(Fourth Embodiment)

Next, a hybrid relay of Embodiment 4 of the present invention will be described with reference to the drawings. 5 is a schematic circuit diagram showing an internal configuration of a hybrid relay according to the fourth embodiment. In addition, the same code | symbol is attached | subjected about the part same as the hybrid relay of Embodiment 1 shown in FIG. 1, and the detailed description is abbreviate | omitted.

In the hybrid relay of Embodiment 4 of the present invention, as shown in Fig. 5 (a), the second mechanical contact switch 17 has a basic configuration of the hybrid relay 1 of Embodiment 1 shown in Fig. 1. Is added.

In other words, this embodiment includes a terminal 10 connected to the other end of the AC power supply 2, one end of which is connected to one end of the load 3, a terminal 11 connected to the other end of the load 3, The first mechanical contact switch 12 having the contact portion S1 connected at both ends to the terminals 10 and 11, and the contact portion whose one end is connected to the connection node at one end of the terminal 10 and the contact portion S1. The second mechanical contact switch 17 having (S5) and a phototriac S3 having one electrode connected to the other end of the contact portion S5 and the other electrode connected to the terminal 11 are provided. The semiconductor switch 13, the signal processing circuit 15 which performs ON / close (open) control of each of the 1st and 2nd mechanical contact switches 12 and 17 and the semiconductor switch 13 is provided. . Hereinafter, in the circuit which has two mechanical contact switches, it is set as the 1st and 2nd mechanical contact switches 12 and 17, The 1st mechanical contact switch 12 is the mechanical contact switch 12 used by the said embodiment. The same reference numerals as those in the drawings are used.

The structure of the 1st mechanical contact switch 12 and the 2nd mechanical contact switch 17 shown to FIG. 5 (a) is the same as that of the mechanical contact switch 12 shown in FIG. In addition, although the structure of the semiconductor switch 13 in FIG. 5 is the same as that of the semiconductor switch 13 in FIG. 1, one electrode of the phototriac S3 passes through the temperature fuse F1, The other end of the contact portion S5 of the second mechanical contact switch 17 is connected.

That is, the hybrid relay of this embodiment includes the first and second mechanical contact switches 12 and 17 whose contacts are opened and closed by the drive unit, and the semiconductor switch 13 connected in parallel with the second mechanical contact switch. And a feed path supplied from the AC power supply 2 to the load 3, the first feed path by the first mechanical contact switch 12, the second mechanical contact switch 17, and the semiconductor switch 13. Is a hybrid relay provided in parallel with a second feed path configured in series, and a thermal fuse F1 that is disconnected when the temperature of the semiconductor switch 13 reaches a predetermined temperature or more is provided on the second feed path. . The action and effect of the thermal fuse F1 are the same as those of the hybrid relay of Embodiment 1 of the present invention shown in FIG. 1.

The hybrid relay shown in FIG. 5 (b) is a modification of the hybrid relay shown in FIG. 5 (a), and includes the first mechanical contact switch 12, the second mechanical contact switch 17, and the semiconductor switch 13. The configuration of is different.

That is, the first mechanical contact switch 12 is a latching mechanical contact switch, which includes a magnetic coil L3 for generating an electromagnetic force for switching the contact portion S1 to ON (closed), and a contact portion S1. Is provided with a magnetic coil L4 for generating an electromagnetic force for turning OFF. One end of the magnetic coil L3 is connected to the signal processing circuit 15 via the backflow prevention diode D1, and the other end is grounded. On the other hand, one end of the magnetic coil L4 is connected to the signal processing circuit 15 via the backflow prevention diode D3, and the other end is grounded. The diode D2 connected in parallel to the magnetic coil L3 and the diode D4 connected in parallel to the magnetic coil L4 are diodes for bypass.

On the other hand, the second mechanical contact switch 17 includes a magnetic coil L5. One end of the magnetic coil L5 is connected to the signal processing circuit 16 via the diode D5 for preventing backflow, and the other end is grounded. The diode D6 connected in parallel to the magnetic coil L5 is a diode for bypass.

The semiconductor switch 13 includes a resistor R1 and a capacitor C1 connected in parallel between the triac S2, one electrode of the triac S2, and the gate electrode, and the triac S2. It consists of the phototriac coupler 14 provided with the resistor R2 whose one end was connected to the other electrode, and the phototriac S3 which one electrode was connected to the other end of the resistor R2. The phototriac coupler 14 further includes a light emitting diode LD connected to the signal processing circuit 15 through the resistor R3, and the phototriac coupler 14 is connected to the phototriac S3 from the light emitting diode LD. It is a structure in which an optical signal is incident. In addition, the phototriac S3 is a semiconductor switching element having a zero cross function, and when an optical signal from the light emitting diode LD is received, the phototriac S3 is connected to the one electrode side by the AC power supply 2. The center voltage (reference voltage) is detected and then turned on.

The temperature fuse F1 is fixed to the surface or vicinity of the phototriac S3 in order to function as a temperature detection element of the phototriac S3. In addition, as described later in Embodiment 9, the main body portion of the thermal fuse F1 is provided on the upper surface of the convex portion of the package of the phototriac S3 to function more efficiently.

In addition, in this embodiment, as shown in FIG.5 (a), when the temperature of the semiconductor switch 13 becomes more than predetermined temperature, the thermal fuse F1 which disconnects is a 2nd mechanical type on a 2nd feed path. Although provided between the contact switch 17 and the semiconductor switch 13, it is not limited to this position. For example, as shown to Fig.6 (a), this thermal fuse F1 may be provided on the 2nd feed path from the side near the connection node of a 2nd feed path and a 1st feed path. . As shown in FIG. 6B, the thermal fuse F1 may be provided between the AC power supply 2 and the first mechanical contact switch 12, that is, on the first feed path.

In addition, as shown in Fig. 5B, the first mechanical contact switch 12 is a latching mechanical contact switch, and the second mechanical contact switch 17 is configured by adding a magnetic coil L5. Similarly, the position of the thermal fuse F1 can be changed. For example, as shown to Fig.7 (a), this thermal fuse F1 is a side near the connection node of a 2nd feed path and a 1st feed path, and may be provided on the 2nd feed path. . As shown in FIG. 7B, the thermal fuse F1 may be provided between the AC power supply 2 and the first mechanical contact switch 12, that is, on the first feed path.

(Embodiment 5)

Next, the hybrid relay of Embodiment 5 of the present invention will be described. The hybrid relays shown in Figs. 8A and 8B are both modifications of the hybrid relay of the fourth embodiment shown in Fig. 5A. In FIG. 8A, a thermal fuse F2 for detecting an abnormal temperature of the triac S2 is provided between one electrode of the triac S2 and the second mechanical contact switch 17. . In FIG. 8B, the thermal fuse F3 is provided between one electrode of the phototriac S3 and the second mechanical contact switch 17. Even in this way, the same effects as in the hybrid relay of the embodiment shown in Fig. 5A can be obtained.

(Embodiment 6)

Next, the hybrid relay of Embodiment 6 of the present invention will be described. FIG. 9 is a diagram illustrating an internal configuration of a hybrid relay of Embodiment 6. FIG. In this example, the configuration in which the temperature fuse F1 is removed from the hybrid relay of the fourth embodiment shown in FIG. 5A and the temperature switch S4 connected between the emitter and collector of the transistor Tr1 is provided do. The function and effect of the temperature switch S4 are the same as that of Embodiment 2 shown in FIG.

(Seventh Embodiment)

Next, the hybrid relay of Embodiment 7 of the present invention will be described. 10 is a diagram illustrating an internal configuration of a hybrid relay of the seventh embodiment. In this example, the temperature fuse T1 for removing the temperature fuse F1 from the hybrid relay of the fourth embodiment of FIG. 5A and measuring the temperature of the semiconductor switch 13 and the semiconductor switch 13 It becomes the structure which provided the notification part 16 which notifies externally when temperature becomes abnormal temperature. Actions and effects of the temperature sensor T1 and the notification unit 16 are the same as those of the relay switch of the third embodiment shown in FIG. 4.

(Embodiment 8)

Next, the hybrid relay of Embodiment 8 of the present invention will be described. In the embodiment described above, the safety circuit portion such as the thermal fuse is provided in the second feed path by the semiconductor switch, but the safety circuit portion such as the thermal fuse may be installed in the first feed path by the mechanical switch. An example thereof is shown in FIG. In this example, in the configuration of the hybrid relay of Embodiment 1, the temperature fuse F1 is provided in the first feed path, that is, in the feed path by the mechanical switch. According to this configuration, even when the mechanical switch malfunctions and generates heat, the feed path is cut off and can be safely maintained. However, in this case, there is a problem that the feeder is cut off and the current supply to the load is stopped.

Thus, although the thermal fuse F1 was installed in the 1st feed path, you may make it install in both the 1st and 2nd feed paths. In this case, the blowdown temperature of the thermal fuse may be increased on the first feed path side. That is, by setting the safety control temperature higher than the semiconductor switch side on the mechanical switch side, when the mechanical switch reaches a predetermined temperature, the first feed path may be closed in any case to cut off the supply of current to the load.

In addition, in above-mentioned Embodiment 1-3 or Embodiment 4-8, you may use together temperature fuse F1, F2, F3, a temperature sensor, and a temperature switch. In that case, more efficient safety control is attained by changing the set temperature so that safety control can be performed in stages.

(Embodiment 9)

Next, as Embodiment 9 of this invention, the circuit arrangement of this hybrid relay is demonstrated.

12 is a top view of the printed wiring board 100 in which the temperature fuses F1 are provided in each of the semiconductor switches of the four hybrid relays. 13A and 13B are front and side views of a semiconductor switch and a thermal fuse. In this example, the main body portion 301 of the thermal fuse F1 is provided on the upper surface of the convex portion 202 of the package 201 of the phototriac S3 constituting the semiconductor switch 13. One lead terminal 302 of the lead terminals 302 and 303 of the thermal fuse F1 is disposed in close contact with the center of the package 201 of the phototriac S3. The mounting width W ₂ of the thermal fuse F1 and the phototriac S3 is the lead terminal 302 such that when the distance W ₁ between the lead terminals of the thermal fuse F1 is W ₂ > W ₁ . Is bent. The height of the center of the thermal fuse F1 was H ₁ , and the height of the body part was H ₂ .

According to this structure, the main body part 301 of the thermal fuse F1 abuts against the convex part 202 of the package 201 of the phototriac S3 with respect to the stress from above, so that the thermal fuse F1 The position of can be fixed. Moreover, since this position is ensured, the insulation distance between the lead terminals 302 and 303 and other components can be ensured, and it becomes possible to provide a hybrid relay resistant to the load.

Further, by arranging one of the lead terminals 302, 303 of the thermal fuse F1 in close contact with the center of the package 201 of the phototriac S3, the thermal fuse F1 is formed by the phototriac S3. Can prevent the fall. In addition, the phototriac S3 can also be prevented from falling to the temperature fuse F1 side. In this way, the thermal fuse F1 and the phototriac S3 are supported by each other, so that the angle with respect to the substrate surface can be maintained. As a result, not only the thermal fuse F1 and the phototriac S3 but also the insulation distance between these and other components can be ensured, and further reliability can be improved.

As described above, the hybrid relay of the present invention includes the following configuration.

The hybrid relay of the present invention includes a mechanical contact switch in which a contact is opened and closed by a driving unit, and a semiconductor switch connected in parallel with the mechanical contact switch, and is a feed path supplied from a power supply to a load. A hybrid relay comprising a first feed path and a second feed path by a semiconductor switch in parallel, wherein a temperature fuse that is disconnected when the temperature of the semiconductor switch reaches a predetermined temperature or more is provided on the second feed path. do.

In addition, the hybrid relay according to the present invention includes a mechanical contact switch in which a contact is opened and closed by a driving unit, and a semiconductor switch connected in parallel with the mechanical contact switch. A hybrid relay comprising a first feed path by a switch and a second feed path by a semiconductor switch in parallel, wherein a temperature switch for operating a driving unit to close a contact of a mechanical contact switch when the temperature of the semiconductor switch reaches a predetermined temperature or more Characterized in that installed.

In addition, the hybrid relay according to the present invention includes a mechanical contact switch in which a contact is opened and closed by a driving unit, and a semiconductor switch connected in parallel with the mechanical contact switch. A hybrid relay comprising a first feed path by a second feed path and a second feed path by a semiconductor switch, wherein the temperature sensor detects a temperature of the semiconductor switch and the temperature of the semiconductor switch detected by the temperature sensor is predetermined. It is characterized by including the control part which closes the contact of the said mechanical contact switch by operating the said drive part, when it became temperature abnormality.

In addition, the hybrid relay according to the present invention includes a first and a second mechanical contact switch in which a contact is opened and closed by a driving unit, and a semiconductor switch connected in parallel with the mechanical contact switch, and a power supply path supplied from the power supply to the load. A hybrid relay comprising a first feed path by the first mechanical contact switch and a second feed path in which the second mechanical contact switch and the semiconductor switch are configured in series, wherein the temperature of the semiconductor switch is When the temperature reaches a predetermined temperature or more, a thermal fuse to be disconnected is provided on the second feed path.

In addition, the hybrid relay according to the present invention includes a first and a second mechanical contact switch in which a contact is opened and closed by a driving unit, and a semiconductor switch connected in parallel with the mechanical contact switch, and a power supply path supplied from the power supply to the load. As a hybrid relay in which a first feed path by the first mechanical contact switch and a second feed path in which the second mechanical contact switch and the semiconductor switch are connected in series are configured in parallel, the temperature of the semiconductor switch is increased. It is characterized by providing the temperature switch which closes the contact of the said 1st mechanical contact switch by operating the drive part of the said 1st mechanical contact switch when it becomes more than predetermined temperature.

In addition, the hybrid relay according to the present invention includes a first and a second mechanical contact switch in which a contact is opened and closed by a driving unit, and a semiconductor switch connected in parallel with the mechanical contact switch, and a power supply path supplied from the power supply to the load. A hybrid relay comprising a first feed path by the first mechanical contact switch and a second feed path in which the second mechanical contact switch and the semiconductor switch are connected in series to detect a temperature of the semiconductor switch. And a control unit for operating the drive unit of the first mechanical contact switch to close the contact of the first mechanical contact switch when the temperature of the semiconductor switch detected by the temperature sensor is equal to or higher than a predetermined temperature. It features.

In the configuration in which the thermal fuse is provided as the safety circuit portion, when the semiconductor switch reaches an abnormal temperature equal to or higher than a predetermined temperature, the thermal fuse is disconnected and the second feed path is cut off, so that the semiconductor switch is further heated to prevent burnout and ignition.

Moreover, in the structure provided with the temperature switch as the said safety circuit part, when the semiconductor switch becomes abnormal temperature more than predetermined temperature, since the contact of the mechanical contact switch which comprises a 1st feed path is forcibly closed by a temperature switch, The amount of current flowing through the two feed paths decreases. For this reason, the semiconductor switch is further heated and does not burn out or ignite.

Moreover, in the structure provided with the temperature sensor as the said safety circuit part, and the control part which closes the contact of the mechanical contact switch which comprises a 1st feed path when the temperature of the semiconductor switch detected by this temperature sensor became more than predetermined temperature, it is a semiconductor. When the switch reaches an abnormal temperature equal to or higher than the predetermined temperature, the control unit forcibly closes the contact of the mechanical contact switch constituting the first feed path, so that the amount of current flowing in the second feed path decreases. For this reason, the semiconductor switch is further heated and does not burn out or ignite.

Moreover, in the structure provided with the notification part, the user can be notified of the lifetime of a semiconductor switch.

The hybrid relay may further include a notification unit that notifies the outside of the abnormality when the semiconductor switch reaches a predetermined temperature or more.

This application is based on the JP Patent application (Japanese Patent Application No. 2009-246239) of an application on October 27, 2009 and the Japanese patent application (Japanese Patent Application No. 2010-204786) of an application on September 13, 2010, The content here Is introduced as.

1: hybrid relay 2: AC power
3: load 10, 11: terminal
12: mechanical contact switch (first mechanical contact switch)
13: semiconductor switch 14: phototriac coupler
15 signal processing circuit 16 notification unit
F1? F3: thermal fuse S2: triac
S3: Photo Triac S4: Temperature Switch
S5: contact point T1: temperature sensor
201: package 202: convex portion
301: main body 302, 303: lead terminal

Claims (10)

A mechanical contact switch which opens and closes a contact by a driving unit,
A semiconductor switch connected in parallel with the mechanical contact switch,
A feeder for supplying power to a load from a power supply, A hybrid relay in which a first feeder by the mechanical contact switch and a second feeder by the semiconductor switch are connected in parallel.
A hybrid relay provided with a safety circuit portion for performing power feeding control when the temperature of the semiconductor switch reaches a predetermined temperature or more. The method according to claim 1,
The said safety circuit part is a hybrid relay which is a thermal fuse which disconnects when the temperature of the said semiconductor switch becomes more than predetermined temperature. The method according to claim 2,
And the thermal fuse is provided on the second feed path. The method according to claim 1,
The said safety circuit part is a hybrid relay which is a temperature switch which operates the said drive part and closes the contact of the said mechanical contact switch, when the temperature of the said semiconductor switch becomes more than predetermined temperature. The method according to claim 1,
The safety circuit unit, and a temperature sensor for detecting the temperature of the semiconductor switch;
And a control unit which closes the contact of the mechanical contact switch by operating the drive unit when the temperature of the semiconductor switch detected by the temperature sensor is equal to or higher than a predetermined temperature. The method according to any one of claims 1 to 5,
The mechanical contact switch includes a first and a second mechanical contact switch in which the contact is opened and closed by a driving unit,
A feed path for supplying the load from the power source, comprising a first feed path by the first mechanical contact switch and a second feed path in which the second mechanical contact switch and the semiconductor switch are connected in series, in parallel Hybrid relays. The method of claim 6,
And a temperature switch for closing the contact of the first mechanical contact switch by operating the drive unit of the first mechanical contact switch when the temperature of the semiconductor switch reaches a predetermined temperature or more. The method according to claim 1,
The safety circuit portion is a hybrid relay provided on an upper surface of the convex portion of the package of the semiconductor switch. The method according to claim 8,
And said safety circuit part is a thermal fuse, and one side of a lead terminal of said thermal fuse is disposed in close contact with the center of a package of said semiconductor switch. The method according to any one of claims 1 to 9,
And a notifying unit for notifying abnormality to the outside when the semiconductor switch reaches a predetermined temperature or more.

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