CN102576625B - Hybrid relay - Google Patents
Hybrid relay Download PDFInfo
- Publication number
- CN102576625B CN102576625B CN201080047874.2A CN201080047874A CN102576625B CN 102576625 B CN102576625 B CN 102576625B CN 201080047874 A CN201080047874 A CN 201080047874A CN 102576625 B CN102576625 B CN 102576625B
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- Prior art keywords
- switch
- temperature
- power supply
- mechanical contact
- supply circuits
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H47/00—Circuit arrangements not adapted to a particular application of the relay and designed to obtain desired operating characteristics or to provide energising current
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H47/00—Circuit arrangements not adapted to a particular application of the relay and designed to obtain desired operating characteristics or to provide energising current
- H01H47/002—Monitoring or fail-safe circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
- H01H9/54—Circuit arrangements not adapted to a particular application of the switching device and for which no provision exists elsewhere
- H01H9/541—Contacts shunted by semiconductor devices
- H01H9/542—Contacts shunted by static switch means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H47/00—Circuit arrangements not adapted to a particular application of the relay and designed to obtain desired operating characteristics or to provide energising current
- H01H47/02—Circuit arrangements not adapted to a particular application of the relay and designed to obtain desired operating characteristics or to provide energising current for modifying the operation of the relay
- H01H2047/025—Circuit arrangements not adapted to a particular application of the relay and designed to obtain desired operating characteristics or to provide energising current for modifying the operation of the relay with taking into account of the thermal influences, e.g. change in resistivity of the coil or being adapted to high temperatures
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- Relay Circuits (AREA)
Abstract
A kind of hybrid relay that can prevent the high heat of semiconductor switch is provided.Hybrid relay of the present invention possesses: mechanical contact switch (12), and its contact is disconnected by drive division or closes; And semiconductor switch (13), itself and this mechanical contact switch (12) is connected in parallel, first power supply circuits that mechanical contact switch (12) will be utilized to be formed and the second power supply circuits utilizing semiconductor switch (13) to be formed are connected in parallel and are used as by the power supply circuits of power supply to load supplying, such as, possess the safety circuit portion that temperature fuse F1 is used as the shut-off circuit when the temperature of semiconductor switch is more than set point of temperature.
Description
Technical field
The present invention relates to a kind of hybrid relay possessing mechanical contact switch and semiconductor switch.
Background technology
In the past, in order to possessing switching between load supplying and power-off of carrying out anti-facies-controlled negative circuit to ligthing paraphernalia etc., the hybrid relay of structure mechanical contact switch and semiconductor switch are connected in parallel was used.In addition, in the load possessing negative circuit, set up jumbo smmothing capacitor, so that alternating voltage is converted to direct voltage, when being energized to load by AC power, big current flows into this smmothing capacitor.Therefore, generation flows to shoving of load.Particularly when, high capacity high at supply voltage, flow into shoving of load and become large, therefore also flow in the hybrid relay be connected between load and AC power based on this big current shoved.
Therefore, in the hybrid relay be connected with this load, can when opening and stable state time carry out the switching of semiconductor switch and mechanical contact switch.First, be after conducting (ON) makes to shove and flows into semiconductor switch only making semiconductor switch, when the electric current being supplied to load becomes stable state, mechanical contact switch is made to be closed (ON) (with reference to patent documentation 1).By carrying out such action, big current can be suppressed to flow through mechanical contact switch in hybrid relay, therefore, it is possible to avoid causing contact weld by contact to producing electric arc before being about to contact.Like this, hybrid relay is set to and possesses semiconductor switch to prevent the structure of the contact weld in mechanical contact switch, make mechanical contact switch be ON and make semiconductor switch be cut-off (OFF), starting load supplying.
Patent documentation 1: Japanese Unexamined Patent Publication 11-238441 publication
Summary of the invention
the problem that invention will solve
Like this, possesses the hybrid relay of mechanical contact switch and semiconductor switch as the hybrid relay of patent documentation 1, in order to prevent the contact weld of mechanical contact switch, first making semiconductor switch be ON when powering, making semiconductor switch be OFF in the event of a power failure afterwards.Therefore, shove whenever carrying out unlatching, the closing motion of hybrid relay and all can flow through semiconductor switch, therefore the lifetime of semiconductor switch compared with mechanical contact switch.There is following situation: when this semiconductor switch reaches the life-span and the time of being short-circuited, semiconductor switch is continuous "on" position, and therefore semiconductor switch is in Gao Re and becomes reason on fire.
The present invention completes in view of the foregoing, and its object is to provides a kind of hybrid relay that can prevent the high heat of semiconductor switch.
for the scheme of dealing with problems
In order to reach above-mentioned purpose, hybrid relay of the present invention possesses: mechanical contact switch, and its contact is disconnected by drive division or closes; And semiconductor switch, itself and this mechanical contact switch is connected in parallel, wherein, the first power supply circuits formed utilizing mechanical contact switch and the second power supply circuits utilizing semiconductor switch to be formed are connected in parallel and are used as by the power supply circuits of power supply to load supplying, the feature of this hybrid relay is, also possess safety circuit portion, when the temperature of semiconductor switch is more than set point of temperature, this safety circuit portion carries out power supply control.
In addition, the present invention also comprises following characteristics, and in above-mentioned hybrid relay, safety circuit portion is temperature fuse, and when the temperature of semiconductor switch is more than set point of temperature, this temperature fuse disconnects.
In addition, the present invention also comprises following characteristics, and in above-mentioned hybrid relay, temperature fuse is arranged on the second power supply circuits.
In addition, the present invention also comprises following characteristics, and in above-mentioned hybrid relay, safety circuit portion is temperature switch, and when the temperature of semiconductor switch is more than set point of temperature, this temperature switch makes drive division action come the contact of closed mechanical contact switch.
In addition, the present invention also comprises following characteristics, and namely in above-mentioned hybrid relay, safety circuit portion possesses: temperature sensor, and it detects the temperature of semiconductor switch; And control part, when the temperature of the semiconductor switch detected by temperature sensor is more than set point of temperature, this control part makes drive division action come the contact of closed mechanical contact switch.
In addition, the present invention also comprises following characteristics, in above-mentioned hybrid relay, above-mentioned mechanical contact switch possesses the first mechanical contact switch and the second mechanical contact switch, the contact of this first mechanical contact switch and the second mechanical contact switch is closed by drive division or disconnects, second power supply circuits and the first power supply circuits utilizing the first mechanical contact switch to be formed are configured to by the power supply circuits of power supply to load supplying in parallel, wherein, these second power supply circuits are connected in series by the second mechanical contact switch and semiconductor switch.
In addition, the present invention also comprises following characteristics, in above-mentioned hybrid relay, is provided with temperature switch, when the temperature of semiconductor switch is more than set point of temperature, this temperature switch makes the drive division action of the first mechanical contact switch come the contact of closed first mechanical contact switch.
In addition, the present invention also comprises following characteristics, and in above-mentioned hybrid relay, safety circuit portion is arranged on above the protuberance of the packaging body of semiconductor switch.
In addition, the present invention also comprises following characteristics, and in above-mentioned hybrid relay, safety circuit portion is temperature fuse, and the Central places that a lead terminal of temperature fuse is closely attached on the packaging body of semiconductor switch is configured.
In addition, the present invention also comprises following characteristics, in above-mentioned hybrid relay, also possesses notification unit, and when the temperature of semiconductor switch is more than set point of temperature, this notification unit externally notifies exception.
the effect of invention
In the structure possessing above-mentioned safety circuit portion, power supply circuits can be cut off when semiconductor switch is the abnormal temperature of more than set point of temperature, therefore semiconductor switch can not burn because being further heated, on fire.
Accompanying drawing explanation
Fig. 1 is the synoptic circuit diagram of the internal structure of the hybrid relay representing embodiments of the present invention 1.
(a) of Fig. 2, (b) of Fig. 2 are the synoptic circuit diagram of the internal structure of the variation of the hybrid relay representing embodiments of the present invention 1 respectively.
Fig. 3 is the synoptic circuit diagram of the internal structure of the hybrid relay representing embodiments of the present invention 2.
Fig. 4 is the synoptic circuit diagram of the internal structure of the hybrid relay representing embodiments of the present invention 3.
(a) of Fig. 5, (b) of Fig. 5 are the synoptic circuit diagram of the internal structure of the hybrid relay representing embodiments of the present invention 4 respectively.
(a) of Fig. 6, (b) of Fig. 6 are the synoptic circuit diagram of the internal structure of the variation of the hybrid relay representing embodiments of the present invention 4 respectively.
(a) of Fig. 7, (b) of Fig. 7 are the synoptic circuit diagram of the internal structure of other variation of the hybrid relay representing embodiments of the present invention 4 respectively.
(a) of Fig. 8, (b) of Fig. 8 are the synoptic circuit diagram of the internal structure of the hybrid relay representing embodiments of the present invention 5 respectively.
Fig. 9 is the synoptic circuit diagram of the internal structure of the hybrid relay representing embodiments of the present invention 6.
Figure 10 is the synoptic circuit diagram of the internal structure of the hybrid relay representing embodiments of the present invention 7.
Figure 11 is the synoptic circuit diagram of the internal structure of the hybrid relay representing embodiments of the present invention 8.
Figure 12 is to the semiconductor switch of the hybrid relay of embodiments of the present invention 9 set temperature fuse F1 and the vertical view of the printed circuit board (PCB) obtained respectively.
The vertical view of Figure 13 to be (a) of the figure of the major part of the hybrid relay representing embodiments of the present invention 9, Figure 13 be semiconductor switch and temperature fuse, (b) of Figure 13 is the end view of semiconductor switch and temperature fuse.
Embodiment
Illustrate with reference to accompanying drawing and implement hybrid relay of the present invention.
(execution mode 1)
Fig. 1 is the synoptic circuit diagram of the internal structure representing execution mode.
As shown in Figure 1, the feature of this hybrid relay 1 is, the first power supply circuits formed utilizing mechanical contact switch 12 and the second power supply circuits utilizing semiconductor switch 13 to be formed are connected in parallel, and these second power supply circuits possess the safety circuit portion that temperature fuse F1 is used as closing when the temperature of semiconductor switch 13 is more than set point of temperature power supply circuits.
This hybrid relay 1 forms closed-loop path by being connected with terminal 10,11 with AC power 2 and load 3, and this terminal 10,11 is the one end of the AC power 2 and load 3 be connected in series respectively.That is, by making hybrid relay 1 be that conducting (ON) or cut-off (OFF) decide to be energized and power-off by AC power 2 pairs of loads 3.At this, such as, AC power 2 is set to the source power supply etc. of 100V, load 3 is such as the ligthing paraphernalia or air exhauster etc. that comprise fluorescent lamp, incandescent lamp.
That is, this hybrid relay 1 possesses: terminal 10, and it is connected with one end of AC power 2, and the other end of this AC power 2 is connected with one end of load 3; Terminal 11, it is connected with the other end of load 3; Mechanical contact switch 12 and semiconductor switch 13, their two ends are connected with terminal 10,11 and they are parallel with one anotherly connected; And signal processing circuit 15.Further, this mechanical contact switch 12 has contact portion S1.In addition, semiconductor switch 13 has three terminal bidirectional switch S 2, is connected in parallel with contact portion S1 by making two ends be connected with mechanical contact switch 12 and terminal 10,11.Further, closed (the ON)/disconnection (OFF) of this signal processing circuit 15 pairs of mechanical contact switch 12 and conducting (the ON)/cut-off (OFF) of semiconductor switch 13 control.Mechanical contact switch 12 is made up of contact portion S1 and solenoid L1, and this solenoid L1 produces and contact portion S1 disconnected or closed electromagnetic force.One end of solenoid L1 is applied in power supply potential, and the other end is connected with the drain electrode of transistor Tr1.The base electrode of transistor Tr1 is transfused to the control signal from signal processing circuit 15, and grounded emitter.Like this, utilize signal processing circuit 15 and be attached thereto the transistor Tr1 that connects as drive division to make mechanical contact switch 12 disconnect or closed.
Semiconductor switch 13 possesses three terminal bidirectional switch S 2 and photoelectricity three terminal bidirectional switch couples device 14.An electrode of this three terminal bidirectional switch S 2 is connected with terminal 10 via temperature fuse F1, and another electrode is connected with terminal 11.Photoelectricity three terminal bidirectional switch couples device 14 has the photoelectricity three terminal bidirectional switch S 3 of zero-based and the light-emitting diode LD to this photoelectricity three terminal bidirectional switch S 3 incident optical signal.The photoelectricity three terminal bidirectional switch S 3 of zero-based is connected between another electrode and gate electrode of three terminal bidirectional switch S 2.Further, power supply potential is applied to the anode electrode of this light-emitting diode LD, and cathode electrode is connected with the drain electrode of the npn transistor npn npn Tr2 as switch element.In addition, the base electrode of this transistor Tr2 is transfused to the control signal from signal processing circuit 15, and grounded emitter.
Below, to hybrid relay 1 carry out respectively be energized by AC power 2 pairs of loads 3 and power-off time action illustrate simply.First, when being energized by AC power 2 pairs of loads 3, applying control signal from the base electrode of signal processing circuit 15 couples of transistor Tr2, making transistor Tr2 be conducting state (ON).Thus, in semiconductor switch 13, the light signal from light-emitting diode LD is incident to photoelectricity three terminal bidirectional switch S 3, makes photoelectricity three terminal bidirectional switch S 3 for conducting (ON).In addition, photoelectricity three terminal bidirectional switch S 3 possesses zero passage function, therefore when voltage (reference voltage) centered by the alternating voltage from AC power 2 being detected, makes photoelectricity three terminal bidirectional switch S 3 for ON.
Make the alternating current from AC power 2 flow through photoelectricity three terminal bidirectional switch S 3 by this photoelectricity three terminal bidirectional switch S 3 of conducting, therefore provide electric current to the gate electrode of three terminal bidirectional switch S 2, photoelectricity three terminal bidirectional switch S 3 is ON.Thus, load 3 is electrically connected with AC power 2 via the semiconductor switch 13 in hybrid relay 1, therefore, it is possible to utilize AC power 2 pairs of loads 3 to be energized.Like this, making after the three terminal bidirectional switch S 2 in semiconductor switch 13 connects the power supply from AC power 2 for ON to load 3, the base electrode of signal processing circuit 15 couples of transistor Tr1 applies control signal, makes transistor Tr1 be ON, provides drive current to solenoid L1.Thus, solenoid L1 produces electromagnetic force, and contact portion S1 becomes closed (ON) state.
And, when the contact portion S1 utilizing AC power 2 via this mechanical contact switch 12 starts to power to load 3, in order to cut off the power supply circuits in semiconductor switch 13, signal processing circuit 15 makes transistor Tr2 be cut-off state (OFF), stops providing electric current to light-emitting diode LD.Therefore, light-emitting diode LD stops light-emission operation, stop photoelectricity three terminal bidirectional switch S 3 incident optical signal, therefore centered by the alternating voltage from AC power 2 time voltage (reference voltage), photoelectricity three terminal bidirectional switch S 3 stops action and becomes OFF.Further, when photoelectricity three terminal bidirectional switch S 3 is OFF, no longer provide electric current to the gate electrode of three terminal bidirectional switch S 2, therefore make three terminal bidirectional switch S 2 for cut-off state, make semiconductor switch 13 be OFF.
On the other hand, when cutting off the power supply by AC power 2 pairs of loads 3, the base electrode of signal processing circuit 15 couples of transistor Tr2 applies control signal, makes transistor Tr2 be ON, to the light signal of photoelectricity three terminal bidirectional switch S 3 incidence from light-emitting diode LD.Thus, make three terminal bidirectional switch S 2 for ON by making photoelectricity three terminal bidirectional switch S 3 for ON, except the power supply circuits (the first power supply circuits) utilizing mechanical contact switch 12 to be formed, in hybrid relay 1, also form the power supply circuits (the second power supply circuits) utilizing semiconductor switch 13 to form.Further, signal processing circuit 15 makes transistor Tr1 be OFF, stops providing drive current to solenoid L1, makes contact portion S1 be off (OFF) state.Thereby, it is possible to the power supply circuits (the first power supply circuits) cutting off main power supply circuits, namely utilize mechanical contact switch 12 to be formed.Afterwards, signal processing circuit 15 makes transistor Tr2 be OFF, stops providing electric current to light-emitting diode LD, makes photoelectricity three terminal bidirectional switch S 3 for OFF thus.Thus, owing to making three terminal bidirectional switch S 2 for OFF, therefore, it is possible to cut off the power supply circuits utilizing semiconductor switch 13 to be formed, therefore, it is possible to cut off by the power supply of AC power 2 pairs of loads 3.
Temperature fuse F1 be fixed on three terminal bidirectional switch S 2 surface or near, using as detect three terminal bidirectional switch S 2 abnormal temperature detector unit and play function.When the temperature of three terminal bidirectional switch S 2 is the abnormal temperature of more than operating temperature, such as flow into three terminal bidirectional switch S 2 or three terminal bidirectional switch S 2 when to shove etc. owing to reaching life-span and the time of being short-circuited, this temperature fuse F1 disconnects, and can cut off and provide electric current to three terminal bidirectional switch S 2 and photoelectricity three terminal bidirectional switch S 3.Configuration about this temperature fuse F1 hereinafter describes, but not apply mechanicalness load and to be configured near the mode of semiconductor switch 13.At this, temperature fuse F1 is configured to make temperature fuse lead terminal be closely attached on the center of the packaging body of semiconductor switch 13 on the protuberance of the packaging body of semiconductor switch 13.
Thereby, it is possible to protection three terminal bidirectional switch S 2 and photoelectricity three terminal bidirectional switch S 3 are from heat damage, fire etc. can be prevented.At this, the power supply circuits utilizing temperature fuse F1 to cut off are only the power supply circuits (the second power supply circuits) utilizing semiconductor switch 13 to be formed, switch on and off due to the power supply circuits (the first power supply circuits) utilizing main contacts, i.e. mechanical contact switch 12 to be formed can be made, even if therefore after temperature fuse disconnects, also can by controlling the disconnection of mechanical contact switch 12 or closing to perform and power and power-off to load 3.
In addition, in the above-described embodiment, the structure being connected with temperature fuse F1 between the connected node and terminal 10 of three terminal bidirectional switch S 2 and photoelectricity three terminal bidirectional switch S 3 is illustrated, but as variation, also can be set to the structure as (a) of Fig. 2, namely, by the temperature fuse F2 of the abnormal temperature detecting three terminal bidirectional switch S 2 be connected between an electrode of three terminal bidirectional switch S 2 and terminal 10.In addition, also can be set to the structure as shown in (b) of Fig. 2, namely, between an electrode and an electrode of three terminal bidirectional switch S 2 of photoelectricity three terminal bidirectional switch S 3, be connected the temperature fuse F3 of the abnormal temperature detecting three terminal bidirectional switch S 2.And, when the structure that (b) of (a) or Fig. 2 that are configured to Fig. 1, Fig. 2 is such, allocation position can be adjusted, make it possible to utilize temperature fuse F1, F2 not only to detect the abnormal temperature of three terminal bidirectional switch S 2, also detect the abnormal temperature of photoelectricity three terminal bidirectional switch S 3.
(execution mode 2)
Then, with reference to accompanying drawing, embodiments of the present invention 2 are described.Fig. 3 is the synoptic circuit diagram of the internal structure of the hybrid relay representing execution mode 2.In addition, identical Reference numeral is added to the part identical with the hybrid relay of the execution mode 1 shown in Fig. 1, omits its detailed description.
As shown in Figure 3, this hybrid relay is following structure: remove temperature fuse F1 from the structure of the execution mode 1 shown in Fig. 1, arrange the temperature switch S4 be connected between the emitter of transistor Tr1 and collector electrode.Thus, different from the relay switch of the execution mode 1 shown in Fig. 1 in the action only carried out at temperature switch S4, and other structure, action are identical with the execution mode of Fig. 1, therefore omit its detailed content.Below, the action based on temperature switch S4 is described.
Temperature switch S4 is as bimetal release etc., the switch carrying out closing or disconnecting action by reacting to the temperature detected is formed, in the same manner as the hybrid relay of the execution mode 1 of Fig. 1, in order to detect the temperature of the three terminal bidirectional switch S 2 in semiconductor switch 13, this temperature switch S4 be fixed on three terminal bidirectional switch S 2 surface or near.
As long as three terminal bidirectional switch S 2 is in set point of temperature, then temperature switch S4 is off the state of (OFF), is controlled the drive current provided or cut off solenoid L1 by ON or OFF of transistor Tr1.On the other hand, if the temperature of three terminal bidirectional switch S 2 is the temperature higher than set point of temperature, then temperature switch S4 is the state of closed (ON), forces to provide drive current to solenoid L1.Thus, electromagnetic force is produced by solenoid L1, the contact S1 of mechanical contact switch 12 is made to become ON forcibly, therefore form the power supply circuits utilizing this mechanical contact switch 12 to be formed and be used as main power supply circuits, consequently, can the magnitude of current flowing through the power supply circuits utilizing semiconductor switch 13 to be formed be suppressed.Thus, the magnitude of current flowing through three terminal bidirectional the switch S 2 and photoelectricity three terminal bidirectional switch S 3 forming semiconductor switch 13 respectively declines, therefore, it is possible to prevent from producing high heat by semiconductor switch 13.
Further, with reference to accompanying drawing, other execution mode is described.Fig. 4 is the synoptic circuit diagram of the internal structure representing other execution mode.In addition, identical Reference numeral is added to the part identical with the execution mode of Fig. 1, and omit its detailed description.
(execution mode 3)
Then, the hybrid relay of embodiments of the present invention 3 is described.As shown in Figure 4, in this embodiment, for following structure: remove temperature fuse F1 from the hybrid relay of execution mode 1 as shown in Figure 1, and the temperature sensor T1 that the temperature measuring semiconductor switch is set and the notification unit 16 externally notified when the temperature of semiconductor switch 13 is abnormal temperature.Thus, the structure identical to the hybrid relay of the execution mode with Fig. 1 is added identical Reference numeral and omits the description, below, temperature sensor is described.
Temperature sensor T1 is made up of such temperature-sensing elements such as thermistors, in the same manner as temperature fuse F1 in the hybrid relay of the execution mode of Fig. 1, in order to detect the temperature of the three terminal bidirectional switch S 2 in semiconductor switch 13, temperature sensor T1 is fixed on three terminal bidirectional switch S 2 surface or near.Further, in the measurement moment of the every regulation of temperature sensor T1, the temperature of the semiconductor switch 13 measured is informed to signal processing part 15.
Signal processing part 15 is connected with notification unit 16, externally notify that exception occurs semiconductor switch 13, this notification unit 16 is made up of display unit such as the sounding body such as loud speaker or buzzer, LED (Light Emitting Diode: light-emitting diode) or liquid crystal display.
That is, detected the temperature of semiconductor switch 13 by temperature sensor T1, if abnormal temperature, then drive notification unit 16, externally there is this extremely in notice.
Now, signal processing part 15 can be following structure: apply control signal to the base electrode of transistor Tr1, make transistor Tr1 be ON, thus mechanical contact switch 12 is closed.By like this, the power supply circuits be made up of mechanical contact switch 12 can be formed forcibly and be used as main power supply circuits, thus can the magnitude of current flowing through the power supply circuits utilizing semiconductor switch 13 to be formed be suppressed.Thereby, it is possible to make the magnitude of current respectively flowing through three terminal bidirectional the switch S 2 and photoelectricity three terminal bidirectional switch S 3 forming semiconductor switch 13 decline, thus can prevent semiconductor switch 13 from producing high heat.In addition, by performing notification action by notification unit 16, can be abnormal temperature to external notification semiconductor switch 13, the life-span of user's semiconductor switch 13 can be informed as early as possible.
In addition, in this case, also can use the temperature fuse F1 of execution mode 1 simultaneously.In addition, the temperature that now can utilize temperature sensor T1 that temperature fuse F1 is occurred in fusing is set as higher than temperature when driving notification unit 16, carrys out prior notice thus and produces high heat.
(execution mode 4)
Then, the hybrid relay of embodiments of the present invention 4 is described with reference to accompanying drawing.Fig. 5 is the synoptic circuit diagram of the internal structure of the hybrid relay representing execution mode 4.In addition, identical Reference numeral added to the part identical with the hybrid relay of the execution mode 1 shown in Fig. 1 and omit its detailed description.
As shown in (a) of Fig. 5, the hybrid relay of embodiments of the present invention 4 is the structures that with the addition of the second mechanical contact switch 17 in the basic structure of the hybrid relay 1 of the execution mode 1 shown in Fig. 1.
That is, in the present embodiment, possess: terminal 10, it is connected with one end of AC power 2, and the other end of this AC power 2 is connected with one end of load 3; Terminal 11, it is connected with the other end of load 3; First mechanical contact switch 12, it has the contact portion S1 that two ends are connected with terminal 10,11; Second mechanical contact switch 17, it has the contact portion S5 that one end is connected with the connected node of one end of contact portion S1 with terminal 10; Semiconductor switch 13, it has photoelectricity three terminal bidirectional switch S 3, and an electrode of this photoelectricity three terminal bidirectional switch S 3 is connected with the other end of contact portion S5, and another electrode is connected with terminal 11; And signal processing circuit 15, it controls respective the closing (ON) and disconnect (OFF) of the first mechanical contact switch 12, second mechanical contact switch 17 and semiconductor switch 13.Below, in the circuit with two mechanical contact switch, be set to the first mechanical contact switch 12 and the second mechanical contact switch 17, but it is identical with the mechanical contact switch 12 that above-mentioned execution mode uses to be set to the first mechanical contact switch 12, and additional identical Reference numeral.
The structure of the first mechanical contact switch 12, second mechanical contact switch 17 shown in (a) of Fig. 5 is identical with the mechanical contact switch 12 shown in Fig. 1.In addition, the structure of the semiconductor switch 13 in Fig. 5 is identical with the semiconductor switch 13 in Fig. 1, but an electrode of photoelectricity three terminal bidirectional switch S 3 is connected with the other end of the contact portion S5 of the second mechanical contact switch 17 via temperature fuse F1.
Namely, the hybrid relay of present embodiment is possessed contact and is disconnected by drive division or the first closed mechanical contact switch 12 and the second mechanical contact switch 17, and the semiconductor switch 13 to be connected in parallel with this second mechanical contact switch, in this hybrid relay, utilize the first power supply circuits power supply circuits of being configured to by AC power 2 pair loads 3 provided electric power in parallel with the second power supply circuits that the first mechanical contact switch 12 is formed, wherein, these second power supply circuits by the second mechanical contact switch 17 and semiconductor switch 13 in series, set temperature fuse F1 on the second power supply circuits, this temperature fuse F1 disconnects when the temperature of semiconductor switch 13 is more than set point of temperature.The hybrid relay of the effect of temperature fuse F1, the embodiments of the present invention 1 shown in effect with Fig. 1 is identical.
Hybrid relay shown in (b) of Fig. 5 is the variation of the hybrid relay shown in Fig. 5 (a), and the structure of the first mechanical contact switch 12, second mechanical contact switch 17 and semiconductor switch 13 is different.
That is, the first mechanical contact switch 12 is locking type mechanical contact switch, possesses: solenoid L3, and it produces the electromagnetic force being used for contact portion S1 being switched to closed (ON); And solenoid L4, it produces the electromagnetic force being used for contact portion S1 being switched to disconnection (OFF).One end of solenoid L3 is connected with signal processing circuit 15 via preventing the diode D1 of adverse current, other end ground connection.On the other hand, one end of solenoid L4 is connected with signal processing circuit 15 via preventing the diode D3 of adverse current, other end ground connection.The diode D2 be connected in parallel with solenoid L3 and be the diode of bypass with the diode D4 that solenoid L4 is connected in parallel.
On the other hand, the second mechanical contact switch 17 possesses solenoid L5.One end of solenoid L5 is connected with signal processing circuit 15 via preventing the diode D5 of adverse current, other end ground connection.The diode D6 be connected in parallel with solenoid L5 is the diode of bypass.
Semiconductor switch 13 is formed by with lower component: three terminal bidirectional switch S 2; Resistance R1 and capacitor C1, they are connected in one of three terminal bidirectional switch S 2 in parallel between electrode and gate electrode; Resistance R2, its one end is connected with another electrode of three terminal bidirectional switch S 2; And photoelectricity three terminal bidirectional switch couples device 14, it possesses photoelectricity three terminal bidirectional switch S 3, and an electrode of this photoelectricity three terminal bidirectional switch S 3 is connected with the other end of resistance R2.Photoelectricity three terminal bidirectional switch couples device 14 is following structures: also possess the light-emitting diode LD be connected with signal processing circuit 15 via resistance R3, to the light signal of photoelectricity three terminal bidirectional switch S 3 incidence from light-emitting diode LD.In addition, photoelectricity three terminal bidirectional switch S 3 is the thyristors possessing zero passage function, when by the light signal of incidence from light-emitting diode LD, this photoelectricity three terminal bidirectional switch S 3 just conducting (ON) after an electrode side detects the center voltage (reference voltage) of the alternating voltage of AC power 2.
Temperature fuse F1 be fixed on photoelectricity three terminal bidirectional switch S 3 surface or near, play function using the detector unit as photoelectricity three terminal bidirectional switch S 3.In addition, in execution mode 9, as described later, by the main part of temperature fuse F1 is arranged on the protuberance of the packaging body of photoelectricity three terminal bidirectional switch S 3 above come to play function more efficiently.
In addition, in the present embodiment, as shown in (a) of Fig. 5, the temperature fuse F1 disconnected when the temperature of semiconductor switch 13 is more than set point of temperature is arranged on the second power supply circuits, between the second mechanical contact switch 17 and semiconductor switch 13, but is not limited to this position.Such as, shown in (a) of Fig. 6, also this temperature fuse F1 can be arranged on the second power supply circuits of the connected node side of close second power supply circuits and the first power supply circuits.In addition, as shown in (b) of Fig. 6, also this temperature fuse F1 can be arranged between AC power 2 and the first mechanical contact switch 12, namely on the first power supply circuits.
In addition, as shown in (b) of Fig. 5, when the first mechanical contact switch 12 being set to locking type mechanical contact switch, add solenoid L5 when forming second mechanical contact switch 17, the position of temperature fuse F1 can be changed too.Such as, shown in (a) of Fig. 7, also this temperature fuse F1 can be arranged on the second power supply circuits of the connected node side of close second power supply circuits and the first power supply circuits.In addition, as shown in (b) of Fig. 7, also this temperature fuse F1 can be arranged between AC power 2 and the first mechanical contact switch 12, namely on the first power supply circuits.
(execution mode 5)
Then, the hybrid relay of embodiments of the present invention 5 is described.(a) of Fig. 8, the hybrid relay shown in (b) of Fig. 8 are all the variation of the hybrid relay of the execution mode 4 shown in Fig. 5 (a).In (a) of Fig. 8, the temperature fuse F2 detected the abnormal temperature of three terminal bidirectional switch S 2 is arranged between an electrode of three terminal bidirectional switch S 2 and the second mechanical contact switch 17.In addition, in (b) of Fig. 8, temperature fuse F2 is arranged between an electrode of photoelectricity three terminal bidirectional switch S 3 and the second mechanical contact switch 17.Even if so also the effect identical with the hybrid relay of the execution mode shown in (a) of Fig. 5 can be obtained.
(execution mode 6)
Then, the hybrid relay of embodiments of the present invention 6 is described.Fig. 9 is the figure of the internal structure of the hybrid relay representing execution mode 6.In this embodiment, hybrid relay is following structure: from the hybrid relay of the execution mode 4 shown in (a) of Fig. 5, remove temperature fuse F1, and set temperature switch S 4, between the emitter that this temperature switch S4 is connected to transistor Tr1 and collector electrode.The effect of temperature switch S4 is identical with the execution mode 2 shown in Fig. 3.
(execution mode 7)
Then, the hybrid relay of embodiments of the present invention 7 is described.Figure 10 is the figure of the internal structure of the hybrid relay representing execution mode 7.In this embodiment, hybrid relay is following structure: from the hybrid relay of the execution mode 4 shown in (a) of Fig. 5, remove temperature fuse F1, and the temperature sensor T1 that the temperature measuring semiconductor switch 13 is set and the notification unit 16 externally notified when the temperature of semiconductor switch 13 is abnormal temperature.The relay switch of the effect of temperature sensor T1, notification unit 16, the execution mode 3 shown in effect with Fig. 4 is identical.
(execution mode 8)
Then, the hybrid relay of embodiments of the present invention 8 is described.In the embodiment described above, the safety circuit portions such as temperature fuse be arranged on utilize semiconductor switch to be formed the second power supply circuits on, but also the safety circuit portions such as temperature fuse can be arranged on utilize mechanical switch to be formed the first power supply circuits on.Figure 11 shows a wherein example.In this embodiment, in the structure of the hybrid relay of execution mode 1, temperature fuse F1 is arranged on the first power supply circuits, namely utilize mechanical switch to be formed power supply circuits on.According to this structure, even if when causing heating due to mechanical switch generation misoperation, also can power supply circuits be cut off and maintain safety.But, in this case, there is the problem cut off power supply circuits and caused stopping load being provided to electric current.
Like this, although temperature fuse F1 is arranged on the first power supply circuits, also temperature fuse F1 can be arranged on the first power supply circuits and the second power supply circuits.In this case, the fusing-off temperature that the fusing-off temperature of temperature fuse can be set as the temperature fuse of the first power supply circuits side is high.That is, by making the security control temperature of security control temperature higher than semiconductor switch side of mechanical switch side, thus once mechanical switch is set point of temperature, under any circumstance all making the first power supply circuits disconnect, cutting off the electric current supply to load.
In addition, in above execution mode 1 to 3 or execution mode 4 to 8, can simultaneously serviceability temperature fuse F1, F2, F3 or temperature sensor, temperature switch.In this case, by being configured to can change design temperature, carry out security control step by step, more efficient security control can be carried out.
(execution mode 9)
Then, as embodiments of the present invention 9, the Circnit Layout of this hybrid relay is described.
Figure 12 is set temperature fuse F1 and the vertical view of the printed circuit board (PCB) 100 obtained respectively on the semiconductor switch of four hybrid relaies.(a) of Figure 13 and (b) of Figure 13 is front view and the end view of semiconductor switch and temperature fuse.In this example embodiment, form semiconductor switch 13 photoelectricity three terminal bidirectional switch S 3 packaging body 201 protuberance 202 above the main part 301 of set temperature fuse F1.Further, a Central places lead terminal 302 in the lead terminal 302,303 of temperature fuse F1 being closely attached on the packaging body 201 of photoelectricity three terminal bidirectional switch S 3 is configured.About the installing space W of temperature fuse F1 and photoelectricity three terminal bidirectional switch S 3
2, when the lead terminal spacing of temperature fuse F1 is set to W
1time, make lead terminal 302 bending to make W
2> W
1.The height at the center of temperature fuse F1 is set to H
1, the height of main part is set to H
2.
According to this structure, for the stress from top, the main part 301 of temperature fuse F1 is abutted to the protuberance 202 of the packaging body 201 of photoelectricity three terminal bidirectional switch S 3, thus can the position of fixed temperature fuse F1.In addition, by guaranteeing that the insulation distance between lead terminal 302,303 and other parts is guaranteed in this position, can be able to provide for the firm hybrid relay of load.
In addition, be configured by a Central places lead terminal in the lead terminal 302,303 of temperature fuse F1 being closely attached on the packaging body 201 of photoelectricity three terminal bidirectional switch S 3, photoelectricity three terminal bidirectional switch S 3 can be utilized to prevent toppling over of temperature fuse F1.In addition, can also prevent photoelectricity three terminal bidirectional switch S 3 from rolling to temperature fuse F1.Like this, temperature fuse F1 and photoelectricity three terminal bidirectional switch S 3 support mutually, can maintain the angle relative to real estate.Consequently, much less temperature fuse F1 and photoelectricity three terminal bidirectional switch S 3 are to guarantee insulation distance between they and other parts, thus can improve reliability further.
As described above, hybrid relay of the present invention comprises the parts possessing following structure.
Hybrid relay of the present invention possesses: mechanical contact switch, and its contact is closed by drive division or disconnects; And semiconductor switch, itself and this mechanical contact switch is connected in parallel, wherein, the first power supply circuits formed utilizing this mechanical contact switch and the second power supply circuits utilizing semiconductor switch to be formed are configured to by the power supply circuits of power supply to load supplying in parallel, the feature of this hybrid relay is, set temperature fuse on the second power supply circuits, this temperature fuse disconnects when the temperature of semiconductor switch is more than set point of temperature.
In addition, hybrid relay of the present invention possesses: mechanical contact switch, and its contact is closed by drive division or disconnects; And semiconductor switch, itself and this mechanical contact switch is connected in parallel, the first power supply circuits formed utilizing above-mentioned mechanical contact switch and the second power supply circuits utilizing above-mentioned semiconductor switch to be formed are configured to by the power supply circuits of power supply to load supplying in parallel, the feature of this hybrid relay is, set temperature switch, when the temperature of semiconductor switch is more than set point of temperature, this temperature switch makes drive division action come the contact of closed mechanical contact switch.
In addition, hybrid relay of the present invention possesses: mechanical contact switch, and its contact is closed by drive division or disconnects; And semiconductor switch, itself and this mechanical contact switch is connected in parallel, the first power supply circuits formed utilizing above-mentioned mechanical contact switch and the second power supply circuits utilizing above-mentioned semiconductor switch to be formed are configured to by the power supply circuits of power supply to load supplying in parallel, the feature of this hybrid relay is, also possess: temperature sensor, it detects the temperature of above-mentioned semiconductor switch; And control part, when the temperature of the above-mentioned semiconductor switch detected by said temperature transducer is more than set point of temperature, this control part makes above-mentioned drive division action come the contact of closed above-mentioned mechanical contact switch.
In addition, hybrid relay of the present invention possesses: the first mechanical contact switch and the second mechanical contact switch, and the contact of this first mechanical contact switch and the second mechanical contact switch is closed by drive division or disconnects; And semiconductor switch, itself and this mechanical contact switch is connected in parallel, second power supply circuits and the first power supply circuits utilizing this first mechanical contact switch to be formed are configured to by the power supply circuits of power supply to load supplying in parallel, wherein, these second power supply circuits are in series made up of above-mentioned second mechanical contact switch and above-mentioned semiconductor switch, the feature of this hybrid relay is, set temperature fuse on above-mentioned second power supply circuits, this temperature fuse disconnects when the temperature of above-mentioned semiconductor switch is more than set point of temperature.
In addition, hybrid relay of the present invention possesses: the first mechanical contact switch and the second mechanical contact switch, and the contact of this first mechanical contact switch and the second mechanical contact switch is closed by drive division or disconnects, and semiconductor switch, itself and this mechanical contact switch is connected in parallel, second power supply circuits and the first power supply circuits utilizing above-mentioned first mechanical contact switch to be formed are configured to by the power supply circuits of power supply to load supplying in parallel, wherein, these second power supply circuits are connected in series by above-mentioned second mechanical contact switch and above-mentioned semiconductor switch, the feature of this hybrid relay is, set temperature switch, when the temperature of above-mentioned semiconductor switch is more than set point of temperature, this temperature switch makes the drive division action of above-mentioned first mechanical contact switch come the contact of closed above-mentioned first mechanical contact switch.
In addition, hybrid relay of the present invention possesses: the first mechanical contact switch and the second mechanical contact switch, and the contact of this first mechanical contact switch and the second mechanical contact switch is closed by drive division or disconnects; And semiconductor switch, itself and this mechanical contact switch is connected in parallel, second power supply circuits and the first power supply circuits utilizing above-mentioned first mechanical contact switch to be formed are configured to by the power supply circuits of power supply to load supplying in parallel, wherein, these second power supply circuits are connected in series by above-mentioned second mechanical contact switch and above-mentioned semiconductor switch, the feature of this hybrid relay is also possess: temperature sensor, and it detects the temperature of above-mentioned semiconductor switch; And control part, when the temperature of the above-mentioned semiconductor switch detected by said temperature transducer is more than set point of temperature, this control part makes the drive division action of above-mentioned first mechanical contact switch come the contact of closed above-mentioned first mechanical contact switch.
Possessing in the structure of temperature fuse as above-mentioned safety circuit portion, when semiconductor switch is the abnormal temperature of more than set point of temperature, temperature fuse disconnect, cut off the second power supply circuits, therefore semiconductor switch can not burn because being further heated, on fire.
In addition, possessing in the structure of temperature switch as above-mentioned safety circuit portion, when semiconductor switch is the abnormal temperature of more than set point of temperature, utilize temperature switch to close the contact of the mechanical contact switch of formation first power supply circuits forcibly, the magnitude of current therefore flowing through the second power supply circuits reduces.Therefore, semiconductor switch can not burn because being further heated, on fire.
In addition, possessing temperature sensor and making the control part of the closing of contact of the mechanical contact switch forming the first power supply circuits when the temperature of the semiconductor switch detected by this temperature sensor is more than set point of temperature, be used as in the structure in above-mentioned safety circuit portion, when semiconductor switch is the abnormal temperature of more than set point of temperature, control part closes the contact of the mechanical contact switch of formation first power supply circuits forcibly, and the magnitude of current therefore flowing through the second power supply circuits reduces.Therefore, semiconductor switch can not burn because being further heated, on fire.
In addition, in the structure possessing notification unit, the life-span of semiconductor switch can be notified to user.
In addition, above-mentioned hybrid relay can also possess notification unit, and when the temperature of above-mentioned semiconductor switch is more than set point of temperature, this notification unit externally notifies exception.
Based on the Japanese patent application (Patent 2010-204786) of the Japanese patent application (Patent 2009-246239) that the application applied for by October 27th, 2009 and application on September 13rd, 2010, at this, its content is introduced into the present invention as reference.
description of reference numerals
1: hybrid relay; 2: AC power; 3: load; 10,11: terminal; 12: mechanical contact switch (the first mechanical contact switch); 13: semiconductor switch; 14: photoelectricity three terminal bidirectional switch couples device; 15: signal processing circuit; 16: notification unit; F1 ~ F3: temperature fuse; S2: three terminal bidirectional switch; S3: photoelectricity three terminal bidirectional switch; S4: temperature switch; S5: contact portion; T1: temperature sensor; 201: packaging body; 202: protuberance; 301: main part; 302,303: lead terminal.
Claims (5)
1. a hybrid relay, possesses:
Mechanical contact switch, its contact is disconnected by drive division or closes; And
Semiconductor switch, itself and above-mentioned mechanical contact switch are connected in parallel,
Wherein, the first power supply circuits formed utilizing above-mentioned mechanical contact switch and the second power supply circuits utilizing above-mentioned semiconductor switch to be formed are connected in parallel and are used as by the power supply circuits of power supply to load supplying,
This hybrid relay also possesses safety circuit portion, and when the temperature of above-mentioned semiconductor switch is more than set point of temperature, this safety circuit portion carries out power supply control,
Wherein, above-mentioned safety circuit portion is arranged on above the protuberance of the packaging body of above-mentioned semiconductor switch,
Above-mentioned safety circuit portion is temperature fuse, and the Central places that a lead terminal of said temperature fuse is closely attached on the packaging body of above-mentioned semiconductor switch is configured.
2. hybrid relay according to claim 1, is characterized in that,
When the temperature of above-mentioned semiconductor switch is more than set point of temperature, said temperature fuse disconnects.
3. hybrid relay according to claim 2, is characterized in that,
Said temperature fuse is arranged on above-mentioned second power supply circuits.
4. the hybrid relay according to any one in claims 1 to 3, is characterized in that,
Above-mentioned mechanical contact switch possesses the first mechanical contact switch and the second mechanical contact switch, and the contact of this first mechanical contact switch and this second mechanical contact switch is closed by drive division or disconnects,
Second power supply circuits and the first power supply circuits utilizing above-mentioned first mechanical contact switch to be formed are configured to by the power supply circuits of above-mentioned power supply to load supplying in parallel, wherein, these second power supply circuits are connected in series by above-mentioned second mechanical contact switch and above-mentioned semiconductor switch.
5. the hybrid relay according to any one in claims 1 to 3, is characterized in that,
Also possess notification unit, when the temperature of above-mentioned semiconductor switch is more than set point of temperature, this notification unit externally notifies exception.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009246239 | 2009-10-27 | ||
| JP2009-246239 | 2009-10-27 | ||
| JP2010-204786 | 2010-09-13 | ||
| JP2010204786A JP5669086B2 (en) | 2009-10-27 | 2010-09-13 | Hybrid relay |
| PCT/JP2010/068999 WO2011052606A1 (en) | 2009-10-27 | 2010-10-26 | Hybrid relay |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102576625A CN102576625A (en) | 2012-07-11 |
| CN102576625B true CN102576625B (en) | 2015-10-14 |
Family
ID=43922031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201080047874.2A Expired - Fee Related CN102576625B (en) | 2009-10-27 | 2010-10-26 | Hybrid relay |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5669086B2 (en) |
| KR (1) | KR101369032B1 (en) |
| CN (1) | CN102576625B (en) |
| TW (1) | TWI598921B (en) |
| WO (1) | WO2011052606A1 (en) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8930724B2 (en) * | 2011-08-17 | 2015-01-06 | Broadcom Corporation | Semiconductor device predictive dynamic thermal management |
| JP5895171B2 (en) * | 2011-10-31 | 2016-03-30 | パナソニックＩｐマネジメント株式会社 | Polarized electromagnetic relay |
| KR101348154B1 (en) | 2011-12-09 | 2014-01-14 | 주식회사 유라코퍼레이션 | Apparatus for cutting off dark current of vehicle |
| KR101206386B1 (en) * | 2012-06-14 | 2012-11-29 | 김정호 | Closed Circuit PLC system for large capacity load |
| JP6206788B2 (en) * | 2012-12-21 | 2017-10-04 | パナソニックＩｐマネジメント株式会社 | Flasher |
| JP6206796B2 (en) * | 2013-07-31 | 2017-10-04 | パナソニックＩｐマネジメント株式会社 | Relay unit and load control system |
| JP5876613B1 (en) * | 2015-01-16 | 2016-03-02 | 崇 中尾 | Control device, switch device, adapter device, socket device and load device using the same |
| KR20170116472A (en) | 2016-04-11 | 2017-10-19 | 주식회사 엘지화학 | Apparatus and method for protecting MOSFET relay using a voltage detector and signal fuse |
| JP6620674B2 (en) * | 2016-05-26 | 2019-12-18 | 株式会社オートネットワーク技術研究所 | Power supply control device, power supply control method, and computer program |
| JP6669097B2 (en) * | 2017-02-14 | 2020-03-18 | 株式会社オートネットワーク技術研究所 | Power supply control device |
| KR102039576B1 (en) | 2018-05-29 | 2019-11-01 | 한밭대학교 산학협력단 | Hybrid relay for energy storage system |
| TWI676198B (en) * | 2018-07-03 | 2019-11-01 | 易湘雲 | Rocker switch and sliding member thereof |
| JP7132020B2 (en) * | 2018-08-06 | 2022-09-06 | 東芝インフラシステムズ株式会社 | Aircraft lighting controller |
| KR102187348B1 (en) | 2020-03-09 | 2020-12-07 | (주)에너담 | Hybrid contactor for direct current high voltage |
| CN112290925A (en) * | 2020-09-30 | 2021-01-29 | 惠州莫思特智照科技有限公司 | Multifunctional electric appliance control system and control method |
| KR20230150554A (en) | 2022-04-22 | 2023-10-31 | 삼어스코 주식회사 | The critical rate of Triac current rise, dI/dT, limiting method through zero cross current synchronization when a hybrid relay is off or switches over |
| KR20230174561A (en) | 2022-06-21 | 2023-12-28 | 삼어스코 주식회사 | Hybrid starter for Direct-On-Line starting with current ratio increase/decrease control function |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1217813A (en) * | 1996-05-07 | 1999-05-26 | 西门子公司 | Hybrid relay |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55117844A (en) * | 1979-02-28 | 1980-09-10 | Matsushita Electric Works Ltd | Switching circuit |
| JPS6030048B2 (en) * | 1979-04-27 | 1985-07-13 | 松下電工株式会社 | switching circuit |
| JP3948093B2 (en) * | 1998-01-30 | 2007-07-25 | 松下電工株式会社 | Hybrid relay |
| JP2005347186A (en) * | 2004-06-07 | 2005-12-15 | Jamco Corp | Hybrid relay |
| JP2008210638A (en) * | 2007-02-26 | 2008-09-11 | Matsushita Electric Works Ltd | Switch and automatic photoelectric flashing device |
-
2010
- 2010-09-13 JP JP2010204786A patent/JP5669086B2/en active Active
- 2010-10-26 KR KR1020127010259A patent/KR101369032B1/en active IP Right Grant
- 2010-10-26 WO PCT/JP2010/068999 patent/WO2011052606A1/en active Application Filing
- 2010-10-26 CN CN201080047874.2A patent/CN102576625B/en not_active Expired - Fee Related
- 2010-10-27 TW TW099136747A patent/TWI598921B/en active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1217813A (en) * | 1996-05-07 | 1999-05-26 | 西门子公司 | Hybrid relay |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011052606A1 (en) | 2011-05-05 |
| TWI598921B (en) | 2017-09-11 |
| JP2011119228A (en) | 2011-06-16 |
| CN102576625A (en) | 2012-07-11 |
| JP5669086B2 (en) | 2015-02-12 |
| TW201140636A (en) | 2011-11-16 |
| KR101369032B1 (en) | 2014-02-28 |
| KR20120081163A (en) | 2012-07-18 |
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