KR20120080978A - Sealing apparatus, joining apparatus and processing apparatus for substrate using the same - Google Patents

Abstract

PURPOSE: A sealing device for a chamber, a substrate bonding device using the same, and a substrate processing device are provided to prevent particles from bellows which make a chamber airtight. CONSTITUTION: A support plate(122) is arranged on an external side of a chamber. The support plate is separated from the chamber. The support plate supports bellows. A guide(211) is coupled with the inner circumference of the bellows. The guide linearly guides the bellows. The bellows are extended or contracted in the longitudinal direction of a shaft.

Description

Sealing apparatus for a chamber, substrate bonding apparatus and substrate processing apparatus using the same {Sealing apparatus, joining apparatus and processing apparatus for substrate using the same}

The present invention relates to a chamber sealing apparatus, a substrate bonding apparatus and a substrate processing apparatus using the same. Relates to a device.

Liquid crystal display devices (LCDs) are formed by injecting a liquid crystal between a TFT (Thin Film Transistor) substrate on which an electrode is formed and a CF (Color filter) substrate on which a phosphor is applied.

Therefore, in manufacturing LCD, after manufacturing TFT substrate and CF substrate, it is necessary to join two substrates and inject liquid crystal material into the space between them. Is one of the important processes to determine.

On the other hand, the substrate bonding apparatus used to bond the two substrates includes an upper chamber, a lower chamber separated by a lower, and a chamber lift to open and close the upper chamber by raising and lowering the upper chamber.

The substrate bonding apparatus keeps the inside of the upper and lower chambers clean and maintains the inside of the chamber under vacuum during the bonding process in order to smoothly bond the two substrates. Therefore, an exhaust pipe connected to the vacuum pump is connected to the upper chamber and / or the lower chamber. In addition, the substrate bonding apparatus includes a plurality of lift pins that respectively support two substrates loaded into the upper and lower chambers, and lift the two substrates so that the two substrates are respectively supported by the upper and lower chambers.

As described above, the substrate bonding apparatus is provided with a plurality of lift pins for elevating the two substrates to transfer the two substrates to the upper and lower chambers, and the exhaust pipe for forming the vacuum in the chamber. Accordingly, a plurality of through holes are formed in the upper and lower chambers, and bellows are provided outside the respective through holes in order to prevent leakage of the upper and lower chambers from the through holes. At this time, when using the bellows alone, due to the characteristics of the bellows, it is difficult to correct the straightness of the bellows in accordance with the lifting and lowering of the chamber or the lift pin to install the guide link around the bellows.

However, the bellows outer surface of the bellows is in contact with the guide links in the process of stretching the bellows in accordance with the chamber lift or lift pin lift, or particles are generated from the bellows and the guide link in accordance with the driving of numerous links.

The particles thus generated may be mixed between the upper and lower chambers and mixed between the two substrates during the bonding process. Such particles act as a problem of degrading the product quality of the bonded substrate.

It is an object of the present invention to provide a sealing device for a chamber, a substrate bonding apparatus and a substrate processing apparatus using the same, in which particles are not generated from a bellows that maintains the airtightness of the chamber.

Sealing apparatus for a chamber according to the present invention is coupled to the outer wall of the chamber to wrap the circumference of the axis passing through the chamber, a support plate disposed outside the chamber and spaced apart from the chamber to support the bellows, And a guide coupled to the inner circumferential surface to linearly guide the bellows constrained to the shaft and stretched in the longitudinal direction of the shaft.

The guide may be a ring coupled to the inner circumferential surface of the bellows and surrounding the outer circumferential surface of the shaft.

The sealing device for the chamber includes a first coupling plate coupled to one end of the bellows and coupled to the support plate, a second coupling plate coupled to the other end of the bellows and coupled to the chamber, and the support plate and the first coupling plate. It may further include a first O-ring installed between the second O-ring installed between the chamber and the second coupling plate.

Meanwhile, the substrate bonding apparatus according to the present invention includes a first chamber supporting a first substrate, a second chamber supporting a second substrate facing the first substrate, and supporting the second chamber, wherein the second chamber is supported. A chamber lift for elevating the chamber relative to the first chamber to open and close the first chamber and the second chamber, and being coupled to an outer wall of the first chamber or the second chamber and coupled to the first chamber or the second chamber; A bellows surrounding the circumference of the shaft passing through the chamber, a support plate disposed outside the first chamber or the second chamber and spaced apart from the first chamber or the second chamber to support the bellows, and an inner peripheral surface of the bellows. And a guide coupled to and constrained the bellows constrained to the shaft and stretched in the longitudinal direction of the shaft.

The guide may be a ring coupled to the inner circumferential surface of the bellows and surrounding the outer circumferential surface of the shaft.

The substrate bonding apparatus includes a first coupling plate coupled to one end of the bellows and coupled to the support plate, a second coupling plate coupled to the other end of the bellows and coupled to the first chamber or the second chamber, and the support plate; A first O-ring provided between the first coupling plate and a second O-ring provided between the first chamber or the second chamber and the second coupling plate may be further included.

The shaft may be a vacuum forming exhaust pipe used to evacuate between the second chamber and the second chamber through the first chamber or the second chamber.

The shaft may be a lift pin that passes through the first chamber or the second chamber and supports the first substrate or the second substrate carried into the first chamber or the second chamber.

The substrate bonding apparatus further includes a pin lifter disposed outside the first chamber or the second chamber to support the support plate and to elevate the support plate, wherein the lift pin is supported by the support plate to be elevated together with the support plate. Can be.

The first chamber may be a lower chamber, the second chamber may be an upper chamber, and the second substrate may be an upper substrate.

The lift pin penetrating the second chamber is provided in the form of a pipe, and the support plate may be coupled with a vacuum suction exhaust pipe communicating with the lift pin.

On the other hand, the substrate processing apparatus according to the present invention includes a chamber for supporting a substrate therein, a bellows coupled to an outer wall of the chamber and surrounding the axis passing through the chamber, and disposed outside the chamber and spaced apart from the chamber. It may include a support plate for supporting the bellows, and a guide coupled to the inner circumferential surface of the bellows to guide the bellows linearly constrained to the shaft and stretched in the longitudinal direction of the shaft.

The guide may be a ring coupled to the inner circumferential surface of the bellows and surrounding the outer circumferential surface thereof.

The substrate processing apparatus includes a first coupling plate coupled to one end of the bellows and coupled to the support plate, a second coupling plate coupled to the other end of the bellows and coupled to the chamber, and the support plate and the first coupling plate. It may further include a first O-ring provided between, and a second O-ring provided between the chamber and the second coupling plate.

The shaft may be a vacuum forming exhaust pipe used to evacuate between the second chamber and the second chamber through the chamber.

The shaft may be a lift pin that supports the substrate penetrating the chamber and into the chamber.

The substrate processing apparatus may further include a pin lifter disposed outside the chamber to support the support plate and to elevate the support plate, and the lift pin may be supported by the support plate to be elevated together with the support plate.

The lift pin may be provided in a pipe shape to penetrate the upper wall of the chamber, and the support plate may be coupled to a vacuum suction exhaust pipe communicating with the lift pin.

The chamber sealing apparatus, the substrate bonding apparatus and the substrate processing apparatus using the same prevent the particles from being generated from the bellows that maintain the airtightness of the chamber, thereby preventing particles from being mixed into the chamber. There is an effect that can be maintained to improve the quality of the substrate processed inside the chamber.

1 is a cross-sectional view showing a substrate bonding apparatus according to the present embodiment.
FIG. 2 is an enlarged cross-sectional view illustrating an enlarged portion “I” shown in FIG. 1.
3 is a cross-sectional view illustrating a state in which two substrates are loaded into two chambers of the substrate bonding apparatus according to the present embodiment.
4 is a cross-sectional view showing a state in which two substrates are elevated to each chamber in the substrate bonding apparatus according to the present embodiment.
5 is a view showing a state in which the two substrates are bonded in the substrate bonding apparatus according to the present embodiment.

Hereinafter, a chamber sealing apparatus, a substrate bonding apparatus and a substrate processing apparatus using the same according to the present embodiment will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view showing a substrate bonding apparatus according to the present embodiment.

Referring to FIG. 1, the substrate bonding apparatus according to the present exemplary embodiment includes a first chamber 110 and a second chamber 120 disposed to face each other.

The second chamber 120 is supported by a chamber lift 130 disposed at the periphery of the first chamber 110. The chamber elevator 130 lifts the second chamber 120 with respect to the first chamber 110. In Figure 1, the chamber elevator 130 is shown to be made of a combination of a screw and a rotary motor. Although not shown, in another embodiment, the chamber elevator 130 may be implemented by changing any one of a rack and pinion combination and a hydraulic / pneumatic cylinder.

The first chamber 110 and the second chamber 120 form a space that opens and closes as the second chamber 120 moves up and down. An airtight member 140 such as an O-ring for maintaining the airtightness of the closed space is disposed between the first chamber 110 and the second chamber 120.

The first surface 110a for supporting the first substrate 11 is disposed inside the first chamber 110, and the second surface support for the second substrate 12 is disposed inside the second chamber 120. 120a) is disposed. Although not shown, the first plate 110a and the second plate 120a may be provided with a substrate chuck capable of stably supporting the first substrate 11 and the second substrate 12. The substrate chuck may be implemented by any one of a vacuum chuck, an electrostatic chuck and an adhesive chuck.

The second chamber 120 is provided with a vacuum forming exhaust pipe 121 for vacuum exhaust of the space formed between the two chambers (110, 120). The vacuum exhaust pipe 121 is connected to a vacuum pump (not shown), and the front end portion is opened to communicate with the inside of the second chamber 120. Although FIG. 1 illustrates that the vacuum forming exhaust pipe 121 is coupled to only the second chamber 120, another vacuum forming exhaust pipe may be installed in the first chamber 110 to improve the efficiency of the vacuum exhaust. .

As described above, the first bellows 210 is installed outside the second chamber 120 as the vacuum forming exhaust pipe 121 passes through the second chamber 120. In this case, the first support plate 122 spaced apart from the second chamber 120 in the direction in which the second chamber 120 moves up and down is installed outside the second chamber 120. The first support plate 122 has a fixed position with respect to the second chamber 120 which is driven up and down, so that the first bellows 210 is supported.

FIG. 2 is an enlarged cross-sectional view illustrating an enlarged portion “I” shown in FIG. 1.

Referring to FIG. 2, the first bellows 210 surrounds the vacuum forming exhaust pipe 121, one end of which is coupled to the second chamber 120, and the other end of which is coupled to the first support plate 122. Accordingly, the first bellows 210 prevents leakage of the airtight of the first chamber 110 and the second chamber 120 between the second chamber 120 and the vacuum forming exhaust pipe 121.

In addition, the first bellows 210 is linearly stretched according to the lifting and lowering of the second chamber 120. At this time, the first guide 211 is installed inside the first bellows 210 to guide linear expansion and contraction of the first bellows 210 by being constrained by the vacuum forming exhaust pipe 121. The first guide 211 may have an inner diameter larger than the outer diameter of the vacuum forming exhaust pipe 121 and may be provided in a ring shape coupled to the inner circumferential surface of the first bellows 210.

At this time, the first coupling plate 212 is coupled to one end of the first bellows 210, the first O-ring 213 is installed between the first coupling plate 212 and the second chamber 120. In addition, a second coupling plate 214 is coupled to the other end of the first bellows 210, and a second O-ring 215 is installed between the second coupling plate 214 and the first support plate 122. The first o-ring 213 and the second o-ring 215 is a leak of airtight leakage between the first bellows 210 and the second chamber 120, between the first bellows 210 and the first support plate 122 prevent.

On the other hand, the first support plate 122 is formed with a communication hole (122a) in communication with the exhaust pipe 121 for forming a vacuum. The communication hole 122a is coupled to another vacuum forming exhaust pipe drawn out from the vacuum pump (not shown), so that the vacuum inside the first chamber 110 and the second chamber 120 through the vacuum forming exhaust pipe 121. Enable exhaust.

Referring back to FIG. 1, the substrate bonding apparatus 100 according to the present embodiment may include a first substrate 11 and a second substrate 12 carried between the first chamber 110 and the second chamber 120. Each of the first lift pin 151 and the second lift pin 152 are transferred to the first surface plate 110a and the second surface plate 120a. The first lift pin 151 penetrates through the first chamber 110 and the first surface plate 110a, and the second lift pin 152 penetrates through the second chamber 120 and the second surface plate 120a. It extends to the outside of the first chamber 110 and the second chamber 120. The first lift pin 151 and the second lift pin 152 are respectively coupled to the second support plate 153 and the third support plate 154, which are installed outside the first chamber 110, and the second support plate 153. ) Is lifted by the first pin elevator 155 and the second pin elevator 156 to lift and lower the third support plate 154, respectively. The first lift pin 151 and the second lift pin 152 are provided in a tubular shape so as to suck the first substrate 11 and the second substrate 12 in vacuum, respectively, and are connected to a vacuum pump (not shown). It is in communication with each of the vacuum suction exhaust pipe (150).

As the first lift pin 151 and the second lift pin 152 penetrate the first chamber 110 and the second chamber 120, respectively, between the first chamber 110 and the first support plate 122. The second bellows 220 and the third bellows prevent the leakage of airtight between the first chamber 110 and the second chamber 120 between the second chamber 120 and the second support plate 153. 230 is installed.

 Here, the second bellows 220 and the third bellows 230 have a difference in the object to be coupled and the object penetrating therein, and is similar to the first bellows 210 described above with reference to FIG. do.

That is, the first bellows 210 is coupled to the first support plate 122 and the second chamber 120, and a vacuum forming exhaust pipe 121 penetrates therein. The second bellows 220 is coupled to the second support plate 153 and the first chamber 110, and the first lift pin 151 penetrates therein. The third bellows 230 is coupled to the third support plate 154 and the second chamber 120, and the second lift pin 152 penetrates therein.

At this time, the second guide 221 is coupled to the inner circumferential surface of the second bellows 220, the second guide 221 is constrained by the first lift pin 151 to guide the linear expansion and contraction of the second bellows 220. . The third guide 231 is coupled to the inner circumferential surface of the third bellows 230, and the third guide 231 is constrained to the second lift pin 152 to guide linear expansion and contraction of the third bellows 230.

Hereinafter, the operation of the substrate bonding apparatus according to the present embodiment will be described in detail with reference to the accompanying drawings.

3 is a cross-sectional view illustrating a state in which two substrates are loaded into two chambers of the substrate bonding apparatus according to the present embodiment.

Referring to FIG. 3, the second chamber 120 is spaced apart from the first chamber 110 by the chamber elevator 130.

Subsequently, the first substrate 11 and the second substrate 12 are carried between the first chamber 110 and the second chamber 120 by a transfer robot (not shown). In FIG. 3, the first substrate 11 and the second substrate 12 are shown to be carried together between the first chamber 110 and the second chamber 120. In another embodiment, the first substrate 11 11) and any one of the second substrate 12 may be carried in first, and then the other one may be carried.

4 is a cross-sectional view showing a state in which two substrates are elevated to each chamber in the substrate bonding apparatus according to the present embodiment.

Referring to FIG. 4, the first pin elevator 155 raises the second support plate 153. The first lift pin 151 is raised together with the second support plate 153 to support the first substrate 11. In addition, the second bellows 220 is compressed as the second support plate 153 rises. At this time, the second guide 221 guides linear compression of the second bellows 220.

Meanwhile, the second pin elevator 156 lowers the third support plate 154. The second lift pin 152 is lowered together with the third support plate 154 to contact the second substrate 12. At this time, exhaust is performed through the vacuum suction exhaust pipe 150, and the second substrate 12 is vacuum-adsorbed to the second lift pin 152. In addition, the third bellows 230 is compressed as the third support plate 154 descends. At this time, the third guide 231 guides linear compression of the third bellows 230.

Subsequently, the first pin elevator 155 lowers the second support plate 153. The second lift pin 152 is lowered together with the second support plate 153. The first substrate 11 is separated from the second lift pin 152 while being in contact with the first surface plate 110a, and the first surface plate 110a supports the first substrate 11. Along with this, the second bellows 220 extends as the second support plate 153 descends. At this time, the second guide 221 guides linear extension of the second bellows 220.

Meanwhile, the second pin elevator 156 raises the third support plate 154. The second lift pin 152 is raised together with the third support plate 154. The second substrate 12 is separated from the second lift pin 152 while being in contact with the second surface plate 120a, and the second surface plate 120a supports the second substrate 12. At this time, the exhaust through the vacuum suction exhaust pipe 150 is stopped. In addition, the third bellows 230 is extended as the third support plate 154 rises. At this time, the third guide 231 guides linear extension of the third bellows 230.

5 is a view showing a state in which the two substrates are bonded in the substrate bonding apparatus according to the present embodiment.

Referring to FIG. 5, in a state in which the first substrate 11 is supported on the first surface plate 110a and the second substrate 12 is supported on the second surface plate, the chamber elevator 130 may include the second chamber 120. Down). The first bellows 210 is extended as the second chamber 120 descends. At this time, the first guide 211 guides linear extension of the first bellows 210.

As such, when the second chamber 120 is lowered and the gap between the first chamber 110 and the second chamber 120 is closed, vacuum exhaust is performed through the exhaust pipe 121 for forming a vacuum, and the first chamber 110 is closed. ) And the second chamber 120 is a vacuum atmosphere is formed.

On the other hand, as the second chamber 120 is lowered, the first substrate 11 and the second substrate 12 are close to each other within a few um, and the second substrate 12 is freely dropped from the second surface plate 120a. In contact with the first substrate (11).

Then, when pressure is applied to the two substrates 11 and 12 in contact with each other, the two substrates 11 and 12 are bonded. As a means for pressing the two bonded substrates (11, 12) as a mechanical pressure means, a means by pneumatic, etc. have already been disclosed by a known technique, a detailed description thereof will be omitted.

As described above, the substrate bonding apparatus 100 according to the present embodiment may include the first, second, and second seals in order to prevent leakage of airtight from the through holes formed in the first chamber 110 and the second chamber 120. The first, second and third guides 211, 221, and 231 including three bellows 210, 220, and 230, and guide linear expansion and contraction of the first, second, and third bellows 210, 220, and 230 are first. , 2, 3 bellows (210, 220, 230) is coupled to the inner peripheral surface.

Therefore, the substrate bonding apparatus 100 according to the present embodiment is prevented from generating particles in relation to the stretching operation of the first, second, third bellows (210, 220, 230), the first, second, third bellows ( Linear stretching of 210, 220, 230 can be corrected.

On the other hand, the above-described first, second, third bellows (210, 220, 230) and the first, second, third guide (211, 221, 231) is in a chamber other than the substrate bonding apparatus 100 according to the present embodiment It can be used as a sealing device for the chamber to maintain the airtightness of the chamber.

In addition, the above-described first, second, third bellows 210, 220, 230 and the first, second, third guides 211, 221, 231 are predetermined on the substrate in addition to the substrate bonding apparatus 100 according to the present embodiment. It can be used in a substrate processing apparatus that applies a treatment of, for example, a substrate deposition apparatus, a substrate etching apparatus and the like to be used in a substrate processing apparatus for maintaining the airtightness of the chamber used for substrate processing.

100: substrate bonding device 110: first chamber
120: second chamber 130: chamber lift
121 exhaust pipe for forming a vacuum 122 first support plate
210: first bellows 211: first guide

Claims (18)

A bellows coupled to an outer wall of the chamber and surrounding a shaft passing through the chamber;
A support plate disposed outside the chamber and spaced apart from the chamber to support the bellows;
And a guide coupled to the inner circumferential surface of the bellows to guide the bellows linearly constrained to the shaft and stretched in the longitudinal direction of the shaft. The method of claim 1, wherein the guide
And a ring coupled to the inner circumferential surface of the bellows and surrounding the outer circumferential surface of the shaft. The method according to claim 1,
A first coupling plate coupled to one end of the bellows and coupled to the support plate;
A second coupling plate coupled to the other end of the bellows and coupled to the chamber;
A first O-ring installed between the support plate and the first coupling plate,
And a second O-ring installed between the chamber and the second coupling plate. A first chamber supporting the first substrate,
A second chamber supporting the second substrate so as to face the first substrate;
A chamber lifter supporting the second chamber and lifting and closing the second chamber with respect to the first chamber to open and close the first chamber and the second chamber;
A bellows coupled to an outer wall of the first chamber or the second chamber and surrounding a shaft passing through the first chamber or the second chamber;
A support plate disposed outside the first chamber or the second chamber and spaced apart from the first chamber or the second chamber to support the bellows;
And a guide coupled to the inner circumferential surface of the bellows to guide the bellows linearly constrained to the shaft and stretched in the longitudinal direction of the shaft. The method of claim 4, wherein the guide
And a ring coupled to an inner circumferential surface of the bellows and surrounding the outer circumferential surface of the bellows. 5. The method of claim 4,
A first coupling plate coupled to one end of the bellows and coupled to the support plate;
A second coupling plate coupled to the other end of the bellows and coupled to the first chamber or the second chamber;
A first O-ring installed between the support plate and the first coupling plate,
And a second O-ring disposed between the first chamber or the second chamber and the second coupling plate. The method of claim 4 wherein the axis is
And a vacuum forming exhaust pipe which is used to evacuate between the second chamber and the second chamber through the first chamber or the second chamber. The method of claim 4 wherein the axis is
And a lift pin for supporting the first substrate or the second substrate carried through the first chamber or the second chamber and carried into the first chamber or the second chamber. The method of claim 8,
A pin lifter disposed outside the first chamber or the second chamber to support the support plate and to elevate the support plate;
And the lift pin is supported by the support plate to be elevated together with the support plate. 6. The substrate bonding apparatus of claim 5, wherein the first chamber is a lower chamber, the second chamber is an upper chamber, and the second substrate is an upper substrate. The method of claim 10,
The lift pin penetrating the second chamber is provided in the form of a pipe (pipe),
Substrate bonding apparatus characterized in that the support plate is coupled to the vacuum suction exhaust pipe communicating with the lift pin. A chamber supporting the substrate therein;
A bellows coupled to an outer wall of the chamber and surrounding a shaft passing through the chamber;
A support plate disposed outside the chamber and spaced apart from the chamber to support the bellows;
And a guide coupled to the inner circumferential surface of the bellows to guide the bellows linearly constrained to the shaft and stretched in the longitudinal direction of the shaft. The method of claim 12, wherein the guide
And a ring coupled to an inner circumferential surface of the bellows and surrounding the outer circumferential surface of the bellows. The method of claim 12,
A first coupling plate coupled to one end of the bellows and coupled to the support plate;
A second coupling plate coupled to the other end of the bellows and coupled to the chamber;
A first O-ring installed between the support plate and the first coupling plate,
And a second O-ring disposed between the chamber and the second coupling plate. The method of claim 12, wherein the axis
And a vacuum forming exhaust pipe that is used to evacuate between the second chamber and the second chamber through the chamber. The method of claim 12, wherein the axis
And a lift pin that supports the substrate penetrating through the chamber and into the chamber. 17. The method of claim 16,
A pin lifter disposed outside the chamber to support the support plate and to elevate the support plate;
And the lift pin is supported by the support plate and lifted together with the support plate. 17. The method of claim 16,
The lift pin is provided in the form of a pipe (pipe) to penetrate the upper wall of the chamber,
And the support plate is coupled to a vacuum suction exhaust pipe communicating with the lift pin.

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