KR20120069804A - Perpendicular type plating apparatus with glass pipe - Google Patents

Perpendicular type plating apparatus with glass pipe Download PDF

Info

Publication number
KR20120069804A
KR20120069804A KR1020100131106A KR20100131106A KR20120069804A KR 20120069804 A KR20120069804 A KR 20120069804A KR 1020100131106 A KR1020100131106 A KR 1020100131106A KR 20100131106 A KR20100131106 A KR 20100131106A KR 20120069804 A KR20120069804 A KR 20120069804A
Authority
KR
South Korea
Prior art keywords
plating
liquid
rod
passage
movable part
Prior art date
Application number
KR1020100131106A
Other languages
Korean (ko)
Inventor
김남성
Original Assignee
(주)포인텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)포인텍 filed Critical (주)포인텍
Priority to KR1020100131106A priority Critical patent/KR20120069804A/en
Publication of KR20120069804A publication Critical patent/KR20120069804A/en

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004Sealing devices
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils
    • C25D7/0628In vertical cells

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

PURPOSE: A perpendicular plating apparatus is provided to minimize thermal deformation and scratch of a rod which contacts a substrate or damage to the substrate due to the rod because the rod is made of glass. CONSTITUTION: A perpendicular plating apparatus comprises a plating bath and a glass rod(200). The plating bath is opened on both ends via vertical paths and has a receiving part(111) to be filled with plating liquid. The glass rod is vertically installed in the paths and contacts a substrate inserted in the paths. The paths have an inlet(140) and an outlet(150) respectively formed on one and the other ends of the plating bath.

Description

Perpendicular type plating apparatus with glass pipe}

The present invention relates to a vertical plating apparatus, and more particularly, to a vertical plating apparatus equipped with a glass liquid rod that is mounted to be plated while the glass liquid rod is continuously moved.

Even if the metals are used for a certain period of time, depending on the conditions of use or conditions, the coating may be formed or the surface may be damaged by oxidation. However, the plating of other metals, which is difficult to oxidize, has been conventionally performed. In recent years, plating has been favored and extended to applications such as durability and surface treatment.

Conventionally, as the plating apparatus, one having a shape as shown in FIG. 4 was used.

It consists of a plating tank 1 by injecting a plating solution at a predetermined level into a wall 11 of a container having a predetermined volume, and an anode bar 15 and a plated to which a plating metal 15a is attached on the plating tank 1. The negative electrode bar 16a to which the sieve 16b is attached is mounted to be energized.

Therefore, when the current defined in each of the positive electrode bar 15 and the negative electrode bar 16a is energized, the plating metal 15a attached to the positive electrode bar 15 is oxidized and ionized to melt into the plating solution, and the negative electrode bar 16 In the plated body 16b attached thereto, the ionized metal ions are reduced and attached to the surface of the plated body 16b in a film form.

At this time, in order to facilitate the replacement of the plated metal (15a) and the plated body (16b) when the process is finished, the plating tank to be removable or easy to remove the positive electrode bar 15 and the negative electrode bar (16a) (1), or in order to increase the plating efficiency by allowing the plating ions to be continuously purified from the anode to the cathode, for example, to install a fan in the plating bath (1) or to easily change the plating solution. To this end, various improvements such as attaching the supply / discharge pipe to the plating bath 1 have been made.

However, the plated body 16b used in the above-described conventional plating bath 1 is mainly a small body, and in order to use the large plated body 16b, the plating bath 1 is used as the large plated body ( 16b) is a large size that can be accommodated, so the installation economy is low, and the above-described plated body (16b) is replaced by manpower, so the worker is exposed to harmful gas due to evaporation of the plating solution when energized To cause an industrial disaster (the plating factory has become one of the work avoiding factories in the 3D industry), and in particular, the plated body 16b may be damaged due to inadequate use of the positive electrode 15 or the negative electrode 16b and the plating solution. ) Has a fatal defect that it cannot be used when manufacturing precision electronic parts such as printed circuit boards and lead frames since non-uniform plating films are formed.

In order to solve this problem, a vertical plating apparatus has recently been developed, and plating is performed while continuously moving a substrate in a vertical state in a plating bath.

At this time, one of the most problematic is that one end and the other end of the plating bath is to move the substrate is open and the other end.

In this case, in order to prevent the plating liquid contained in the plating bath from leaking to the outside, a liquid-tight rod contacting the substrate is vertically mounted in a passage formed at one end and the other end of the plating bath.

The liquid rod contacts the substrate, thereby minimizing the outflow of the plating liquid contained in the plating vessel to the outside, and the substrate is introduced into the plating vessel in contact with the liquid rod and discharged after plating.

However, conventionally, the liquid rods were made of plastic or metal and used.

When the liquid rods are made of plastic, scratches are easily generated on the outer circumferential surface of the liquid rods and are susceptible to high temperatures, so that the substrates may be deteriorated when the liquid rod is in contact with the substrate.

In addition, when the liquid rod is made of a metal material (SUS, etc.), the liquid rod is weak in chemical resistance due to the characteristics of the metal, so that the liquid rod causes chemical deformation by the plating solution, thereby affecting the substrate.

The present invention is to solve the above problems, the liquid rods in contact with the substrate to minimize the chemical deformation, the deformation caused by high temperature and the scratch on the outer circumferential surface by the plating liquid, the substrate contacting the liquid rods by the liquid rods An object of the present invention is to provide a vertical plating apparatus equipped with a glass liquid rod that can minimize deterioration.

In order to achieve the above object, the vertical liquid plating apparatus equipped with the glass liquid cutting rod of the present invention includes: a plating bath having passages formed at one end and the other end, respectively, and having a receiving portion filled with a plating liquid therein; Is mounted vertically to the passage, made of a liquid rod in contact with the substrate inserted into the passage, the passage consists of an inlet formed in one end of the plating bath, the outlet formed in the other end of the plating bath, It is characterized by consisting of a glass material.

The liquid rod is made of a hollow cylindrical shape.

The liquid rods are respectively mounted on both sides of the passage, and are in contact with the substrate inserted into the passage.

The plating bath may have a wing portion formed at one end and the other end, and a communication hole is formed in the wing portion in a vertical direction, and a fixing portion having the accommodation portion filled with the plating liquid therein; A first movable part mounted to the wing at one side of the communication hole based on the communication hole; The first movable part or the first movable part or the second movable part which is mounted to the wing portion on the other side of the communication hole, and forming the passage communicating with the communication hole between the first movable part based on the communication hole, The two movable parts are slidably mounted in the directions adjacent to the wing parts to adjust the gap between the passages.

A first guide member mounted at an outer wall of the plating bath and gradually mounted in an outer direction of the accommodation part to guide the substrate flowing into the inlet; And a second guide member mounted on an inner side wall of the other end of the plating bath and mounted to expand inwardly of the accommodating part to guide the substrate discharged from the accommodating part to the outlet.

At one end and the other end of the plating tank, an auxiliary storage part for receiving a plating liquid discharged from the accommodation part through the passage from the outside of the accommodation part is formed, respectively, and the plating solution stored in the auxiliary storage part is received by the circulation pump. Resupply by payment.

One side or both sides of the passage formed in the plating bath is formed with a long groove in the vertical direction, the liquid rod is inserted into the groove.

In addition, the liquid rod is mounted in a plurality of spaced apart from each other in the moving direction of the substrate on one side or both sides of the passage.

According to the vertical plating apparatus equipped with the glass liquid rod of the present invention as described above, the liquid rod in contact with the substrate is made of a glass material, chemical deformation by the plating liquid, deformation due to high temperature and scratches on the outer peripheral surface Can be minimized.

For this reason, it can minimize that the board | substrate which contact | connects a liquid drop rod becomes defective by a liquid drop rod.

1 is a perspective view of a plating apparatus according to an embodiment of the present invention,
2 is a plan view of a plating apparatus according to an embodiment of the present invention,
3 is a front view of a plating apparatus according to an embodiment of the present invention,
4 is a perspective view of a conventional plating apparatus,

1 is a perspective view of a plating apparatus according to an embodiment of the present invention, Figure 2 is a plan view of a plating apparatus according to an embodiment of the present invention, Figure 3 is a front view of the plating apparatus according to an embodiment of the present invention.

As shown in FIGS. 1 to 3, the vertical plating apparatus equipped with the glass liquid cutting rod of the present invention includes a plating bath 100, a liquid cutting rod 200, a first guide member 310, and a first plating member. It consists of the two guide member 320, the auxiliary storage unit 400 and the like.

The plating bath 100 is formed in a substantially hexahedral shape, a passage is formed vertically at one end and the other end, respectively, and is opened, and an upper part thereof is opened.

In addition, an accommodation part 111 in which a plating liquid is filled is formed in the plating bath 100.

The passage includes an inlet 140 formed at one end of the plating bath 100 and an outlet 150 formed at the other end of the plating bath 100.

The substrate is introduced into the plating bath 100 through the inlet 140 and plated, and the substrate introduced into the plating bath 100 is discharged to the outside through the outlet 150.

The liquid rod 200 is mounted perpendicularly to the passage to be in contact with the substrate inserted into the passage.

The liquid rod 200 is mounted in the passage to contact the substrate inserted into the passage, thereby minimizing leakage of the plating liquid contained in the plating bath 100 to the outside.

The liquid rod 200 may be mounted only on one side of the passage, or may be mounted on both sides of the passage so as to be in contact with the substrate passing through the passage.

In the present embodiment, the liquid rod 200 is mounted on both sides of the inlet 140 to be spaced apart from each other, and is mounted on both sides of the outlet 150.

The liquid rod 200 is made of a glass material, and is formed in a hollow cylindrical rod shape.

By making the liquid rod 200 made of a glass material, when the liquid rod 200 is in contact with a substrate, a scratch caused by contact with the substrate may not be generated on the outer circumferential surface of the liquid rod 200.

If a scratch is generated on the outer circumferential surface of the liquid deflector 200, the substrate may be in contact with the liquid deflector 200, thereby increasing the defective rate of the substrate.

However, by making the liquid rod 200 made of a glass material as in the present invention, it is possible to prevent scratches from occurring on the outer circumferential surface of the liquid rod 200, thereby affecting the substrate in contact with the liquid rod 200. Minimizing the impact can reduce the defective rate of the substrate.

In addition, by making the liquid rod 200 made of a glass material, the liquid rod 200 can be minimized to occur in the chemical deformation and temperature deformation according to the plating liquid contained in the plating bath 100. .

In addition, by forming the liquid rods 200 in a hollow shape, the liquid liquid rods 200 have a slight elastic force even when the plating liquid is hot or the thickness of the substrate is thicker than when the liquid rods 200 are not hollow. The liquid rod 200 may be maintained without breaking its function.

In addition, the liquid rod 200 may be rotatably mounted to the plating bath 100, but is preferably fixedly mounted so as not to rotate.

On the other hand, the plating bath 100 may be formed integrally, but is preferably divided into a fixed part 110, a first movable part 120, and a second movable part 130 as in this embodiment.

The fixing part 110 is formed in a substantially hexahedral shape, and wing portions 112 are formed at one end and the other end, and communication holes 113 are formed in the wing portion 112 in the vertical direction.

In addition, the accommodating part 111 in which the plating liquid is filled is formed in the fixing part 110.

Only one wing unit 112 may be formed at one end and the other end of the fixing unit 110, and a plurality of wings 112 may be formed to be spaced apart from each other as shown in the drawing of the present embodiment.

The first movable part 120 is formed in a flat plate shape, and is mounted to the wing 112 at one side of the communication hole 113 based on the communication hole 113.

The second movable part 130 is formed in a flat plate shape, and is mounted to the wing part 112 at the other side of the communicating hole 113 based on the communicating hole 113, and is connected to the first movable part 120. The passage is formed in communication with the communication hole 113 therebetween.

The first movable part 120 and the second movable part 130 may be mounted on an inner wall of the wing part 112, but preferably mounted on an outer wall of the wing part 112.

In addition, the space spaced between the first movable part 120 and the second movable part 130, that is, the size of the passage is smaller than the size of the communication hole 113.

In this case, the liquid rod 200 is mounted to the first movable part 120 and / or the second movable part 130 forming the passage.

To this end, one side or both sides of the passage formed in the plating bath 100, that is, the first movable part 120 and / or the second movable part 130 is formed with a long groove in the vertical direction, the liquid rod ( 200 is inserted into the groove is fixedly mounted.

The groove is formed as described above, and the liquid rod 200 is inserted into the groove, thereby increasing the contact area between the plating vessel 100 and the liquid rod 200 so that the liquid rod 200 is the plating vessel. It can be well coupled to (100).

The first movable part 120 and / or the second movable part 130 may be fixedly coupled to the wing part 112, but are mounted to be slidable in adjacent directions so as to adjust the gap between the passages. This is preferred.

To this end, in the present embodiment, the first movable part 120 and the second movable part 130 are formed in the long holes (121,131) in the horizontal direction, respectively, the first movable part 120 and the first through the long holes (121,131) By coupling the two movable parts 130 to the wing part 112 using a fastening member 160 such as a bolt, the first movable part 120 and the second movable part 130 are mutually along the long holes 121 and 131. It was made to be slidable in the adjacent or away direction.

As described above, the first movable part 120 and the second movable part 130 are slidably mounted to adjust the gap of the passage with respect to the wing 112, according to the thickness of the substrate passing through the passage. It can be easily adjusted to increase the compatibility of the plating bath (100).

The first guide member 310 is mounted to the outer wall of one end of the plating bath 100 to guide the substrate introduced into the inlet 140 to be inserted into the inlet 140 well.

To this end, the first guide member 310 is mounted to be gradually enlarged toward the outside of the accommodating portion 111.

In more detail, the first guide member 310 is mounted on the outer wall of the first movable part 120 and the outer wall of the second movable part 130 in the opposite direction of the accommodating part 111, respectively.

The first guide member 310 mounted to each of the first movable part 120 and the second movable part 130 is formed to be inclined such that the mutual separation distance is gradually increased toward the opposite direction of the accommodating part 111. It is mounted gradually in the opposite direction of the passage.

In addition, the second guide member 320 is mounted on the other inner wall of the plating bath 100 to guide the substrate discharged to the discharge port 150 to be discharged well to the discharge port 150.

To this end, the second guide member 320 is mounted to gradually expand in the inner direction of the accommodating portion 111.

In more detail, the second guide member 320 is mounted on the inner wall of the first movable part 120 and the inner wall of the second movable part 130 in the inward direction of the accommodating part 111, respectively.

The second guide member 320 mounted to each of the first movable part 120 and the second movable part 130 is formed to be inclined such that the mutual separation distance increases gradually toward the inner side of the accommodating part 111. It is mounted gradually in the opposite direction of the passage.

The auxiliary storage unit 400 is formed on the outside of the housing 111 at one end and the other end of the plating bath 100, and serves to store the plating liquid discharged from the housing 111 through the passage. Do it.

The plating liquid discharged and received by the auxiliary storage unit 400 is resupplied to the storage unit 111 by a separate circulation pump.

In addition, when a plurality of wings 112 is formed at one end and the other end of the fixing part 110, the first movable part 120, the second movable part 130, the first guide member 310 and the second A plurality of guide members 320 may be mounted on the mallear wing 112 to block a plurality of plating liquids discharged from the plating bath 100.

On the other hand, the liquid rod 200 may be mounted in a plurality of spaced apart from each other in the moving direction of the substrate on one side or both sides of the passage.

In other words, the first movable part 120 and the second movable part 130 may each be equipped with one of the liquid rods 200, but preferably each of the two liquid rods 200 may be spaced apart from each other. Make sure

That is, the first liquid rods 210 and the second liquid rods 220 are mounted on the first movable part 120 and the second movable part 130 so as to be spaced apart from each other in the moving direction of the substrate.

As such, the two liquid drop rods 200 are mounted to be spaced apart from each other in the moving direction of the substrate, such that the plating solution accommodated in the fixing part 110 may be disposed between the first liquid drop rods 210 and the substrate. When it is discharged through it may be strongly discharged, but because the second liquid cutting rod 220 is disposed adjacent to the first liquid cutting rod 210 is strongly ejected between the first liquid cutting rod 210 and the substrate After the plating liquid hits the second liquid cutting rod 220 directly and the ejection speed is reduced, the plating liquid is discharged to the outside again between the second liquid cutting rod 220 and the substrate. Can be prevented from leaking to the outside.

The vertical plating apparatus equipped with the glass liquid cutting rod of the present invention is not limited to the above-described embodiment, and may be variously modified within the range to which the technical idea of the present invention is permitted.

100: plating bath, 110: fixed part, 111: housing part, 112: wing part, 113: communication hole, 120: first movable part, 121: long hole, 130: second movable part, 131: long hole, 140: inlet port, 150 : Outlet, 160: fastening member,
200: liquid rod, 210: first liquid rod, 220: second liquid rod,
310: first guide member, 320: second guide member,
400: auxiliary storage,

Claims (8)

A plating bath having a passage vertically formed at one end and the other end thereof, the opening being formed therein and a receiving part filled with a plating liquid therein;
Is mounted vertically to the passage, made of a liquid rod in contact with the substrate inserted into the passage,
The passage is composed of an inlet formed in one end of the plating bath, and an outlet formed in the other end of the plating bath,
The liquid rod is a vertical plating device equipped with a glass liquid rod, characterized in that made of a glass material.
The method of claim 1,
The liquid rod is a vertical plating apparatus equipped with a glass liquid rod, characterized in that the hollow cylindrical shape.
3. The method according to claim 1 or 2,
Wherein the liquid rods are mounted on both sides of the passage, the vertical plating apparatus with a glass liquid rod, characterized in that the contact with the substrate inserted into the passage.
3. The method according to claim 1 or 2,
The plating bath,
A fixed portion having one wing portion formed at one end and the other end, a communication hole formed in the wing portion in a vertical direction, and the receiving portion filled with the plating liquid therein;
A first movable part mounted to the wing at one side of the communication hole based on the communication hole;
The second movable part is formed on the other side of the communication hole on the basis of the communication hole, the second movable part for forming the passage communicating with the communication hole between the first movable part,
And the first movable part or the second movable part is slidably mounted in a direction adjacent to the wing part to adjust the gap between the passages.
3. The method according to claim 1 or 2,
A first guide member mounted at an outer wall of the plating bath and gradually mounted in an opposite direction of the housing to guide the substrate introduced into the inlet;
And a second guide member mounted on an inner side wall of the other end of the plating bath and mounted to expand inwardly of the accommodating part to guide the substrate discharged from the accommodating part to the outlet. Vertical plating equipment equipped with glass liquid cutting rod.
3. The method according to claim 1 or 2,
At one end and the other end of the plating bath is provided with an auxiliary storage portion for receiving the plating liquid discharged from the storage portion through the passage from the outside of the receiving portion, respectively,
The plating liquid accommodated in the auxiliary storage unit is a vertical plating apparatus equipped with a glass liquid rod, characterized in that the recirculation pump is supplied back to the housing.
3. The method according to claim 1 or 2,
One side or both sides of the passage formed in the plating bath is formed with a long groove in the vertical direction,
The liquid rod is a vertical plating device equipped with a glass liquid rod, characterized in that the insertion rod is inserted into the groove.
3. The method according to claim 1 or 2,
The liquid rod is a vertical plating apparatus equipped with a glass liquid rod, characterized in that a plurality of the rod is spaced apart from each other in the moving direction of the substrate on one side or both sides of the passage.
KR1020100131106A 2010-12-21 2010-12-21 Perpendicular type plating apparatus with glass pipe KR20120069804A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100131106A KR20120069804A (en) 2010-12-21 2010-12-21 Perpendicular type plating apparatus with glass pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100131106A KR20120069804A (en) 2010-12-21 2010-12-21 Perpendicular type plating apparatus with glass pipe

Publications (1)

Publication Number Publication Date
KR20120069804A true KR20120069804A (en) 2012-06-29

Family

ID=46687794

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100131106A KR20120069804A (en) 2010-12-21 2010-12-21 Perpendicular type plating apparatus with glass pipe

Country Status (1)

Country Link
KR (1) KR20120069804A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102327038B1 (en) 2021-07-12 2021-11-16 주식회사 지씨이 A liquid isolator for vertical continuous plating apparatus
KR102406773B1 (en) * 2021-11-10 2022-06-13 주식회사 지씨이 Vertical continuous plating equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102327038B1 (en) 2021-07-12 2021-11-16 주식회사 지씨이 A liquid isolator for vertical continuous plating apparatus
KR102406773B1 (en) * 2021-11-10 2022-06-13 주식회사 지씨이 Vertical continuous plating equipment

Similar Documents

Publication Publication Date Title
KR102124406B1 (en) A horizontal plating apparatus and a method thereof
KR101375920B1 (en) Apparatus and method for providing an inerting gas during soldering
TWI552821B (en) Electrochemical machining device
JP5774669B2 (en) Plating equipment for manufacturing flexible printed circuit boards
KR20120069804A (en) Perpendicular type plating apparatus with glass pipe
US20230349064A1 (en) Plating systems having reduced air entrainment
CN109023458B (en) A kind of electroplanting device and method of PCB circuit board
JP3115047U (en) Jet floating plating tank
CN203007458U (en) PCB (Printed Circuit Board) electroplating bath with movable cathode
CN218507916U (en) Liquid medicine circulation system and pure copper anode electroplating line
CN217922393U (en) Plating solution tank and coating machine
CN215289004U (en) Point plating device
TWM468525U (en) Electroplating apparatus
JP7057869B1 (en) Plating equipment
CN212864969U (en) Jet flow device for IC carrier plate chemical plating
KR20110067402A (en) Apparatus to plate substrate
CN213596397U (en) Chemical plating device for IC carrier plate
CN209798154U (en) Device for heating and cooling electroplating cathode contact
CN114525574A (en) Plating solution circulating device and plating solution filtering method
CN220767220U (en) Plating tank
CN110753763A (en) Electrolytic processing assembly and surface processing device using same
KR20210008772A (en) An apparatus for a horizontal plating
JP5092240B2 (en) Plating equipment
WO2017037757A1 (en) Surface treatment apparatus
KR101205310B1 (en) Apparatus to Plate Substrate

Legal Events

Date Code Title Description
A201 Request for examination
E601 Decision to refuse application